CN105225990A - High-yield chip fixing device and method thereof - Google Patents
High-yield chip fixing device and method thereof Download PDFInfo
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- CN105225990A CN105225990A CN201510720176.9A CN201510720176A CN105225990A CN 105225990 A CN105225990 A CN 105225990A CN 201510720176 A CN201510720176 A CN 201510720176A CN 105225990 A CN105225990 A CN 105225990A
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- 238000000034 method Methods 0.000 title claims description 23
- 238000003825 pressing Methods 0.000 claims abstract description 47
- 238000003475 lamination Methods 0.000 claims description 52
- 238000004519 manufacturing process Methods 0.000 claims description 40
- 238000006073 displacement reaction Methods 0.000 claims description 23
- 238000010521 absorption reaction Methods 0.000 claims description 17
- 238000007514 turning Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000013078 crystal Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Abstract
A high throughput wafer attachment apparatus, comprising: a carrying platform; a multi-sucking-releasing unit located above the carrier; an adjustment stage adjacent to the carrier; a support platform adjacent to the adjustment platform; and a multi-pressing unit arranged above the bearing platform; wherein the carrier is provided for at least two first workpieces; the multi-ejection unit ejects at least two first workpieces on the carrier; the multi-sucking-releasing unit sucks the at least two first workpieces and places the at least two first workpieces on the adjusting table; the supporting platform is used for installing a second workpiece; the multi-pressing unit performs a rotation motion, and the multi-pressing unit sucks at least two first workpieces on the adjusting table and presses the at least two first workpieces to the second workpiece.
Description
Technical field
The present invention relates to a kind of high production wafer fixing apparatus and method thereof, espespecially one can eject multiple first workpiece simultaneously, and multiple first workpiece is pressed on method and the device thereof of a second workpiece simultaneously.
Background technology
Eject, draw and be common in manufacture of semiconductor with the step system of pressing.Ejecting is utilize thimble ejection one wafer (crystal grain), is separated from each other to make wafer and a film body.Drawing system utilizes an absorption heads that aforementioned is moved to another location by the wafer of ejection.Pressing system utilizes a combining pressing head wafer to be pressed on a substrate place.
Right above-mentioned thimble, absorption heads or the design of combining pressing head system only can eject a wafer or draw a wafer, but for the semiconductor industry of efficient, the thimble that only can eject single wafer, the absorption heads only drawing single wafer or only can the combining pressing head of pressing single wafer, its production capacity is limited.Particularly when because of when wafer thickness is very thin or material is fragile, eject the processing time needing to grow very much, or when wafer needs certain pressing time, no matter how the speed of the running of known method mechanism promotes, production efficiency is still low, therefore need a brand-new operating type, break through the restriction of old mode, effectively promote production capacity.
Summary of the invention
The object of the invention is to provide a kind of high production wafer fixing apparatus and method thereof, and it is that utilization ejects at least two first workpiece simultaneously, and is same as by this at least two first workpiece and is pressed on a second workpiece place, uses the effect reaching and promote production capacity.
For achieving the above object, the first device technique scheme that the present invention adopts is: a kind of high production wafer fixing apparatus, is characterized in that: it includes:
One microscope carrier;
Inhale one more and put unit, it is the top being positioned at this microscope carrier;
One adjustment platform, it is adjacent to this microscope carrier;
One cushion cap, it is adjacent to this adjustment platform; And
Lamination unit more than one, it is the top being located at this cushion cap;
Wherein, this microscope carrier system is at least two first workpiece setting; This many suction is put unary system and is drawn this at least two first workpiece, and this at least two first workpiece is positioned over this adjustment platform; This cushion cap system is arranged for a second workpiece; This multiple pressure is closed unary system and is carried out a rotary motion, and this multiple pressure is closed unary system and drawn at least two first workpiece being positioned at this adjustment platform, and this at least two first workpiece is pressed on this second workpiece.
In such scheme, described adjustment platform system adjusts the relative position of this at least two first workpiece, and this adjustment platform has a displacement module, carries out a longitudinal reciprocating motion, a straight reciprocating motion or a traverse motion to enable this adjustment platform.
Further again, described adjustment platform has at least two adjusting seats, and each adjusting seat system carries out a straight reciprocating motion or a traverse motion, to adjust the relative position of this at least two first workpiece.
In such scheme, it has more a roll-over unit, and this roll-over unit system is between this adjustment platform and this many lamination unit.
In such scheme, it has more a First look locating module, and this First look locating module system is positioned at the top that unit is put in this many suction.
In such scheme, it has more one second vision locating module, and this second vision locating module system is positioned at the top of this adjustment platform.
In such scheme, it has more one the 3rd vision locating module, and the 3rd vision locating module system is positioned at the top of this cushion cap and this many lamination unit.
Further again, described 3rd vision locating module system captures this first workpiece not in the face of the image of the one side of the 3rd vision locating module, or the 3rd vision locating module system is through this first workpiece, to capture the image of this second workpiece or this cushion cap.
In such scheme, described microscope carrier has a displacement module, and to make, this microscope carrier carries out a straight reciprocating motion, a transverse reciprocating moves or a rotary motion; This cushion cap has a displacement module, and to make, this cushion cap carries out a straight reciprocating motion, a transverse reciprocating moves or the past attached motion of a rotation.
In such scheme, it has more ejecting unit more than, this many ejecting units system is located at the below of this microscope carrier, this many ejecting unit has at least two thimbles, this many ejecting unit has more a displacement module, is a longitudinal reciprocating motion, a straight reciprocating motion or a traverse motion to make this many ejecting units system relative to this microscope carrier.
In such scheme, described inhale is put unit and is had a displacement module more, puts that unit carries out one longitudinally moving back and forth, a straight reciprocating motion or a traverse motion to make this many suction, and this many suction is put unit and had at least two absorption heads.
In such scheme, described many lamination units have a displacement module, and to make this many lamination unit carry out a longitudinal reciprocating motion or this rotary motion, this many lamination unit has at least two combining pressing heads.
Further again, described combining pressing head has a heating module; This cushion cap has a heating module.Described many lamination units are more than two, and this displacement module system makes this many lamination unit carry out a straight reciprocating motion.
For achieving the above object, the first method technical scheme that the present invention adopts is: a kind of high production wafer fixing method, is characterized in that: it includes:
One ejecting unit system ejects at least two first workpiece being positioned at a microscope carrier;
Inhale one more and put unary system and draw this at least two first workpiece, and this at least the first workpiece is positioned over an adjustment platform;
One multiple pressure is closed unary system and is drawn at least two first workpiece being positioned at this adjustment platform, and by the top of the second workpiece of this at least two first workpiece movable to cushion cap;
This multiple pressure is closed unary system and this at least two first workpiece is pressed on this second workpiece.
In such scheme, it more includes a roll-over unit system and draws at least two first workpiece being positioned at this adjustment platform, and by this at least two first workpiece turnings one angle, draws for this lamination unit.
In such scheme, described adjustment platform system adjusts the relative position of this at least two first workpiece; This first workpiece is a substrate, a wafer, a wafer or a crystal grain; This second workpiece is a substrate, a film body, a wafer, a wafer or a crystal grain; This multiple pressure is closed unary system and is carried out a rotary motion, so that this first workpiece is pressed on this second workpiece.
For achieving the above object, the second method technical scheme that the present invention adopts is: a kind of high production wafer fixing method, is characterized in that: it includes:
Inhale one more and put at least two first workpiece that unary system absorption is positioned at a microscope carrier, and this at least the first workpiece is positioned over an adjustment platform;
One multiple pressure is closed unary system and is drawn at least two first workpiece being positioned at this adjustment platform, and by the top of the second workpiece of this at least two first workpiece movable to cushion cap;
This multiple pressure is closed unary system and this at least two first workpiece is pressed on this second workpiece.
In such scheme, it more includes a roll-over unit system and draws at least two first workpiece being positioned at this adjustment platform, and by this at least two first workpiece turnings one angle, draws for this lamination unit.
In such scheme, described adjustment platform system adjusts the relative position of this at least two first workpiece; This first workpiece is a substrate, a wafer, a wafer or a crystal grain; This second workpiece is a substrate, a film body, a wafer, a wafer or a crystal grain; This multiple pressure is closed unary system and is carried out a rotary motion, so that this first workpiece is pressed on this second workpiece.
Comprehensively above-mentioned, the high production wafer fixing apparatus of the present invention and method thereof, it is eject multiple first workpiece simultaneously, and ejected multiple first workpiece are pressed on second workpiece place simultaneously, uses the effect reaching and promote production capacity.For making the efficiency of many lamination units higher, many lamination units can adopt the mode rotating multigroup group to carry out.
Why first workpiece of microscope carrier must be ejected by an ejecting unit, and it is because of in manufacture of semiconductor, and the first workpiece is often wafer, it binds on a blue film, and blue film sticks on an iron hoop, and iron hoop is then seated on microscope carrier, therefore make wafer and blue UF membrane, one must be had to eject behavior can reach.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the first embodiment high production wafer fixing apparatus;
Fig. 2 is the schematic diagram of the relative position of adjustment platform adjustment at least two first workpiece;
Fig. 3 is another schematic diagram of the relative position of adjustment platform adjustment at least two first workpiece;
Fig. 4 carries out the schematic diagram of a rotary motion for lamination unit more than;
Fig. 5 is the schematic diagram of the second embodiment high production wafer fixing apparatus;
Fig. 6 is the schematic flow sheet of the 3rd embodiment high production wafer fixing method;
Fig. 7 is the schematic flow sheet of the 4th embodiment high production wafer fixing method;
Fig. 8 is the schematic flow sheet of the 5th embodiment high production wafer fixing method.
In above accompanying drawing: 10, microscope carrier; 100, displacement module; 11, many ejecting units; 110, thimble; 111, displacement module; 12, inhale puts unit more; 120, displacement module; 121, absorption heads; 13; Adjustment platform; 130, displacement module; 131, adjusting seat; 14, cushion cap; 140, displacement module; 141, heating module; 15, many lamination units; 150, displacement module; 151, combining pressing head; 152, heating module; 16, First look locating module; 17, the second vision locating module; 18, the 3rd vision locating module; 19, roll-over unit; 20, the first workpiece; 21, second workpiece; S1 ~ S13, step.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Embodiment one:
Please coordinate with reference to shown in the 1st figure, the present embodiment is a kind of high production wafer fixing apparatus, and it has a microscope carrier 10, ejecting unit more than more than 11, is inhaled and put unit 12, adjustment platform 13, cushion cap 14, lamination unit more than one 15, First look locating module 16,1 second vision locating module 17 and one the 3rd vision locating module 18.
Microscope carrier 10 has a displacement module 100, and to make, microscope carrier 10 can carry out a straight reciprocating motion (X axis reciprocating motion), a transverse reciprocating moves (Y-axis reciprocating motion) or a rotary motion.Microscope carrier 10 is can arrange at least two first workpiece 20.This first workpiece 20 is a substrate, a wafer, a wafer or a crystal grain.
Many ejecting units 11 are the below being located at microscope carrier 10, many ejecting units 11 have at least two thimbles 110, many ejecting units 11 have more a displacement module 111, can be a longitudinal reciprocating motion (Z-axis direction reciprocating motion), a straight reciprocating motion or a traverse motion relative to microscope carrier 10 to make many ejecting units 11.Thimble 110 is to eject the first workpiece 20 that at least two are positioned at microscope carrier 10.The first workpiece 20 quantity that right thimble 110 can eject according to need, to control single needle or spininess synchronously ejects.
It is the top being located at microscope carrier 10 that unit 12 is put in many suctions, and inhale is put unit 12 and had a displacement module 120 more, with make inhale put that unit 12 can carry out one longitudinally moving back and forth, a straight reciprocating motion or a traverse motion.Many suctions are put unit 12 and are had at least two absorption heads 121, inhale that to put unit 12 be couple a vacuum module more, to provide a negative-pressure sucking or a malleation thrust to absorption heads 121, and each absorption heads 121 can be inhaled put at least two first workpiece 20.
Adjustment platform 13 is adjacent to microscope carrier 10, adjustment platform 13 has a displacement module 130, a longitudinal reciprocating motion, a straight reciprocating motion or a traverse motion can be carried out to make adjustment platform 13, adjustment platform 13 has at least two adjusting seats 131, and each adjusting seat 131 is to carry out a straight reciprocating motion or a traverse motion.The function of adjusting seat 13 is the position of the first workpiece 20 adjusted above it, to make the distance between first workpiece 20 of more than two meet the distance that will be placed on second workpiece 21, and makes position more accurate.
Cushion cap 14 is adjacent to adjustment platform 13, and cushion cap 14 is arrange at least one second workpiece 21, and this second workpiece 21 is a substrate, a film body, a wafer, a wafer or a crystal grain.Cushion cap 14 has a displacement module 140, can carry out a straight reciprocating motion, a traverse motion or a rotary motion to make cushion cap 14.This cushion cap 14 has a heating module 141, and this heating module 141 is for heating second workpiece 21, is easy to pressing second workpiece 21 to make the first workpiece 20.
Many lamination units 15 are the top being located at cushion cap 14, and many lamination units 15 have a displacement module 150, can carry out a longitudinal reciprocating motion, a traverse motion, a rotary motion or a straight reciprocating motion to make many lamination units 15.Many lamination units 15 have at least two combining pressing heads 151, many lamination units 15 are couple a vacuum module, to provide a negative-pressure sucking or a malleation thrust to combining pressing head 151, be to draw at least two first workpiece 20 to make each combining pressing head 151, and at least two first workpiece 20 are pressed on the first workpiece 21.Many lamination units 15 also can install more than 2 on displacement module 150, rotation mode many lamination units 15 can also be rotated pressing in turn, in proper order with raising efficiency.Each combining pressing head 151 has a heating module 152, with in heating first workpiece 20.Many lamination units 15 also can be the design of at least two groups.
First look locating module 16 is be positioned at the top that unit 12 is put in many suctions.First look locating module 16 is that the image information of acquisition microscope carrier 10, first workpiece 20 uses as location, and this image information is following first image information.
Second vision locating module 17 is the top being positioned at adjustment platform 13.Second image locating module 17 is the image information of acquisition adjustment platform 13 and the first workpiece 20, and this image information is following second image information.
3rd vision locating module 18 is the top being positioned at cushion cap 14 and many lamination units 15.3rd vision locating module 18 is the image information of each combining pressing head 151, first workpiece 20 of acquisition, second workpiece 21 and cushion cap 14, and this image information is the 3rd following image information.3rd vision locating module 18 further can capture the first workpiece 20 not in the face of the image of the one side of the 3rd vision locating module 18, or the 3rd vision locating module 18 can through the combining pressing head with the first workpiece, to capture the image of the first workpiece 20, second workpiece 21 or cushion cap 14.
Embodiment two:
Please coordinate with reference to shown in the 5th figure, the present embodiment is a kind of high production wafer fixing apparatus, it has microscope carrier 10, many ejecting units 11, unit 12 is put in many suctions, adjustment platform 13, cushion cap 14, many lamination units 15, First look locating module 16, second vision locating module 17 and the 3rd vision locating module 18 are embodiment one described above, therefore element numbers system edge embodiment one, therefore no longer this repeats, spy first states.
In the present embodiment, a roll-over unit 19 is be located between adjustment platform 13 and many lamination units 15, and because of roll-over unit 19 newly-increased in the present embodiment, therefore the setting position of adjustment platform 13 can lower than microscope carrier 10.Roll-over unit 19 is couple a vacuum module, to provide a negative-pressure sucking or a malleation thrust to roll-over unit 19, and roll-over unit 19 can be drawn be positioned at least two first workpiece 20 of adjustment platform 13, and this at least two first workpiece 20 is rotated an angle, and each combining pressing head 151 can be drawn by the first workpiece 20 of rotation one angle.
In the present embodiment, this second image information further has the image information of roll-over unit 19.
Embodiment three:
Please coordinate with reference to shown in the 6th figure, the present embodiment is a kind of high production wafer fixing method, and its step includes:
S1, the top of microscope carrier 10 is provided with multiple first workpiece 20, if the first workpiece 20 is a wafer or a crystal grain, it binds on a blue film, and blue film sticks on an iron hoop, and iron hoop is then seated on microscope carrier 10, therefore make wafer and blue UF membrane, one must be had to eject behavior can reach.First look locating module 16 is that acquisition is positioned at one first image information of the first workpiece 20 of microscope carrier 10, and sends the operation result of this first image information to microscope carrier 10, to adjust exact position, then issues orders and sends many ejecting units 11 to.Many ejecting units 11 are according to this order, and the direction towards microscope carrier 10 is moved, will eject at least two first workpiece 20.After ejecting at least two first workpiece 20, many ejecting units 11 are return back to original position, to treat again to eject at least two first workpiece 20.
S2, it is receive this first image information that unit 12 is put in many suctions, and according to this first image information, and move towards microscope carrier 10 direction, it is draw above-mentioned at least two first workpiece 20 be ejected that unit 12 is put in many suctions, after drawing at least two first workpiece 20.And move towards adjustment platform 13 direction, and at least two first workpiece 20 are positioned over the adjusting seat 131 of adjustment platform 13.Second vision locating module 17 is the second image information in acquisition adjusting seat, and this second image information is sent to adjustment platform 13.
Put after at least two first workpiece 20 are positioned over adjustment platform 13 by unit 12 until inhale, it is return back to original position that unit 12 is put in many suctions, to treat again to draw at least two first workpiece 20 being positioned at microscope carrier 10 more.
S3, please coordinate with reference to shown in the 2nd figure and the 3rd figure, adjustment platform 13 also receives this second image information, and makes at least two adjusting seat 131 relative movements, to adjust the position of the first workpiece 20 being positioned at least two adjusting seats 131.And make the spacing distance of more than two the first workpiece 20 on it, the spacing of the first workpiece 20 on second workpiece 21 can be adjusted to.
S4, please coordinate with reference to shown in the 1st figure again, if the first embodiment of the high production wafer fixing apparatus of the present embodiment, adjustment platform 13 is move towards the direction of many lamination units 15, many lamination units 15 also receive this second image information, to make many lamination units 15 move towards adjustment platform 13 direction, combining pressing head 151 is at least two first workpiece 20 drawn and be positioned at adjusting seat 131.The combining pressing head 151 with at least two first workpiece 20 is the top moving to cushion cap 14.
Adjustment platform 13 is return back to original position, to treat that suction is put unit 12 and again the first workpiece 20 is positioned over adjustment platform 13.
Please coordinate with reference to shown in the 5th figure, if the present embodiment two high production wafer fixing apparatus, adjustment platform 13 is move towards roll-over unit 19.Roll-over unit 19 is receive this second image information, and turns to the direction of adjustment platform 13, and roll-over unit 19 is at least two first workpiece 20 drawn and be positioned at adjustment platform 13, and at least two first workpiece 20 are rotated an angle.Many lamination units 15 move towards roll-over unit 19, to draw the first workpiece 20 being positioned at roll-over unit 19.The combining pressing head 151 with at least two first workpiece 20 is the top moving to cushion cap 14.
S5,3rd vision locating module 18 is the image information capturing the first workpiece 20, second workpiece 21 and the cushion cap 14 that are positioned at combining pressing head 151, this image information is one the 3rd image information, lamination unit 15 is accept the 3rd image information, at least two first workpiece 20 can be pressed on second workpiece 21 to make combining pressing head 151.Before the first workpiece 20 is pressed on second workpiece 21, cushion cap 14 also receives the 3rd image information, to adjust cushion cap 14 relative to the position of the combining pressing head 151 with the first workpiece 20.After to be laminated, lamination unit 15 and cushion cap 14 are return back to original position, or move to next service position, to treat pressing program again.
Embodiment four:
Please coordinate with reference to shown in the 7th figure, the present embodiment is a kind of high production wafer fixing method, and its step includes:
S6, the top of microscope carrier 10 is provided with multiple first workpiece 20, First look locating module 16 is one first image information that acquisition is positioned at the first workpiece 20 of microscope carrier 10, and send the operation result of this first image information to microscope carrier 10, to adjust exact position, then issue orders to send how unit 12 is put in suction to.If the first workpiece 20 does not bind on a blue film, then need not use ejecting unit 11.
It is receive this first image information that unit 12 is put in many suctions, and according to this first image information, and move towards microscope carrier 10 direction, it is draw at least two first above-mentioned workpiece 20 that unit 12 is put in many suctions, after absorption at least two first workpiece 20.And move towards adjustment platform 13 direction, and at least two first workpiece 20 are positioned over the adjusting seat 131 of adjustment platform 13.Second vision locating module 17 is the second image information in acquisition adjusting seat, and this second image information is sent to adjustment platform 13.
Put after at least two first workpiece 20 are positioned over adjustment platform 13 by unit 12 until inhale, it is return back to original position that unit 12 is put in many suctions, to treat again to draw at least two first workpiece 20 be positioned on microscope carrier 10 more.
S7, please coordinate with reference to shown in the 2nd figure and the 3rd figure, adjustment platform 13 also receives this second image information, and makes at least two adjusting seat 131 relative movements, to adjust the position of the first workpiece 20 being positioned at least two adjusting seats 131.And make the spacing distance of more than two the first workpiece 20 on it, the spacing of the first workpiece 20 on second workpiece 21 can be adjusted to.
S8, please coordinate with reference to shown in the 1st figure again, if embodiment one high production wafer fixing apparatus, adjustment platform 13 is move towards the direction of many lamination units 15, many lamination units 15 also receive this second image information, to make many lamination units 15 move towards adjustment platform 13 direction, combining pressing head 151 is at least two first workpiece 20 that absorption is positioned at adjusting seat 131.The combining pressing head 151 with at least two first workpiece 20 is the top moving to cushion cap 14.
Adjustment platform 13 is return back to original position, to treat that suction is put unit 12 and again the first workpiece 20 is positioned over adjustment platform 13.
Please coordinate with reference to shown in the 5th figure, if embodiment two high production wafer fixing apparatus, adjustment platform 13 is move towards roll-over unit 19.Roll-over unit 19 is receive this second image information, and turns to the direction of adjustment platform 13, and roll-over unit 19 is at least two first workpiece 20 drawn and be positioned at adjustment platform 13, and at least two first workpiece 20 are rotated an angle.Many lamination units 15 move towards roll-over unit 19, to draw the first workpiece 20 being positioned at roll-over unit 19.The combining pressing head 151 with at least two first workpiece 20 is the top moving to cushion cap 14; Or the combining pressing head 151 with at least two first workpiece 20 is the top turning to cushion cap 14.
S9,3rd vision locating module 18 is the image information that acquisition is positioned at the first workpiece 20 of combining pressing head 151, second workpiece 21 and cushion cap 14, this image information is one the 3rd image information, lamination unit 15 is accept the 3rd image information, at least two first workpiece 20 can be pressed on second workpiece 21 to make combining pressing head 151.Before the first workpiece 20 is pressed on second workpiece 21, cushion cap 14 also receives the 3rd image information, to adjust cushion cap 14 relative to the position of the combining pressing head 151 with the first workpiece 20.After to be laminated, lamination unit 15 and cushion cap 14 are return back to original position, or move to next service position, to treat pressing program again.
Embodiment five:
Please coordinate with reference to shown in the 8th figure, the present embodiment is a kind of high production wafer fixing method, and its step includes:
S10, it is move towards microscope carrier 10 direction that unit 12 is put in many suctions, and it is draw at least two first above-mentioned workpiece 20 that unit 12 is put in many suctions, after absorption at least two first workpiece 20.And move towards adjustment platform 13 direction, and at least two first workpiece 20 are positioned over the adjusting seat 131 of adjustment platform 13.In the present embodiment, it is to adopt above-mentioned S1 and S2 or the step of S6.
S11, at least two adjusting seat 131 relative movements, to adjust the position of the first workpiece 20 being positioned at least two adjusting seats 131.And make the spacing distance of more than two the first workpiece 20 on it, the spacing of the first workpiece 20 on second workpiece 21 can be adjusted to.
S12, as shown in Figure 4, many lamination units 15 move towards adjustment platform 13 direction with a rotary movement, and combining pressing head 151 is at least two first workpiece 20 that absorption is positioned at adjusting seat 131.The combining pressing head 151 with at least two first workpiece 20 is the top moving to cushion cap 14 with a rotary movement.In this step, it is the step that can adopt above-mentioned S8 or S4.
Many lamination units 15 are can move with a rotary movement, and this rotary movement system can make multiple combining pressing head 151 can sequentially operation.And then promote the efficiency of pressing.
S13, at least two first workpiece 20 can be pressed on second workpiece 21 by combining pressing head 151.In this step, it is the step that can adopt above-mentioned S9 or S5.
The first above-mentioned image information, the second image information and the 3rd image information system are for promoting the accuracy of location.
Each embodiment of high production wafer fixing method described above, its step can be:
Many ejecting units 11 are according to this order, and the direction towards microscope carrier 10 is moved, will eject at least two first workpiece 20.After ejecting at least two first workpiece 20, many ejecting units 11 are return back to original position, to treat again to eject at least two first workpiece 20.This step also can be omitted.
If omit above-mentioned eject step, it is at least two first workpiece 20 that absorption is positioned at microscope carrier 10 that unit 12 is put in many suctions, after absorption at least two first workpiece 20.And move towards adjustment platform 13 direction, and at least two first workpiece 20 are positioned over the adjusting seat 131 of adjustment platform 13.
At least two adjusting seat 131 relative movements, to adjust the position of the first workpiece 20 being positioned at least two adjusting seats 131.And make the spacing distance of more than two the first workpiece 20 on it, the spacing of the first workpiece 20 on second workpiece 21 can be adjusted to.
Many lamination units 15 move towards adjustment platform 13 direction with a rotary movement, and combining pressing head 151 is at least two first workpiece 20 that absorption is positioned at adjusting seat 131.The combining pressing head 151 with at least two first workpiece 20 is the top moving to cushion cap 14 with a rotary movement.Many lamination units 15 more can carry out one longitudinally moving back and forth further, a straight reciprocating motion or a traverse motion.This longitudinal direction moves back and forth, this straight reciprocating motion or this traverse motion are a selectivity motion.
In addition, roll-over unit 19 is at least two first workpiece 20 drawn and be positioned at adjustment platform 13, and at least two first workpiece 20 are rotated an angle.Many lamination units 15 move with a rotary movement and move towards roll-over unit 19, to draw the first workpiece 20 being positioned at roll-over unit 19.The combining pressing head 151 with at least two first workpiece 20 is the top moving to cushion cap 14 with a rotary movement.
At least two first workpiece 20 are pressed on second workpiece 21 by combining pressing head 151, and before pressing, above-mentioned heating module 141,152 is heat second workpiece 21 and the first workpiece 20 respectively, and the first workpiece 20 after heating is be easier to pressing with second workpiece 21.
Comprehensively above-mentioned, this creation system utilizes many ejecting units, and to eject the first workpiece that at least two are positioned at microscope carrier, the many suctions of recycling are put unit and picked and placeed this at least the first workpiece, and utilize many lamination units that at least two first workpiece are pressed on the second workpiece place being positioned at cushion cap.
By increasing the quantity ejecting the first workpiece being positioned at microscope carrier, and multiple first workpiece is pressed on second workpiece place simultaneously, and reaches the effect promoting production capacity.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (10)
1. a high production wafer fixing apparatus, is characterized in that: it includes:
One microscope carrier;
Inhale one more and put unit, it is the top being positioned at this microscope carrier;
One adjustment platform, it is adjacent to this microscope carrier;
One cushion cap, it is adjacent to this adjustment platform; And
Lamination unit more than one, it is the top being located at this cushion cap;
Wherein, this microscope carrier system is at least two first workpiece setting; This many suction is put unary system and is drawn this at least two first workpiece, and this at least two first workpiece is positioned over this adjustment platform; This cushion cap system is arranged for a second workpiece; This multiple pressure is closed unary system and is carried out a rotary motion, and this multiple pressure is closed unary system and drawn at least two first workpiece being positioned at this adjustment platform, and this at least two first workpiece is pressed on this second workpiece.
2. high production wafer fixing apparatus according to claim 1, it is characterized in that: described adjustment platform system adjusts the relative position of this at least two first workpiece, this adjustment platform has a displacement module, carries out a longitudinal reciprocating motion, a straight reciprocating motion or a traverse motion to enable this adjustment platform.
3. high production wafer fixing apparatus according to claim 1, it is characterized in that: it has more a roll-over unit, this roll-over unit system is between this adjustment platform and this many lamination unit.
4. high production wafer fixing apparatus according to claim 1, it is characterized in that: it has more a First look locating module, the second vision locating module and the 3rd vision locating module, this First look locating module system is positioned at the top that unit is put in this many suction; This second vision locating module system is positioned at the top of this adjustment platform; 3rd vision locating module system is positioned at the top of this cushion cap and this many lamination unit.
5. high production wafer fixing apparatus according to claim 1, it is characterized in that: it has more ejecting unit more than, this many ejecting units system is located at the below of this microscope carrier, this many ejecting unit has at least two thimbles, this many ejecting unit has more a displacement module, is a longitudinal reciprocating motion, a straight reciprocating motion or a traverse motion to make this many ejecting units system relative to this microscope carrier.
6. high production wafer fixing apparatus according to claim 1, it is characterized in that: described many lamination units have a displacement module, to make this many lamination unit carry out a longitudinal reciprocating motion or this rotary motion, this many lamination unit has at least two combining pressing heads.
7. a high production wafer fixing method, is characterized in that: it includes:
One ejecting unit system ejects at least two first workpiece being positioned at a microscope carrier;
Inhale one more and put unary system and draw this at least two first workpiece, and this at least the first workpiece is positioned over an adjustment platform;
One multiple pressure is closed unary system and is drawn at least two first workpiece being positioned at this adjustment platform, and by the top of the second workpiece of this at least two first workpiece movable to cushion cap;
This multiple pressure is closed unary system and this at least two first workpiece is pressed on this second workpiece.
8. high production wafer fixing method according to claim 7, is characterized in that: it more includes a roll-over unit system and draws at least two first workpiece being positioned at this adjustment platform, and by this at least two first workpiece turnings one angle, draws for this lamination unit.
9. a high production wafer fixing method, is characterized in that: it includes:
Inhale one more and put at least two first workpiece that unary system absorption is positioned at a microscope carrier, and this at least the first workpiece is positioned over an adjustment platform;
One multiple pressure is closed unary system and is drawn at least two first workpiece being positioned at this adjustment platform, and by the top of the second workpiece of this at least two first workpiece movable to cushion cap;
This multiple pressure is closed unary system and this at least two first workpiece is pressed on this second workpiece.
10. high production wafer fixing method according to claim 9, is characterized in that: it more includes a roll-over unit system and draws at least two first workpiece being positioned at this adjustment platform, and by this at least two first workpiece turnings one angle, draws for this lamination unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103140571 | 2014-11-24 | ||
| TW103140571A TWI566315B (en) | 2014-11-24 | 2014-11-24 | Wafer mounted apparatus with high yield and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105225990A true CN105225990A (en) | 2016-01-06 |
| CN105225990B CN105225990B (en) | 2019-01-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510720176.9A Active CN105225990B (en) | 2014-11-24 | 2015-10-30 | wafer fixing device and method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105225990B (en) |
| TW (1) | TWI566315B (en) |
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| CN109037420A (en) * | 2018-07-02 | 2018-12-18 | 惠州雷通光电器件有限公司 | A kind of flip-chip crystal solidifying apparatus and method |
| CN109664188A (en) * | 2018-12-14 | 2019-04-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer device for attaching/detaching |
| CN110690152A (en) * | 2019-08-28 | 2020-01-14 | 苏州均华精密机械有限公司 | Large-size wafer bonding device |
| CN113299577A (en) * | 2020-02-21 | 2021-08-24 | 均华精密工业股份有限公司 | Die bonder |
| US20220122939A1 (en) * | 2020-10-15 | 2022-04-21 | Gallant Micro. Machining Co., Ltd. | Producing apparatus and pre-bonding device |
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| TWI703668B (en) * | 2019-08-13 | 2020-09-01 | 均華精密工業股份有限公司 | Large size wafer bonding apparatus |
| TWI722801B (en) * | 2020-02-21 | 2021-03-21 | 均華精密工業股份有限公司 | Die bonder |
| TWI780424B (en) * | 2020-04-07 | 2022-10-11 | 均華精密工業股份有限公司 | Improving accuracy and speed of bonding apparatus |
| TWI798595B (en) * | 2020-10-22 | 2023-04-11 | 均華精密工業股份有限公司 | Die bonding device |
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Also Published As
| Publication number | Publication date |
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| TW201620060A (en) | 2016-06-01 |
| TWI566315B (en) | 2017-01-11 |
| CN105225990B (en) | 2019-01-08 |
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