CN103594400B - A kind of axial diode chip automation chip filling production system - Google Patents

A kind of axial diode chip automation chip filling production system Download PDF

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Publication number
CN103594400B
CN103594400B CN201310624224.5A CN201310624224A CN103594400B CN 103594400 B CN103594400 B CN 103594400B CN 201310624224 A CN201310624224 A CN 201310624224A CN 103594400 B CN103594400 B CN 103594400B
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Prior art keywords
tin cream
conveyer belt
lead
graphite boat
chip
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CN201310624224.5A
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CN103594400A (en
Inventor
赵宇
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Rugao Dachang Electronics Co Ltd
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Rugao Dachang Electronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75611Feeding means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a kind of axial diode chip automation chip filling production system, mainly comprise lead to mechanism, scrape tin cream mechanism and chip filling mechanism; Described lead mainly comprises lead to machine, graphite boat and conveyer belt A to mechanism; Described tin cream mechanism of scraping mainly comprises conveyer belt B, liftout tank, fixed platform, top board and scrapes tin cream machine; Described chip filling mechanism mainly comprises screen plate, vacuum pump and connects tracheae; Described graphite boat to be delivered to the conveyer belt A in mechanism by lead and to scrape tin cream mechanism, then is delivered to chip filling mechanism by the conveyer belt B scraped in tin cream mechanism.The invention has the advantages that: graphite boat to be delivered to the conveyer belt A in mechanism by lead and to scrape tin cream mechanism, chip filling mechanism is delivered to again by the conveyer belt B scraped in tin cream mechanism, whole process is by tape transport and automatically scrape tin cream to lead-in wire, transport without the need to staff and scrape tin cream, staff under saving can be used as his use, and operating efficiency also improves simultaneously.

Description

A kind of axial diode chip automation chip filling production system
Technical field
The present invention relates to the filling of a kind of axial diode chip automation chip production system, specifically a kind of diode chip for backlight unit production system that can realize automatic management.
Background technology
Diode, also known as crystal diode, is called for short diode (diode), in addition, also has early stage vacuum electronic diode; It is a kind of can the electronic device of unidirectional conduction current.Have a PN junction two lead terminals in semiconductor diode inside, this electronic device, according to the direction of applied voltage, possesses the conductibility of unidirectional current.In general, crystal diode is one and sinters by p-type semiconductor and n-type semiconductor the p-n junction interface formed.Form space charge layer in the both sides at its interface, form built-in field.When applied voltage equals zero, to cause dissufion current equal with the drift current that caused by built-in field and be in electric equilibrium state for the concentration difference due to p-n junction both sides charge carrier, and this is also the diode characteristic under normality.
In the production technology of existing axial diode, its technological process is: lead is to-cDNA microarray-chip filling, and-----------plastic packaging-----------examine outward--and pack Post RDBMS in plating by lettering test in baking in gluing in pickling.
When carrying out chip filling, the mode of current employing is: lead is sequenced lead-in wire by graphite boat from staff to machine place is carried on workbench, again by staff first after the top of lead-in wire brushes one deck tin cream, then the chip screened be filled to brush on the lead-in wire of tin cream.When adopting such method to load, hand labor intensity is large, and this entire work flow needs to consume a large amount of staff, and operating efficiency is also lower simultaneously.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of diode chip for backlight unit mechanized production system that can realize automatic management.
In order to solve the problems of the technologies described above, technical scheme of the present invention is: a kind of axial diode chip automation chip filling production system, and its innovative point is: mainly comprise lead to mechanism, scrape tin cream mechanism and chip filling mechanism;
Described lead mainly comprises lead to machine, graphite boat and conveyer belt A to mechanism, at lead, the discharge outlet of machine is provided with graphite boat, graphite boat is evenly distributed with some fairleads;
Described tin cream mechanism of scraping mainly comprises conveyer belt B, liftout tank, fixed platform, top board and scrapes tin cream machine, described fixed platform is between the discharging opening and the charging aperture of conveyer belt B of conveyer belt A, the cavity holding roof movement is had in fixed platform, the lower end of top board is connected with liftout tank, liftout tank is not when working, fixed platform flushes with the position of conveyer belt A and conveyer belt B, is provided with and scrapes tin cream machine above top board;
Describedly scrape tin cream owner and will comprise guide rail and walk on stage, mobile scrape tin cream head, described movement is scraped tin cream head and is arranged on guide rail walks on stage, described movement is scraped tin cream head and is comprised head hoofing part and detent mechanism, web plate and scraper, described movement is scraped tin cream head and is driven by head hoofing part and detent mechanism and move along guide rail bearing of trend of walking on stage and locate, web plate has the hole corresponding with the fairlead on graphite boat, and described scraper moving direction is parallel with graphite boat throughput direction;
Described chip filling mechanism mainly comprises screen plate, vacuum pump and connects tracheae, and the lower end of described screen plate has the chip hole matched with fairlead on graphite boat, and the side of screen plate is connected with vacuum pump by connecting tracheae;
Described graphite boat to be delivered to the conveyer belt A in mechanism by lead and to scrape tin cream mechanism, then is delivered to chip filling mechanism by the conveyer belt B scraped in tin cream mechanism.
The invention has the advantages that: graphite boat to be delivered to the conveyer belt A in mechanism by lead and to scrape tin cream mechanism, chip filling mechanism is delivered to again by the conveyer belt B scraped in tin cream mechanism, whole process is by tape transport and automatically scrape tin cream to lead-in wire, transport without the need to staff and scrape tin cream, staff under saving can be used as his use, and operating efficiency also improves simultaneously.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of axial diode chip automation chip of the present invention filling production system.
Fig. 2 is the vertical view of the print cream machine of axial diode chip automation chip of the present invention filling production system.
Embodiment
Schematic diagram is as shown in Figure 1 known, diode chip for backlight unit mechanized production system of the present invention mainly comprise lead to mechanism, scrape tin cream mechanism and chip filling mechanism.
Lead mainly comprises lead to machine, graphite boat 2 and conveyer belt A1 to mechanism, at lead, the discharge outlet of machine is provided with graphite boat 2, graphite boat 2 is evenly distributed with some fairleads.
Scrape tin cream mechanism mainly comprise conveyer belt B6, liftout tank 4, fixed platform 7, top board 3 and scrape tin cream machine 5, fixed platform 7 is between the discharging opening and the charging aperture of conveyer belt B6 of conveyer belt A1, the cavity holding top board 3 activity is had at the medium position of fixed platform 7, be connected with liftout tank 4 in the lower end of top board 3, liftout tank 4 is not when working, fixed platform 7 flushes with the position of conveyer belt A1 and conveyer belt B6, is provided with and scrapes tin cream machine 5 above top board 3.
Schematic diagram is as shown in Figure 2 known, scrape tin cream owner will comprise guide rail and walk on stage 12, mobilely scrape tin cream head 11, mobile tin cream head 11 of scraping is arranged on guide rail and walks on stage on 12, movement is scraped tin cream head 11 and is comprised head hoofing part and detent mechanism 21, web plate 13 and scraper 22, mobile scrape tin cream head 11 by head hoofing part and detent mechanism 21 drive along guide rail walk on stage 12 bearing of trend move and locate, web plate 13 has the hole corresponding with the fairlead on graphite boat 2, and scraper 22 moving direction is parallel with the throughput direction of graphite boat 2.
Chip filling mechanism mainly comprises screen plate, vacuum pump and connects tracheae, and the lower end of screen plate has the chip hole matched with fairlead on graphite boat, and the side of screen plate is connected with vacuum pump by connecting tracheae.
When carrying out chip filling, to machine, the lead-in wire sequenced is distributed on graphite boat 2 by lead, the graphite boat 2 installing lead-in wire is delivered in fixed platform 7 by conveyer belt A1, by top board 3, the lead-in wire in graphite boat 2 is upwards ejected, by scraper 22, the tin cream on web plate 13 is scraped the top of the lead-in wire to graphite boat 2 from the hole web plate 13, top board 3 is descending again, lead-in wire falls in graphite boat 2, therefore will scrape tin cream by the graphite boat of conveying on conveyer belt A1 again and complete graphite boat top on conveyer belt B6, chip filling mechanism is delivered to by conveyer belt B6, utilize screen plate to be filled to by chip by staff to brush on the graphite boat 2 of tin cream.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.

Claims (1)

1. axial diode chip automation chip filling a production system, it is characterized in that: mainly comprise lead to mechanism, scrape tin cream mechanism and chip filling mechanism;
Described lead mainly comprises lead to machine, graphite boat and conveyer belt A to mechanism, at lead, the discharge outlet of machine is provided with graphite boat, graphite boat is evenly distributed with some fairleads;
Described tin cream mechanism of scraping mainly comprises conveyer belt B, liftout tank, fixed platform, top board and scrapes tin cream machine, described fixed platform is between the discharging opening and the charging aperture of conveyer belt B of conveyer belt A, the cavity holding roof movement is had in fixed platform, the lower end of top board is connected with liftout tank, liftout tank is not when working, fixed platform flushes with the position of conveyer belt A and conveyer belt B, is provided with and scrapes tin cream machine above top board;
Describedly scrape tin cream owner and will comprise guide rail and walk on stage, mobile scrape tin cream head, described movement is scraped tin cream head and is arranged on guide rail walks on stage, described movement is scraped tin cream head and is comprised head hoofing part and detent mechanism, web plate and scraper, described movement is scraped tin cream head and is driven by head hoofing part and detent mechanism and move along guide rail bearing of trend of walking on stage and locate, web plate has the hole corresponding with the fairlead on graphite boat, and described scraper moving direction is parallel with graphite boat throughput direction;
Described chip filling mechanism mainly comprises screen plate, vacuum pump and connects tracheae, and the lower end of described screen plate has the chip hole matched with fairlead on graphite boat, and the side of screen plate is connected with vacuum pump by connecting tracheae;
Described graphite boat to be delivered to the conveyer belt A in mechanism by lead and to scrape tin cream mechanism, then is delivered to chip filling mechanism by the conveyer belt B scraped in tin cream mechanism.
CN201310624224.5A 2013-11-29 2013-11-29 A kind of axial diode chip automation chip filling production system Active CN103594400B (en)

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Application Number Priority Date Filing Date Title
CN201310624224.5A CN103594400B (en) 2013-11-29 2013-11-29 A kind of axial diode chip automation chip filling production system

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CN103594400A CN103594400A (en) 2014-02-19
CN103594400B true CN103594400B (en) 2016-02-17

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Publication number Priority date Publication date Assignee Title
TWI566315B (en) * 2014-11-24 2017-01-11 均華精密工業股份有限公司 Wafer mounted apparatus with high yield and method thereof
CN109473386B (en) * 2018-12-28 2023-10-24 乐山希尔电子股份有限公司 Semiconductor device assembling method and production line thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151272A (en) * 2013-03-22 2013-06-12 常熟艾科瑞思封装自动化设备有限公司 Diode packaging device
CN203631504U (en) * 2013-11-29 2014-06-04 如皋市大昌电子有限公司 Automated chip filling production system for axial diode chips

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080041471A (en) * 2006-11-07 2008-05-13 삼성전자주식회사 A die bonder
KR100967526B1 (en) * 2008-04-25 2010-07-05 에스티에스반도체통신 주식회사 Apparatus for manufacturing semiconductor package for wide lead frame and method for constructing semiconductor package using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103151272A (en) * 2013-03-22 2013-06-12 常熟艾科瑞思封装自动化设备有限公司 Diode packaging device
CN203631504U (en) * 2013-11-29 2014-06-04 如皋市大昌电子有限公司 Automated chip filling production system for axial diode chips

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