EP3150748A1 - Undurchlässiger substratträger zur elektroplattierung - Google Patents
Undurchlässiger substratträger zur elektroplattierung Download PDFInfo
- Publication number
- EP3150748A1 EP3150748A1 EP16197330.0A EP16197330A EP3150748A1 EP 3150748 A1 EP3150748 A1 EP 3150748A1 EP 16197330 A EP16197330 A EP 16197330A EP 3150748 A1 EP3150748 A1 EP 3150748A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- carrier
- conductive
- carrier body
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 210
- 238000009713 electroplating Methods 0.000 title claims abstract description 39
- 238000007373 indentation Methods 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 76
- 229910052751 metal Inorganic materials 0.000 description 76
- 229920001169 thermoplastic Polymers 0.000 description 29
- 239000004416 thermosoftening plastic Substances 0.000 description 29
- 235000012431 wafers Nutrition 0.000 description 21
- 238000000034 method Methods 0.000 description 15
- 239000008151 electrolyte solution Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000969 carrier Substances 0.000 description 9
- 239000004033 plastic Substances 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 239000004568 cement Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000004801 Chlorinated PVC Substances 0.000 description 5
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008439 repair process Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/889,232 US8221601B2 (en) | 2010-09-23 | 2010-09-23 | Maintainable substrate carrier for electroplating |
US12/889,228 US8221600B2 (en) | 2010-09-23 | 2010-09-23 | Sealed substrate carrier for electroplating |
US12/889,219 US8317987B2 (en) | 2010-09-23 | 2010-09-23 | Non-permeable substrate carrier for electroplating |
EP11827131.1A EP2619349B1 (de) | 2010-09-23 | 2011-07-11 | Nicht durchlässiger substratträger für die galvanotechnik |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11827131.1A Division EP2619349B1 (de) | 2010-09-23 | 2011-07-11 | Nicht durchlässiger substratträger für die galvanotechnik |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3150748A1 true EP3150748A1 (de) | 2017-04-05 |
EP3150748B1 EP3150748B1 (de) | 2018-05-09 |
Family
ID=45874099
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11827131.1A Active EP2619349B1 (de) | 2010-09-23 | 2011-07-11 | Nicht durchlässiger substratträger für die galvanotechnik |
EP16197330.0A Active EP3150748B1 (de) | 2010-09-23 | 2011-07-11 | Undurchlässiger substratträger zur elektroplattierung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11827131.1A Active EP2619349B1 (de) | 2010-09-23 | 2011-07-11 | Nicht durchlässiger substratträger für die galvanotechnik |
Country Status (6)
Country | Link |
---|---|
EP (2) | EP2619349B1 (de) |
JP (2) | JP5792820B2 (de) |
KR (2) | KR101764275B1 (de) |
CN (2) | CN203795007U (de) |
ES (1) | ES2605805T3 (de) |
WO (3) | WO2012039816A1 (de) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4796157A (en) * | 1988-01-04 | 1989-01-03 | Motorola, Inc. | Substrate mounting assembly |
US5078852A (en) * | 1990-10-12 | 1992-01-07 | Microelectronics And Computer Technology Corporation | Plating rack |
US20050061665A1 (en) * | 2003-08-06 | 2005-03-24 | Sunpower Corporation | Substrate carrier for electroplating solar cells |
DE102005039100A1 (de) * | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung |
US20070151599A1 (en) * | 2005-12-30 | 2007-07-05 | Sunpower Corporation | Solar cell having polymer heterojunction contacts |
US20080248596A1 (en) * | 2007-04-04 | 2008-10-09 | Endicott Interconnect Technologies, Inc. | Method of making a circuitized substrate having at least one capacitor therein |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4297197A (en) * | 1980-11-13 | 1981-10-27 | International Telephone And Telegraph Corp. | Electroplating rack |
KR100616198B1 (ko) * | 1998-04-21 | 2006-08-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판상에 전기도금하는 전기화학적 증착 시스템 및 방법 |
JP2001234397A (ja) * | 2000-02-24 | 2001-08-31 | Matsushita Electric Works Ltd | 電気メッキ用冶具 |
JP3413185B2 (ja) * | 2000-11-15 | 2003-06-03 | 古河電気工業株式会社 | めっき用治具 |
US7930006B2 (en) * | 2004-09-08 | 2011-04-19 | Belkin International, Inc. | Holder, electrical supply, and RF transmitter unit for electronic devices |
EP1717351A1 (de) * | 2005-04-27 | 2006-11-02 | Enthone Inc. | Galvanikbad |
WO2009042669A1 (en) * | 2007-09-24 | 2009-04-02 | Chemical Specialties Manufacturing Corp. | Cleaning device |
-
2011
- 2011-07-11 CN CN201320681505.XU patent/CN203795007U/zh not_active Expired - Lifetime
- 2011-07-11 WO PCT/US2011/043571 patent/WO2012039816A1/en active Application Filing
- 2011-07-11 ES ES11827131.1T patent/ES2605805T3/es active Active
- 2011-07-11 WO PCT/US2011/043573 patent/WO2012039817A2/en active Application Filing
- 2011-07-11 WO PCT/US2011/043576 patent/WO2012039818A1/en active Application Filing
- 2011-07-11 JP JP2013530143A patent/JP5792820B2/ja active Active
- 2011-07-11 EP EP11827131.1A patent/EP2619349B1/de active Active
- 2011-07-11 KR KR1020127034368A patent/KR101764275B1/ko active IP Right Grant
- 2011-07-11 KR KR1020177021079A patent/KR101828394B1/ko active IP Right Grant
- 2011-07-11 EP EP16197330.0A patent/EP3150748B1/de active Active
- 2011-07-11 CN CN2011900005857U patent/CN203307439U/zh not_active Expired - Lifetime
-
2015
- 2015-08-06 JP JP2015156113A patent/JP6080320B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4796157A (en) * | 1988-01-04 | 1989-01-03 | Motorola, Inc. | Substrate mounting assembly |
US5078852A (en) * | 1990-10-12 | 1992-01-07 | Microelectronics And Computer Technology Corporation | Plating rack |
US20050061665A1 (en) * | 2003-08-06 | 2005-03-24 | Sunpower Corporation | Substrate carrier for electroplating solar cells |
DE102005039100A1 (de) * | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung |
US20070151599A1 (en) * | 2005-12-30 | 2007-07-05 | Sunpower Corporation | Solar cell having polymer heterojunction contacts |
US20080248596A1 (en) * | 2007-04-04 | 2008-10-09 | Endicott Interconnect Technologies, Inc. | Method of making a circuitized substrate having at least one capacitor therein |
Also Published As
Publication number | Publication date |
---|---|
KR20170091755A (ko) | 2017-08-09 |
JP2013537941A (ja) | 2013-10-07 |
JP2016014192A (ja) | 2016-01-28 |
WO2012039817A3 (en) | 2014-03-20 |
EP2619349A1 (de) | 2013-07-31 |
KR20130121704A (ko) | 2013-11-06 |
EP2619349B1 (de) | 2016-11-09 |
EP2619349A4 (de) | 2016-01-27 |
JP5792820B2 (ja) | 2015-10-14 |
KR101764275B1 (ko) | 2017-08-03 |
CN203307439U (zh) | 2013-11-27 |
WO2012039818A1 (en) | 2012-03-29 |
WO2012039816A1 (en) | 2012-03-29 |
WO2012039817A2 (en) | 2012-03-29 |
ES2605805T3 (es) | 2017-03-16 |
EP3150748B1 (de) | 2018-05-09 |
CN203795007U (zh) | 2014-08-27 |
KR101828394B1 (ko) | 2018-02-12 |
JP6080320B2 (ja) | 2017-02-15 |
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