CN103594400A - Automated chip filling production system of axial diode chips - Google Patents
Automated chip filling production system of axial diode chips Download PDFInfo
- Publication number
- CN103594400A CN103594400A CN201310624224.5A CN201310624224A CN103594400A CN 103594400 A CN103594400 A CN 103594400A CN 201310624224 A CN201310624224 A CN 201310624224A CN 103594400 A CN103594400 A CN 103594400A
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- Prior art keywords
- tin cream
- graphite boat
- conveyer belt
- chip filling
- solder paste
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/75611—Feeding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to an automated chip filling production system of axial diode chips. The automated chip filling production system of the axial diode chips mainly comprises a leading wire arranging mechanism, a solder paste scraping mechanism and a chip filling mechanism. The leading wire arranging mechanism mainly comprises a leading wire arranging machine, a graphite boat and a conveying belt A. The solder paste scraping mechanism mainly comprises a conveying belt B, an ejection cylinder, a fixing platform, an ejection plate and a solder paste scraping machine. The chip filling mechanism mainly comprises a screen plate, a vacuum pump and connecting air pipes. The graphite boat is conveyed to the solder paste scraping mechanism through the conveying belt A of the leading wire arranging mechanism, and then is conveyed to the chip filling mechanism through the conveying belt B of the solder paste scraping mechanism. The automated chip filling production system of the axial diode chips has the advantages that the graphite boat is conveyed to the solder paste scraping mechanism through the conveying belt A of the leading wire arranging mechanism, and then is conveyed to the chip filling mechanism through the conveying belt B of the solder paste scraping mechanism, conveying is carried out through the conveying belts and solder paste scraping is carried out automatically on leading wires in the whole process, manual conveying and manual solder paste scraping are not needed, liberated working staff can serve for other work, and working efficiency is also improved.
Description
Technical field
The present invention relates to a kind of filling of axial diode chip automation chip production system, specifically a kind of diode chip for backlight unit production system that can realize automatic management.
Background technology
Diode claims again crystal diode, is called for short diode (diode), in addition, also has early stage vacuum electronic diode; It is a kind of electronic device that can unidirectional conduction current.In semiconductor diode inside, have two lead terminals of a PN junction, this electronic device, according to the direction of applied voltage, possesses the conductibility of unidirectional current.In general, crystal diode is a p-n junction interface being formed by p-type semiconductor and N-shaped semiconductor sintering.Both sides at its interface form space charge layer, form built-in field.When applied voltage equals zero, because the concentration difference of p-n knot both sides charge carrier causes dissufion current and the drift current that caused by built-in field equates and in electric equilibrium state, this is also the diode characteristic under normality.
In the production technology of existing axial diode, its technological process is: lead is to the filling of-cDNA microarray-chip, and-----------plastic packaging---solidifies afterwards and---electroplates that---lettering test--inspection outward--is packed in baking in gluing in pickling.
When carrying out chip filling, the mode adopting is at present: staff sequences lead graphite boat from lead-in wire to machine place is carried on workbench, by staff, first on the top of lead-in wire, brushed after one deck tin cream again, then the chip having screened is filled on the lead-in wire that brushes tin cream.While adopting such method to load, hand labor intensity is large, and this whole set of requirements of process consumes a large amount of staff, and operating efficiency is also lower simultaneously.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of diode chip for backlight unit mechanized production system that can realize automatic management.
In order to solve the problems of the technologies described above, technical scheme of the present invention is: a kind of axial diode chip automation chip filling production system, and its innovative point is: mainly comprise that lead is to ,Gua tin cream mechanism of mechanism and chip filling mechanism;
Described lead mainly comprises that to mechanism lead is to machine, graphite boat and conveyer belt A, at lead, to the discharging opening place of machine, is provided with graphite boat, is evenly distributed with some fairleads on graphite boat;
The described tin cream mechanism of scraping mainly comprises conveyer belt B, liftout tank, fixed platform, top board and scrapes tin cream machine, described fixed platform is between the discharging opening of conveyer belt A and the charging aperture of conveyer belt B, in fixed platform, have the cavity that holds roof movement, the lower end of top board is connected with liftout tank, liftout tank is not when working, fixed platform flushes with the position of conveyer belt A and conveyer belt B, is provided with the tin cream machine of scraping above top board;
Describedly scrape tin cream owner and will comprise that guide rail is walked on stage, the mobile tin cream head of scraping, described movement is scraped tin cream head and is arranged on guide rail walks on stage, described movement is scraped tin cream head and is comprised head walking driving and detent mechanism, web plate and scraper, described movement is scraped tin cream head and can be walked and be driven and detent mechanism drives along the guide rail bearing of trend of walking on stage and moves and locate by head, on web plate, have the hole corresponding with fairlead on graphite boat, described scraper moving direction is parallel with graphite boat throughput direction;
Described chip filling mechanism mainly comprises screen plate, vacuum pump and connects tracheae, the lower end of described screen plate have with graphite boat on the chip hole that matches of fairlead, a side of screen plate is connected with vacuum pump by connecting tracheae;
Described graphite boat is delivered to the conveyer belt A in mechanism the conveyer belt B scraping in the ，Zai Yougua of tin cream mechanism tin cream mechanism by lead and is delivered to chip filling mechanism.
The invention has the advantages that: graphite boat is delivered to and scrapes tin cream mechanism to the conveyer belt A in mechanism by lead, conveyer belt B in Zai Yougua tin cream mechanism is delivered to chip filling mechanism, whole process is by tape transport and automatically lead-in wire is scraped to tin cream, without staff, transport and scrape tin cream, staff under saving can be as his use, and operating efficiency has also improved simultaneously.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of axial diode chip automation chip filling production system of the present invention.
Fig. 2 is the vertical view of the seal cream machine of axial diode chip automation chip filling production system of the present invention.
Embodiment
Schematic diagram is as shown in Figure 1 known, and diode chip for backlight unit mechanized production system of the present invention mainly comprises that lead is to ,Gua tin cream mechanism of mechanism and chip filling mechanism.
Lead mainly comprises that to mechanism lead is to machine, graphite boat 2 and conveyer belt A1, at lead, to the discharging opening place of machine, is provided with graphite boat 2, is evenly distributed with some fairleads on graphite boat 2.
Scraping tin cream mechanism mainly comprises conveyer belt B6, liftout tank 4, fixed platform 7, top board 3 and scrapes tin cream machine 5, fixed platform 7 is between the discharging opening of conveyer belt A1 and the charging aperture of conveyer belt B6, medium position in fixed platform 7 has the cavity that holds top board 3 activities, lower end at top board 3 is connected with liftout tank 4, liftout tank 4 is not when working, fixed platform 7 flushes with the position of conveyer belt A1 and conveyer belt B6, is provided with the tin cream machine 5 of scraping above top board 3.
Schematic diagram is as shown in Figure 2 known, scrape tin cream owner and will comprise that guide rail walks on stage 12, the mobile tin cream head 11 of scraping, the mobile tin cream head 11 of scraping is arranged on guide rail and walks on stage on 12, the mobile tin cream head 11 of scraping comprises that head walking drives and detent mechanism 21, web plate 13 and scraper 22, the mobile tin cream head 11 of scraping can walk and be driven and detent mechanism 21 drivings are moved and locate along walk on stage 12 bearing of trend of guide rail by head, on web plate 13, have the hole corresponding with fairlead on graphite boat 2, scraper 22 moving directions are parallel with the throughput direction of graphite boat 2.
Chip filling mechanism mainly comprises screen plate, vacuum pump and connects tracheae, the lower end of screen plate have with graphite boat on the chip hole that matches of fairlead, a side of screen plate is connected with vacuum pump by connecting tracheae.
When carrying out chip filling, by lead, to machine, the lead-in wire sequencing is distributed on graphite boat 2, the graphite boat 2 that installs lead-in wire is delivered in fixed platform 7 by conveyer belt A1, by top board 3, the lead-in wire in graphite boat 2 is upwards ejected, by scraper 22, the tin cream on web plate 13 is scraped to the top of the lead-in wire of graphite boat 2 in the hole from web plate 13, top board 3 is descending again, lead-in wire falls in graphite boat 2, by the upper graphite boat of carrying of conveyer belt A1, will therefore scrape tin cream again completes graphite boat and pushes up to conveyer belt B6, by conveyer belt B6, be delivered to chip filling mechanism, by staff, utilize screen plate that chip is filled on the graphite boat 2 that brushes tin cream.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (1)
1. an axial diode chip automation chip filling production system, is characterized in that: mainly comprise that lead is to ,Gua tin cream mechanism of mechanism and chip filling mechanism;
Described lead mainly comprises that to mechanism lead is to machine, graphite boat and conveyer belt A, at lead, to the discharging opening place of machine, is provided with graphite boat, is evenly distributed with some fairleads on graphite boat;
The described tin cream mechanism of scraping mainly comprises conveyer belt B, liftout tank, fixed platform, top board and scrapes tin cream machine, described fixed platform is between the discharging opening of conveyer belt A and the charging aperture of conveyer belt B, in fixed platform, have the cavity that holds roof movement, the lower end of top board is connected with liftout tank, liftout tank is not when working, fixed platform flushes with the position of conveyer belt A and conveyer belt B, is provided with the tin cream machine of scraping above top board;
Describedly scrape tin cream owner and will comprise that guide rail is walked on stage, the mobile tin cream head of scraping, described movement is scraped tin cream head and is arranged on guide rail walks on stage, described movement is scraped tin cream head and is comprised head walking driving and detent mechanism, web plate and scraper, described movement is scraped tin cream head and can be walked and be driven and detent mechanism drives along the guide rail bearing of trend of walking on stage and moves and locate by head, on web plate, have the hole corresponding with fairlead on graphite boat, described scraper moving direction is parallel with graphite boat throughput direction;
Described chip filling mechanism mainly comprises screen plate, vacuum pump and connects tracheae, the lower end of described screen plate have with graphite boat on the chip hole that matches of fairlead, a side of screen plate is connected with vacuum pump by connecting tracheae;
Described graphite boat is delivered to the conveyer belt A in mechanism the conveyer belt B scraping in the ，Zai Yougua of tin cream mechanism tin cream mechanism by lead and is delivered to chip filling mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310624224.5A CN103594400B (en) | 2013-11-29 | 2013-11-29 | A kind of axial diode chip automation chip filling production system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310624224.5A CN103594400B (en) | 2013-11-29 | 2013-11-29 | A kind of axial diode chip automation chip filling production system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103594400A true CN103594400A (en) | 2014-02-19 |
| CN103594400B CN103594400B (en) | 2016-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310624224.5A Active CN103594400B (en) | 2013-11-29 | 2013-11-29 | A kind of axial diode chip automation chip filling production system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105225990A (en) * | 2014-11-24 | 2016-01-06 | 苏州均华精密机械有限公司 | High-yield chip fixing device and method thereof |
| CN109473386A (en) * | 2018-12-28 | 2019-03-15 | 乐山希尔电子股份有限公司 | A kind of semiconductor devices assemble method and its production line |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080041471A (en) * | 2006-11-07 | 2008-05-13 | 삼성전자주식회사 | A die bonder |
| US20090269887A1 (en) * | 2008-04-25 | 2009-10-29 | Sts Semiconductor & Telecommunications Co., Ltd. | Apparatus for Manufacturing Semiconductor Package for Wide Lead Frame and Method of Constructing Semiconductor Package Using the Same |
| CN103151272A (en) * | 2013-03-22 | 2013-06-12 | 常熟艾科瑞思封装自动化设备有限公司 | Diode packaging device |
| CN203631504U (en) * | 2013-11-29 | 2014-06-04 | 如皋市大昌电子有限公司 | Automated chip filling production system for axial diode chips |
-
2013
- 2013-11-29 CN CN201310624224.5A patent/CN103594400B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080041471A (en) * | 2006-11-07 | 2008-05-13 | 삼성전자주식회사 | A die bonder |
| US20090269887A1 (en) * | 2008-04-25 | 2009-10-29 | Sts Semiconductor & Telecommunications Co., Ltd. | Apparatus for Manufacturing Semiconductor Package for Wide Lead Frame and Method of Constructing Semiconductor Package Using the Same |
| CN103151272A (en) * | 2013-03-22 | 2013-06-12 | 常熟艾科瑞思封装自动化设备有限公司 | Diode packaging device |
| CN203631504U (en) * | 2013-11-29 | 2014-06-04 | 如皋市大昌电子有限公司 | Automated chip filling production system for axial diode chips |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105225990A (en) * | 2014-11-24 | 2016-01-06 | 苏州均华精密机械有限公司 | High-yield chip fixing device and method thereof |
| CN105225990B (en) * | 2014-11-24 | 2019-01-08 | 苏州均华精密机械有限公司 | wafer fixing device and method thereof |
| CN109473386A (en) * | 2018-12-28 | 2019-03-15 | 乐山希尔电子股份有限公司 | A kind of semiconductor devices assemble method and its production line |
| CN109473386B (en) * | 2018-12-28 | 2023-10-24 | 乐山希尔电子股份有限公司 | Semiconductor device assembling method and production line thereof |
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| Publication number | Publication date |
|---|---|
| CN103594400B (en) | 2016-02-17 |
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