CN203148990U

CN203148990U - Probe head of electronic component test device

Info

Publication number: CN203148990U
Application number: CN 201320051092
Authority: CN
Inventors: 林信忠; 陈威助; 游辉哲
Original assignee: CHINA CONTACT PROBES Co Ltd
Current assignee: CHINA CONTACT PROBES Co Ltd
Priority date: 2013-01-29
Filing date: 2013-01-29
Publication date: 2013-08-21
Anticipated expiration: 2023-01-29

Abstract

The utility model discloses a probe head of an electronic component test device. The electronic component test device comprises a seat body, a cover body, a bearing platform, multiple elastic components and multiple probe units and is used for detecting an electrical conduction state of each pin of a square flat packaging semiconductor, and each probe unit comprises an external tube, a spring and a probe head. The probe head of the electronic component test device is characterized in that one contact end of the probe head is exposed outside the external tube, multiple first pointed cones are molded at outer periphery of the contact end around the probe head, and a second pointed cone is molded at a central portion of the contact end. During detection, the second pointed cone and at least one first pointed cone simultaneously contact the pin to form at least two-point support, so tin scrapping of the probe head caused by transverse deflection during contact and guide is avoided.

Description

The probe of electronic component testing apparatus

Technical field

The utility model is the field that belongs to electronic component testing apparatus, refers to a kind of probe structure that is used for preventing the tin scraping problem of probe unit when the contact correcting especially.

Background technology

General quad flat package semiconductor (Quad Flat Package, QFP) be a kind of common encapsulated semiconductor for surface adhesion (SMT) or insertion assembling, described QFP is extended respectively by four sides of a base material to be provided with a plurality of pins and to present gull wings (L) type, and its employed material has three kinds in pottery, metal and plastic cement etc., and the overwhelming majority is plastic cement QFP processed.But, along with the increase of external pin number, and when these a plurality of pins from the centre distance of described base material more hour, its pin is easy to generate diastrophic problem, thereby the fraction defective when having improved assembling.

Therefore, normally carrying out one by an electronic component testing apparatus at described a plurality of pins is the electric test of row, to reduce the fraction defective after assembling.See also Fig. 1 and Fig. 2, the view during for the structural representation of general electronic component testing apparatus and operation thereof.Described electronic component testing apparatus 1 comprises a pedestal 11, one lid 12, one plummer 13, a plurality of flexible members 14 and a plurality of probe unit 15, wherein said pedestal 11 and described lid 12 are involutory settings, and in the corresponding accommodation space 111 that forms of central part, for ccontaining described plummer 13 and these a plurality of flexible members 14, described plummer 13 is on average to abut against on these a plurality of flexible members 14 and activity is located in the described accommodation space 111, and described pedestal 11 corresponding described each probe unit 15 and be provided with a plurality of first perforation 112, and described lid 12 is corresponding described each probe unit 15 and be provided with a plurality of second perforation 121, described each probe unit 15 is that correspondence is arranged between described first perforation 112 and described second perforation 121 respectively, and each probe unit 15 comprises an outer tube 151, one spring 152 and a probe 153, described probe 153 is to be movably set in the described outer tube 151 together with described spring 152, make a contact jaw 1531 of described probe 153 pass described outer tube 151, described contact jaw also is piercing in described first perforation (figure does not illustrate) simultaneously and exposes in the described accommodation space 111.During detection, be that described QFP2 is on average placed on the described plummer 13, press down described QFP2 together with described plummer 13 by suitable pressure, and then detect described a plurality of pin 21 whether can with the described contact jaw 1531 of described each probe 153 mutually by touching, further reach the purpose of its electrically conducting state of detection.

Yet, described contact jaw 1531 is four cone-shaped structures along the outer peripheral edges institute moulding of described probe 151, behind described probe 151 pressurizeds, can make described probe 153 inwardly oppress described spring 152, owing between described probe 153 and the described outer tube 151 appropriate gap is arranged, not only can rotate and also have the purpose that beat moves to reach the contact correcting, but in its process, described contact jaw 1531 also might produce transversal displacement and cause the surface of described pin 21 to produce the tin scraping problem.Moreover, the described contact jaw 1531 that is cone-shaped structure and described pin 21 are when tactile, also have different situations, sometimes described pin 21 can fall to placing between described two cone-shaped structures, also sometimes only with a described wherein cone-shaped structure mutually by touching, all might have influence on the result of detection, so be necessary to be improved.

Summary of the invention

In view of this, a purpose of the present utility model, aim to provide a kind of probe of electronic component testing apparatus, around a contact jaw, form a plurality of first pointed cones, central authorities form one second pointed cone, during detection, can make described second pointed cone and described at least one first pointed cone form 2 supports by touching described pin simultaneously, guarantee the accuracy of its detection.Moreover such design also can avoid described probe to produce excessive horizontal beat when the contact correcting, thus can effectively avoid having now the tin scraping phenomenon when detecting, and can not influence electrically conducting effect in the future.

For reaching above-mentioned purpose, the probe of electronic component testing apparatus of the present utility model, wherein said electronic component testing apparatus is by a pedestal, one lid, one carrying platform, a plurality of flexible members and a plurality of probe unit are formed, described each probe unit comprises an outer tube at least, one spring and a probe, described a plurality of probe unit contacts a quad flat package semiconductor (Quad Flat Package, during QFP) each pin, utilize a contact jaw of each described probe by touching on each described pin, to detect the electrically conducting state of described each pin, described probe is a metal cylindrical-shaped structure body, be located in the lump in the described outer tube with described spring, and the described contact jaw of described probe is to expose to described outside pipe, described contact jaw is along the outer peripheral edges of described probe and form a plurality of first pointed cones, its central part also forms one second pointed cone, described a plurality of first pointed cone is around being located at around described second pointed cone, and the height of described a plurality of first pointed cones and described second pointed cone is identical; During use, described second pointed cone and described at least one first pointed cone are simultaneously by touching in described pin, and form 2 supports.

Wherein, described a plurality of first pointed cone and described second pointed cone are to have one to set spacing, described setting spacing is the width smaller or equal to described pin, make described second pointed cone and described at least one first pointed cone can be on average by touching described pin, and do not cause described pin to fall to placing therebetween.

In an embodiment, the probe of described electronic component testing apparatus of the present utility model, have more a plurality of the 3rd pointed cones, described a plurality of the 3rd pointed cones are to take shape between adjacent described 2 first pointed cones, and the height of described a plurality of the 3rd pointed cones is to be lower than described first pointed cone.

Moreover, between adjacent described a plurality of first pointed cones, described second pointed cone and described a plurality of the 3rd pointed cone, have more a plurality of chases, and described a plurality of first pointed cone, described second pointed cone and described a plurality of the 3rd pointed cone are to be pyramidal structure.

In a specific embodiment, described contact jaw of the present utility model is to have 4 first pointed cones, 1 second pointed cone and 4 the 3rd pointed cones, and described a plurality of chases are to interconnect and form a groined type chase.

In a specific embodiment, described a plurality of first pointed cones and described second pointed cone are to be pyramidal structure.

In a specific embodiment, described a plurality of first pointed cones and described second pointed cone are to have one to set spacing, and described setting spacing is the width smaller or equal to described pin.

The utility model is when detecting, and described second pointed cone and described at least one first pointed cone are simultaneously by touching described pin, and can form 2 supports, the tin scraping phenomenon that the horizontal beat when avoiding described probe to contact correcting causes.

Description of drawings

Fig. 1 is the structural representation of general electronic component testing apparatus.

View when Fig. 2 is the operation of general electronic component testing apparatus.

Fig. 3 is the scheme of installation of the utility model preferred embodiment.

Fig. 3 A is the partial enlarged drawing of the probe of the utility model preferred embodiment.

Fig. 3 B is the top view of the probe of the utility model preferred embodiment.

Fig. 4 is the structural representation of the contact jaw of the utility model preferred embodiment.

View when Fig. 5 operates for the utility model preferred embodiment.

Description of reference numerals:

(having now)

The 1-electronic component testing apparatus; The 11-pedestal; The 111-accommodation space; The 12-lid; 121-second perforation; The 13-plummer; The 14-flexible member; The 15-probe unit; The 151-outer tube; The 152-spring; The 153-probe; The 1531-contact jaw; 2-quad flat package semiconductor; The 21-pin;

(the utility model)

The 3-electronic component testing apparatus; The 31-pedestal; The 311-accommodation space; 312-first perforation; The 32-lid; 321-second perforation; The 33-plummer; The 34-flexible member; The 35-probe unit; The 351-outer tube; The 352-spring; The 353-probe; The 3531-contact jaw; 3532-first pointed cone; 3533-second pointed cone; 3534-the 3rd pointed cone; The 3535-chase; 4-quad flat package semiconductor; The 41-pin.

Embodiment

Understand content of the present utility model for your juror can be known, it is graphic only to arrange in pairs or groups in the following instructions, please consult.

See also Fig. 3,3A, 3B, 4,5, be scheme of installation and the partial enlarged drawing thereof of the utility model preferred embodiment, with and the structural representation of the contact jaw view during with operation.As shown in FIG., specific embodiment of the utility model is equally by being installed in the electronic component testing apparatus 3, the structure of described electronic component testing apparatus 3 is identical with existing Fig. 1 electronic component testing apparatus 1, it comprises a pedestal 31 equally, one lid 32, one carrying platform 33, a plurality of flexible members 34 and a plurality of probe unit 35 are formed, and described each probe unit 35 comprises an outer tube 351 at least, one spring 352 and a probe 353, and can utilize described a plurality of probe unit 35 contacts one quad flat package semiconductor (Quad Flat Package, QFP) during each pin 41 of 4, utilize a contact jaw 3531 of described each probe 353 by touching on described each pin 41, to detect the electrically conducting state of described each pin 41.

Described probe 353 of the present utility model is metal cylindrical-shaped structure bodies, and is located in the lump in the described outer tube 351 with described spring 352, and to make the described contact jaw 3531 of described probe 353 be to be exposed to described outer tube 351 outsides.Specific embodiment of the utility model, be outer peripheral edges in described contact jaw 3531 along described probe 353 and form four first pointed cones 3532, its central part also forms one second pointed cone 3533, make described a plurality of first pointed cone 3532 around being located at around described second pointed cone 3533, the height of described a plurality of first pointed cones 3532 and described second pointed cone 3533 is identical, and described a plurality of first pointed cone 3532 be around the described probe 353 a cambered surface and in abutting connection with the pyramidal structure on two inclined-planes that arrange, described second pointed cone 3533 then presents quadrangular pyramid shape structure, wherein, described a plurality of first pointed cone 3532 and described second pointed cone 3533 are to have one to set spacing, and described setting spacing is the width smaller or equal to described pin 41.

It should be noted, described probe 353 of the present utility model is in adding man-hour, also can be between adjacent described 2 first pointed cones 3532 and form a plurality of the 3rd pointed cones 3534, and the height of described a plurality of the 3rd pointed cones 3534 is to be lower than described a plurality of first pointed cone 3532, and between adjacent described a plurality of first pointed cones 3532, described second pointed cone 3533 and described a plurality of the 3rd pointed cone 3534, form a plurality of chases 3535, and described a plurality of chase 3535 seen is to be groined type by the top.

During use, described probe 353 is the downforce that are subjected to described pin 41, and then compresses described spring 352, makes in the described outer tube 351 of described probe 353 retractions.Be simultaneously by touching the end in described pin 41 by described second pointed cone 3533 and described wherein one first pointed cone 3532, and form 2 support effect, when described probe 353 rotates with respect to described outer tube 351 or during beat, relatively more firmly and effectively promote and detect effect, and can not cause the surperficial tin scraping problem of described pin 41.

The above person, it only is preferred embodiment of the present utility model, be not in order to limit the scope that the utility model is implemented, so have in the technical field under described and know the knowledgeable usually, or be familiar with this technology and done equivalence or variation person easily, not breaking away from the equalization variation of doing under spirit of the present utility model and the scope and modification, all should be covered by in the claim of the present utility model.

Claims

1. the probe of an electronic component testing apparatus, wherein said electronic component testing apparatus is made up of a pedestal, a lid, a carrying platform, a plurality of flexible member and a plurality of probe unit, each described probe unit comprises an outer tube, a spring and a probe at least, when described a plurality of probe unit contacts semi-conductive each pin of a quad flat package, utilize a contact jaw of described each probe by touching on described each pin, to detect the electrically conducting state of described each pin, it is characterized in that:

Described probe is a metal cylindrical-shaped structure body, be located in the lump in the described outer tube with described spring, and the described contact jaw of described probe is to expose to described outside pipe, described contact jaw is along the outer peripheral edges of described probe and form a plurality of first pointed cones, central part also forms one second pointed cone, described a plurality of first pointed cone is around being located at around described second pointed cone, and the height of described a plurality of first pointed cones and described second pointed cone is identical; During use, described second pointed cone and described at least one first pointed cone are simultaneously by touching in described pin, and form 2 supports.

2. the probe of electronic component testing apparatus according to claim 1, it is characterized in that, have more a plurality of the 3rd pointed cones, described a plurality of the 3rd pointed cones are to take shape between adjacent described 2 first pointed cones, and the height of described a plurality of the 3rd pointed cones is to be lower than described first pointed cone.

3. the probe of electronic component testing apparatus according to claim 2 is characterized in that, has more a plurality of chases, is to take shape between adjacent described a plurality of first pointed cones, described second pointed cone and described a plurality of the 3rd pointed cone.

4. the probe of electronic component testing apparatus according to claim 3 is characterized in that, described a plurality of first pointed cones, described second pointed cone and described a plurality of the 3rd pointed cone are to be pyramidal structure.

5. the probe of electronic component testing apparatus according to claim 3 is characterized in that, described contact jaw is to have 4 first pointed cones, 1 second pointed cone and 4 the 3rd pointed cones, and described a plurality of chase is to interconnect and form a groined type chase.

6. the probe of electronic component testing apparatus according to claim 1 is characterized in that, described a plurality of first pointed cones and described second pointed cone are to be pyramidal structure.

7. the probe of electronic component testing apparatus according to claim 1 is characterized in that, described a plurality of first pointed cones and described second pointed cone are to have one to set spacing, and described setting spacing is the width smaller or equal to described pin.