CN203218317U - LED (Light-Emitting Diode) integrated light source - Google Patents
LED (Light-Emitting Diode) integrated light source Download PDFInfo
- Publication number
- CN203218317U CN203218317U CN 201320109494 CN201320109494U CN203218317U CN 203218317 U CN203218317 U CN 203218317U CN 201320109494 CN201320109494 CN 201320109494 CN 201320109494 U CN201320109494 U CN 201320109494U CN 203218317 U CN203218317 U CN 203218317U
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- Prior art keywords
- reflective cup
- substrate
- cup
- reflection
- led chip
- Prior art date
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Abstract
The utility model provides an LED integrated light source, which comprises a substrate, an insulating layer, a reflection cup, an LED chip and package glue. The reflection cup is punched from the substrate, wherein the reflection cup is punched upwards from the backside of the substrate via a mold to form a cup edge, the inner of the reflection cup is plated with a reflection layer, and an insulating wire is arranged in the reflection cup and isolates the reflection body into a positive electrode and a negative electrode insulated from each other; the LED chip is arranged in the middle of the reflection cup, the anode of the LED chip is connected with the anode of the reflection cup via a binding wire, and the cathode of the LED chip is connected with the cathode of the reflection cup via another binding wire; the packaging glue is arranged on the reflection cup; and the insulating layer covers the front side of the substrate in parts except the reflection body. The LED integrated light source has the advantages that structure is simple, reflection effect is strong, the packaging glue can coat the reflection cup stably, and brightness of the whole light source is improved; and heat radiation is good, temperature of the whole light source is reduced, reliability is improved, service life is long, and cost is low.
Description
[technical field]
The utility model relates to a kind of light source, relates in particular to a kind of LED integrated optical source.
[background technology]
In the prior art, LED integrated optical source substrate has following several:
Traditional PCB wiring board is carried out circuit at PCB, uses SMD paster or solid crystalline substance then, bonding wire, sealing, packaging technology production integrated optical source, LED also can produce heat in luminous, the high radiating effect of PCB wiring board thermal resistance is poor, thereby reduces reliability of products and useful life.
Traditional aluminium, copper base, carry out circuit at the aluminum bronze substrate, use SMD paster or solid crystalline substance then, bonding wire, sealing, packaging technology production integrated optical source, LED also can produce heat in luminous, the aluminum bronze substrate generally has three layers, and line layer, insulating barrier, basic unit's (aluminium or copper) three laminations close and form, and the insulating barrier in the middle of the substrate is conductive barrier maximum in the structure at present.
Traditional aluminum bronze substrate punching, on traditional aluminum bronze substrate, blind hole is beaten with automation equipment in solid brilliant position, solid in the hole of accomplishing fluently the LED wafer again, bonding wire, sealing, this method can be accomplished thermoelectric the separation, and is very effective to the transmission of heat, but there is insulating barrier at the edge in hole, insulating barrier generally is yellow or milky not refractive body, can draw a part of light source.The processing knife mark is also arranged at the bottom in hole, and reflecting effect is poor, and the light efficiency of LED is not greatly improved, the luminous energy that does not reflect away can change into heat energy in substrate, improve the bulk temperature of product, thereby reduce reliability of products and useful life, using punching to produce also can increase production cost.
[utility model content]
The purpose of this utility model is to overcome LED integrated optical source in the prior art, and reflecting effect is poor, temperature height, poor reliability, useful life is short, cost is high deficiency and a kind of New LED integrated optical source of providing.
The utility model is achieved through the following technical solutions: a kind of LED integrated optical source, comprise substrate, insulating barrier, reflective cup, led chip, packaging plastic, go out the reflector body on the described substrate, reflective cup uses mould upwards to recoil into a cup edge from substrate back, be coated with one deck reflector layer in the described reflective cup, in described reflective cup, be provided with insulated wire, the positive and negative electrode that reflective cup is cut off into mutually insulated, described led chip is located in the middle of the described reflective cup, described led chip positive pole is connected with reflective cup positive pole by group's alignment, described led chip negative pole is connected with reflective cup negative pole by another group's alignment, above described reflective cup, be provided with packaging plastic, described packaging plastic is because surface tension presents hemisphere at reflective cup, and the part outside the reflective cup of described substrate front side is covered with insulating barrier.
Further, described reflector layer is silver coating.
Further, the material of described insulating barrier is white oil, and the material of described insulated wire is white oil.
Further, described substrate material is metal substrate.
The beneficial effects of the utility model are: simple in structure, can improve the reflecting effect of led light source greatly, reflecting power can be up to more than 98 percent, the packaging plastic of putting on the reflective cup is because surface tension can form hemisphere automatically on reflective cup, and because reflective cup is provided with cup along making overlaying on the reflective cup that packaging plastic can be firm, and improved the brightness of entire product; Good heat dissipation reduces the temperature of entire product, and it is low to improve entire product reliability, long service life, cost.
[description of drawings]
Fig. 1 is the reflective cup generalized section of the utility model.
Reference numeral: 1, substrate; 2, insulating barrier; 3, reflective cup; 4, led chip; 5, packaging plastic; 6, group's alignment; 7, insulated wire; 31, cup edge; 32, reflector layer.
[embodiment]
Below in conjunction with the drawings and the specific embodiments the utility model is described further:
As shown in Figure 1, a kind of LED integrated optical source, comprise substrate 1, insulating barrier 2, reflective cup 3, led chip 4, packaging plastic 5, go out reflector body 3 on described basic 1, reflective cup 3 uses mould upwards to recoil into a cup along 31 from substrate 1 back side, be coated with one deck reflector layer 32 in the described reflective cup 3, in described reflective cup 3, be provided with insulated wire 7, the positive and negative electrode that reflective cup 3 is cut off into mutually insulated, described led chip 4 is located in the middle of the described reflective cup 3, described led chip 4 positive poles are connected with reflective cup 3 positive poles by group's alignment, described led chip 4 negative poles are connected with reflective cup 3 negative poles by another group's alignment, above described reflective cup 3, be provided with packaging plastic 5, described packaging plastic 5 is because surface tension presents hemisphere at reflective cup 3, and the part outside the reflective cup 3 of described substrate front side is covered with insulating barrier 2.
Preferably, described reflector layer 32 is silver coating.
Preferably, the material of described insulating barrier 2 is white oil, and the material of described insulated wire 7 is white oil.
Preferably, described substrate 1 material is metal substrate.
The announcement of book and instruction according to the above description, the utility model those skilled in the art can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the utility model is not limited to also should fall in the protection range of claim of the present utility model modifications and changes more of the present utility model.In addition, although used some specific terms in this specification, these terms do not constitute any restriction to the utility model just for convenience of description.
Claims (4)
1. LED integrated optical source, comprise substrate, insulating barrier, reflective cup, led chip, packaging plastic, it is characterized in that: go out the reflector body on the described substrate, reflective cup uses mould upwards to recoil into a cup edge from substrate back, be coated with one deck reflector layer in the described reflective cup, in described reflective cup, be provided with insulated wire, the positive and negative electrode that reflective cup is cut off into mutually insulated, described led chip is located in the middle of the described reflective cup, described led chip positive pole is connected with reflective cup positive pole by group's alignment, described led chip negative pole is connected with reflective cup negative pole by another group's alignment, above described reflective cup, be provided with packaging plastic, described packaging plastic is because surface tension presents hemisphere at reflective cup, and the part outside the reflective cup of described substrate front side is covered with insulating barrier.
2. according to claims 1 described LED integrated optical source, it is characterized in that: described reflector layer is silver coating.
3. according to claims 1 described LED integrated optical source, it is characterized in that: the material of described insulating barrier is white oil, and the material of described insulated wire is white oil.
4. according to claims 1 described LED integrated optical source, it is characterized in that: described substrate material is metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320109494 CN203218317U (en) | 2013-03-11 | 2013-03-11 | LED (Light-Emitting Diode) integrated light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320109494 CN203218317U (en) | 2013-03-11 | 2013-03-11 | LED (Light-Emitting Diode) integrated light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203218317U true CN203218317U (en) | 2013-09-25 |
Family
ID=49207827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320109494 Expired - Fee Related CN203218317U (en) | 2013-03-11 | 2013-03-11 | LED (Light-Emitting Diode) integrated light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203218317U (en) |
-
2013
- 2013-03-11 CN CN 201320109494 patent/CN203218317U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Chen Liesheng Document name: Notice of termination of patent |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130925 Termination date: 20200311 |