CN203134760U - Diode packaging equipment - Google Patents

Diode packaging equipment Download PDF

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Publication number
CN203134760U
CN203134760U CN 201320133445 CN201320133445U CN203134760U CN 203134760 U CN203134760 U CN 203134760U CN 201320133445 CN201320133445 CN 201320133445 CN 201320133445 U CN201320133445 U CN 201320133445U CN 203134760 U CN203134760 U CN 203134760U
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CN
China
Prior art keywords
conveying mechanism
diode package
support
glue applying
package equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320133445
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Chinese (zh)
Inventor
王敕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGSHU AIKERUIS PACKAGING AUTOMATION EQUIPMENT CO LTD
Original Assignee
CHANGSHU AIKERUIS PACKAGING AUTOMATION EQUIPMENT CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by CHANGSHU AIKERUIS PACKAGING AUTOMATION EQUIPMENT CO LTD filed Critical CHANGSHU AIKERUIS PACKAGING AUTOMATION EQUIPMENT CO LTD
Priority to CN 201320133445 priority Critical patent/CN203134760U/en
Application granted granted Critical
Publication of CN203134760U publication Critical patent/CN203134760U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses diode packaging equipment which comprises a machine base; at least one conveying mechanism which is slidingly connected to the machine base; a driving mechanism which is arranged on the base and is used for driving the conveying mechanism to reach a plurality of working positions; a dispensing mechanism which is arranged on the machine base and is above the movement direction of the conveying mechanism, wherein the dispensing mechanism comprises at least one dispensing head; at least one mechanical hand mechanism which is slidingly or rotatingly connected to the machine base, wherein the above dispensing mechanism and at least one mechanical hand mechanism are orderly arranged along the movement direction of the above conveying mechanism to form the above working positions. According to the diode packaging equipment, the processing efficiency and the consistency of a diode finished product can be raised.

Description

A kind of diode package equipment
Technical field
The utility model relates to the semiconductor packaging field, particularly a kind of diode package equipment.
Background technology
In the encapsulation process of diode, chip being fitted between the upper and lower tablet of diode is a very important operation.
Realization for this operation in the tradition is to realize by artificial or half artificial mode mostly.Concrete execution mode is: first workman uses point gum machine to carry out a glue at following tablet, the following tablet that to put glue then moves to the next bit workman, this workman then carries out solid brilliant step this moment, generally be crystal grain (being chip) to be sieved to down on the some glue position of tablet by shaking tray, finish solid crystalline substance, Gu the semi-finished product that crystalline substance finishes move to the next bit workman again, this workman re-uses point gum machine and carries out a glue at last tablet, own or will go up tablet and this finished product is fitted by other people then, finish that chip is fitted to this operation between the upper and lower tablet of diode.
Now, brilliant machine also occurred much consolidating, it replaces the artificial solid crystal type of tradition by machine.Be that 102543801 Chinese patent application discloses a kind of solid brilliant machine as publication number, it has been installed solid brilliant motion, solid brilliant swing arm, solid brilliant nation head, some rubber moulding piece, has got brilliant motion etc. at a machine.During operation, Gu brilliant motion will descend tablet to move to solid brilliant position, getting brilliant motion moves to wafer and gets brilliant position, the following tablet that this time point rubber moulding piece is opposite on the solid brilliant motion carries out a glue operation, solid brilliant nation head drives solid brilliant swing arm and obtains on the some glue position that crystal grain places down crystal grain tablet then to getting brilliant position then, finishes solid crystalline substance.As seen, this solid brilliant machine tablet point glue under giving has been realized machine operation with solid brilliant these two steps.
Above-described existing in prior technology shortcoming is, traditional manual work mode, it needs 3-4 people to carry out operation at least, assist operation even use solid brilliant machine, also need 2-3 people to carry out operation at least, because though brilliant machine has only realized giving the machine operation of tablet point glue and solid these two steps of crystalline substance down, still need be by means of manually finishing for descending tablet to fit in down on tablet and the chip this step, so it remains bigger for expending of human resources.On the one hand, in today that human cost is expected to rise day by day and the recruitment famine occurred, many enterprises are all doing one's utmost to compress number of workers, control the cost expenditure of enterprise or the ordinary production of assurance enterprise, these above-mentioned operating types obviously are difficult to satisfy requirement of enterprise, and artificial or half artificial operating type, and its production efficiency obviously also is not high, and workman's mood just certainly will all can have influence on its work, makes the working (machining) efficiency instability; On the other hand, this artificial or half artificial operating type also can bring the conforming problem of product price, and dynamics inhomogeneous as a glue, that fit is not enough etc., and this inconsistent problem also can directly have influence on the quality of finished product.
Therefore, in order can be better the following tablet of diode to be fitted on the last tablet and chip that solid crystalline substance finishes, need a kind of equipment that can overcome above-mentioned shortcoming badly.
The utility model content
The purpose of this utility model is exactly at the problems referred to above, provides a kind of and can improve working (machining) efficiency and the conforming diode package equipment of diode finished product.
To achieve these goals, the utility model provides following technical scheme: a kind of diode package equipment, be used for the following tablet of diode is fitted in last tablet and the chip that solid crystalline substance finishes, and this sealed in unit comprises:
Support;
At least one conveying mechanism, it is slidingly connected on the above-mentioned support;
Driving mechanism, it is arranged on the above-mentioned support, is used for driving above-mentioned conveying mechanism and arrives a plurality of stations;
Glue applying mechanism, it is arranged on the above-mentioned support, the top of the above-mentioned conveying mechanism direction of motion, and this glue applying mechanism comprises at least one Glue dripping head;
At least one manipulator mechanism, it is slidingly connected and/or is rotationally connected with on the above-mentioned support;
Above-mentioned glue applying mechanism and at least one manipulator mechanism set gradually the above-mentioned a plurality of stations of formation along the direction of motion of above-mentioned conveying mechanism.
Further, above-mentioned sealed in unit also comprises shell, and it covers on the above-mentioned support, and this shell is provided with visual window.
Further, above-mentioned sealed in unit also comprises cutting agency, and it is set in turn in after the above-mentioned glue applying mechanism and manipulator mechanism, and this cutting agency comprises the material grasping manipulator.
Further, above-mentioned sealed in unit also comprises at least one pallet, and it is arranged on the above-mentioned conveying mechanism.
Again further, above-mentioned conveying mechanism comprises guide rail and is slidingly connected to slide on this guide rail.
Further, above-mentioned driving mechanism comprises a plurality of cylinders, and it is arranged on a plurality of positions of above-mentioned support at interval.
Further, above-mentioned glue applying mechanism also comprises the camera model corresponding with above-mentioned Glue dripping head.
Further, above-mentioned glue applying mechanism also comprises the transducer for detection of object, and it is electrically connected with this glue applying mechanism.
Adopt the beneficial effect of above technical scheme to be:
1) the utility model mainly comprises support, be slidingly connected to the conveying mechanism on the support, driving mechanism, glue applying mechanism and manipulator mechanism, wherein, glue applying mechanism and at least one manipulator mechanism all are arranged on the support, the top of the conveying mechanism direction of motion, they set gradually a plurality of stations of formation along the direction of motion of conveying mechanism, the semi-finished product (namely descending tablet and chip) that solid crystalline substance is finished place on the conveying mechanism, under the driving of driving mechanism, conveying mechanism is delivered to semi-finished product on the station of first glue applying mechanism chip on the tablet is down carried out a glue operation, be delivered to then on the station of manipulator mechanism, manipulator mechanism will be gone up tablet and place on the crystal grain, finish the encapsulation of whole diode, what can see is, this equipment in the diode package down tablet fit to that this operation has realized the machine operation on the semi-finished product that solid crystalline substance finishes, reduced artificial intensity on the one hand, whole device just wanted a workman to watch and cooperate to get final product, process with respect to the traditional workman of 2-3 at least, quantitatively carried out bigger reduction, just in time solved enterprise because human cost is expected to rise day by day and the worry that the recruitment famine is brought occurred, reduced manual intervention, guaranteed stable working (machining) efficiency, certainly also improved working (machining) efficiency, on the other hand, machine replaces artificial mode of operation and has also guaranteed consistency of product, has guaranteed the quality of finished product;
2) in the further embodiment of the utility model, above-mentioned sealed in unit also comprises shell, it covers on the support, and this shell is provided with visual window, can also make things convenient for the staff to observe inner operation situation when interior arrangement is protected;
3) in the further embodiment of the utility model, above-mentioned sealed in unit also comprises cutting agency, and it is arranged at the other end of support, and this cutting agency comprises the material grasping manipulator, is used for grasping the diode finished product of finishing encapsulation, convenient arrangement shipment;
4) in the further embodiment of the utility model, above-mentioned sealed in unit also comprises at least one pallet, and it is arranged on the conveying mechanism, is used for the drop target thing.
Description of drawings
Fig. 1 is the structural representation of angle before the diode package equipment of the present utility model.
Fig. 2 is the structural representation of diode package equipment depression angle of the present utility model.
Fig. 3 is the structural representation that diode package equipment of the present utility model adds casing.
Wherein, 1. support 2. conveying mechanisms 21. guide rails 22. slides 3. glue applying mechanism 31. Glue dripping heads 32. camera models 33. transducers 34. supports 41. manipulators 411. mechanical arms 412. grippers 42. bearings 5. shells 51. visual windows 61. material grasping manipulators 611. mechanical arms 612. grippers 62. bearings 7. pallets 8. cylinders.
Embodiment
Describe preferred implementation of the present utility model in detail below in conjunction with accompanying drawing.
As shown in Figure 1 and Figure 2, the diode package equipment in the present embodiment comprises: support 1; Conveying mechanism 2, it is slidingly connected on the support 1; Driving mechanism, it is arranged on the support 1, is used for driving conveying mechanism 2 and arrives a plurality of stations; Glue applying mechanism 3, it is arranged on the support 1, the top of conveying mechanism 2 directions of motion, and this glue applying mechanism 3 comprises two Glue dripping heads 31; Manipulator mechanism, it is slidingly connected and is rotationally connected with on the support 1, realize the motion of manipulator mechanism all directions, be slidingly connected and wait to realize by slide rail and slide are installed, be rotationally connected and wait to realize by articulated elements is installed, the connected mode of above-mentioned manipulator mechanism and support 1 also can be set to be slidingly connected or be rotationally connected, to satisfy the use needs in the practical operation; Above-mentioned glue applying mechanism 3 and manipulator mechanism set gradually the above-mentioned a plurality of stations of formation along the direction of motion of conveying mechanism 2.
Above-mentioned conveying mechanism 2 can also be set to more than one, adapts to more massive operation needs; Above-mentioned manipulator mechanism also can be set to more than one, adapts to more massive operation needs equally.
The quantity of above-mentioned Glue dripping head 31 also can be set to one or more than two, satisfies different operation needs, as the operation scale less then can only arrange one, then can arrange more than two as operation is larger, should arrange one at least.
As shown in Figure 1, above-mentioned manipulator mechanism comprises manipulator 41 and bearing 42.This manipulator 41 comprises mechanical arm 411 and gripper 412.Bearing 42 is slidingly connected with support 1, and mechanical arm 411 is rotationally connected with bearing 42, can realize the motion of more than 41 direction of manipulator like this.
As shown in Figure 3, above-mentioned sealed in unit also comprises shell 5, and it covers on the support 1, and this shell 5 is provided with visual window 51, and visual window 51 can be offered a fan or many fans.
As shown in Figure 1 and Figure 2, above-mentioned sealed in unit also comprises cutting agency, and the other end that it is arranged at support 1 is used for the diode that encapsulation is finished is carried out blanking and readjusting operations, and this cutting agency comprises material grasping manipulator 61, has also comprised bearing 62.This material grasping manipulator 61 comprises mechanical arm 611 and gripper 612.Bearing 62 is slidingly connected with support 1, and mechanical arm 611 is rotationally connected with bearing 62, can realize the motion of a plurality of directions of manipulator like this.
As shown in Figure 1, above-mentioned sealed in unit also comprises a pallet 7, and it is arranged on the conveying mechanism 2, is used for taking up workpiece.
As shown in Figure 1 and Figure 2, above-mentioned conveying mechanism 2 comprises guide rail 21 and is slidingly connected to slide 22 on this guide rail, makes conveying mechanism 2 to slide.Guide rail 21 and slide 22 also can replace implementing with modes of being slidingly connected well known in the prior art such as chute and slide blocks.
As shown in Figure 1, above-mentioned driving mechanism comprises two cylinders 8, and it is arranged on two positions of support 1 at interval.
How much quantity of above-mentioned cylinder 11 should according to the adjusting of station, but at least all more than one.
As shown in Figure 1 and Figure 2, glue applying mechanism 3 also comprises the camera model 32 corresponding with Glue dripping head 31, the accuracy of the some glue position that camera model 32 can guarantee point gluing mechanism 3.Glue applying mechanism 3 can also comprise support 31.
As shown in Figure 1, the first above-mentioned glue applying mechanism 3 also comprises the transducer 33 for detection of object, and it is electrically connected with this first glue applying mechanism 3, can enter rear drive glue applying mechanism 3 and come workpiece is carried out a glue detecting workpiece.This transducer 33 can adopt transducers more well known in the prior art such as infrared ray sensor to implement.
Introduce operation principle of the present utility model below:
The semi-finished product (i.e. applying following tablet and chip together) that solid crystalline substance is finished place on the conveying mechanism 2, under the driving of driving mechanism, conveying mechanism 2 is delivered to these semi-finished product on the station of glue applying mechanism 3 chip on it is carried out a glue operation, the semi-finished product that some glue is finished continue to be transported on the station of manipulator mechanism, manipulator mechanism will be gone up tablet and place down on the chip on the tablet, finish the applying of tablet and following tablet, chip, make crystal grain can be fitted between the upper and lower tablet.
The beneficial effect of above-described embodiment is:
1) the utility model mainly comprises support, be slidingly connected to the conveying mechanism on the support, driving mechanism, glue applying mechanism and manipulator mechanism, wherein, glue applying mechanism and at least one manipulator mechanism all are arranged on the support, the top of the conveying mechanism direction of motion, they set gradually a plurality of stations of formation along the direction of motion of conveying mechanism, the semi-finished product (namely descending tablet and chip) that solid crystalline substance is finished place on the conveying mechanism, under the driving of driving mechanism, conveying mechanism is delivered to semi-finished product on the station of first glue applying mechanism chip on the tablet is down carried out a glue operation, be delivered to then on the station of manipulator mechanism, manipulator mechanism will be gone up tablet and place on the crystal grain, finish the encapsulation of whole diode, what can see is, this equipment in the diode package down tablet fit to that this operation has realized the machine operation on the semi-finished product that solid crystalline substance finishes, reduced artificial intensity on the one hand, whole device just wanted a workman to watch and cooperate to get final product, process with respect to the traditional workman of 2-3 at least, quantitatively carried out bigger reduction, just in time solved enterprise because human cost is expected to rise day by day and the worry that the recruitment famine is brought occurred, reduced manual intervention, guaranteed stable working (machining) efficiency, certainly also improved working (machining) efficiency, on the other hand, machine replaces artificial mode of operation and has also guaranteed consistency of product, has guaranteed the quality of finished product;
2) in the further embodiment of the utility model, above-mentioned sealed in unit also comprises shell, it covers on the support, and this shell is provided with visual window, can also make things convenient for the staff to observe inner operation situation when interior arrangement is protected;
3) in the further embodiment of the utility model, above-mentioned sealed in unit also comprises cutting agency, and it is arranged at the other end of support, and this cutting agency comprises the material grasping manipulator, is used for grasping the diode finished product of finishing encapsulation, convenient arrangement shipment;
4) in the further embodiment of the utility model, above-mentioned sealed in unit also comprises at least one pallet, and it is arranged on the conveying mechanism, is used for the drop target thing.
The utility model other NM contents are all can be learnt in the prior art, does not therefore repeat them here.
Above-described only is preferred implementation of the present utility model; should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not break away from the utility model creation design; can also make some distortion and this advances, these all belong to protection range of the present utility model.

Claims (8)

1. a diode package equipment is used for the following tablet of diode is fitted in last tablet and the chip that solid crystalline substance finishes, and it is characterized in that: described sealed in unit comprises:
Support;
At least one conveying mechanism, it is slidingly connected on the described support;
Driving mechanism, it is arranged on the described support, is used for driving described conveying mechanism and arrives a plurality of stations;
Glue applying mechanism, it is arranged on the described support, the top of the described conveying mechanism direction of motion, and described glue applying mechanism comprises at least one Glue dripping head;
At least one manipulator mechanism, it is slidingly connected and/or is rotationally connected with on the described support;
Described glue applying mechanism and at least one manipulator mechanism set gradually the described a plurality of stations of formation along the direction of motion of described conveying mechanism.
2. diode package equipment according to claim 1, it is characterized in that: described sealed in unit also comprises shell, and it covers on the described support, and described shell is provided with visual window.
3. diode package equipment according to claim 1, it is characterized in that: described sealed in unit also comprises cutting agency, and it is set in turn in after described glue applying mechanism and the manipulator mechanism, and described cutting agency comprises the material grasping manipulator.
4. diode package equipment according to claim 1, it is characterized in that: described sealed in unit also comprises at least one pallet, it is arranged on the described conveying mechanism.
5. according to claim 1 or 4 described diode package equipment, it is characterized in that: described conveying mechanism comprises guide rail and is slidingly connected to slide on the described guide rail.
6. diode package equipment according to claim 1, it is characterized in that: described driving mechanism comprises a plurality of cylinders, it is arranged on a plurality of positions of described support at interval.
7. diode package equipment according to claim 1, it is characterized in that: described glue applying mechanism also comprises the camera model corresponding with described Glue dripping head.
8. according to claim 1 or 7 described diode package equipment, it is characterized in that: described glue applying mechanism also comprises the transducer for detection of object, and it is electrically connected with described glue applying mechanism.
CN 201320133445 2013-03-22 2013-03-22 Diode packaging equipment Expired - Fee Related CN203134760U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320133445 CN203134760U (en) 2013-03-22 2013-03-22 Diode packaging equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320133445 CN203134760U (en) 2013-03-22 2013-03-22 Diode packaging equipment

Publications (1)

Publication Number Publication Date
CN203134760U true CN203134760U (en) 2013-08-14

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ID=48942711

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320133445 Expired - Fee Related CN203134760U (en) 2013-03-22 2013-03-22 Diode packaging equipment

Country Status (1)

Country Link
CN (1) CN203134760U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151272A (en) * 2013-03-22 2013-06-12 常熟艾科瑞思封装自动化设备有限公司 Diode packaging device
CN103529054A (en) * 2013-10-12 2014-01-22 四川蓝彩电子科技有限公司 Diode/triode appearance inspection and packaging device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151272A (en) * 2013-03-22 2013-06-12 常熟艾科瑞思封装自动化设备有限公司 Diode packaging device
CN103151272B (en) * 2013-03-22 2016-07-06 江苏艾科瑞思封装自动化设备有限公司 A kind of diode encapsulation device
CN103529054A (en) * 2013-10-12 2014-01-22 四川蓝彩电子科技有限公司 Diode/triode appearance inspection and packaging device
CN103529054B (en) * 2013-10-12 2015-08-26 四川蓝彩电子科技有限公司 Diode/triode appearance detects and packaging system

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130814

Termination date: 20170322