CN109037420A - A kind of flip-chip crystal solidifying apparatus and method - Google Patents

A kind of flip-chip crystal solidifying apparatus and method Download PDF

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Publication number
CN109037420A
CN109037420A CN201810712664.9A CN201810712664A CN109037420A CN 109037420 A CN109037420 A CN 109037420A CN 201810712664 A CN201810712664 A CN 201810712664A CN 109037420 A CN109037420 A CN 109037420A
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chip
flip
substrate
electrode
suction nozzle
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CN201810712664.9A
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CN109037420B (en
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罗锦长
许晋源
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Huizhou Lei Tong Photoelectric Device Co Ltd
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Huizhou Lei Tong Photoelectric Device Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

The invention discloses a kind of flip-chip crystal solidifying apparatus and method, described device includes: flip-chip, film, flip-chip plummer, thimble, thimble driving device, receives bracket, mechanism for picking, rotating mechanism and translation mechanism；The mechanism for picking is for picking up or putting down flip-chip；The rotating mechanism is used for the flip-chip that picks up the mechanism for picking perpendicular to 180 ° of plane internal rotation of film, makes the electrode of the flip-chip downward；The translation mechanism is used to for the flip-chip being moved to position corresponding with the route on the reception bracket；The present invention, so that thimble pushes up flip-chip by the substrate of top flip-chip upwards, will not push up the epitaxial layer and electrode for hurting flip-chip by the way that the substrate of flip-chip to be pasted on film.

Description

A kind of flip-chip crystal solidifying apparatus and method
Technical field
The present invention relates to chip die bond technical fields, and in particular to a kind of flip-chip crystal solidifying apparatus and method.
Background technique
LED (Light Emitting Diode, light emitting diode) is that one kind can convert electrical energy into partly leading for luminous energy Body device has many advantages, such as that the service life is long, light efficiency is high and low and radiates and low-power consumption.
The LED chip occurred earliest is the positive cartridge chip of LED.The positive cartridge chip of LED is disposed with electrode, P- from top to bottom GaN, luminescent layer, N-GaN and substrate.Electrode setting in the positive cartridge chip of LED is square on the light-emitting layer, can tie up light-emitting area, Luminous efficiency is influenced, therefore, research staff devises the LED flip chip that electrode is arranged below.Traditional LED flip chip It is followed successively by substrate, N-GaN, luminescent layer, P-GaN and electrode from top to bottom, substrate is sapphire, N-GaN, luminescent layer, P-GaN The structure of composition is referred to as epitaxial layer, compares substrate, and epitaxial layer is more fragile.In recent years, as miniature LED flip chip application is got over Come more extensive, the material that the epitaxial layer of LED flip chip uses becomes the GaAs more more fragile than GaN.Existing LED upside-down mounting core Piece is adhered to electrode on blue film during die bond, and when thimble jacks up LED flip chip, what is pushed up is epitaxial layer, is easy The problems such as epitaxial layer is hurt on top, and electric leakage is caused to fail.
Notification number is that the utility model patent of CN205609484U discloses a kind of novel inverted chip die bonder structure, is wrapped Include: pedestal, flip LED chips and the plummer between pedestal and flip LED chips, the plummer is for carrying The flip LED chips, the plummer top are provided with the adsorbent equipment of absorption flip LED chips, are arranged on the pedestal There is driving device, the plummer is internally provided with thimble placement department, thimble, the driving are provided in the thimble placement department Device drives the thimble to move up and down, and has one layer of scribing film, the upside-down mounting between the plummer and the flip LED chips LED chip is pasted on the scribing film, and the electrode of the flip LED chips bottom is respectively aligned to the thimble placement department, institute The top for stating thimble is corresponding with the bottom electrode position of the flip LED chips.
In above-mentioned patent, although thimble will not push up the luminescent layer for hurting chip when jacking up chip, there are still it is following not Foot: thimble can push up the electrode for hurting flip LED chips.
Summary of the invention
The first purpose of this invention is intended to provide a kind of flip-chip crystal solidifying apparatus, prevents thimble from jacking up flip-chip When, the epitaxial layer and electrode of flip-chip are hurt in top.
In order to realize the first purpose of this invention, this invention takes the following technical solutions:
A kind of flip-chip crystal solidifying apparatus, the crystal solidifying apparatus include: flip-chip, film, plummer, thimble, thimble Driving device and reception bracket；The flip-chip includes substrate, epitaxial layer and electrode；The film is fixed at described On plummer, thimble accommodating hole is provided on the plummer；The film has viscosity, and the flip chip attachment is described Film upper surface；The thimble moves up and down in the thimble accommodating hole under the driving of the thimble driving device, thin Film following table jacks up upwardly the flip-chip；The substrate of the flip-chip is pasted onto the film upper surface, the thimble Below the substrate of the flip-chip；The flip-chip crystal solidifying apparatus further includes mechanism for picking, rotating mechanism, translation machine Structure and reception bracket；The mechanism for picking picks up the flip-chip jacked up or puts down flip-chip；The rotating mechanism is by institute The flip-chip of mechanism for picking pickup is stated perpendicular to 180 ° of plane internal rotation of film, makes the electrode court of the flip-chip Under；The route that the translation mechanism is used to be moved to the flip-chip that the mechanism for picking picks up with receive on bracket is corresponding Position；The reception bracket is for receiving the flip-chip；Be provided on the reception bracket for the flip-chip The logical route of electrode conductance.
Further, the mechanism for picking includes that epitaxial layer picks up component and substrate pickup component；The epitaxial layer picks up Taking component includes epitaxial layer vacuum slot, and the epitaxial layer vacuum slot is corresponding with the epitaxial layer position of the flip-chip, is used In the epitaxial layer for attracting the flip-chip；The substrate pickup component includes substrate vacuum suction nozzle, the substrate vacuum suction nozzle It is corresponding with the substrate location of the flip-chip, for attracting the substrate of the flip-chip；The rotation of the rotating mechanism is defeated Outlet is connect with the rotary input that the epitaxial layer picks up component, for driving the epitaxial layer vacuum slot perpendicular to thin 180 ° of the plane internal rotation of film, or, the rotary input of the rotary output of the rotating mechanism and the substrate pickup component Connection, for driving the substrate vacuum suction nozzle perpendicular to 180 ° of plane internal rotation of film；The movement of the translation mechanism Output end is connect with the mobile input terminal that the epitaxial layer picks up component, for driving the epitaxial layer vacuum slot mobile, or, The mobile output end of the translation mechanism is connect with the mobile input terminal of the substrate pickup component, for driving the substrate true Suction mouth is mobile.
Further, it further includes epitaxial layer die bond arm that the epitaxial layer, which picks up component, the epitaxial layer die bond arm with it is described Epitaxial layer vacuum slot is vertically fixedly connected；The substrate pickup component further includes substrate die bond arm, the substrate die bond arm with The substrate vacuum suction nozzle is vertically fixedly connected；The rotation of the rotary output of the rotating mechanism and the epitaxial layer die bond arm Input terminal connection, or, the rotary output of the rotating mechanism is connect with the rotary input of the substrate die bond arm；It is described flat The mobile output end of telephone-moving structure is connect with the mobile input terminal of the epitaxial layer die bond arm, or, the movement of the translation mechanism is defeated Outlet is connect with the mobile input terminal of the substrate die bond arm.
Further, it includes multiple epitaxial layer vacuum slots that the epitaxial layer, which picks up component,.
Further, the mechanism for picking includes that electrode picks up component and substrate pickup component；The electrode pickup group Part includes electrode vacuum suction nozzle, and the electrode vacuum suction nozzle is corresponding with two electrodes of the flip-chip, described for attracting Two electrodes of flip-chip；The substrate pickup component includes substrate vacuum suction nozzle, the substrate vacuum suction nozzle and it is described fall The substrate of core piece is corresponding, for attracting the substrate of the flip-chip；The rotary output of the rotating mechanism and the electricity The rotary input connection of component is picked up in pole, for driving the electrode vacuum suction nozzle in the plane internal rotation perpendicular to film 180 °, or, the rotary output of the rotating mechanism is connect with the rotary input of the substrate pickup component, for driving Substrate vacuum suction nozzle is stated perpendicular to 180 ° of plane internal rotation of film；The mobile output end and the electrode of the translation mechanism The mobile input terminal connection for picking up component, for driving the electrode vacuum suction nozzle mobile, or, the movement of the translation mechanism is defeated Outlet is connect with the mobile input terminal of the substrate pickup component, for driving the substrate vacuum suction nozzle mobile.
Further, it further includes electrode die bond arm that the electrode, which picks up component, and the electrode die bond arm and the electrode are true Suction mouth is vertically fixedly connected；The substrate pickup component；It includes substrate die bond arm that the electrode, which picks up component, and the substrate is solid Brilliant arm is vertical with the substrate vacuum suction nozzle to be fixedly connected；The rotary output of the rotating mechanism and the electrode die bond arm Rotary input connection, or, the rotary output of the rotating mechanism is connect with the rotary input of the substrate die bond arm；Institute The mobile output end for stating translation mechanism is connect with the mobile input terminal of the electrode die bond arm, or, the movement of the translation mechanism Output end is connect with the mobile input terminal of the substrate die bond arm.
Further, it includes symmetrically arranged even number of electrodes vacuum slot that the electrode, which picks up component, for attracting State two electrodes of flip-chip.
Further, the substrate pickup component includes multiple substrate vacuum suction nozzles.
Further, the mechanism for picking includes side pick component；The side pick component includes side pick head, The side pick head is used to clamp the side of the flip-chip；The rotating output shaft of the rotating mechanism is picked up with the side The Rotating input shaft of head is taken to connect, for driving the side pick head perpendicular to 180 ° of plane internal rotation of the film； The mobile output shaft of the translation mechanism and the mobile input axis connection of side pick component, for driving the side pick head It is mobile.
Further, the side pick component further includes side die bond arm, and the side die bond arm is picked up with the side Head is taken vertically to be fixedly connected；The mobile output shaft of the translation mechanism and the mobile input axis connection of side die bond arm.
Second object of the present invention is intended to provide a kind of flip-chip die-bonding method, prevents thimble from jacking up flip-chip When, the epitaxial layer and electrode of flip-chip are hurt in top.
In order to realize second object of the present invention, this invention takes the following technical solutions:
A kind of flip-chip die-bonding method, using above-mentioned flip-chip crystal solidifying apparatus；The die-bonding method includes following step It is rapid: (1) substrate of flip-chip to be pasted onto film upper surface；(2) it drives thimble to move up by thimble driving device, pushes up Needle pushes up the substrate of flip-chip upwards；(3) when the power that thimble pushes up flip-chip upwards is greater than film to the substrate of flip-chip When viscous force, the substrate and thin film separation of flip-chip；(4) mechanism for picking picks up the flip-chip with thin film separation；(5) whirler The flip-chip that structure picks up mechanism for picking the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, Substrate is upward；The flip-chip that mechanism for picking picks up is moved to position corresponding with the route received on bracket by translation mechanism； (6) flip-chip is placed on and receives corresponding position on bracket by flip-chip pick device.
Further, the mechanism for picking includes that epitaxial layer picks up component and substrate pickup component；The epitaxial layer picks up Taking component includes epitaxial layer vacuum slot；The substrate pickup component includes substrate vacuum suction nozzle；
The step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, into And flip-chip is picked up, the step (5) is that rotating mechanism drives epitaxial layer vacuum slot in the plane inward turning perpendicular to film Turn 180 °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate court On, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum slot is inhaled in substrate vacuum Stopping attracting the epitaxial layer of flip-chip after the substrate of mouth attraction flip-chip, translation mechanism drives substrate vacuum suction nozzle mobile, It drives flip-chip mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, And then flip-chip is picked up, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum is inhaled Mouth stops attracting after the substrate that substrate vacuum suction nozzle attracts flip-chip the epitaxial layer of flip-chip, and the step (5) is rotation Rotation mechanism drives substrate vacuum suction nozzle in the plane internal rotation 180 perpendicular to film after substrate vacuum suction nozzle picks up flip-chip Degree °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, put down Telephone-moving structure drives substrate vacuum suction nozzle mobile, drives flip-chip mobile, makes the electrode of flip-chip and receives the line on bracket Road position is corresponding,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, And then flip-chip is picked up, the step (5) is that rotating mechanism drives epitaxial layer vacuum slot in the plane perpendicular to film 180 ° of rotation, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate court On, translation mechanism drives epitaxial layer vacuum slot mobile, drives flip-chip mobile, makes the electrode of flip-chip and receives bracket On place on line it is corresponding, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum is inhaled Mouth stops attracting after the substrate that substrate vacuum suction nozzle attracts flip-chip the epitaxial layer of flip-chip,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, And then flip-chip is picked up, the step (5) is that translation mechanism drives epitaxial layer vacuum slot mobile, and flip-chip is driven to move It is dynamic, keep the electrode of flip-chip corresponding with the place on line received on bracket, substrate pickup component is inhaled by substrate vacuum suction nozzle Draw the substrate of flip-chip, epitaxial layer vacuum slot stops attracting upside-down mounting after the substrate that substrate vacuum suction nozzle attracts flip-chip The epitaxial layer of chip, rotating mechanism drive substrate vacuum suction nozzle perpendicular to film after substrate vacuum suction nozzle picks up flip-chip Plane internal rotation 180 degree °, drive flip-chip perpendicular to 180 ° of plane internal rotation of film, make the electrode of flip-chip Downward, substrate is upward；
The step (6) is the substrate that substrate vacuum suction nozzle stops attracting flip-chip, and flip-chip is placed on reception The electrode of flip-chip is connected with the line electricity received on bracket in corresponding position on bracket.
Further, it further includes epitaxial layer die bond arm that the epitaxial layer, which picks up component, the epitaxial layer die bond arm with it is described Epitaxial layer vacuum slot is vertically fixedly connected；The substrate pickup component further includes substrate die bond arm, the substrate die bond arm with The substrate vacuum suction nozzle is vertically fixedly connected；
The step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, into And flip-chip is picked up, the step (5) is that rotating mechanism drives epitaxial layer die bond arm in the plane internal rotation perpendicular to film 180 °, drive epitaxial layer vacuum slot perpendicular to 180 ° of plane internal rotation of film, so drive flip-chip perpendicular to 180 ° of the plane internal rotation of film, make the electrode of flip-chip downward, substrate upward, substrate pickup component passes through substrate vacuum and inhales Mouth attracts the substrate of flip-chip, and epitaxial layer vacuum slot stops attracting after the substrate that substrate vacuum suction nozzle attracts flip-chip The epitaxial layer of flip-chip, translation mechanism drive substrate die bond arm mobile, drive substrate vacuum suction nozzle mobile, and then drive upside-down mounting Chip is mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, And then flip-chip is picked up, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum is inhaled Mouth stops attracting after the substrate that substrate vacuum suction nozzle attracts flip-chip the epitaxial layer of flip-chip, and the step (5) is rotation Rotation mechanism drives substrate die bond arm in the plane internal rotation 180 perpendicular to film after substrate vacuum suction nozzle picks up flip-chip Degree ° drives substrate vacuum suction nozzle in the plane internal rotation 180 degree ° perpendicular to film, and then drives flip-chip perpendicular to thin 180 ° of the plane internal rotation of film, make the electrode of flip-chip downward, substrate upward, translation mechanism drives substrate die bond arm mobile, It drives substrate vacuum suction nozzle mobile, and then drives flip-chip mobile, make the electrode of flip-chip and receive the route on bracket Position is corresponding,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, And then flip-chip is picked up, the step (5) is that rotating mechanism drives epitaxial layer die bond arm in the plane inward turning perpendicular to film Turn 180 °, drives epitaxial layer vacuum slot perpendicular to 180 ° of plane internal rotation of film, and then drive flip-chip vertical In 180 ° of plane internal rotation of film, make the electrode of flip-chip downward, substrate upward, translation mechanism drives epitaxial layer die bond arm It is mobile, it drives epitaxial layer vacuum slot mobile, and then drive flip-chip mobile, makes the electrode of flip-chip and receive on bracket Place on line it is corresponding, substrate pickup component attracts the substrate of flip-chip, epitaxial layer vacuum slot by substrate vacuum suction nozzle Stop attracting the epitaxial layer of flip-chip after the substrate that substrate vacuum suction nozzle attracts flip-chip,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, And then flip-chip is picked up, the step (5) is that translation mechanism drives epitaxial layer die bond arm mobile, drives epitaxial layer vacuum slot It is mobile, and then drive flip-chip mobile, keep the electrode of flip-chip corresponding with the place on line received on bracket, substrate pickup Component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum slot attracts upside-down mounting core in substrate vacuum suction nozzle Stop attracting the epitaxial layer of flip-chip after the substrate of piece, rotating mechanism drives lining after substrate vacuum suction nozzle picks up flip-chip Bottom die bond arm drives substrate vacuum suction nozzle in the plane inward turning perpendicular to film in the plane internal rotation 180 degree ° perpendicular to film Turnback °, so drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, lining Bottom is upward.
Further, the mechanism for picking includes that electrode picks up component and substrate pickup component；The electrode picks up component Including electrode vacuum suction nozzle；The substrate pickup component includes substrate vacuum suction nozzle；
The step (4) is that electrode picks up component by the electrode of electrode vacuum suction nozzle attraction flip-chip, and then picks up Flip-chip, the step (5) are that rotating mechanism drives the electrode vacuum suction nozzle in the plane internal rotation perpendicular to film 180 °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, Substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle attracts in substrate vacuum suction nozzle Stop attracting the electrode of flip-chip after the substrate of flip-chip, translation mechanism drives substrate vacuum suction nozzle mobile, drives upside-down mounting Chip is mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is the electrode layer that electrode picks up that component attracts flip-chip by electrode vacuum suction nozzle, in turn Flip-chip is picked up, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle is serving as a contrast Stop attracting the electrode of flip-chip after the substrate of bottom vacuum slot attraction flip-chip, the step (5) is that rotating mechanism exists Driving substrate vacuum suction nozzle drives in the plane internal rotation 180 degree ° perpendicular to film after substrate vacuum suction nozzle picks up flip-chip Flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, translation mechanism drives Dynamic substrate vacuum suction nozzle is mobile, drives flip-chip mobile, makes the electrode of flip-chip and receives the place on line pair on bracket It answers,
Or, the step (4) is the electrode that electrode picks up that component attracts flip-chip by electrode vacuum suction nozzle, and then inhale Flip-chip is played, the step (5) is that rotating mechanism drives the electrode vacuum suction nozzle in the plane internal rotation perpendicular to film 180 °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, Translation mechanism driving electrodes vacuum slot is mobile, drives flip-chip mobile, makes the electrode of flip-chip and receives on bracket Place on line is corresponding, and substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle is serving as a contrast Stop attracting the electrode of flip-chip after the substrate of bottom vacuum slot attraction flip-chip,
Or, the step (4) is the electrode that electrode picks up that component attracts flip-chip by electrode vacuum suction nozzle, and then inhale Flip-chip is played, the step (5) is mobile for translation mechanism driving electrodes vacuum slot, drives flip-chip mobile, makes upside-down mounting The electrode of chip is corresponding with the place on line received on bracket, and substrate pickup component attracts flip-chip by substrate vacuum suction nozzle Substrate, electrode vacuum suction nozzle substrate vacuum suction nozzle attract flip-chip substrate after stop attract flip-chip epitaxy Layer, rotating mechanism drive substrate vacuum suction nozzle in the plane inward turning perpendicular to film after substrate vacuum suction nozzle picks up flip-chip Turnback °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate court On；
The step (6) is the substrate that substrate vacuum suction nozzle stops attracting flip-chip, and flip-chip is placed on reception The electrode of flip-chip is connected with the line electricity received on bracket in corresponding position on bracket.
Further, it further includes electrode die bond arm that the electrode, which picks up component, and the electrode die bond arm and the electrode are true Suction mouth is vertically fixedly connected；The substrate pickup component；It includes substrate die bond arm that the electrode, which picks up component, and the substrate is solid Brilliant arm is vertical with the substrate vacuum suction nozzle to be fixedly connected；
The step (4) is that electrode picks up component by the electrode of electrode vacuum suction nozzle attraction flip-chip, and then picks up Flip-chip, the step (5) are rotating mechanism driving electrodes die bond arm perpendicular to 180 ° of plane internal rotation of film, are driven Electrode vacuum suction nozzle drives flip-chip in the plane perpendicular to film perpendicular to 180 ° of plane internal rotation of film 180 ° of rotation, make the electrode of flip-chip downward, substrate upward, substrate pickup component attracts upside-down mounting core by substrate vacuum suction nozzle The substrate of piece, electrode vacuum suction nozzle stop attracting after the substrate that substrate vacuum suction nozzle attracts flip-chip the electricity of flip-chip Pole, translation mechanism drive substrate die bond arm mobile, drive substrate vacuum suction nozzle mobile, and then drive flip-chip mobile, make down The electrode of cartridge chip is corresponding with the place on line received on bracket,
Or, the step (4) is the electrode layer that electrode picks up that component attracts flip-chip by electrode vacuum suction nozzle, in turn Flip-chip is picked up, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle is serving as a contrast Stop attracting the electrode of flip-chip after the substrate of bottom vacuum slot attraction flip-chip, the step (5) is that rotating mechanism exists Driving substrate die bond arm drives true in the plane internal rotation 180 degree ° perpendicular to film after substrate vacuum suction nozzle picks up flip-chip Suction mouth drives flip-chip in the plane internal rotation perpendicular to film in the plane internal rotation 180 degree ° perpendicular to film 180 °, make the electrode of flip-chip downward, substrate upward, translation mechanism drives die bond arm in bottom mobile, drives substrate vacuum suction nozzle It is mobile, and then drive flip-chip mobile, keep the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is the electrode that electrode picks up that component attracts flip-chip by electrode vacuum suction nozzle, and then inhale Play flip-chip, the step (5) is rotating mechanism driving electrodes die bond arm perpendicular to 180 ° of plane internal rotation of film, band Moving electrode vacuum slot drives flip-chip in the plane perpendicular to film perpendicular to 180 ° of plane internal rotation of film Interior 180 ° of rotation, make the electrode of flip-chip downward, substrate upward, translation mechanism driving electrodes die bond arm is mobile, band moving electrode Vacuum slot is mobile, and then drives flip-chip mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket, Substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle attracts in substrate vacuum suction nozzle Stop attracting the electrode of flip-chip after the substrate of flip-chip,
Or, the step (4) is the electrode that electrode picks up that component attracts flip-chip by electrode vacuum suction nozzle, and then inhale Flip-chip is played, the step (5) is mobile for translation mechanism driving electrodes die bond arm, drives electrode vacuum suction nozzle mobile, in turn It drives flip-chip mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket, substrate pickup component passes through Substrate vacuum suction nozzle attracts the substrate of flip-chip, and electrode vacuum suction nozzle is after the substrate that substrate vacuum suction nozzle attracts flip-chip Stop attracting the epitaxial layer of flip-chip, rotating mechanism drives substrate die bond arm to exist after substrate vacuum suction nozzle picks up flip-chip Perpendicular to the plane internal rotation 180 degree ° of film, drive substrate vacuum suction nozzle in the plane internal rotation 180 degree ° perpendicular to film, And then drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward；
The step (6) is the substrate that substrate vacuum suction nozzle stops attracting flip-chip, and flip-chip is placed on reception The electrode of flip-chip is connected with the line electricity received on bracket in corresponding position on bracket.
Further, the mechanism for picking includes side pick component；The side pick component includes side pick head, The side pick head is used to clamp the side of the flip-chip；
The step (4) is the side that side pick component passes through side pick head clamping flip-chip, and then picks up Cartridge chip；The step (5) is that rotating mechanism drives side pick-up head perpendicular to 180 ° of plane internal rotation of film, and drive is fallen Cartridge chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward；Translation mechanism driving Side pick head is mobile, drives flip-chip mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket；Institute Stating step (6) is the side that side pick head stops clamping flip-chip, and flip-chip is placed on to the correspondence received on bracket The electrode of flip-chip is connected with the line electricity received on bracket in position.
Further, the side pick component further includes side die bond arm, and the side die bond arm is picked up with the side Head is taken vertically to be fixedly connected；
The step (5) is that rotating mechanism drives side pick-up head perpendicular to 180 ° of plane internal rotation of film, is driven Flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward；Translation mechanism drives Dynamic side die bond arm is mobile, drives side pick head mobile, and then drives flip-chip mobile, makes the electrode of flip-chip and connects Place on line on revenue and expenditure frame is corresponding.
The invention has the advantages that:
By the way that the substrate of flip-chip to be pasted on film, thimble is pushed up the present invention upwards by the substrate of top flip-chip Flip-chip will not push up the epitaxial layer and electrode for hurting flip-chip, and the material that substrate uses is harder than epitaxial layer and electrode, quilt The risk of thimble top wound is low, and at the same time, flip-chip is rotated 180 ° by rotating mechanism by the present invention, makes the electricity of flip-chip It pole downward, can be corresponding with the route received on bracket.Further, the present invention attracts upside-down mounting core by epitaxial layer vacuum slot The epitaxial layer of piece, substrate vacuum suction nozzle attract the substrate of flip-chip, make epitaxial layer vacuum slot or substrate by rotating mechanism Vacuum slot rotates 180 °, and then flip-chip is made to rotate 180 °, and the electrode of flip-chip is downward.Further, the present invention is logical The epitaxial layer that multiple epitaxial layer vacuum slots attract flip-chip is crossed, convenient for more stably picking up flip-chip；Further, originally Invention attracts the electrode of flip-chip by electrode vacuum suction nozzle, and substrate vacuum suction nozzle attracts the substrate of flip-chip, passes through rotation Rotation mechanism makes electrode vacuum suction nozzle or substrate vacuum suction nozzle rotate 180 °, and then flip-chip is made to rotate 180 °, flip-chip Electrode is downward.Further, the present invention attracts the electrode of flip-chip by multiple electrodes vacuum slot, convenient for more stably inhaling Play flip-chip；Further, the present invention attracts the substrate of flip-chip by multiple substrate vacuum suction nozzles, convenient for more stably Pick up flip-chip；Further, the present invention passes through the side of side pick head clamping flip-chip, makes side by rotating mechanism Face pick-up head rotates 180 °, and then flip-chip is made to rotate 180 °, and the electrode of flip-chip is downward.
Detailed description of the invention
In order to illustrate the embodiments of the present invention more clearly, simple Jie is done to attached drawing needed in the embodiment below It continues.The accompanying drawings in the following description is only that the embodiment in the present invention is not being paid for those of ordinary skill in the art Out under the premise of creative work, it can also be obtained according to these attached drawings other accompanying drawings.
Fig. 1 is the state diagram that the substrate of one flip-chip of the embodiment of the present invention is pasted on film；
Fig. 2 is the state diagram for the substrate that one thimble of the embodiment of the present invention corresponds to flip-chip；
Fig. 3 is the substrate that one thimble of the embodiment of the present invention jacks up flip-chip, and epitaxial layer vacuum slot attracts flip-chip Epitaxial layer state diagram；
Fig. 4 is that one rotating mechanism of embodiment of the present invention driving epitaxial layer vacuum slot rotates 180 °, drives flip-chip rotation After turning 180 °, substrate vacuum suction nozzle attracts the state diagram of the substrate of flip-chip；
Fig. 5 is that one translation mechanism of embodiment of the present invention driving substrate vacuum suction nozzle is mobile, makes the electrode movement of flip-chip To with state diagram when receiving the corresponding position of route on bracket；
Fig. 6 is the epitaxial layer that two epitaxial layer vacuum slot of the embodiment of the present invention attracts flip-chip, and substrate vacuum suction nozzle is inhaled Draw the state diagram of the substrate of flip-chip；
Fig. 7 is that two rotating mechanism of embodiment of the present invention driving substrate vacuum suction nozzle rotates 180 °, drives flip-chip rotation 180 °, and translation mechanism driving substrate vacuum suction nozzle is mobile, make the electrode movement of flip-chip to receive route pair on bracket The state diagram when position answered；
Fig. 8 is the substrate that three thimble of the embodiment of the present invention jacks up flip-chip, and electrode vacuum suction nozzle picks up flip-chip The state diagram of electrode；
Fig. 9 is the substrate that five thimble of the embodiment of the present invention jacks up flip-chip, the side of side pick head clamping flip-chip The state diagram in face；
Figure 10 is that five rotating mechanism of embodiment of the present invention driving side pick-up head rotates 180 °, drives flip-chip rotation 180 °, and translation mechanism driving side pick-up head is mobile, make the electrode movement of flip-chip to corresponding with route on bracket is received Position when state diagram；
Detailed description of the invention: 1, flip-chip；11, substrate；12, epitaxial layer；13, electrode；131, electrode；132, electrode；2, it is thin Film；3, flip-chip plummer；4, thimble；51, mechanism for picking；511, epitaxial layer picks up component；512, substrate pickup component； 513, electrode picks up component；514, side pick component；511a, epitaxial layer vacuum slot；511b, epitaxial layer die bond arm；512a, Epitaxial layer vacuum slot；512b, epitaxial layer die bond arm；513a, electrode vacuum suction nozzle；513b, electrode vacuum suction nozzle；513c, electricity Pole die bond arm；514a, side pick head；514b, side pick head；514c, side die bond arm；6, receive bracket；61, route.
Specific embodiment
With reference to the accompanying drawing, the present invention will be described in detail.
In order to which the purpose of the present invention, technical solution, advantage is more clearly understood, with reference to the accompanying drawings and embodiments to this Invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, not For limiting the present invention.
Embodiment 1
As shown in Fig. 1 to 5, flip-chip crystal solidifying apparatus provided in this embodiment includes flip-chip 1, film 2, upside-down mounting core Piece plummer 3, thimble 4, thimble driving device (not shown), mechanism for picking 51, rotating mechanism (not shown), translation mechanism are (not Diagram) and reception bracket 6.As shown in Fig. 1 to 5, flip-chip 1 includes substrate 11, epitaxial layer 12 and electrode 13.Receive branch Route 61 is provided on frame 6.
As shown in Figure 1, film 2 is arranged on flip-chip plummer 3, film 2 has viscosity, the substrate of flip-chip 1 11 are pasted onto side of the film 2 far from flip-chip plummer 3, and substrate 11 is sequentially arranged above epitaxial layer 12 and electrode 13； As shown in Fig. 2, thimble accommodating hole 31 is provided on flip-chip plummer 3, the substrate 11 and thimble of flip-chip 1 to be jacked up The position of accommodating hole 31 is corresponding；The drive output of thimble driving device is connect with the driving input terminal of thimble 4, for driving Thimble 4 is stated to move up and down in thimble accommodating hole 31.
Mechanism for picking 51 is used to pick up by flip-chip 1 that thimble 4 jacks up and puts down flip-chip 1；Rotating mechanism is used In the flip-chip 1 for picking up mechanism for picking 51 perpendicular to 180 ° of plane internal rotation of film 2, make the electrode of flip-chip 1 13 downward；The route 61 that translation mechanism is used to be moved to the flip-chip 1 that mechanism for picking 51 picks up with receive on bracket 6 is corresponding Position；It receives bracket 6 and is picked the flip-chip 1 that mechanism 51 is put down for receiving, and the electrode 13 of flip-chip 1 and reception Route 61 on bracket 6 conducts.
As shown in Fig. 1 to 5, in the present embodiment, mechanism for picking 51 includes that epitaxial layer picks up component 511 and substrate pickup Component 512；It includes epitaxial layer vacuum slot 511a and epitaxial layer die bond arm 511b, epitaxial layer die bond that epitaxial layer, which picks up component 511, Arm 511b is vertical with epitaxial layer vacuum slot 511 to be fixedly connected, the rotating output shaft and epitaxial layer die bond arm 511b of rotating mechanism Rotating input shaft connection, for drive epitaxial layer die bond arm 511b perpendicular to 180 ° of plane internal rotation of film 2, drive it is of heap of stone Crystal layer vacuum slot 511a picks up epitaxial layer vacuum slot 511a perpendicular to 180 ° of plane internal rotation of film 2 Flip-chip 1 is perpendicular to 180 ° of plane internal rotation of film 2；Substrate pickup component 512 include substrate vacuum suction nozzle 512a and Substrate die bond arm 512b, substrate die bond arm 512b is vertical with substrate vacuum suction nozzle 512a to be fixedly connected, and the movement of translation mechanism is defeated The mobile input axis connection of shaft and substrate die bond arm 512b drives substrate vacuum for driving substrate die bond arm 512b mobile Suction nozzle 512a is mobile, and then the flip-chip 1 for driving substrate vacuum suction nozzle 512a to pick up is mobile.
The working principle of above-mentioned flip-chip crystal solidifying apparatus is as follows:
Flip-chip 1 is placed on film 2, and the substrate 11 of flip-chip 1 is pasted onto film 2 and carries far from flip-chip The side of platform 3；Thimble driving device driving thimble 4 moves up, and thimble 4 pushes up the substrate 11 of flip-chip 1 upwards, works as thimble When the power of 4 top flip-chips 1 upwards are greater than film 2 to the viscous force of the substrate 11 of flip-chip 1, the substrate 11 of flip-chip 1 with Film 2 separates；Epitaxial layer picks up component 511 and passes through epitaxial layer vacuum slot after the substrate 11 of flip-chip 1 is separated with film 2 511a picks up flip-chip 1；Rotating mechanism drives epitaxial layer die bond arm after epitaxial layer vacuum slot 511a picks up flip-chip 1 511b drives epitaxial layer vacuum slot 511a in the plane perpendicular to film 2 perpendicular to 180 ° of plane internal rotation of film 2 180 ° of rotation, and then drive flip-chip 1 perpendicular to 180 ° of plane internal rotation of film 2, make 13 court of electrode of flip-chip 1 Under, substrate 11 is upward；Substrate pickup component 512 is attracted by substrate vacuum suction nozzle 512a afterwards downward in the electrode 13 of flip-chip The substrate 11 of flip-chip 1, epitaxial layer vacuum slot 511a is after the substrate 11 that substrate vacuum suction nozzle 512a attracts flip-chip 1 Stop attracting the epitaxial layer 12 of flip-chip 1；Translation mechanism drives substrate after substrate vacuum suction nozzle 512a picks up flip-chip 1 Die bond arm 512b is mobile, drives substrate vacuum suction nozzle 512a mobile, and then drives flip-chip 1 mobile, makes the electricity of flip-chip 1 Pole 13 is corresponding with 61 position of route received on bracket 6；Substrate vacuum suction nozzle 512a is after flip-chip 1 is moved to corresponding position Flip-chip 1, is placed on the corresponding position received on bracket 6, makes flip-chip 1 by the substrate 11 for stopping attracting flip-chip 1 Electrode 13 with receive bracket 6 on route 61 conduct.
In the present embodiment, film 2 is blue film.
In this embodiment, the head that thimble 4 is responsible for jacking up flip-chip 1 is trapezium structure, compares prong structure, reduces A possibility that substrate 11 of flip-chip 1 are hurt on top；In other embodiments, the head that thimble 4 is responsible for jacking up flip-chip 1 is circle The structures such as angle, spherical shape.
In the present embodiment, thimble driving device is motor.
In the present embodiment, the quantity that epitaxial layer picks up epitaxial layer vacuum slot 511a in component 511 is one, corresponds to The middle position of the epitaxial layer 12 of cartridge chip 1；In other embodiments, epitaxial layer picks up epitaxial layer vacuum slot in component 511 The quantity of 511a be it is multiple, for more steadily picking up flip-chip 1.
In the present embodiment, the quantity of substrate vacuum suction nozzle 512a is one in substrate pickup component 512, corresponding upside-down mounting core The middle position of the substrate 11 of piece 1；In other embodiments, in substrate pickup component 512 substrate vacuum suction nozzle 512a quantity To be multiple, for more steadily picking up flip-chip 1.
Flip-chip die-bonding method provided in this embodiment, comprising the following steps:
(1) substrate 11 of flip-chip 1 is pasted on film 2；
(2) thimble 4 is driven to move up by thimble driving device, thimble 4 pushes up the substrate 11 of flip-chip 1 upwards；
(3) when the power that thimble 4 pushes up flip-chip 1 upwards is greater than viscous force of the film 2 to the substrate 11 of flip-chip 1, The substrate 11 of cartridge chip 1 is separated with film 2；
(4) mechanism for picking 51 picks up the flip-chip 1 isolated with film 2；
(5) flip-chip 1 that rotating mechanism picks up mechanism for picking 51 makes perpendicular to 180 ° of plane internal rotation of film The electrode 13 of flip-chip 1 downward, substrate 11 upward；Translation mechanism by the flip-chip 1 that mechanism for picking 51 picks up be moved to Receive the corresponding position of route 61 on bracket 6；
(6) flip-chip 1 is placed on and receives corresponding position on bracket 6 by flip-chip pick device 51.
In the present embodiment, step (4) is that epitaxial layer pickup component 511 passes through epitaxial layer vacuum slot 511a attraction upside-down mounting The epitaxial layer 12 of chip 1, and then pick up flip-chip 1；Step (5) is that rotating mechanism drives epitaxial layer die bond arm 511b vertical In 180 ° of plane internal rotation of film 2, drive epitaxial layer vacuum slot 511a perpendicular to 180 ° of plane internal rotation of film 2, And then drive flip-chip 1 the electrode 13 for perpendicular to 180 ° of plane internal rotation of film 2, making flip-chip 1 downward, substrate 11 Upward；Substrate pickup component 512 attracts the substrate 11 of flip-chip 1, epitaxial layer vacuum slot by substrate vacuum suction nozzle 512a 511a stops attracting after the substrate 11 that substrate vacuum suction nozzle 512a attracts flip-chip 1 epitaxial layer 12 of flip-chip 1, translation Mechanism drives substrate die bond arm 512b mobile, drives substrate vacuum suction nozzle 512a mobile, and then drives flip-chip 1 mobile, makes The electrode 13 of flip-chip 1 is corresponding with 61 position of route received on bracket 6；Step (6) is substrate vacuum suction nozzle 512a stopping Flip-chip 1 is placed on the corresponding position received on bracket 6, makes the electricity of flip-chip 1 by the substrate 11 for attracting flip-chip 1 Pole 13 is conducted with the route 61 received on bracket 6.
Embodiment 2
As shown in Figures 6 and 7, the difference between this embodiment and the first embodiment lies in: the rotating output shaft and substrate of rotating mechanism The Rotating input shaft of die bond arm 512b connects, and the mobile output shaft of translation mechanism and the mobile output shaft of substrate die bond arm 512b connect It connects.
In the present embodiment, the step of flip-chip die-bonding method (4) is that epitaxial layer pickup component 511 is true by epitaxial layer Suction mouth 511a attracts the epitaxial layer 12 of flip-chip 1, and then picks up flip-chip 1, and substrate pickup component 512 is true by substrate Suction mouth 512a attracts the substrate 11 of flip-chip 1, and epitaxial layer vacuum slot 511a attracts upside-down mounting in substrate vacuum suction nozzle 512a Stop attracting the epitaxial layer 12 of flip-chip 1 after the substrate 11 of chip 1；Step (5) is rotating mechanism in substrate vacuum suction nozzle Driving substrate die bond arm 512b drives substrate in the plane internal rotation 180 degree ° perpendicular to film 2 after 512a picks up flip-chip 1 Vacuum slot 512a drives flip-chip 1 perpendicular to the flat of film 2 perpendicular to 180 ° of plane internal rotation of film 2 180 ° are rotated in face, make the electrode 13 of flip-chip 1 downward, substrate 11 upward；Translation mechanism drives substrate die bond arm 512b to move It is dynamic, it drives substrate vacuum suction nozzle 512a mobile, and then drive flip-chip 1 mobile, makes the electrode 13 of flip-chip 1 and receive branch 61 position of route on frame 6 is corresponding.
In other embodiments, the mobile input axis connection of the mobile output shaft of translation mechanism and epitaxial layer die bond arm.
In other embodiments, the mobile output axis connection of the mobile output shaft of translation mechanism and epitaxial layer die bond arm；Rotation The rotating output shaft of rotation mechanism is connect with the mobile input terminal of substrate die bond arm.
Embodiment 3
As shown in figure 8, the difference between this embodiment and the first embodiment lies in: mechanism for picking includes that electrode picks up component 513；Electricity It includes two electrode vacuum suction nozzle 513a, 513b and electrode die bond arm 513c that component 513 is picked up in pole；Electrode vacuum suction nozzle 513a, 513b are parallel to each other, and respectively correspond two electrodes 131,132 of flip-chip 1, for attracting the two of flip-chip 1 A electrode 131,132, and then pick up flip-chip 1；Electrode die bond arm 513c is vertical with electrode vacuum suction nozzle 513a, 513b to be fixed Connection；The rotating output shaft of rotating mechanism is fixedly connected with the Rotating input shaft of electrode die bond arm 513c, solid for driving electrodes Brilliant arm 513c drives electrode vacuum suction nozzle 513a, 513b perpendicular to film 2 perpendicular to 180 ° of plane internal rotation of film 2 180 ° of plane internal rotation, and then drive flip-chip 1 perpendicular to 180 ° of plane internal rotation of film 2.
In the present embodiment, electrode 131,132 respectively symmetrically is set to the both ends of flip-chip 1, and electrode picks up component 513 pick up the electrode 131,132 of flip-chip by electrode vacuum suction nozzle 513a, 513b respectively, can more stably pick up down Cartridge chip 1.
In the present embodiment, the step of flip-chip die-bonding method (4) is that electrode pickup component 513 passes through electrode vacuum suction Mouth 513a, 513b attract the electrode 131,132 of flip-chip 1, and then pick up flip-chip 1；Step (5) is rotating mechanism driving Electrode die bond arm 513c perpendicular to 180 ° of plane internal rotation of film 2, drive electrode vacuum suction nozzle 513a, 513b perpendicular to 180 ° of the plane internal rotation of film 2, and then drive flip-chip 1 perpendicular to 180 ° of plane internal rotation of film 2, make upside-down mounting core The electrode 13 of piece 1 downward, substrate 11 upward；Substrate pickup component 512 attracts flip-chip 1 by substrate vacuum suction nozzle 512a Substrate 11, electrode vacuum suction nozzle 513a, 513b stop attracting after the substrate 11 that substrate vacuum suction nozzle 512a attracts flip-chip 1 The electrode 13 of flip-chip 1, translation mechanism drive substrate die bond arm 512b mobile, drive substrate vacuum suction nozzle 512a mobile, into And drive flip-chip 1 mobile, keep the electrode 13 of flip-chip 1 corresponding with 61 position of route received on bracket 6.
Embodiment 4
The present embodiment and the difference of real-time example three are: the rotation of the rotating output shaft and substrate die bond arm 512b of rotating mechanism It transfers into axis connection, the mobile output shaft of translation mechanism and the mobile output axis connection of substrate die bond arm 512b.
In the present embodiment, the step of flip-chip die-bonding method (4) is that electrode pickup component 513 passes through electrode vacuum suction Mouth 513a, 513b attract the electrode 131,132 of flip-chip 1, and then pick up flip-chip 1；Substrate pickup component 512 passes through lining Bottom vacuum slot 512a attracts the substrate 11 of flip-chip 1, and electrode vacuum suction nozzle 513a, 513b is inhaled in substrate vacuum suction nozzle 512a Draw the electrode 13 for stopping attracting flip-chip 1 after the substrate 11 of flip-chip 1；Step (5) is that rotating mechanism drives substrate die bond Arm 512b drives substrate vacuum suction nozzle 512a in the plane perpendicular to film 2 perpendicular to 180 ° of plane internal rotation of film 2 180 ° of rotation, and then drive flip-chip 1 perpendicular to 180 ° of plane internal rotation of film 2, make 13 court of electrode of flip-chip 1 Under, substrate 11 upward；Translation mechanism drives substrate die bond arm 512b mobile, drives substrate vacuum suction nozzle 512a mobile, and then band Dynamic flip-chip 1 is mobile, keeps the electrode 13 of flip-chip 1 corresponding with 61 position of route received on bracket 6.
In other embodiments, the mobile input axis connection of the mobile output shaft of translation mechanism and electrode die bond arm.
In other embodiments, the mobile output axis connection of the mobile output shaft of translation mechanism and electrode die bond arm；Rotation The rotating output shaft of mechanism is connect with the mobile input terminal of substrate die bond arm.
Embodiment 5
As shown in Figures 9 and 10, the difference between this embodiment and the first embodiment lies in: mechanism for picking includes side pick component 514, for picking up the side of 1 chip of upside-down mounting, and then pick up flip-chip 1；Side pick component 511 includes side pick head 514a, 514b and side die bond arm 514c；Side pick head 514a, 514b respectively correspond two opposite sides of flip-chip 1 Face for clamping two opposite flanks of flip-chip 1, and then picks up flip-chip 1；Side die bond arm 514c and side pick Head 514a, 514b are vertically fixedly connected；Rotating mechanism include two rotating output shafts, respectively with side pick head 514a, 514b Rotating input shaft connection, for driving side pick-up head 514a, 514b perpendicular to 180 ° of plane internal rotation of film 2, band Dynamic flip-chip 1 is perpendicular to 180 ° of plane internal rotation of film 2；The mobile output shaft and side die bond arm 514c of translation mechanism Mobile input axis connection drive side pick head 514a, 514b mobile, in turn for driving side die bond arm 514c mobile Drive flip-chip 1 mobile.
In the present embodiment, the step of flip-chip die-bonding method (4) is that side pick component 511 passes through side pick head 514a, 514b clamp the side of flip-chip 1, and then pick up flip-chip 1；Step (5) is that rotating mechanism drives side pick Head 514a, 514b drives flip-chip 1 in the plane inward turning perpendicular to film 2 perpendicular to 180 ° of plane internal rotation of film 2 Turn 180 °, make the electrode 13 of flip-chip 1 downward, substrate 11 upward；Translation mechanism drives side die bond arm 514c mobile, drives Side pick head 514a, 514b are mobile, drive flip-chip 1 mobile, make the electrode 13 of flip-chip 1 and receive on bracket 6 61 position of route is corresponding；Step (6) is the side that side pick head 514a, 514b stop clamping flip-chip 1, by flip-chip 1 is placed on the corresponding position received on bracket 6, conducts the electrode 13 of flip-chip 1 with the route 61 received on bracket 6.
The above is only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to above-mentioned implementation Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications It should be regarded as protection scope of the present invention.

Claims (17)

1. a kind of flip-chip crystal solidifying apparatus, the crystal solidifying apparatus includes: flip-chip, film, plummer, thimble, thimble drive Dynamic device and reception bracket；The flip-chip includes substrate, epitaxial layer and electrode；The film is fixed at described hold On microscope carrier, thimble accommodating hole is provided on the plummer；The film has viscosity, and the flip chip attachment is described thin Film upper surface；The thimble moves up and down in the thimble accommodating hole under the driving of the thimble driving device, in film Following table jacks up upwardly the flip-chip；It is characterized by: the substrate of the flip-chip is pasted onto the film upper surface, The thimble is located at below the substrate of the flip-chip；The flip-chip crystal solidifying apparatus further includes mechanism for picking, whirler Structure, translation mechanism and reception bracket；The mechanism for picking picks up the flip-chip jacked up or puts down flip-chip；The rotation The flip-chip that the mechanism for picking picks up in mechanism makes the flip-chip perpendicular to 180 ° of plane internal rotation of film Electrode is downward；The translation mechanism is used to for the flip-chip that the mechanism for picking picks up being moved to and receives the route on bracket Corresponding position；The reception bracket is for receiving the flip-chip；Be provided on the reception bracket for it is described fall The logical route of the electrode conductance of cartridge chip.
2. flip-chip crystal solidifying apparatus according to claim 1, it is characterised in that: the mechanism for picking includes that epitaxial layer picks up Take component and substrate pickup component；It includes epitaxial layer vacuum slot that the epitaxial layer, which picks up component, and the epitaxial layer vacuum is inhaled Mouth is corresponding with the epitaxial layer position of the flip-chip, for attracting the epitaxial layer of the flip-chip；The substrate pickup group Part includes substrate vacuum suction nozzle, and the substrate vacuum suction nozzle is corresponding with the substrate location of the flip-chip, described for attracting The substrate of flip-chip；The rotary output of the rotating mechanism is connect with the rotary input that the epitaxial layer picks up component, For driving the epitaxial layer vacuum slot perpendicular to 180 ° of plane internal rotation of film, or, the rotation of the rotating mechanism Output end is connect with the rotary input of the substrate pickup component, for driving the substrate vacuum suction nozzle perpendicular to film 180 ° of plane internal rotation；The mobile input terminal that the mobile output end and the epitaxial layer of the translation mechanism pick up component connects It connects, for driving the epitaxial layer vacuum slot mobile, or, the mobile output end of the translation mechanism and the substrate pickup group The mobile input terminal of part connects, for driving the substrate vacuum suction nozzle mobile.
3. flip-chip crystal solidifying apparatus according to claim 2, it is characterised in that: the epitaxial layer picks up component and further includes Epitaxial layer die bond arm, the epitaxial layer die bond arm is vertical with the epitaxial layer vacuum slot to be fixedly connected；The substrate pickup group Part further includes substrate die bond arm, and the substrate die bond arm is vertical with the substrate vacuum suction nozzle to be fixedly connected；The rotating mechanism Rotary output connect with the rotary input of the epitaxial layer die bond arm, or, the rotary output of the rotating mechanism with The rotary input of the substrate die bond arm connects；The shifting of the mobile output end of the translation mechanism and the epitaxial layer die bond arm Dynamic input terminal connection, or, the mobile output end of the translation mechanism is connect with the mobile input terminal of the substrate die bond arm.
4. flip-chip crystal solidifying apparatus according to claim 2, it is characterised in that: it includes more that the epitaxial layer, which picks up component, A epitaxial layer vacuum slot.
5. flip-chip crystal solidifying apparatus according to claim 1, it is characterised in that: the mechanism for picking includes that electrode picks up Component and substrate pickup component；It includes electrode vacuum suction nozzle that the electrode, which picks up component, the electrode vacuum suction nozzle with it is described Two electrodes of flip-chip are corresponding, for attracting two electrodes of the flip-chip；The substrate pickup component includes lining Bottom vacuum slot, the substrate vacuum suction nozzle is corresponding with the substrate of the flip chip, for attracting the lining of the flip-chip Bottom；The rotary output of the rotating mechanism is connect with the rotary input that the electrode picks up component, for driving the electricity Pole vacuum slot is perpendicular to 180 ° of plane internal rotation of film, or, the rotary output of the rotating mechanism and the substrate The rotary input connection for picking up component, for driving the substrate vacuum suction nozzle in the plane internal rotation perpendicular to film 180°；The mobile output end of the translation mechanism is connect with the mobile input terminal that the electrode picks up component, described for driving Electrode vacuum suction nozzle is mobile, or, the mobile input terminal of the mobile output end of the translation mechanism and the substrate pickup component connects It connects, for driving the substrate vacuum suction nozzle mobile.
6. flip-chip crystal solidifying apparatus according to claim 4, it is characterised in that: it further includes electricity that the electrode, which picks up component, Pole die bond arm, the electrode die bond arm is vertical with the electrode vacuum suction nozzle to be fixedly connected；The substrate pickup component；The electricity It includes substrate die bond arm that component is picked up in pole, and the substrate die bond arm is vertical with the substrate vacuum suction nozzle to be fixedly connected；The rotation The rotary output of rotation mechanism is connect with the rotary input of the electrode die bond arm, or, the rotation of the rotating mechanism exports End is connect with the rotary input of the substrate die bond arm；The mobile output end of the translation mechanism and the electrode die bond arm Mobile input terminal connection, or, the mobile output end of the translation mechanism is connect with the mobile input terminal of the substrate die bond arm.
7. flip-chip crystal solidifying apparatus according to claim 4, it is characterised in that: it includes symmetrical that the electrode, which picks up component, The even number of electrodes vacuum slot of setting, for attracting two electrodes of the flip-chip.
8. according to flip-chip crystal solidifying apparatus described in claim 2-7 any one, it is characterised in that: the substrate pickup group Part includes multiple substrate vacuum suction nozzles.
9. flip-chip crystal solidifying apparatus according to claim 1, it is characterised in that: the mechanism for picking includes side pick Component；The side pick component includes side pick head, and the side pick head is used to clamp the side of the flip-chip； The rotating output shaft of the rotating mechanism is connect with the Rotating input shaft of the side pick head, for driving the side pick Head is perpendicular to 180 ° of plane internal rotation of the film；The shifting of the mobile output shaft and side pick component of the translation mechanism Driven input shaft connection, for driving the side pick head mobile.
10. flip-chip crystal solidifying apparatus according to claim 1, it is characterised in that: the side pick component further includes Side die bond arm, the side die bond arm is vertical with the side pick head to be fixedly connected；The mobile output of the translation mechanism The mobile input axis connection of axis and side die bond arm.
11. a kind of flip-chip die-bonding method, which is characterized in that use flip-chip crystal solidifying apparatus described in claim 1；Institute Die-bonding method is stated the following steps are included: the substrate of flip-chip is pasted onto film upper surface by (1)；(2) it is driven and is filled by thimble It sets driving thimble to move up, thimble pushes up the substrate of flip-chip upwards；(3) when thimble pushes up the power of flip-chip greater than thin upwards When film is to the viscous force of the substrate of flip-chip, the substrate and thin film separation of flip-chip；(4) mechanism for picking pickup and thin film separation Flip-chip；(5) flip-chip that rotating mechanism picks up mechanism for picking makes perpendicular to 180 ° of plane internal rotation of film The electrode of flip-chip downward, substrate upward；The flip-chip that mechanism for picking picks up is moved to and receives bracket by translation mechanism On the corresponding position of route；(6) flip-chip is placed on and receives corresponding position on bracket by flip-chip pick device.
12. flip-chip die-bonding method according to claim 11, it is characterised in that: the mechanism for picking includes that epitaxial layer picks up Take component and substrate pickup component；It includes epitaxial layer vacuum slot that the epitaxial layer, which picks up component,；The substrate pickup component Including substrate vacuum suction nozzle；
The step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, and then is inhaled Flip-chip is played, the step (5) is that rotating mechanism drives epitaxial layer vacuum slot in the plane internal rotation perpendicular to film 180 °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, Substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum slot is inhaled in substrate vacuum suction nozzle Draw the epitaxial layer for stopping attracting flip-chip after the substrate of flip-chip, translation mechanism drives substrate vacuum suction nozzle mobile, drives Flip-chip is mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, in turn Flip-chip is picked up, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum slot exists Stop attracting the epitaxial layer of flip-chip after the substrate of substrate vacuum suction nozzle attraction flip-chip, the step (5) is whirler Structure drives substrate vacuum suction nozzle in the plane internal rotation 180 degree ° perpendicular to film after substrate vacuum suction nozzle picks up flip-chip, Drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, translate machine Structure drives substrate vacuum suction nozzle mobile, drives flip-chip mobile, makes the electrode of flip-chip and receives the route position on bracket Correspondence is set,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, in turn Flip-chip is picked up, the step (5) is that rotating mechanism drives epitaxial layer vacuum slot in the plane internal rotation perpendicular to film 180 °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, Translation mechanism drives epitaxial layer vacuum slot mobile, drives flip-chip mobile, makes the electrode of flip-chip and receives on bracket Place on line it is corresponding, substrate pickup component attracts the substrate of flip-chip, epitaxial layer vacuum slot by substrate vacuum suction nozzle Stop attracting the epitaxial layer of flip-chip after the substrate that substrate vacuum suction nozzle attracts flip-chip,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, in turn Flip-chip is picked up, the step (5) is that translation mechanism drives epitaxial layer vacuum slot mobile, drives flip-chip mobile, makes The electrode of flip-chip is corresponding with the place on line received on bracket, and substrate pickup component attracts upside-down mounting by substrate vacuum suction nozzle The substrate of chip, epitaxial layer vacuum slot stop attracting flip-chip after the substrate that substrate vacuum suction nozzle attracts flip-chip Epitaxial layer, rotating mechanism drive substrate vacuum suction nozzle in the plane perpendicular to film after substrate vacuum suction nozzle picks up flip-chip Inward turning turnback °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, lining Bottom is upward；
The step (6) is the substrate that substrate vacuum suction nozzle stops attracting flip-chip, and flip-chip is placed on reception bracket On corresponding position, make the electrode of flip-chip with receive bracket on line electricity be connected.
13. flip-chip die-bonding method according to claim 12, it is characterised in that: the epitaxial layer picks up component and also wraps Epitaxial layer die bond arm is included, the epitaxial layer die bond arm is vertical with the epitaxial layer vacuum slot to be fixedly connected；The substrate pickup Component further includes substrate die bond arm, and the substrate die bond arm is vertical with the substrate vacuum suction nozzle to be fixedly connected；
The step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, and then is inhaled Play flip-chip, the step (5) is that rotating mechanism drives epitaxial layer die bond arm perpendicular to 180 ° of plane internal rotation of film, It drives epitaxial layer vacuum slot perpendicular to 180 ° of plane internal rotation of film, and then drives flip-chip perpendicular to film 180 ° of plane internal rotation, make the electrode of flip-chip downward, substrate upward, substrate pickup component is attracted by substrate vacuum suction nozzle The substrate of flip-chip, epitaxial layer vacuum slot stop attracting upside-down mounting core after the substrate that substrate vacuum suction nozzle attracts flip-chip The epitaxial layer of piece, translation mechanism drive substrate die bond arm mobile, drive substrate vacuum suction nozzle mobile, and then flip-chip is driven to move It is dynamic, keep the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, in turn Flip-chip is picked up, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum slot exists Stop attracting the epitaxial layer of flip-chip after the substrate of substrate vacuum suction nozzle attraction flip-chip, the step (5) is whirler Structure drives substrate die bond arm in the plane internal rotation 180 degree ° perpendicular to film, band after substrate vacuum suction nozzle picks up flip-chip Dynamic substrate vacuum suction nozzle drives flip-chip perpendicular to the flat of film in the plane internal rotation 180 degree ° perpendicular to film 180 ° are rotated in face, make the electrode of flip-chip downward, substrate upward, translation mechanism drives substrate die bond arm mobile, drives lining Bottom vacuum slot is mobile, and then drives flip-chip mobile, makes the electrode of flip-chip and receives the place on line pair on bracket It answers,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, in turn Flip-chip is picked up, the step (5) is that rotating mechanism drives epitaxial layer die bond arm in the plane internal rotation perpendicular to film 180 °, drive epitaxial layer vacuum slot perpendicular to 180 ° of plane internal rotation of film, so drive flip-chip perpendicular to 180 ° of the plane internal rotation of film, make the electrode of flip-chip downward, substrate upward, translation mechanism drives epitaxial layer die bond arm to move It is dynamic, it drives epitaxial layer vacuum slot mobile, and then drive flip-chip mobile, makes the electrode of flip-chip and receive on bracket Place on line is corresponding, and substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum slot exists Stop attracting the epitaxial layer of flip-chip after the substrate of substrate vacuum suction nozzle attraction flip-chip,
Or, the step (4) is the epitaxial layer that epitaxial layer picks up that component attracts flip-chip by epitaxial layer vacuum slot, in turn Flip-chip is picked up, the step (5) is that translation mechanism drives epitaxial layer die bond arm mobile, and epitaxial layer vacuum slot is driven to move It is dynamic, and then drive flip-chip mobile, keep the electrode of flip-chip corresponding with the place on line received on bracket, substrate pickup group Part attracts the substrate of flip-chip by substrate vacuum suction nozzle, and epitaxial layer vacuum slot attracts flip-chip in substrate vacuum suction nozzle Substrate after stop attracting the epitaxial layer of flip-chip, rotating mechanism drives substrate after substrate vacuum suction nozzle picks up flip-chip Die bond arm drives substrate vacuum suction nozzle in the plane internal rotation perpendicular to film in the plane internal rotation 180 degree ° perpendicular to film 180 degree °, so drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate Upward.
14. flip-chip die-bonding method according to claim 11, it is characterised in that: the mechanism for picking includes that electrode picks up Take component and substrate pickup component；It includes electrode vacuum suction nozzle that the electrode, which picks up component,；The substrate pickup component includes lining Bottom vacuum slot；
The step (4) is that electrode picks up component by the electrode of electrode vacuum suction nozzle attraction flip-chip, and then picks up upside-down mounting Chip, the step (5) are that rotating mechanism drives the electrode vacuum suction nozzle perpendicular to 180 ° of plane internal rotation of film, band Dynamic flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, substrate pickup Component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle attracts flip-chip in substrate vacuum suction nozzle Substrate after stop attracting the electrode of flip-chip, translation mechanism drives substrate vacuum suction nozzle mobile, drives flip-chip mobile, Keep the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is that electrode picks up component by the electrode layer of electrode vacuum suction nozzle attraction flip-chip, and then picks up Flip-chip, substrate pickup component attract the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle is true in substrate Stop attracting the electrode of flip-chip after the substrate of suction mouth attraction flip-chip, the step (5) is rotating mechanism in substrate Driving substrate vacuum suction nozzle drives upside-down mounting in the plane internal rotation 180 degree ° perpendicular to film after vacuum slot picks up flip-chip Chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, translation mechanism driving lining Bottom vacuum slot is mobile, drives flip-chip mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is that electrode picks up component by the electrode of electrode vacuum suction nozzle attraction flip-chip, and then picks up down Cartridge chip, the step (5) are that rotating mechanism drives the electrode vacuum suction nozzle perpendicular to 180 ° of plane internal rotation of film, Drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward, translate machine Structure driving electrodes vacuum slot is mobile, drives flip-chip mobile, makes the electrode of flip-chip and receives the route position on bracket Correspondence is set, substrate pickup component attracts the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle is in substrate vacuum Stop attracting the electrode of flip-chip after the substrate of suction nozzle attraction flip-chip,
Or, the step (4) is that electrode picks up component by the electrode of electrode vacuum suction nozzle attraction flip-chip, and then picks up down Cartridge chip, the step (5) is mobile for translation mechanism driving electrodes vacuum slot, drives flip-chip mobile, makes flip-chip Electrode with receive bracket on place on line it is corresponding, substrate pickup component by substrate vacuum suction nozzle attraction flip-chip lining Bottom, electrode vacuum suction nozzle stop attracting after the substrate that substrate vacuum suction nozzle attracts flip-chip the epitaxial layer of flip-chip, rotation Rotation mechanism drives substrate vacuum suction nozzle in the plane internal rotation 180 perpendicular to film after substrate vacuum suction nozzle picks up flip-chip Degree °, drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward；
The step (6) is the substrate that substrate vacuum suction nozzle stops attracting flip-chip, and flip-chip is placed on reception bracket On corresponding position, make the electrode of flip-chip with receive bracket on line electricity be connected.
15. flip-chip die-bonding method according to claim 14, it is characterised in that: the electrode picks up component and further includes Electrode die bond arm, the electrode die bond arm is vertical with the electrode vacuum suction nozzle to be fixedly connected；The substrate pickup component；It is described It includes substrate die bond arm that electrode, which picks up component, and the substrate die bond arm is vertical with the substrate vacuum suction nozzle to be fixedly connected；
The step (4) is that electrode picks up component by the electrode of electrode vacuum suction nozzle attraction flip-chip, and then picks up upside-down mounting Chip, the step (5) are rotating mechanism driving electrodes die bond arm perpendicular to 180 ° of plane internal rotation of film, band moving electrode Vacuum slot drives flip-chip in the plane internal rotation perpendicular to film perpendicular to 180 ° of plane internal rotation of film 180 °, make the electrode of flip-chip downward, substrate upward, substrate pickup component attracts flip-chip by substrate vacuum suction nozzle Substrate, electrode vacuum suction nozzle stop attracting the electrode of flip-chip after the substrate that substrate vacuum suction nozzle attracts flip-chip, put down Telephone-moving structure drives substrate die bond arm mobile, drives substrate vacuum suction nozzle mobile, and then drives flip-chip mobile, makes flip-chip Electrode with receive bracket on place on line it is corresponding,
Or, the step (4) is that electrode picks up component by the electrode layer of electrode vacuum suction nozzle attraction flip-chip, and then picks up Flip-chip, substrate pickup component attract the substrate of flip-chip by substrate vacuum suction nozzle, and electrode vacuum suction nozzle is true in substrate Stop attracting the electrode of flip-chip after the substrate of suction mouth attraction flip-chip, the step (5) is rotating mechanism in substrate Driving substrate die bond arm drives vacuum to inhale in the plane internal rotation 180 degree ° perpendicular to film after vacuum slot picks up flip-chip Mouth drives flip-chip in the plane internal rotation perpendicular to film in the plane internal rotation 180 degree ° perpendicular to film 180 °, make the electrode of flip-chip downward, substrate upward, translation mechanism drives die bond arm in bottom mobile, drives substrate vacuum suction nozzle It is mobile, and then drive flip-chip mobile, keep the electrode of flip-chip corresponding with the place on line received on bracket,
Or, the step (4) is that electrode picks up component by the electrode of electrode vacuum suction nozzle attraction flip-chip, and then picks up down Cartridge chip, the step (5) are rotating mechanism driving electrodes die bond arm perpendicular to 180 ° of plane internal rotation of film, drive electricity Pole vacuum slot drives flip-chip in the plane inward turning perpendicular to film perpendicular to 180 ° of plane internal rotation of film Turn 180 °, make the electrode of flip-chip downward, substrate upward, translation mechanism driving electrodes die bond arm is mobile, drives electrode vacuum Suction nozzle is mobile, and then drives flip-chip mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket, substrate The substrate that component attracts flip-chip by substrate vacuum suction nozzle is picked up, electrode vacuum suction nozzle attracts upside-down mounting in substrate vacuum suction nozzle Stop attracting the electrode of flip-chip after the substrate of chip,
Or, the step (4) is that electrode picks up component by the electrode of electrode vacuum suction nozzle attraction flip-chip, and then picks up down Cartridge chip, the step (5) is mobile for translation mechanism driving electrodes die bond arm, drives electrode vacuum suction nozzle mobile, and then drive Flip-chip is mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket, substrate pickup component passes through substrate Vacuum slot attracts the substrate of flip-chip, and electrode vacuum suction nozzle stops after the substrate that substrate vacuum suction nozzle attracts flip-chip Attract the epitaxial layer of flip-chip, rotating mechanism drives substrate die bond arm vertical after substrate vacuum suction nozzle picks up flip-chip In the plane internal rotation 180 degree ° of film, drive substrate vacuum suction nozzle in the plane internal rotation 180 degree ° perpendicular to film, in turn Drive flip-chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward；
The step (6) is the substrate that substrate vacuum suction nozzle stops attracting flip-chip, and flip-chip is placed on reception bracket On corresponding position, make the electrode of flip-chip with receive bracket on line electricity be connected.
16. flip-chip die-bonding method according to claim 11, it is characterised in that: the mechanism for picking includes that side is picked up Take component；The side pick component includes side pick head, and the side pick head is used to clamp the side of the flip-chip Face；
The step (4) is the side that side pick component passes through side pick head clamping flip-chip, and then picks up upside-down mounting core Piece；The step (5) is that rotating mechanism drives side pick-up head perpendicular to 180 ° of plane internal rotation of film, drives upside-down mounting core Piece the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward；Translation mechanism drives side Pick-up head is mobile, drives flip-chip mobile, keeps the electrode of flip-chip corresponding with the place on line received on bracket；The step Suddenly (6) are the side that side pick head stops clamping flip-chip, and flip-chip is placed on to the corresponding position received on bracket, The electrode of flip-chip is connected with the line electricity received on bracket.
17. flip-chip die-bonding method according to claim 16, it is characterised in that: the side pick component further includes Side die bond arm, the side die bond arm is vertical with the side pick head to be fixedly connected；
The step (5) is that rotating mechanism drives side pick-up head perpendicular to 180 ° of plane internal rotation of film, drives upside-down mounting Chip the electrode for perpendicular to 180 ° of plane internal rotation of film, making flip-chip downward, substrate upward；Translation mechanism driving side Face die bond arm is mobile, drives side pick head mobile, and then drives flip-chip mobile, makes the electrode of flip-chip and receives branch Place on line on frame is corresponding.
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