TWI722801B - Die bonder - Google Patents

Abstract

A die bonder is disclosed, which includes at least one bonding carrier, a supplying module, a picking and placing module, a station module and a rotation module. The bonding carrier is for disposing substrates which have at least one category. The supplying module is for supplying at least one die which has a grade that is corresponding to the category of the substrates. The picking and placing module is disposed above the supplying module and for picking and placing die. The station module is disposed between the supplying module and rotation module, which is for receiving die from picking and locating module. The rotation module is disposed next to the bonding carrier and has at least one picking and placing unit for picking and placing at least one die on one of the substrates which has a category that is corresponding to the grade of die.

Description

Bonding machine

The present invention relates to a die bonding machine, in particular to a type that can bond wafers with corresponding types of substrates according to the wafer level, and can solve the uneven heating, labor-consuming, and low production efficiency that exist in the traditional die bonding process. Chip bonding machine for other problems.

The existing die bonder uses a pick-and-place module to pick up the die located in the die supply module, and then transport the die to a bonding stage to bond with the substrate on the bonding stage .

A wafer contains many dies. Under ideal conditions, the quality of the dies should be good, but due to various factors, the actual condition is not the case. Therefore, the general industry practice is to use a wafer tester to test each die. , In order to distinguish the quality of the crystal grains.

The simplest test result is to divide the die into good or bad. For the bad die, the die will be marked (ink mark), and the pick and place module will identify the mark and avoid the bad die. Only good dies are used, and badly marked dies are discarded.

However, for some crystal grains, it is impossible to simply distinguish between good and bad. For example, the memory can be used even if it is partially damaged. In other words, the memory can be divided into multiple (at least three) levels according to whether it is damaged and the degree of damage.

In view of the above-mentioned multiple levels, the traditional method is to make the test results into a test result file. The test result file content can display the test result of each die, and the pick-and-place module picks and places the die in batches according to the grade. For example, when the test result file shows that the die is divided into four grades from A to D, the pick-and-place module will first process all the A-grade dies to the substrate before proceeding to all the B-grade dies. Then, the C-level and D-level crystal grains are processed in sequence.

Because when processing different grades of dies, the substrate corresponding to that grade must be placed on the bonding stage, which consumes a lot of man-hours to replace the substrate. In addition, it takes a lot of time to wait for the die and the substrate to bond and solidify. . All the above factors lead to low production efficiency.

In order to solve the above-mentioned problems, the practice of some manufacturers is to separate the different grades of dies, and then use two operation lines to be responsible for the A grade and B grade dies. It uses a pick-and-place module to pick up grade A and grade B dies and send them to different operating lines to simultaneously perform the process of bonding with the substrate. Although this method can process the bonding process of two dies at the same time, the equipment cost and the space occupied by the equipment must be invested. In addition, the path for the pick-and-place module to pick and place the die is lengthened, and the actual man-hours that can be saved are limited.

For the process of bonding the die and the substrate, since different die have different thicknesses and the state of the die is different, the selection of the heater for the die bonding process is also an important consideration.

For example, when the crystal grains are thick, heating in one direction from the bottom or top of the crystal grains will cause uneven heat distribution. Or, when the die has a multi-layer structure, such as 3D flash memory (NAND), which belongs to a layer-by-layer structure, if the bottom of the 3D flash memory (NAND) is heated, it will cause insufficient heat at the top. The bonding effect is affected. However, if the heating time is prolonged, the bottom part will be overheated and the process quality will deteriorate.

According to this, how can there be a kind of "bonding die" that can bond the wafer to the corresponding type of substrate according to the wafer level, and can solve the problems of uneven heating, labor-consuming, and low production efficiency that exist in the traditional die-bonding process. "Operation" is a topic that people in the relevant technical fields need to solve urgently.

In one embodiment, the present invention provides a die bonding machine, which includes: at least one bonding stage for setting a plurality of substrates of the same or different types; a supply module for setting at least one die, the die having One level, the level corresponds to the type of one of the substrates; one pick-and-place module is set above the supply module to pick and place the die; one transfer module is set between the supply module and the rotating module , Used to receive the die picked and placed by the pick-and-place module; and a rotary module, arranged on one side of the joint carrier, the rotary module includes at least one pick-and-place unit for picking up the die, The die is placed on the surface of the corresponding type of substrate.

1,1A: Chip bonding machine

2~2D: Die

10: Supply module

20, 20A: Pick and place module

21A, 22A: Pick and place head

30, 30A: transfer module

40, 40A: Rotating module

41: Rotating seat

42,42A: Pick and place unit

421: Pick and Place Head

422: heater

423: Pressure Controller

50: Joint carrier

50A: The first joint carrier

50B: The second joining stage

51: clamping element

60~60D: substrate

70, 70A: heater

81: The first visual capture unit

82: The second visual capture unit

83: The third visual capture unit

90: Compression module

91: Seat

92: pressure head

921: Pressure Controller

922: heater

100: Glue module

102: viscose

110: flip module

120: Glue module

130: eject module

131: eject

C: first axis

FIG. 1 is a schematic top view of an embodiment of the invention.

FIG. 2 is a schematic diagram of the front view architecture of the embodiment in FIG. 1.

FIG. 3 is a schematic top view of another embodiment of the invention.

FIG. 4 is a schematic diagram of the front view architecture of the embodiment in FIG. 3.

FIG. 5 is a schematic top view of another embodiment of the invention.

FIG. 6 is a schematic diagram of the front view structure of the embodiment of FIG. 1 with two bonding stages.

FIG. 7 is a schematic diagram of the structure of the embodiment in FIG. 1 before being equipped with two bonding stages and a pressing module.

FIG. 8 is a schematic view of the structure of the embodiment in FIG. 1 before being equipped with two bonding stages and a gluing module.

FIG. 9 is a schematic diagram of the front view structure of the embodiment of FIG. 1 with different heaters.

FIG. 10 is a schematic structural diagram of the front view of the embodiment in FIG. 1 with a rotating module.

Hereinafter, each embodiment of the content of the present invention will be described in detail, and the drawings will be used as examples. In addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and easy substitutions, modifications, and equivalent changes of any of the embodiments are included in the scope of the present invention and will be covered by the following patents. Prevail. In the description of the specification, in order to enable the reader to have a more complete understanding of the present invention, many specific details are provided; however, the present invention may still be implemented under the premise of omitting some or all of these specific details. In addition, well-known steps or elements are not described in details to avoid unnecessary limitation of the present invention. The same or similar elements in the drawings will be represented by the same or similar symbols. It should be noted that the drawings are for illustration only, and do not represent the actual size or quantity of the components, unless otherwise specified.

Please refer to the embodiment shown in FIGS. 1 and 2. The die bonding machine 1 provided by the present invention includes a supply module 10, a pick-and-place module 20, a transfer module 30, a rotation module 40, and a joint Carrier 50.

The supply module 10 is used to set a plurality of dies 2~2D. The plural dies 2~2D have been tested by a wafer tester and are classified into different grades according to the quality of the dies 2~2D and made into a test result file. In this embodiment, the dies 2~2D respectively represent five different grades, but it is not limited to five. Depending on the actual test results, it is possible that all the dies belong to the same grade.

The pick-and-place module 20 is arranged above the supply module 10 for pick-and-place die 2-2D. A first visual capture unit 81 is provided above the supply module 10 to capture the 2D~2D image information of the die located in the supply module 10, and provide the visual information to the pick-and-place module 20. The display module 20 absorbs the die 2-2D located in the supply module 10 according to the visual information.

The transfer module 30 is disposed between the supply module 10 and the rotating module 40. FIGS. 1 and 2 show that the transfer module 30 receives the die 2 picked and placed by the pick-and-place module 20. A second visual capture unit 82 is provided above the transfer module 30 to capture image information of the die 2 located in the transfer module 30 and provide the image information to the transfer module 30. The rotating module 40 then sucks the die 2 on the transfer module 30 according to the image information.

The rotating module 40 includes a rotating seat 41 that rotates around a first axis C, which is perpendicular to the horizontal plane. The rotating base 41 is provided with a plurality of pick-and-place units 42 for sucking the die 2 set on the transfer module 30. When the rotating base 41 rotates, the pick-and-place unit 42 can be synchronously driven to rotate and the sucked die 2 is transported and placed on the surface of the substrate 60 on the bonding stage 50.

The bonding stage 50 is used to set a plurality of substrates 60-60D of the same or different types. The bonding stage 50 is provided with clamping elements 51 that are clamped on two opposite sides of the substrates 60 to 60D, so that the substrates 60 to 60D are maintained in position on the bonding stage 50. The above-mentioned different categories include different sizes and/or different materials. For example, the five substrates 60-60D shown in Figure 1 have four different sizes. As for the substrates 60-60D, they may belong to five different materials or belong to the same material. , Or belong to two to four different materials.

FIG. 1 shows that a total of four groups of pick-and-place units 42 are equiangularly arranged on the rotating seat 41, but it is not limited to this, and the number of pick-and-place units 42 can be determined according to actual needs. In addition, FIG. 1 shows that there are five substrates 60 on the bonding stage 50 for illustration only, and the size and the size of the bonding stage 50 can be designed according to actual needs. The number of substrates 60 accommodated.

In this embodiment, the pick-and-place unit 42 includes a pick-and-place head 421, and the pick-and-place head 421 is connected to a heater 422 and a pressure controller 423. The heater 422 is used for heating the die 2 taken and placed by the pick and place unit 42. In addition to the pressure controller 423 that can sense the pressure applied by the pick-and-place unit 42 when picking and placing the die 2, its main function is to control the pressure applied by the pick-and-place unit 42 when picking and placing the die 2 according to the sensed pressure. The pick-and-place unit 42 applies appropriate pressure to the pick-and-place die 2 to avoid excessive or insufficient pressure. The heater 422 and the pressure controller 423 or only one of them can be provided according to the required design.

Please refer to FIG. 2, an ejector module 130 is provided under the supply module 10, and the ejector module 130 has an ejector 131 for topping the die 2 disposed on the supply module 10 , In order to facilitate the pick-and-place module 20 to pick up the die 2.

Please refer to the embodiment shown in FIGS. 3 and 4, the die bonder 1A provided by the present invention includes a supply module 10, a pick-and-place module 20, a transfer module 30A, a rotation module 40A, and a joint Carrier 50. This embodiment shows that the rotating base 41 of the rotating module 40A is equally divided into four groups of pick-and-place units 42A. Each group of pick-and-place units 42A includes two pick-and-place heads 421, and each pick-and-place head 421 is connected to a heater. 422 and pressure controller 423. The arrangement direction of the two pick-and-place heads 421 of each group of suction unit groups 42A is tangent to a circle formed with a first axis C as the center. The two pick-and-place heads 421 can be controlled to simultaneously or only one of them can suck 2~2D of the die.

FIG. 3 shows that the transfer module 30A carries two different grades of dies 2 and 2C, and the substrates 60 and 60A are respectively bonded with different grades of dies 2A and 2B. FIG. 4 shows that the two pick-and-place heads 421 of one of the sucking unit groups 42A suck different grades of dies 2 and 2B, respectively.

The embodiments of FIGS. 3 and 4 illustrate that the two pick-and-place units 42A of each group can be controlled separately The pick-and-place heads 421 simultaneously or separately pick and place the die 2~2D, and each pick-and-place head 421 heats and controls the sucked die 2~2D through the connected heater 422 and the pressure controller 423. pressure.

As mentioned above, the plural dies 2~2D have been tested by the wafer tester and are classified into different levels according to the quality of the dies 2~2D and made into a test result file. Die 2~2D of different grades must be bonded to substrates 60~60C of different types. Via a control unit (not shown in the figure) electrically connected to the die bonder 1, the pick-and-place module 20 can determine the level of the die 2~2D picked and placed by the pick-and-place unit 42A through the content of the test result file, and determine If the position of the substrate 60~60C corresponding to the level of die 2~2D is found, the pick-and-place unit 42A can place the die 2~2D on the surface of the corresponding type of substrate 60~60C.

In the same way, if two pick-and-place units 42A pick up the die 2~2D with two levels at the same time, and the substrate 60~60D has at least two types corresponding to the two levels, then the substrate 60 of each category The surface of ~60D can be placed with a corresponding level of 2~2D crystal grains.

In this embodiment, a heater 70 is provided in the bonding stage 50 for heating the substrate 60-60D and/or the die 2-2D provided on the substrate 60-60D from the bottom of the substrate 60-60D. So that the die 2~2D is bonded to the substrate 60~60D. Prior to this, since the dies 2-2D can be preheated by the heater 422 of the pick-and-place unit 42A, the speed of bonding with the substrates 60-60D on the bonding stage 50 can be accelerated.

A third visual capturing unit 83 is provided above the bonding stage 50 for capturing bonding image information of the substrates 60-60D of the bonding stage 50 and providing the bonding image information to the rotating module 40.

Through the aforementioned first visual capture unit 81, second visual capture unit 82, and third The visual capture unit 83 monitors the overall process of die 2~2D being sucked from the supply module 10 to bonding with the substrate 60~60D, including the relative position of the die 2~2D and the substrate 60~60D to maintain the smooth progress of the process . The positions of the first visual capturing unit 81, the second visual capturing unit 82, and the third visual capturing unit 83 can be moved as needed to smoothly capture a clear image.

Regarding the condition that the transfer module 30A can carry two different grades of dies, in addition to the pick-and-place module 20 shown in FIG. 3 for a single pick-and-place die, it can also be matched as shown in FIG. 5. It can control the pick-and-place module 20A for picking up and placing two dies at the same time or picking up one die at a time.

Please refer to the embodiment shown in FIG. 5, the chip bonding machine 1B provided by the present invention includes a supply module 10, a pick-and-place module 20A, a transfer module 30A, a rotation module 40A, and a joining stage 50 .

The difference between this embodiment and the embodiment in FIG. 3 includes that the pick-and-place module 20A has two pick-and-place heads 21A, 22A, which can control the pick-and-place heads 21A, 22A to act at the same time to pick up two dies, or control the pick-and-place head 21A , 22A act separately to pick up the die at the same time.

As shown in FIG. 5, two dies 2C are placed on the transfer module 30A. The two dies 2C can be picked up by the two pick-and-place heads 21A and 22A of the pick-and-place module 20A at the same time from the supply module 10. They are then placed on the transfer module 30A at the same time; it can also be picked up by the pick-and-place heads 21A and 22A from the supply module 10 and then placed on the transfer module 30A separately or at the same time.

Then, the pick-and-place unit 42A can pick up the two dies 2C on the transfer module 30A at the same time, and place the two dies 2C on the surface of the substrate 60B on the bonding stage 50 at the same time. Regarding the state of the rotating module 40A used in this embodiment, please refer to FIG. 4. The rotating seat 41 of the rotating module 40A is equally divided into four groups of pick-and-place units 42A, and each group of pick-and-place units 42A includes Two pick-and-place heads 421, each pick-and-place head 421 is respectively connected to a heater 422 and a pressure controller 423.

The embodiment of FIG. 5 uses the pick-and-place module 20A with two pick-and-place heads 21A, 22A to pick up two die at a time. The purpose is that when the thickness of the die is thin, it takes more time to pick the die. Therefore, using the pick-and-place module 20A with two pick-and-place heads 21A and 22A to pick up two dies at a time can shorten the time for picking up the dies; and if the two pick-up dies are of the same grade, it can be Placing two dies on the same substrate at the same time further shortens the die bonding time and improves production efficiency.

However, as mentioned above, even if the pick-and-place module 20A can pick up two dies at the same time, it can control only one of the pick-and-place heads 21A, 22A to actuate. For example, FIG. 5 also discloses that two dies 2A are placed on the substrate 60. The two dies 2A can be picked up by the two pick-and-place heads 21A, 22A of the pick-and-place module 20A at the same time from the supply module 10. It is placed on the transfer module 30A at the same time, and then picked up by the pick-and-place unit 42A and placed on the substrate 60 at the same time. Alternatively, the two dies 2A may be individually picked up by the pick-and-place heads 21A and 22A, and then separately placed on the transfer module 30A, and then picked up by the pick-and-place unit 42A and placed on the substrate 60 at the same time.

In the same way, the ejection module 130 shown in FIG. 2 can also be applied to the supply module 10 in FIG. 5. In order to match the pick-and-place module 20A with two pick-and-place heads 21A and 22A capable of picking up two dies at the same time, the ejection module 130 can be provided with two ejector pieces 131 for placing the two on the supply module 10 The die is placed on top at the same time, so that the pick-and-place module 20A can pick up two die at the same time, which improves the efficiency of picking and placing the die. However, the two ejectors 131 provided by the ejector module 130 can control only one of them to act, and it is not limited to act simultaneously.

Please refer to the embodiment shown in FIG. 6, the main difference between this embodiment and the embodiment in FIG. 2 is that this embodiment has a first bonding stage 50A and a second bonding stage 50B, the first bonding stage 50A and the second bonding stage 50A The bonding stage 50B can alternately receive the die 2~2D transported by the pick-and-place unit 42.

For example, when the substrate 60 of the first bonding stage 50A accepts all the dies 2~2D, it is moved aside, and the substrate 60~60D of the second bonding stage 50B accepts the die 2. The substrate 60 and the die 2B, 2D on the first bonding stage 50A moved aside can be heated by the heater 70, while waiting for the substrate 60 on the first bonding stage 50A and the die 2B, 2D to be completely bonded and solidified In the process, the substrate 60 on the second bonding stage 50B can undergo a process of receiving the die 2-2D. In this way, the time spent waiting for the substrate 60 and the die 2~2D to be completely bonded and solidified can be fully utilized, and the production efficiency can be improved.

Please refer to the embodiment shown in FIG. 7. The main difference between this embodiment and the embodiment in FIG. 6 is that this embodiment is further equipped with a pressing module 90. The pressing module 90 has a base 91, and a plurality of pressing heads 92 are provided at the bottom of the base 91. Each pressure head 92 includes a pressure controller 921 and a heater 922. The position of the indenter 92 corresponds to the position of the die 2-2D on the substrate 60.

When the substrate 60 of the first bonding stage 50A accepts all the dies 2~2D (Figure 7 only shows the second dies 2 and 2D), then move to the side and replace it with the substrate 60 of the second bonding stage 50B. Die 2~2D. The die 2-2D on the substrate 60 of the first bonding stage 50A is pressed and heated by the pressing module 90. Each indenter 92 is pressed against the corresponding die 2 respectively, and each pressure controller 921 can sense and control the pressure exerted by the indenter 92 on the die 2 so as not to exert excessive or insufficient pressure on the die 2~2D , And each heater 922 can heat the pressed die 2~2D and/or the substrate 60 on which the die 2~2D is placed.

In other words, when the substrate 60 of the first bonding stage 50A receives the die 2 to 2D, the first stage of "pre-compression" can be performed, and it can be heated by the heater 70 of the first bonding stage 50A. After the first bonding stage 50A moves to the side, the second stage of "main pressure" is performed, which is pressurized by the pressing module 90 and heated by the heater 922. Waiting for the substrate 60 and the die on the first bonding stage 50A During the 2~2D complete bonding and curing process, the substrate 60 on the second bonding stage 50B can undergo a process of receiving the 2~2D die. In this way, the time spent waiting for the substrate 60 and the die 2~2D to be fully bonded and solidified can be fully utilized, and the production efficiency can be improved.

It must be noted that the die 2~2D in the embodiment of Figs. 1 to 7 already has glue on its contact surface with the substrate 60~60D, which is heated by the heater 422, the heater 922, and the heater 70 By melting the glue originally attached to the die 2~2D, the die 2~2D can be bonded to the substrate 60~60D, so there is no need for additional glue. However, for dies 2~2D that do not have glue, glue is required, such as Dipping, Dispenser, Syringe Transfer, Stamping, or Screen Printing. One.

Please refer to the embodiment shown in FIG. 8. The main difference between this embodiment and the embodiment in FIG. 6 is that this embodiment is equipped with a gluing module 100. The gluing module 100 is in the shape of a syringe, and the glue 102 can be placed on the surface of the substrate 60 corresponding to the position where the die needs to be arranged 2~2D. As shown in FIG. 8, when the substrate 60 of the first bonding stage 50A is receiving the die 2~2D (FIG. 8 only shows the two dies 2B and 2D) (prior to this, the substrate of the first bonding stage 50A 60 has been dispensed by the gluing module 100), the gluing module 100 can be used to dispense the substrate 60 on the second bonding stage 50B. When the substrate 60 of the first bonding stage 50A accepts all the dies 2~2D, move to the side, and replace the substrate 60 of the second bonding stage 50B to accept the dies 2~2D, which can make full use of waiting for dispensing The time spent improves production efficiency.

In addition, in this embodiment, the first bonding stage 50A and the second bonding stage 50B do not need to be provided with heaters, so as to prevent the adhesive 102 from being heated and solidified.

Please refer to the embodiment shown in FIG. 9. The main difference between this embodiment and the embodiment in FIG. 2 is that the heater 70A of this embodiment is disposed above the bonding stage 50 for driving from the top of the substrate 60 The substrate 60 and/or the dies 2~2D (only the two dies 2B and 2D are shown in FIG. 9) disposed on the substrate 60 are heated.

Regarding the embodiment in which the heater 70A is arranged above the bonding stage 50 shown in FIG. 9, it is also applicable to the structure in which the first bonding stage 50A and the second bonding stage 50B are provided in FIGS. 6 to 8.

In addition, the types of heaters 422, heaters 922, heaters 70, and heaters 70A shown in FIGS. 2 to 9 are not limited, and may be laser heaters, ultrasonic heaters, or far-infrared heaters. One.

Please refer to the embodiment shown in FIG. 10, this embodiment is suitable for the die that needs to be glued. The main difference between this embodiment and the embodiment in FIG. 2 is that this embodiment further includes a turning module 110 and a glue-dipping module 120. The turning module 110 is arranged between the pick-and-place module 20 and the transfer module 30, and is used to receive the 2~2D die picked and placed by the pick-and-place module 20, and after turning over an angle, the die 2~2D Placed on the transfer module 30. Generally speaking, the turning angle of the turning module 110 can be 180 degrees. The function of the flip module 110 is to place one of the die 2-2D that needs to be glued down to facilitate the glueing process.

The glue-dipping module 120 is disposed under the rotating module 40 to provide glue. After the pick-and-place unit 42 picks up the die 2 on the transfer module 30, the die 2 is immersed in the glue dipping module 120, so that the glue is attached to one surface of the die 2. Then, the pick-and-place unit 42 places the die 2 covered with adhesive on the surface of the substrate 60 on the bonding stage 50, and the heater 70 can bond and solidify the substrate 60 and the die 2, as shown in FIG. 10 A die 2D has been bonded and solidified on the substrate 60.

FIG. 1 to FIG. 10 of the present invention disclose the architecture of different embodiments of the present invention, and each architecture has a common feature. During the die bonding process, the substrate is kept in position on the bonding stage. For example, FIG. 1 and FIG. 2 show that during the process of moving the die 2~2D, the substrate 60~60D is always on the bonding stage 50, and the substrate 60~60D does not need to be moved. For example, Figures 3 and 4 show that when the die is moved in 2~2D, During the process, the substrates 60-60D are always on the bonding stage 50, and the substrates 60-60D do not need to be moved. For example, as shown in FIG. 5, whether one or two dies are placed on the substrate, the substrates 60-60D are always on the bonding stage 50, and the substrates 60-60D do not need to be moved. For example, FIGS. 6 to 8 show that the substrate 60 can move synchronously with the corresponding bonding stages 50A, 50B, but the substrate 60 is always positioned on the corresponding bonding stages 50A, 50B. For example, FIG. 9 and FIG. 10 show that during the process of moving the die 2~2D, the substrate 60 is always on the bonding stage 50, and the substrate 60 does not need to be moved.

In summary, the die bonder provided by the present invention, Figures 2 to 10 show different embodiments of the present invention, but do not deviate from the basic structure shown in Figure 2, that is, according to the wafer level of the wafer and phase Corresponding types of substrates are joined together, and can solve the problems of uneven heating, labor-consuming, and low production efficiency in the traditional die bonding process.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

1: Chip bonding machine

2~2D: Die

10: Supply module

20: Pick and place module

30: Transfer module

40: Rotating module

41: Rotating seat

42: Pick and place unit

50: Joint carrier

51: clamping element

60~60D: substrate

81: The first visual capture unit

82: The second visual capture unit

83: The third visual capture unit

C: first axis

Claims (20)

A die bonding machine includes: at least one bonding stage for setting a plurality of substrates of the same or different types, and the plurality of substrates are kept in position on the bonding stage; a supply module for setting at least one die, the The die has a grade corresponding to the type of one of the substrates; a pick-and-place module is arranged above the supply module for picking and placing the die; and a transfer module is arranged on the The supply module and a rotating module are used to receive at least one die taken and placed by the pick-and-place module; the rotating module is arranged on one side of the joining stage, and the rotating module includes at least A pick-and-place unit is used for picking up the at least one die, and the pick-and-place unit places the at least one die on the surface of the corresponding type of the substrate. For example, the die bonder of claim 1, wherein the pick-and-place unit picks up a plurality of the die having at least two levels, the plurality of substrates has at least two two types corresponding to the two levels, and each of the types of the die At least one crystal grain of the corresponding grade is placed on the surface of the substrate. Such as the die bonder of claim 1, wherein the type of the substrate includes different sizes and/or different materials. Such as the die bonder of claim 1, wherein the pick-and-place unit is connected to a heater for heating the at least one die picked-up and placed by the pick-and-place unit. For example, the die bonding machine of claim 1, wherein the pick-and-place unit is connected to a pressure controller for sensing the pressure applied by the pick-and-place unit when picking and placing the at least one die. Such as the die bonder of claim 1, which has a plurality of the bonding stages, the plurality of bonding stages including a first bonding stage and a second bonding stage, the first bonding stage and the second bonding stage The die transported by the pick-and-place unit is alternately received. For example, the die bonding machine of claim 1, which further includes a pressing module for applying pressure and heating to the die placed on the substrate, the pressing module having a plurality of pressure heads, each of the The indenter includes: a pressure controller for controlling the pressure applied by the indenter to the die; and a heater for applying pressure to the die and/or the substrate on which the die is placed heating. Such as the die bonding machine of claim 1, which further includes a glue application module for placing glue on the surface of the substrate. For example, the die bonding machine of claim 8, wherein the gluing method of the gluing module is one of dispensing, stamp printing or screen printing. Such as the die bonder of claim 1, which further includes a heater for heating the at least one die and/or the plurality of substrates. Such as the die bonder of claim 10, wherein the heater is provided in the bonding stage for heating the plurality of substrates and/or at least one die set on the plurality of substrates from the bottom of the plurality of substrates. The die bonder of claim 10, wherein the heater is disposed above the bonding stage for heating the plurality of substrates and/or at least one die set on the plurality of substrates from the top of the plurality of substrates . Such as the die bonder of claim 10, wherein the heater is one of a laser heater, an ultrasonic heater or a far infrared heater. For example, the die bonder of claim 1, which further includes a flip module, which is arranged between the pick-and-place module and the transfer module to receive the die picked and placed by the pick-and-place module, After turning over an angle, the die is placed on the transfer module. For example, the die bonding machine of claim 14, which further includes a dipping module, which is arranged under the rotating module to provide adhesive; after the pick-and-place unit picks up the die on the transfer module Immersing the crystal grains in the dipping module so that glue is attached to one side of the crystal grains. For example, the die bonding machine of claim 1, wherein the rotating module includes a rotating base that rotates with a first axis as the center, and the first axis is perpendicular to the horizontal plane; the rotating base is provided with a plurality of the pick-and-place units Used to suck the die set on the transfer module, the rotating seat drives the pick-and-place unit to rotate and transport the die to the surface of the substrate on the bonding stage. For example, the wafer bonding machine of claim 16, wherein the rotating base of the rotating module is provided with a plurality of pick-and-place units, and each group of the pick-and-place units includes a plurality of the pick-and-place heads, and each of the pick-and-place heads is connected to a Heater and a pressure controller. For example, the die bonder of claim 17, wherein the multiple pick-and-place units are equally divided on the rotating seat, and the arrangement direction of the multiple pick-and-place heads of each group of the suction unit group is formed with the first axis as the center The circle is tangent. For example, the die bonder of claim 1, wherein the pick-and-place module has a plurality of pick-and-place heads, and each of the plural pick-and-place heads of the pick-and-place module can be controlled to act simultaneously to pick up a plurality of the die, or the pick-and-place module Each of the plural pick and place heads of the place module can be controlled to act individually to pick up the die at the same time. For example, the die bonder of claim 1, wherein at least one ejector module is provided below the supply module, and the ejector module has at least one ejector for attaching at least one of the supply modules The die is topped to facilitate the pick-and-place module to pick up the die.

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