JP5792820B2 - 電気メッキ用の非浸透性基板キャリア - Google Patents

電気メッキ用の非浸透性基板キャリア Download PDF

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Publication number
JP5792820B2
JP5792820B2 JP2013530143A JP2013530143A JP5792820B2 JP 5792820 B2 JP5792820 B2 JP 5792820B2 JP 2013530143 A JP2013530143 A JP 2013530143A JP 2013530143 A JP2013530143 A JP 2013530143A JP 5792820 B2 JP5792820 B2 JP 5792820B2
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JP
Japan
Prior art keywords
conductive
clip
substrate
carrier
substrate carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013530143A
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English (en)
Japanese (ja)
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JP2013537941A5 (de
JP2013537941A (ja
Inventor
チュア アバス、エマニュエル
チュア アバス、エマニュエル
チェン、チェン−アン
シャオビン マ、ダイアナ
シャオビン マ、ダイアナ
バーガバ ガンチ、カルヤナ
バーガバ ガンチ、カルヤナ
アニダ ディヴィノ、エドムンド
アニダ ディヴィノ、エドムンド
ランダル ジー． エルミタ、ジェイク
ランダル ジー． エルミタ、ジェイク
フランシスコ エス． カプロング、ホセ
フランシスコ エス． カプロング、ホセ
ヴィラモール カスティーロ、アーノルド
ヴィラモール カスティーロ、アーノルド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunPower Corp
Original Assignee
SunPower Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/889,232 external-priority patent/US8221601B2/en
Priority claimed from US12/889,228 external-priority patent/US8221600B2/en
Priority claimed from US12/889,219 external-priority patent/US8317987B2/en
Application filed by SunPower Corp filed Critical SunPower Corp
Publication of JP2013537941A publication Critical patent/JP2013537941A/ja
Publication of JP2013537941A5 publication Critical patent/JP2013537941A5/ja
Application granted granted Critical
Publication of JP5792820B2 publication Critical patent/JP5792820B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2013530143A 2010-09-23 2011-07-11 電気メッキ用の非浸透性基板キャリア Active JP5792820B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US12/889,228 2010-09-23
US12/889,232 US8221601B2 (en) 2010-09-23 2010-09-23 Maintainable substrate carrier for electroplating
US12/889,232 2010-09-23
US12/889,228 US8221600B2 (en) 2010-09-23 2010-09-23 Sealed substrate carrier for electroplating
US12/889,219 2010-09-23
US12/889,219 US8317987B2 (en) 2010-09-23 2010-09-23 Non-permeable substrate carrier for electroplating
PCT/US2011/043571 WO2012039816A1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015156113A Division JP6080320B2 (ja) 2010-09-23 2015-08-06 電気メッキ用の非浸透性基板キャリア

Publications (3)

Publication Number Publication Date
JP2013537941A JP2013537941A (ja) 2013-10-07
JP2013537941A5 JP2013537941A5 (de) 2014-08-21
JP5792820B2 true JP5792820B2 (ja) 2015-10-14

Family

ID=45874099

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013530143A Active JP5792820B2 (ja) 2010-09-23 2011-07-11 電気メッキ用の非浸透性基板キャリア
JP2015156113A Active JP6080320B2 (ja) 2010-09-23 2015-08-06 電気メッキ用の非浸透性基板キャリア

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015156113A Active JP6080320B2 (ja) 2010-09-23 2015-08-06 電気メッキ用の非浸透性基板キャリア

Country Status (6)

Country Link
EP (2) EP2619349B1 (de)
JP (2) JP5792820B2 (de)
KR (2) KR101828394B1 (de)
CN (2) CN203795007U (de)
ES (1) ES2605805T3 (de)
WO (3) WO2012039818A1 (de)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297197A (en) * 1980-11-13 1981-10-27 International Telephone And Telegraph Corp. Electroplating rack
US4796157A (en) * 1988-01-04 1989-01-03 Motorola, Inc. Substrate mounting assembly
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
EP0991795B1 (de) * 1998-04-21 2006-02-22 Applied Materials, Inc. Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
JP2001234397A (ja) * 2000-02-24 2001-08-31 Matsushita Electric Works Ltd 電気メッキ用冶具
JP3413185B2 (ja) * 2000-11-15 2003-06-03 古河電気工業株式会社 めっき用治具
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells
US7930006B2 (en) * 2004-09-08 2011-04-19 Belkin International, Inc. Holder, electrical supply, and RF transmitter unit for electronic devices
US20080248596A1 (en) * 2007-04-04 2008-10-09 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having at least one capacitor therein
EP1717351A1 (de) * 2005-04-27 2006-11-02 Enthone Inc. Galvanikbad
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
US7718888B2 (en) * 2005-12-30 2010-05-18 Sunpower Corporation Solar cell having polymer heterojunction contacts
US7767030B2 (en) * 2007-09-24 2010-08-03 Chemical Specialties Manufacturing Corp. Cleaning device

Also Published As

Publication number Publication date
ES2605805T3 (es) 2017-03-16
JP2016014192A (ja) 2016-01-28
CN203795007U (zh) 2014-08-27
EP2619349A1 (de) 2013-07-31
CN203307439U (zh) 2013-11-27
EP3150748A1 (de) 2017-04-05
KR101764275B1 (ko) 2017-08-03
WO2012039817A3 (en) 2014-03-20
WO2012039817A2 (en) 2012-03-29
KR20170091755A (ko) 2017-08-09
JP2013537941A (ja) 2013-10-07
EP2619349A4 (de) 2016-01-27
KR101828394B1 (ko) 2018-02-12
EP2619349B1 (de) 2016-11-09
WO2012039818A1 (en) 2012-03-29
JP6080320B2 (ja) 2017-02-15
WO2012039816A1 (en) 2012-03-29
EP3150748B1 (de) 2018-05-09
KR20130121704A (ko) 2013-11-06

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