CN103151272B - A kind of diode encapsulation device - Google Patents
A kind of diode encapsulation device Download PDFInfo
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- CN103151272B CN103151272B CN201310094028.1A CN201310094028A CN103151272B CN 103151272 B CN103151272 B CN 103151272B CN 201310094028 A CN201310094028 A CN 201310094028A CN 103151272 B CN103151272 B CN 103151272B
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 61
- 239000011265 semifinished product Substances 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 230000000007 visual effect Effects 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 10
- 230000007115 recruitment Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010068 moulding (rubber) Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008451 emotion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The invention discloses a kind of diode encapsulation device, comprising: support；At least one conveying mechanism, it is slidably connected on above-mentioned support；Driving mechanism, it is arranged on above-mentioned support, for driving above-mentioned conveying mechanism to arrive multiple stations；Glue applying mechanism, it is arranged on above-mentioned support, the top of the above-mentioned conveying mechanism direction of motion, and this glue applying mechanism includes at least one Glue dripping head；At least one manipulator mechanism, it is slidably connected and/or is rotationally connected with on above-mentioned support；Above-mentioned glue applying mechanism and at least one manipulator mechanism set gradually along the direction of motion of above-mentioned conveying mechanism and form above-mentioned multiple stations.The present invention can improve working (machining) efficiency and improve the concordance of diode finished product.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, particularly to a kind of diode encapsulation device.
Background technology
In the encapsulation process of diode, being fitted to by chip between the upper and lower tablet of diode is a very important operation.
Tradition is realized by artificial or semi-artificial mode for the realization of this operation mostly.Specific embodiment is: first workman uses point gum machine to carry out a glue on lower tablet, then the lower tablet having put glue is moved to next bit workman, this workman now then carries out die bond step, generally by shaking tray, crystal grain (i.e. chip) is sieved on the some glue position of lower tablet, complete die bond, the complete semi-finished product of die bond move to next bit workman again, this workman re-uses point gum machine and carries out a glue on upper tablet, then oneself or by other people by upper tablet and the laminating of this finished product, complete to fit to chip this operation between the upper and lower tablet of diode.
Now, also occurring in that a lot of bonder, it replaces the die bond mode of Traditional Man by machine.Chinese patent application if publication number is 102543801 discloses a kind of bonder, and it is mounted with die bond motion, die bond swing arm, die bond nation head, some rubber moulding block on a machine, takes brilliant motion etc..During operation, lower tablet is moved to die bond position by die bond motion, take brilliant motion to be moved to by wafer and take brilliant position, the lower tablet that this time point rubber moulding block is opposite on die bond motion carries out a glue operation, then die bond nation head drives die bond swing arm to be then placed in by crystal grain on the some glue position of lower tablet to taking brilliant position acquirement crystal grain, completes die bond.Visible, this bonder is achieving machine operation to lower tablet point glue and die bond the two step.
Shortcoming existing for above-described prior art is in that, traditional manual work mode, it at least needs 3-4 people to carry out operation, even if using bonder to assist operation, also 2-3 people is at least needed to carry out operation, because bonder only achieves the machine operation to lower tablet point glue and die bond the two step, and needs for by means of manually completing for lower tablet fits in this step on lower tablet and chip, therefore it remains relatively larger for the consuming of human resources.On the one hand, day by day it is expected to rise in human cost and today that recruitment is waste occurs, many enterprises are all in compression number of workers of doing one's utmost, control the cost payout of enterprise or ensure the normal production of enterprise, these above-mentioned operating types are obviously difficult to meet the demand of enterprise, and artificial or semi-artificial operating type, its production efficiency is obviously also not high, and the emotion height of workman all certainly will can have influence on its work so that working (machining) efficiency is unstable；On the other hand, this artificial or semi-artificial operating type also brings along the conforming problem of product price, and dynamics as uneven in a glue, laminating is inadequate, and this inconsistent problem also can directly influence the quality of finished product.
Therefore, in order to fitted on the complete upper tablet of die bond and chip by the lower tablet of diode better, a kind of equipment that can overcome disadvantages mentioned above is needed badly.
Summary of the invention
The purpose of the present invention is aiming at the problems referred to above, it is provided that one can improve working (machining) efficiency and the conforming diode encapsulation device of diode finished product.
To achieve these goals, the invention provides techniques below scheme: a kind of diode encapsulation device, for the lower tablet of diode is fitted in the complete upper tablet of die bond and chip, this sealed in unit includes:
Support；
At least one conveying mechanism, it is slidably connected on above-mentioned support；
Driving mechanism, it is arranged on above-mentioned support, for driving above-mentioned conveying mechanism to arrive multiple stations；
Glue applying mechanism, it is arranged on above-mentioned support, the top of the above-mentioned conveying mechanism direction of motion, and this glue applying mechanism includes at least one Glue dripping head；
At least one manipulator mechanism, it is slidably connected and/or is rotationally connected with on above-mentioned support；
Above-mentioned glue applying mechanism and at least one manipulator mechanism set gradually along the direction of motion of above-mentioned conveying mechanism and form above-mentioned multiple stations.
Further, above-mentioned sealed in unit also includes shell, and it covers on above-mentioned support, and this shell is provided with visual window.
Further, above-mentioned sealed in unit also includes cutting agency, and after it is set in turn in above-mentioned glue applying mechanism and manipulator mechanism, this cutting agency includes material grasping mechanical hand.
Further, above-mentioned sealed in unit also includes at least one pallet, and it is arranged on above-mentioned conveying mechanism.
Yet further, above-mentioned conveying mechanism includes guide rail and is slidably connected to the slide on this guide rail.
Further, above-mentioned driving mechanism includes multiple cylinder, and it is arranged at intervals on multiple positions of above-mentioned support.
Further, above-mentioned glue applying mechanism also includes the camera model corresponding with above-mentioned Glue dripping head.
Further, above-mentioned glue applying mechanism also includes the sensor for detecting object, and it electrically connects with this glue applying mechanism.
Adopt having the beneficial effects that of above technical scheme:
null1) the invention mainly comprises support、It is slidably connected to the conveying mechanism on support、Driving mechanism、Glue applying mechanism and manipulator mechanism，Wherein，Glue applying mechanism and at least one manipulator mechanism may be contained within support、The top of the conveying mechanism direction of motion，They set gradually the multiple stations of formation along the direction of motion of conveying mechanism，Semi-finished product (namely descending tablet and chip) complete for die bond are placed on conveying mechanism，Under the driving of driving mechanism，Semi-finished product are delivered on the station of the first glue applying mechanism to the chip on lower tablet and carry out a glue operation by conveying mechanism，It is then sent on the station of manipulator mechanism，Upper tablet is placed on crystal grain by manipulator mechanism，Complete the encapsulation of whole diode，It is seen that，Tablet lower in diode package is fitted to this operation on the semi-finished product that die bond is complete and achieves robotic operations by this equipment，Reduce artificial intensity on the one hand，Whole equipment has only to a workman to carry out watching and cooperating，It is processed relative to traditional at least 2-3 workman，Quantitatively carry out bigger reduction，Just solve enterprise because human cost is day by day expected to rise and the worry that recruitment famine is brought occurs，Decrease manual intervention，Ensure that stable working (machining) efficiency，Certainly working (machining) efficiency is also improved，On the other hand，Machine replaces artificial mode of operation and also ensure that the concordance of product，Ensure that the quality of finished product；
2) in further embodiment of the present invention, above-mentioned sealed in unit also includes shell, and it covers on support, and this shell is provided with visual window, it is possible to staff can also be facilitated while interior arrangement is protected to observe the handling situations of inside；
3) in further embodiment of the present invention, above-mentioned sealed in unit also includes cutting agency, and it is arranged at the other end of support, and this cutting agency includes material grasping mechanical hand, for having captured the diode finished product of encapsulation, conveniently arranges shipment；
4) in further embodiment of the present invention, above-mentioned sealed in unit also includes at least one pallet, and it is arranged on conveying mechanism, for drop target thing.
Accompanying drawing explanation
Fig. 1 is the structural representation of the diode encapsulation device front viewing angle of the present invention.
Fig. 2 is the structural representation of the diode encapsulation device depression angle of the present invention.
Fig. 3 is the structural representation that the diode encapsulation device of the present invention adds casing.
Wherein, 1. support 2. conveying mechanism 21. guide rail 22. slide 3. glue applying mechanism 31. Glue dripping head 32. camera model 33. sensor 34. support 41. mechanical hand 411. mechanical arm 412. gripper 42. bearing 5. shell 51. visual window 61. material grasping mechanical hand 611. mechanical arm 612. gripper 62. bearing 7. pallet 8. cylinder.
Detailed description of the invention
The preferred embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
As shown in Figure 1 and Figure 2, the diode encapsulation device in the present embodiment includes: support 1；Conveying mechanism 2, it is slidably connected on support 1；Driving mechanism, it is arranged on support 1, is used for driving conveying mechanism 2 to arrive multiple station；Glue applying mechanism 3, it is arranged on support 1, the top of conveying mechanism 2 direction of motion, and this glue applying mechanism 3 includes two Glue dripping heads 31；Manipulator mechanism, it is slidably connected and is rotationally connected with on support 1, realize the motion of manipulator mechanism all directions, it is slidably connected and can be realized by installation slide rail and slide etc., it is rotationally connected and can be realized by installation articulated elements etc., the connected mode of above-mentioned manipulator mechanism and support 1 is it can also be provided that be slidably connected or be rotationally connected, to meet the use needs in practical operation；Above-mentioned glue applying mechanism 3 and manipulator mechanism set gradually along the direction of motion of conveying mechanism 2 and form above-mentioned multiple stations.
Above-mentioned conveying mechanism 2 may be arranged as more than one, adapts to more massive operation needs；Above-mentioned manipulator mechanism it can also be provided that more than one, adapts to more massive operation needs equally.
The quantity of above-mentioned Glue dripping head 31, it can also be provided that one or more than two, meets different operation needs, as cultivation scale is less, can only arrange one, as cultivation scale then can arrange two or more relatively greatly, at least should arrange one.
As it is shown in figure 1, above-mentioned manipulator mechanism includes mechanical hand 41 and bearing 42.This mechanical hand 41 includes mechanical arm 411 and gripper 412.Bearing 42 and support 1 are slidably connected, and mechanical arm 411 and bearing 42 are rotationally connected, and so can realize the motion of mechanical hand 41 multiple directions.
As it is shown on figure 3, above-mentioned sealed in unit also includes shell 5, it covers on support 1, and this shell 5 is provided with visual window 51, and visual window 51 can be offered a fan or fan more.
As shown in Figure 1 and Figure 2, above-mentioned sealed in unit also includes cutting agency, and it is arranged at the other end of support 1, is used for the diode encapsulated is carried out blanking and readjusting operations, and this cutting agency includes material grasping mechanical hand 61, further comprises bearing 62.This material grasping mechanical hand 61 includes mechanical arm 611 and gripper 612.Bearing 62 and support 1 are slidably connected, and mechanical arm 611 and bearing 62 are rotationally connected, and so can realize the motion of mechanical hand multiple directions.
As it is shown in figure 1, above-mentioned sealed in unit also includes a pallet 7, it is arranged on conveying mechanism 2, is used for taking up workpiece.
As shown in Figure 1 and Figure 2, above-mentioned conveying mechanism 2 includes guide rail 21 and the slide 22 being slidably connected on this guide rail, and conveying mechanism 2 can be slided.Guide rail 21 and slide 22 can also replace implementing by the mode of being slidably connected well known in the prior art such as chute and slide block.
As it is shown in figure 1, above-mentioned driving mechanism includes two cylinders 8, it is arranged at intervals on two positions of support 1.
The quantity of above-mentioned cylinder 11 should be adjusted according to the number of station, but is at least all more than one.
As shown in Figure 1 and Figure 2, glue applying mechanism 3 also includes the camera model 32 corresponding with Glue dripping head 31, and camera model 32 can ensure that the accuracy of the some glue position of glue applying mechanism 3.Glue applying mechanism 3 can also include support 31.
As it is shown in figure 1, the first above-mentioned glue applying mechanism 3 also includes the sensor 33 for detecting object, it electrically connects with this first glue applying mechanism 3, it is possible to detecting that workpiece enters rear drive glue applying mechanism 3 and workpiece is carried out a glue.This sensor 33 can adopt the sensors more well known in the prior art such as infrared ray sensor to be carried out.
The operation principle of the present invention is described below:
Semi-finished product (namely fit lower tablet together and chip) complete for die bond are placed on conveying mechanism 2, under the driving of driving mechanism, by these semi-finished product, the chip being delivered on the station of glue applying mechanism 3 on which carries out a glue operation to conveying mechanism 2, the semi-finished product that some glue completes continue to be transported on the station of manipulator mechanism, upper tablet is placed on the chip on lower tablet by manipulator mechanism, complete the laminating of tablet and lower tablet, chip so that crystal grain can be fitted between upper and lower tablet.
Having the beneficial effects that of above-described embodiment:
null1) the invention mainly comprises support、It is slidably connected to the conveying mechanism on support、Driving mechanism、Glue applying mechanism and manipulator mechanism，Wherein，Glue applying mechanism and at least one manipulator mechanism may be contained within support、The top of the conveying mechanism direction of motion，They set gradually the multiple stations of formation along the direction of motion of conveying mechanism，Semi-finished product (namely descending tablet and chip) complete for die bond are placed on conveying mechanism，Under the driving of driving mechanism，Semi-finished product are delivered on the station of the first glue applying mechanism to the chip on lower tablet and carry out a glue operation by conveying mechanism，It is then sent on the station of manipulator mechanism，Upper tablet is placed on crystal grain by manipulator mechanism，Complete the encapsulation of whole diode，It is seen that，Tablet lower in diode package is fitted to this operation on the semi-finished product that die bond is complete and achieves robotic operations by this equipment，Reduce artificial intensity on the one hand，Whole equipment has only to a workman to carry out watching and cooperating，It is processed relative to traditional at least 2-3 workman，Quantitatively carry out bigger reduction，Just solve enterprise because human cost is day by day expected to rise and the worry that recruitment famine is brought occurs，Decrease manual intervention，Ensure that stable working (machining) efficiency，Certainly working (machining) efficiency is also improved，On the other hand，Machine replaces artificial mode of operation and also ensure that the concordance of product，Ensure that the quality of finished product；
2) in further embodiment of the present invention, above-mentioned sealed in unit also includes shell, and it covers on support, and this shell is provided with visual window, it is possible to staff can also be facilitated while interior arrangement is protected to observe the handling situations of inside；
3) in further embodiment of the present invention, above-mentioned sealed in unit also includes cutting agency, and it is arranged at the other end of support, and this cutting agency includes material grasping mechanical hand, for having captured the diode finished product of encapsulation, conveniently arranges shipment；
4) in further embodiment of the present invention, above-mentioned sealed in unit also includes at least one pallet, and it is arranged on conveying mechanism, for drop target thing.
The present invention other NM contents are all and are appreciated that in prior art, therefore do not repeat them here.
Above-described is only the preferred embodiment of the present invention, it is noted that for the person of ordinary skill of the art, without departing from the concept of the premise of the invention, it is also possible to making some deformation and this enters, these broadly fall into protection scope of the present invention.
Claims (8)
1. a diode encapsulation device, for fitting in the complete lower tablet of die bond and chip by the upper tablet of diode, it is characterised in that: described sealed in unit includes:
Support；
At least one conveying mechanism, it is slidably connected on described support；
Driving mechanism, it is arranged on described support, is used for driving described conveying mechanism to arrive multiple stations；
Glue applying mechanism, it is arranged on described support, the top of the described conveying mechanism direction of motion, and described glue applying mechanism includes at least one Glue dripping head；
At least one manipulator mechanism, it is slidably connected and/or is rotationally connected with on described support, and described manipulator mechanism includes mechanical hand and bearing, and described mechanical hand includes mechanical arm and gripper, described bearing and described support are slidably connected, and described mechanical arm and described bearing are rotationally connected；
Described glue applying mechanism and at least one manipulator mechanism set gradually the plurality of station of formation along the direction of motion of described conveying mechanism；
The lower tablet fitted together and chip are placed on conveying mechanism, under the driving of driving mechanism, the chip that this lower tablet and chip are delivered on the station of glue applying mechanism on which is carried out a glue operation by conveying mechanism, the semi-finished product that some glue completes continue to be transported on the station of manipulator mechanism, upper tablet is placed on the chip on lower tablet by manipulator mechanism, complete the laminating of tablet and lower tablet, chip so that crystal grain can be fitted between upper and lower tablet.
2. diode encapsulation device according to claim 1, it is characterised in that: described sealed in unit also includes shell, and it covers on described support, and described shell is provided with visual window.
3. diode encapsulation device according to claim 1, it is characterised in that: described sealed in unit also includes cutting agency, and after it is set in turn in described glue applying mechanism and manipulator mechanism, described cutting agency includes material grasping mechanical hand.
4. diode encapsulation device according to claim 1, it is characterised in that: described sealed in unit also includes at least one pallet, and it is arranged on described conveying mechanism.
5. the diode encapsulation device according to claim 1 or 4, it is characterised in that: described conveying mechanism includes guide rail and is slidably connected to the slide on described guide rail.
6. diode encapsulation device according to claim 1, it is characterised in that: described driving mechanism includes multiple cylinder, and it is arranged at intervals on multiple positions of described support.
7. diode encapsulation device according to claim 1, it is characterised in that: described glue applying mechanism also includes the camera model corresponding with described Glue dripping head.
8. the diode encapsulation device according to claim 1 or 7, it is characterised in that: described glue applying mechanism also includes the sensor for detecting object, and it electrically connects with described glue applying mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094028.1A CN103151272B (en) | 2013-03-22 | 2013-03-22 | A kind of diode encapsulation device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094028.1A CN103151272B (en) | 2013-03-22 | 2013-03-22 | A kind of diode encapsulation device |
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| CN103151272A CN103151272A (en) | 2013-06-12 |
| CN103151272B true CN103151272B (en) | 2016-07-06 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103311171B (en) * | 2013-06-14 | 2016-01-20 | 邹志峰 | Many suction heads chip fixed equipment |
| CN103594400B (en) * | 2013-11-29 | 2016-02-17 | 如皋市大昌电子有限公司 | A kind of axial diode chip automation chip filling production system |
| CN105921357A (en) * | 2016-06-07 | 2016-09-07 | 苏州天朋精密元器件有限公司 | Automatic adhesive dispensing device |
| CN108155129B (en) * | 2017-12-29 | 2024-07-26 | 山东才聚电子科技有限公司 | Welding die recycling's close piece mechanism |
| CN109368210B (en) * | 2018-11-29 | 2023-11-14 | 东莞市柏尔电子科技有限公司 | Swinging steering arrangement device for diode |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201644323U (en) * | 2009-12-22 | 2010-11-24 | 全方位自动化股份有限公司 | Automatic glue dispensing mechanism |
| CN102543801A (en) * | 2012-02-20 | 2012-07-04 | 常熟艾科瑞思封装自动化设备有限公司 | Die bonder |
| CN203134760U (en) * | 2013-03-22 | 2013-08-14 | 常熟艾科瑞思封装自动化设备有限公司 | Diode packaging equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201655772U (en) * | 2010-02-09 | 2010-11-24 | 东莞朗诚模具有限公司 | Full-automatic substrate arranging machine |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201644323U (en) * | 2009-12-22 | 2010-11-24 | 全方位自动化股份有限公司 | Automatic glue dispensing mechanism |
| CN102543801A (en) * | 2012-02-20 | 2012-07-04 | 常熟艾科瑞思封装自动化设备有限公司 | Die bonder |
| CN203134760U (en) * | 2013-03-22 | 2013-08-14 | 常熟艾科瑞思封装自动化设备有限公司 | Diode packaging equipment |
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Denomination of invention: A diode packaging device Effective date of registration: 20200909 Granted publication date: 20160706 Pledgee: Shanghai Pudong Development Bank Co., Ltd. Changshu sub branch Pledgor: SUZHOU ACCURACY INTELLIGENT EQUIPMENT Co.,Ltd. Registration number: Y2020320010142 |
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Date of cancellation: 20211112 Granted publication date: 20160706 Pledgee: Shanghai Pudong Development Bank Co., Ltd. Changshu sub branch Pledgor: SUZHOU ACCURACY ASSEMBLY AUTOMATION Co.,Ltd. Registration number: Y2020320010142 |