CN203811645U - Test probe station - Google Patents

Test probe station Download PDF

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Publication number
CN203811645U
CN203811645U CN201420235134.7U CN201420235134U CN203811645U CN 203811645 U CN203811645 U CN 203811645U CN 201420235134 U CN201420235134 U CN 201420235134U CN 203811645 U CN203811645 U CN 203811645U
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CN
China
Prior art keywords
wafer
plummer
test probe
test
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201420235134.7U
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Chinese (zh)
Inventor
张程
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Semiconductor Manufacturing International Beijing Corp
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Semiconductor Manufacturing International Beijing Corp
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Priority to CN201420235134.7U priority Critical patent/CN203811645U/en
Application granted granted Critical
Publication of CN203811645U publication Critical patent/CN203811645U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a test probe station, which comprises a chuck and two probe cards, wherein wafers are fixed on the upper surface and the lower surface of the chuck, and the probe cards are respectively arranged on both sides of the chuck for testing the wafers fixed on the upper surface and the lower surface of the chuck. By fixing the wafers and one probe card on the lower surface of the chuck, two wafers can be testes simultaneously on one test probe station, the wafer testing efficiency is increased, and the utilization rate of the idle probe card is improved; in addition, the test probe station can be formed by carrying out hardware improvement on the basis of the existing test probe station without purchasing new equipment, the cost is saved, the place needing to be changed is few, the failure rate is reduced, and the feasibility is increased.

Description

Test probe platform
Technical field
The utility model relates to semiconductor test apparatus, is specifically related to a kind of test probe platform.
Background technology
In the manufacture process of integrated circuit, conventionally can be divided into several stages of silicon wafer process, wafer sort, encapsulation and last test.Before encapsulation, conventionally need to carry out electrical performance testing to the integrated circuit on wafer is wafer sort, to judge that whether integrated circuit is good, complete electrical testing that integrated circuit after packaging technology must carry out another time again and be last test to filter out because of the not good defective products being caused of packaging technology, further promote the yield of final finished.
At present, wafer sort and last test normally utilize test probe platform to test, utilize a probe with some probes, probe is contacted with the integrated circuit that is fixed on the wafer on plummer, to described integrated circuit, apply test signal, to judge that whether its electric property is good.Fig. 1 is the structural representation of test probe platform in prior art, as shown in Figure 1, test probe platform comprises plummer (chuck) 10 and probe 11, in probe 11, be provided with several probes, in test process, probe 11 is fixed on to (not shown) on a levelling bench, keeps probe 11 motionless; On plummer 10, place wafer (wafer) 12, plummer 10 can move along X, Y, Z direction, and wafer is contacted with the probe of probe 11 belows, reaches the object of test wafer.
But, because a test probe platform can only be used a probe at every turn, also can only place a wafer on plummer, so once can only test a wafer, testing efficiency is very low.Situation about need to test as early as possible if there is considerable wafer, can affect the shipment of product.At present, in order to improve testing efficiency, can only buy new test probe platform and optimize as much as possible test formula, but consider utilization factor and the cost of test probe platform, the quantity of buying test probe platform can be very limited, and because product is being constantly updated, can not very effective long-term raising testing efficiency.That is to say, due to the restriction of test probe platform function, cannot improve testing efficiency, and method that utilize to revise test formula is also and be not suitable for all products, DeGrain not only, and increase manpower burden, and may need modification repeatedly.
Utility model content
The purpose of this utility model is to provide a kind of test probe platform, for solving the problem of prior art wafer sort inefficiency.
For achieving the above object and other relevant objects, the utility model provides a kind of test probe platform, it comprises: plummer and two probe, the upper surface of described plummer and lower surface are all fixed with wafer, described probe lays respectively at the both sides of described plummer, so that described plummer upper surface and the fixing wafer of lower surface are tested.
Optionally, on the lower surface of described plummer, be provided with a plurality of adsorption holes.
Optionally, described a plurality of adsorption hole is uniformly distributed in the lower surface of described plummer.
Optionally, described plummer is connected with vacuum-pumping system and gas directing system by breather line.
Optionally, the edge of described plummer side is provided with stationary installation, to fix the wafer of described plummer lower surface.
Optionally, described stationary installation comprises interconnective fixed part and clamping part, and described fixed position is in the side of plummer, and described clamping part is held on the wafer of described plummer lower surface.
Optionally, the number of the stationary installation on described plummer is more than or equal to 3.
Optionally, be provided with four stationary installations on described plummer, described four stationary installations are clamped in position on wafer 90 degree of being respectively separated by.
Compared with prior art, the beneficial effect of test probe platform provided by the utility model is:
1, by fixing wafer and probe is set on the lower surface of plummer, on a test probe platform, can test two wafer simultaneously, improve the testing efficiency of wafer, improve the utilization factor of idle probe simultaneously;
2, the test probe platform that the utility model provides can carry out hardware modifications on the basis of existing test probe platform, without buying new device, has saved cost, and probe is without doing any change, need the place of change few, reduced failure rate, improved feasibility.
Accompanying drawing explanation
Fig. 1 is the structural representation of test probe platform in prior art.
The structural representation of the test probe platform that Fig. 2 provides for the utility model one embodiment.
The position relationship schematic diagram of plummer stationary installation and wafer in the test probe platform that Fig. 3 provides for the utility model one embodiment.
Embodiment
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail.
The utility model can utilize multiple substitute mode to realize; below by preferred embodiment, be illustrated; certainly the utility model is not limited to this specific embodiment, and the known general replacement of one of ordinary skilled in the art is encompassed in protection domain of the present utility model undoubtedly.
Secondly, the utility model utilizes schematic diagram to be described in detail, and when the utility model embodiment is described in detail in detail, for convenience of explanation, schematic diagram disobeys that general ratio is local amplifies, and should not using this as to restriction of the present utility model.
Please refer to Fig. 2, the structural representation of the test probe platform that it provides for the utility model one embodiment, as shown in Figure 2, described test probe platform comprises: plummer 20, the second probe 22 that is positioned at the first probe 21 of described plummer 20 1 sides and is positioned at described plummer opposite side, is respectively arranged with several probes in described the first probe 21 and the second probe 22.
During test, described the first probe 21 and the second probe 22 are separately fixed on a surface level, keep motionless; Equal fixing wafer in the upper and lower surface of described plummer 20, described plummer 20 along continuous straight runs move, and 21 pairs of the first wafers 23 of described the first probe are tested, and 22 pairs of the second wafers 24 of described the second probe are tested.
Compared with prior art, test probe platform provided by the utility model, downside at plummer 20 is provided with the second probe 22, for the second wafer 24 is tested, the to-and-fro movement that plummer is often done a sub-level just can realize on a test probe platform tests two wafer simultaneously, improved the testing efficiency of wafer, also can improve the utilization factor of idle probe simultaneously.
In the present embodiment, for fixing on the lower surface of plummer 20 of the second wafer 24, be provided with a plurality of adsorption hole (not shown)s; Described plummer 20 (not shown) that is connected with vacuum-pumping system and gas directing system by breather line, when test wafer, adopt vacuum-pumping system by the inner vacuum pumping of described plummer 20, by adsorption hole, hold the second wafer 24 that is positioned at plummer 20 lower surfaces, guarantee between the second wafer 24 and the lower surface of plummer 20 very close to each other; After completing wafer sort, adopt gas directing system to pass into gas to described plummer 20 inside, remove the vacuum of described plummer 20 inside, the adsorptive power of adsorption hole is eliminated, thereby can take off the second wafer 24.Same, at the upper surface of described plummer 20, also adsorption hole can be set, make between the first wafer 23 and the upper surface of described plummer 20 very close to each otherly, improve the precision of testing.In preferred version, described adsorption hole is uniformly distributed in the upper and lower surface of described plummer 20, guarantees that wafer is stressed even everywhere.
In order to guarantee the safety of described the second wafer 24, the edge in plummer 20 sides is provided with stationary installation 25, for fixing the second wafer 24 of lower surface.In the present embodiment, described stationary installation 25 comprises interconnective fixed part 25a and clamping part 25b, described fixed part 25a is fixed on the side of described plummer 20, described clamping part 25b is connected with described fixed part 25a, and can rotate with respect to fixed part 25a, when the lower surface of described plummer 20 is not placed wafer, described clamping part 25b and described fixed part 25a are positioned on straight line, when the lower surface of described supporting part 20 is fixedly during wafer, described clamping part 25b is clamped on the second wafer 24 that is positioned at supporting part 20 lower surfaces.
Consider firm contact of described the second wafer 24 and described plummer 20 lower surfaces, the number of the stationary installation 25 on described plummer 20 is preferably greater than and equals 3, in the present embodiment, described stationary installation 25 is four, lays respectively on four sides of described plummer 20.The position relationship schematic diagram of plummer stationary installation and wafer in the test probe platform that Fig. 3 provides for the utility model one embodiment, as shown in Figure 3, clamping part 25b in stationary installation divides four positions to clamp the second wafer 24, the position of described clamping part 25b on described the second wafer 24 90 degree of being respectively separated by.
Below in conjunction with Fig. 2 and Fig. 3, describe the using method of test probe platform provided by the utility model in detail.
First, described clamping part 25b and described fixed part 25a are positioned on straight line, lower surface joint by the second wafer 24 with described plummer 20, then rotate described clamping part 25b, clamping part 25b is clamped on the second wafer 24, guarantees that described the second wafer 24 is fixed on the lower surface of described plummer 20; Then, adopt vacuum-pumping system by the inner vacuum pumping of described plummer 20, by adsorption hole, hold the lower surface that the back side that wafer 25 makes wafer 25 can tightly be attached to described plummer 20; Then mobile described plummer 20, contacts the integrated circuit on wafer 25 with the probe of the second probe 22 belows, and wafer 25 is tested; After having tested, adopt gas directing system to pass into gas to described plummer 20 inside, remove the vacuum state of described plummer 20 inside, then rotate described clamping part 20b, take off the second wafer 24, complete the test of a wafer.It should be noted that, in the process of test the second wafer 24, also complete the test to the first wafer 23 simultaneously.
In sum, by fixing wafer and probe is set on the lower surface of plummer, on a test probe platform, can test two wafer simultaneously, improve the testing efficiency of wafer, improve the utilization factor of idle probe simultaneously; The test probe platform that the utility model provides can carry out hardware modifications on the basis of existing test probe platform, without buying new device, has saved cost, and probe is without doing any change, need the place of change few, reduced failure rate, improved feasibility.
Foregoing description is only the description to the utility model preferred embodiment; the not any restriction to the utility model scope; any change, modification that the those of ordinary skill in the utility model field is done according to above-mentioned disclosure, all belong to the protection domain of claims.

Claims (9)

1. a test probe platform, it is characterized in that, comprise plummer and two probe, the upper surface of described plummer and lower surface are all fixed with wafer, described probe lays respectively at the both sides of described plummer, so that described plummer upper surface and the fixing wafer of lower surface are tested.
2. test probe platform as claimed in claim 1, is characterized in that, is provided with a plurality of adsorption holes on the lower surface of described plummer.
3. test probe platform as claimed in claim 2, is characterized in that, described a plurality of adsorption holes are uniformly distributed in the lower surface of described plummer.
4. test probe platform as claimed in claim 3, is characterized in that, described plummer is connected with vacuum-pumping system and gas directing system by breather line.
5. test probe platform as claimed in claim 1, is characterized in that, the edge of described plummer side is provided with stationary installation, to fix the wafer of described plummer lower surface.
6. test probe platform as claimed in claim 5, is characterized in that, described stationary installation comprises interconnective fixed part and clamping part, and described fixed position is in the side of described plummer, and described clamping part is clamped on the wafer of described plummer lower surface.
7. test probe platform as claimed in claim 6, is characterized in that, the number of the stationary installation on described plummer is more than or equal to 3.
8. test probe platform as claimed in claim 7, is characterized in that, is provided with four stationary installations on described plummer.
9. test probe platform as claimed in claim 8, is characterized in that, described four stationary installations are clamped in position on wafer 90 degree of being respectively separated by.
CN201420235134.7U 2014-05-08 2014-05-08 Test probe station Expired - Fee Related CN203811645U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420235134.7U CN203811645U (en) 2014-05-08 2014-05-08 Test probe station

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Application Number Priority Date Filing Date Title
CN201420235134.7U CN203811645U (en) 2014-05-08 2014-05-08 Test probe station

Publications (1)

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CN203811645U true CN203811645U (en) 2014-09-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112014711A (en) * 2020-09-22 2020-12-01 东莞市凯迪微清洗技术有限公司 Wafer probe station
CN112435955A (en) * 2019-08-26 2021-03-02 合肥晶合集成电路股份有限公司 Supporting device for wafer splinters and fixing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112435955A (en) * 2019-08-26 2021-03-02 合肥晶合集成电路股份有限公司 Supporting device for wafer splinters and fixing method thereof
CN112435955B (en) * 2019-08-26 2024-04-16 合肥晶合集成电路股份有限公司 Wafer crack supporting device and fixing method thereof
CN112014711A (en) * 2020-09-22 2020-12-01 东莞市凯迪微清洗技术有限公司 Wafer probe station

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140903

Termination date: 20190508