KR20140012811A - Die pick-up control method, die pick-up device using the same, and die bonder including the same - Google Patents

Die pick-up control method, die pick-up device using the same, and die bonder including the same Download PDF

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Publication number
KR20140012811A
KR20140012811A KR1020120079812A KR20120079812A KR20140012811A KR 20140012811 A KR20140012811 A KR 20140012811A KR 1020120079812 A KR1020120079812 A KR 1020120079812A KR 20120079812 A KR20120079812 A KR 20120079812A KR 20140012811 A KR20140012811 A KR 20140012811A
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die
level
force
ejector
pick
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KR1020120079812A
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Korean (ko)
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KR101360585B1 (en
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황도연
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우리에이텍(주)
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Priority to CN201210395393.1A priority patent/CN103579061A/en
Publication of KR20140012811A publication Critical patent/KR20140012811A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

Abstract

The present invention relates to a die picker control method of a die bonder for stably picking up each semiconductor die consumed from a wafer, a die picking apparatus driven by the method, and a die bonder having the same, in a wafer attached to an adhesive tape, A die pick-up method for separating a die, comprising: (a) lowering a conveying part to lower the bottom surface of the collet connected to the conveying part from an atmospheric level to an approach level, and decelerating a falling speed when the collet reaches the approach level; (b) raising the ejector to raise the ejector pin associated with the ejector from the standby level to the first pinup level to contact the adhesive tape; (c) if the bottom surface of the collet reaches the chip touch level according to the downward movement of the transfer unit and the bottom surface of the collet contacts the upper surface of the die, waiting for a touch delay time without giving vertical movement to the transfer unit and the ejector; ; (d) waiting for a pick-up delay time without giving vertical movement to the conveyer, raising the ejector to raise the ejector pin to a second pinup level to push the die up; (e) waiting for a pin down delay time without giving vertical movement to the ejector and raising the conveying portion to raise the die-collected collet; And (f) lowering the ejector pins by lowering the ejector; And a control unit.

Figure P1020120079812

Description

DIE PICK-UP CONTROL METHOD, DIE PICK-UP DEVICE USING THE SAME, AND DIE BONDER INCLUDING THE SAME

The present invention relates to a die picker control method of a die bonder, a die picking apparatus driven by the method, and a die bonder having the same, and more particularly, a die of a die bonder for stably picking up each semiconductor die sourced from a wafer. A pickup control method, a die pick-up apparatus driven by this method, and a die bonder having the same.

In general, a semiconductor device post-process is mainly a wafer inspection process for inspecting the quality of semiconductor chips formed on a wafer, and semiconductor chips (hereinafter, referred to as dies) that are cut and separated into wafers are referred to as lead frames. Die bonding process for attaching to a lead frame or a printed circuit board, Wire bonding process for connecting a contact pad provided on the die with a lead of the lead frame or a pattern of a printed circuit board with a wire, Molding process to wrap the outside with encapsulant to protect the internal circuit of the die and other components, trim process to cut the dam bar connecting the lead and the lead, and forming the bend to the desired shape. Process and a test process for inspecting the quality of the semiconductor device completed through the above process.

In the above process, the die bonding process is performed by a die bonder. The die bonder applies an adhesive to a lead frame or a printed circuit board (hereinafter referred to as a 'substrate') and adheres the die to the site where the adhesive is applied.

Such a conventional die bonder may comprise a loader, a pre-baker, a stamping apparatus, an attaching apparatus, a wafer table and an unloader.

The loader supplies the substrate loaded in the magazine to the prebaker via a rail, and the prebaker heats the substrate to a temperature suitable for the action of the adhesive so that the die can adhere to the substrate.

The stamp device receives the heated substrate from the pre-baker and applies the adhesive to the position where the die is to be bonded, and the attaching device adheres the die to the substrate on which the adhesive application is completed. At this time, the die to be bonded is supplied from the wafer table to the attaching apparatus, and the substrate on which die bonding is completed is collected by the unloader.

Here, the attaching apparatus performs a pick-up operation of detaching the die from the wafer and a bonding operation of adhering the detached die to a portion to which the adhesive is applied.

In particular, the conventional pickup device used for the pick-up operation of the attaching device includes a pick-up unit for vacuum suction and transfer of the semiconductor die through a collet, and a semiconductor die in a fixed state by an adhesive tape. And an eject pin placed inside the eject holder, and an eject pin for raising the semiconductor die.

However, since such a conventional pickup device is driven only by the collet lowering operation and the ejector pin raising operation, the die is impacted at the moment when the collet of the actual pickup device contacts the die, and the die is damaged or falls off the adhesive tape to the collet. Since the adsorbed die has a lot of unstable factors such as the micro-rotation caused by the rotation of the adsorbed die, it is difficult to cope with the miniaturization of the semiconductor die and the high speed of the product production work, and the process reliability is lowered.

In particular, the pick-up error is more likely to occur as the adsorption area is smaller and the pick-up speed is faster, because the adsorption area is reduced as the semiconductor die becomes smaller, and the pick-up speed is faster as the production operation is faster.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is a die picker control method of a die bonder for stably picking up each semiconductor die consumed from a wafer, a die picking apparatus driven by the method, and the same. To provide a die bonder.

According to one aspect of the present invention, a die pick-up method for separating a semiconductor die from a wafer attached to an adhesive tape, comprising: (a) lowering the conveying unit to lower the bottom surface of the collet of the pick-up unit connected to the conveying unit from the atmospheric level to the approach level; Decelerating the descending speed when the collet reaches the level; (b) raising the ejector to raise the ejector pin associated with the ejector from the standby level to the first pinup level to contact the adhesive tape; (c) if the bottom surface of the collet reaches the chip touch level according to the downward movement of the transfer unit and the bottom surface of the collet contacts the upper surface of the die, waiting for a touch delay time without giving vertical movement to the transfer unit and the ejector; ; (d) waiting for a pick-up delay time without giving vertical movement to the conveyer, raising the ejector to raise the ejector pin to a second pinup level to push the die up; (e) waiting for a pin down delay time without giving vertical movement to the ejector and raising the conveying portion to raise the die-collected collet; And (f) lowering the ejector pins by lowering the ejector; It provides a die pickup control method comprising a.

Preferably, in the step (b), to control the buffering force of the LM guide having a vertical movement in conjunction with the transfer portion and transfers the buffering force to the pickup portion from the high force level to the middle force level, (b) Between steps and (c), the buffering force of the LM guide is controlled to be reduced from the middle force level back to the pick force level.

Preferably, the buffering force of the high force level is 195g to 205g, the buffering force of the middle force level is 115g to 125g, characterized in that the buffering force of the pick force level is 25g to 35g.

Preferably, between the steps (e) and (f), the buffering force of the LM guide which has a vertical movement in conjunction with the conveying unit and transmits the buffering force to the pickup unit is increased from a pick force level to a middle force level. In step (f), the buffering force of the LM guide is controlled to increase from the middle force level to the high force level.

Preferably, the buffering force of the pick force level is 25g to 35g, the buffering force of the middle force level is 115g to 125g, characterized in that the buffering force of the high force level is 195g to 205g.

Preferably, the touch delay of the step (c) is characterized in that for 8 ㎳ to 12 진행 proceed.

Preferably, the pickup delay of step (d) is characterized in that it is carried out for 18 kHz to 22 kHz.

Preferably, the pin down delay of the step (e) is characterized in that it proceeds for 8 ~ 12㎳.

Meanwhile, according to another aspect of the present invention, a pickup unit for vacuum suction and transfer of the semiconductor die through the collet; A transfer part configured to move the pickup part in a vertical direction; An LM guide installed in the conveying unit and interlocked to provide a cushioning force to the vertical movement of the pickup unit; And an ejector holder on which the semiconductor die fixed by the adhesive tape is placed and which lifts the semiconductor die through the ejector pins of the ejector installed therein; It includes, and provides a die pickup apparatus characterized in that driven by the die pickup method according to any one of the above-described features.

According to still another aspect of the present invention, there is provided a die bonder having a die pick-up device according to the above-described feature.

According to the present invention, it is possible to stably pick up each semiconductor die consumed from the wafer, thereby reducing the occurrence of simple pick-up errors of the semiconductor die, thereby increasing process reliability, and increasing the reliability of the semiconductor dies. There is an effect that can minimize or prevent the occurrence of a problem.

Particularly, in the present invention, the lower surface of the collet is decelerated from the approach level to the chip touch level when the conveying unit descends, thereby reducing the falling speed just before contact with the die to prevent breakage of the die to be picked up or scratch of the die. It can prevent the breakage of the collet and extend the life of the collet.

It is also possible to stabilize contact with the chip by controlling the cushioning force of the LM guide to be reduced step by step from the high force level to the middle force level and back to the pick force level before the collet contacts the die when the feed is lowered. Pick-Miss can be prevented, and impact can be prevented from being transmitted to the die at the moment of contact between the collet and the die.

In addition, by allowing a touch delay during the process, the collet in contact with the die and the ejector pin in contact with the adhesive tape can be stabilized. In particular, the touch delay can be set for a predetermined time after the collet is in contact with the die and the ejector pin is in contact with the adhesive tape. Doing so will prevent the die from shaking.

In addition, the pickup delay during the process allows the collet to stand in contact with the die, while the ejector pin pushes the adhesive tape and waits the collet side at the most important moment, pushing the die upwards. It is possible to prevent the error in the X direction, Y direction).

In addition, it is possible to prevent the die adsorbed to the collet from twisting by first raising the conveying unit to raise the collet to which the die is adsorbed, and then lowering the ejector pin with a time difference.

In addition, it is possible to stably maintain the adsorption state between the die and the collet by controlling the buffer force to be increased in stages from the pick force level to the middle force level and then back to the high force level when the conveyance is raised.

1 is a plan view schematically showing a die bonder according to an embodiment of the present invention.
2 is a schematic cross-sectional view for explaining the die pick-up apparatus according to the embodiment of the present invention.
3 is an operation sequence graph for explaining a die pick-up operation according to an embodiment of the present invention.
4 is a flow diagram of a die pickup operation in accordance with an embodiment of the present invention.

Hereinafter, a die pickup control method of a die bonder according to the present invention, a die pickup apparatus driven by the method, and a die bonder having the same will be described in more detail with reference to the accompanying drawings.

First, the overall configuration of the die bonder according to the present invention will be described with reference to FIG. 1.

Referring to FIG. 1, a die bonder according to a preferred embodiment of the present invention includes a loader 100, a prebaker 200, a stamp device 300, an attaching device 400, a wafer table 500, and an unloader ( 600).

The loader 100 supplies a substrate (ST) loaded in a magazine to the pre-baker 200 through a rail. The prebaker 200 heats the substrate ST to a temperature suitable for the action of the adhesive so that the die can be adhered to the substrate ST before the adhesive is applied to the substrate ST.

On the other hand, the substrate ST, the heating is completed in the pre-baker 200 is alternately subjected to the adhesive coating operation by the stamp device 300. The stamp device 300 receives the heated substrate ST from the pre-baker 200 and applies the adhesive to the position where the die is to be bonded, and the attaching apparatus 400 is the substrate ST on which the adhesive application is completed. Bond the die to At this time, the die to be bonded is supplied from the wafer table 500 to the attaching apparatus 400, and the substrate ST on which die bonding is completed is collected by the unloader 600.

Here, the attaching apparatus 400 performs a die picking operation of detaching the die from the wafer and a die attaching operation of adhering the detached die to a portion to which the adhesive is applied.

2 schematically shows a die pick-up apparatus for performing the die pick-up operation described above.

Referring to FIG. 2, a semiconductor die pick-up apparatus according to the present invention includes a pick-up unit 440 for vacuum suction and transfer of a semiconductor die through a collet, and a semiconductor die fixed by an adhesive tape. It is configured to include an ejector holder (510) to be placed, an ejector (511) installed inside the ejector holder to raise the semiconductor die, and a controller (not shown).

The eject holder 510 is a unit for adsorbing and fixing the wafer 520 on which the sawing is completed on the upper surface in a state where it is attached on the adhesive tape 521, and a plurality of through holes 515 are formed on the upper surface. The eject holder 510 is brought into close contact with the adhesive tape 521 and adsorbed by vacuum pressure.

The ejector 511 is installed in the eject holder 510 and has an eject pin 513 that rises and falls through the through hole 515 of the eject holder 510. The ejector 511 is vertically moved by the vertical drive cylinder 512. As the ejector 511 is raised, the eject pin 513 is raised through the through hole 515 of the eject holder 511.

Here, the vertical movement for the die pick-up of the ejector pin 513 is controlled by the ejector driver 514 for operating the vertical drive cylinder 512, and reciprocates a distance of about 0.27 mm overall under sequence control. .

The pickup unit 440 includes a collet 442 for vacuum suction of the semiconductor die 522 and a transfer head 441 to which the collet 442 is fixed. The vacuum suction force is applied to the collet 442. The semiconductor die 522 is adsorbed to the bottom surface of the collet 442 by the vacuum pressure applied to the collet 442.

In this case, the pick-up unit 440 moves in the front-back direction (X direction), the left-right direction (Y direction) and the vertical direction (Z direction) by the movement of the attaching device 400 as a whole.

In particular, the vertical direction (Z direction) movement of the pickup unit 440 is made by a transfer unit 411 consisting of a stator and a mover.

Here, the vertical movement for the die pick-up of the pickup unit 440 is controlled by the pickup driver 410 which moves the transfer unit 411 in the Z direction, and reciprocates a distance of about 25.1 mm as a whole according to sequence control. Done.

The transfer part 411 is composed of a stator corresponding to the primary side of the induction motor and a mover corresponding to the secondary side to implement the movement of the Z axis by making the rotational movement in a linear motion. Since the principle is already well known, further detailed description is omitted.

The pickup unit 440 connected to the transfer unit 411 and moving in the vertical direction (Z direction) is a device for picking up a die from the wafer 520 and bonding the die to the substrate ST. For this precision movement, the LM guide 421 and the precision mover 422 are provided between the transfer part 411 and the pickup part 440 so that the die is not damaged during the high speed up and down movement of the pickup part 440. It will act as a precision guide.

Here, the LM guide 421 and the precision mover 422 reciprocate the pick-up unit 440 at a short distance in the Z-axis direction to buffer the die when the pick-up unit 440 is touched. Guide 421 and precision mover 422 are controlled by buffer driver 420. The precision mover 422 may be formed of a voice coil motor (VCM), and the LM guide 421 may buffer a distance of about 2 mm.

Here, the buffer driver 420 controls the buffer force (force) applied to the lifting and lowering operation of the corresponding LM guide 421, so that the buffer force is applied to the variable within the range of about 25g to 205g as a whole according to the sequence control Can be controlled. In this case, the unit g of the cushioning force is a weight value applied to the corresponding LM guide 421, and the weight is added to the LM guide 421 to provide a buffering force to the movement of the collet 442 when the LM guide 421 is lowered or raised. do.

Now, with reference to Figures 3 and 4 will be described in detail the pickup operation control method of the pickup apparatus according to the present invention.

3 is an operation sequence graph for explaining a die pick-up operation according to an embodiment of the present invention, Figure 4 is a flow diagram of a die pick-up operation according to an embodiment of the present invention.

As described above, the vertical movement for die pick-up of the ejector pin 513 is controlled by the ejector driver 514 for operating the vertical drive cylinder 512, and the vertical movement for die pick-up of the pick-up portion 440. Is controlled by the pick-up driver 410 which moves the transfer part 411 in the Z direction, and the buffer driver 420 is used to move up and down the LM guide 421 in association with the pick-up part 440. To control the force applied.

In the graph of FIG. 3, the solid line represents the magnitude change of the buffer force applied to the lifting and lowering operation of the LM guide 421 over time, and the dashed-dotted line represents the Z of the transfer unit 411 controlled by the pickup driver 410. Direction (vertical) movement change is shown as the pick-up operation elapses, and the dashed-dotted line indicates the vertical movement change of the ejector pin 511 controlled by the ejector driver 514 over time of the pick-up operation. .

That is, in the graph, the horizontal axis is a time axis indicating the elapsed time of the pick-up operation, and the vertical axis is the magnitude of the buffer force applied to the lifting and lowering operation of the LM guide 421 and the Z-direction (vertical direction) movement of the transfer unit 411. And the vertical movement of the ejector pin 513 together.

Here, for convenience of explanation, the Z-direction (vertical direction) movement of the transfer part 411 represented by the dashed-dotted line indicates that the dashed-dotted line goes up the graph when the transfer part 411 descends, and that the dashed-dotted line of the graph moves up the graph. The movement is expressed as an absolute value so that it moves downward.

Also, in practice, the vertical motion for the die pickup of the ejector pin 513 reciprocates a distance of about 0.27 mm as a whole, and the vertical motion for the die pickup of the pickup 440 reciprocates a distance of about 25.1 mm. However, the scale has been adjusted so that they can be represented together in a single drawing.

Basically, the Z-direction (vertical direction) movement of the transfer unit 411 controlled by the pickup driver 410 is lowered from the initial wait pin level as the pick-up operation elapses, and the touch level touches the die. Level is lowered to the standby pin level.

In addition, the vertical movement of the ejector pin 513 controlled by the ejector driver 514 ascends from the initial wait pin level as time passes in the pick-up operation to the chip touch level in contact with the die. It will have the action of descending to the Wait Pin Level again.

And it provides a buffer force (force) to the lifting operation of the LM guide 421 controlled by the buffer driver 420.

Looking at the combination of each operation in detail, first, the initial state before the pickup, the ejector pin 513 controlled by the ejector driver 514 is in the lowered state (Wait Pin Level), the pickup driver The transfer part 411 controlled by the 410 is at a standby pin level in an elevated state, and the buffering force of the LM guide 421 controlled by the buffer driver 420 is a high force level. )

At this time, the ejector pin 513 is about 0.27mm away from the die at the wait pin level, and the bottom of the collet 442 interlocked with the transfer part 411 is about the die at the wait pin level. It is about 25.1mm away. And the buffer force at the high force level (High Force) of the LM guide 421 is 195g to 205g, preferably about 200g.

Thereafter, in step S10, the pickup driver 410 lowers the transfer unit 411 to approach the bottom of the collet 442 of the pickup unit 440 connected to the transfer unit 411 at a standby pin level. Slow Appoach Level). Here, the approach level of the collet 442 is about 25 mm lowered from the standby level and about 0.1 mm away from the die.

At this time, it takes 45 to 50 ms, preferably about 50 ms, for the bottom of the collet 442 to descend from the atmospheric level to the approach level.

Thereafter, in step S11, when the collet 442 reaches the approach level, the pickup driver 410 decelerates the falling speed of the transfer unit 411. Here, the falling speed is reduced to within 10% of the falling speed of the previous section.

At this time, it takes 3 to 7 ms, preferably about 5 ms to lower the bottom of the collet 442 from the approach level to the chip touch level.

In the present invention, the deceleration of the lowering speed is achieved by the bottom of the collet 442 of the pickup unit 440 ranging from the approach level (Slow Appoach Level) to the chip touch level, and the lowering speed just before contact with the die. Through the reduction of the damage of the die to pick up or the scratch of the die can be prevented, and the damage of the collet 442 can be prevented to extend the life of the collet 442.

Thereafter, in step S12, the buffer driver 420 controls the buffering force of the LM guide 421 to be reduced from the high force level to the middle force level to perform the first buffering force reduction. The ejector driver 514 raises the ejector 511 to raise the ejector pin 513 connected to the ejector 511 from the standby pin level to the first pin up level. The ejector pin 513 that has reached this first pinup level is brought into contact with the adhesive tape 521 of the wafer 520. The buffering force at the high force level of the LM guide 421 here is 195g to 205g, preferably about 200g, and the buffering force at the middle force level is 115g to 125g, preferably about 120g. The first pinup level of the ejector pin 513 is about 0.02 mm above the standby level and about 0.25 mm apart from the die.

Thereafter, as a step S13, the buffer driver 420 controls the buffering force of the LM guide 421 to be reduced from the middle force level to the pick force level to perform the secondary buffering force reduction. The buffering force at the pick force level of the LM guide 421 here is 25 g to 35 g, preferably about 30 g.

In the present invention, such a reduction in buffering force is a high force to middle force level and then pick force level as described above before the collet 442 contacts the die as described above. Force is controlled to decrease step by step. At this time, the reason for passing through the middle force level is to stabilize the contact with the chip by gradually decreasing the buffer force because a shock may occur when changing from a large force to a small force. In particular, when the buffer force is changed, a minute shock occurs due to the characteristics of the precision mover 422 made of a voice coil motor (VCM). Therefore, the downward movement of the collet 442 approaching the die is transmitted to the die as it is. Pick-Miss was happening. In the present invention, the buffer force is gradually reduced through the middle force level in the middle, thereby preventing shock from being transmitted to the die at the moment of contact between the collet 442 and the die. Preferably, the buffer force value of the middle force level is set to a half value of the sum of the buffer force of the high force and the pick force level to achieve an optimal shock mitigation effect.

Subsequently, as a step S14, the bottom surface of the collet 442 of the pickup unit 440 connected to the transfer unit 411 according to the downward movement of the transfer unit 411 decelerated in the step S11 is in the chip touch level. The bottom surface of the collet 442 of the pickup unit 440 abuts the upper surface of the die, and the pickup driver 410 and the ejector driver 514 do not move the transfer unit 411 and the ejector 511, respectively. The die touch operation of the collet 442 may be stabilized by giving a touch delay that waits for a predetermined time instead. Immediately before this touch delay, the ejector pin 513 is in contact with the adhesive tape 521 of the wafer 520 in step S12. The touch delay here takes place between 8 ms and 12 ms, preferably about 10 ms.

In the present invention, such a touch delay allows the collet 442 in contact with the die to be stabilized, and additionally, the ejector pin 513 in contact with the adhesive tape 521 can be stabilized. In particular, after the collet 442 is in contact with the die and the ejector pin 513 is in contact with the adhesive tape 521, a touch delay is allowed for a predetermined time to prevent the die from shaking and the die is adsorbed to the collet 442. You will have enough time to

Thereafter, in step S15, the pickup driver 410 performs a pick-up delay that waits for a predetermined time without moving the transfer unit 411, and the ejector driver 514 raises the ejector 511. The ejector pin 513 connected to the ejector 511 is raised from the first pin up level to the second pin up level. The ejector pin 513 raises the die slightly up from the initial position by raising to the second pinup level. The pick-up delay here takes place between 18 kV and 22 kV, preferably about 20 kV. The second pinup level of the ejector pin 513 is about 0.25 mm higher than the first pinup level.

In the present invention, such a pickup delay allows the collet 442 to stand in contact with the die, and the ejector pin 513 pushes the adhesive tape 521 upwards and pushes the die upwards. 442) By waiting for the side, it is possible to prevent the error that the die is rotated or twisted back and forth, left and right (X direction, Y direction).

Thereafter, in step S16, the ejector driver 514 performs a pin down delay that waits for a predetermined time without moving the ejector 511, and the pickup driver 410 raises the transfer part 411. The bottom surface of the collet 442 of the pickup unit 440 to which the die is adsorbed is raised. The pick down delay here takes place between 8 ms and 12 ms, preferably about 10 ms.

Thereafter, in step S17, the buffer driver 420 controls the buffering force of the LM guide 421 to increase from the pick force level to the middle force level to perform the first buffering force increase. The buffering force at the middle force level of the LM guide 421 here is from 115 g to 125 g, preferably about 120 g.

Thereafter, in step S18, the ejector driver 514 starts to lower the ejector 511 to allow the ejector pin 513 to exit the through hole 515.

In the present invention, the transfer part 411 is first raised to raise the collet 442 on which the die is adsorbed, and then the ejector pin 513 is lowered with a time difference to prevent the die adsorbed on the collet 442 from being twisted. Will be. When the actual ejector pin 513 is lowered, the vibration of the motor used for the lowering operation is transmitted to the ejector pin 513. Therefore, before the lowering operation of the ejector pin 513, the transfer unit 411 is first raised to solve the connection relationship between the die and the ejector pin 513, and then lowering the ejector pin 513 to prevent die twisting. .

Thereafter, in step S19, the transfer unit 411 is up and the ejector 511 is in the down state, and the buffer driver 420 has a high force at a middle force level (Mid Force) of the buffer force of the LM guide 421. It is controlled to increase to high force to perform the secondary buffering force increase. The buffering force at the high force level of the LM guide 421 here is 195 g to 205 g, preferably about 200 g.

After this step S19, each configuration will recover its initial state prior to die pickup. That is, the ejector pin 513 controlled by the ejector driver 514 is at the standby pin level in the lowered state, and the transfer unit 411 controlled by the pickup driver 410 is in the raised state. The buffering force of the LM guide 421 at the Wait Pin Level and controlled by the buffer driver 420 is at the High Force level.

At this time, the ejector pin 513 is about 0.27mm away from the die at the wait pin level, and the bottom of the collet 442 interlocked with the transfer part 411 is about the die at the wait pin level. It is about 25.1mm away. And the buffer force at the high force level (High Force) of the LM guide 421 is 195g to 205g, preferably about 200g.

After the pin down delay, the ejector pin 513 and the transfer part 411 may take 40 to 50 ms, preferably about 45 ms to return to an initial state.

In the present invention, when the transfer unit 411 starts to rise, the cushioning force is controlled to increase step by step from the pick force level to the middle force level and back to the high force level. When the actual transfer portion 411 is rapidly rising, the buffer force must be at a high force level to sustain the acceleration force. However, the reason for passing the middle force level in the middle is to maintain the adsorption state between the die and the collet 442 by gradually increasing the buffering force because the impact may occur when changing from small force to large force. In the present invention, by increasing the buffer force step by step through the middle force level (Mid Force) in this way, it is possible to prevent the collet 442 from dropping the die or the die from twisting in the collet 442. Preferably, the buffering force value of the middle force level is set to a half value of the sum of the buffering force of the high force and the pick force level to achieve an optimal adsorption stabilization effect.

These steps S10 through S19 are pick-up operations of individual dies and will be repeated during the process.

As described above, an optimal embodiment has been disclosed in the drawings and specification. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: loader 200: pre-baker
300: stamp device 400: attaching device
410: pickup driver 411: transfer unit
420: shock absorber 421: LM guide
422: precision mover 440: pickup
441 transfer head 442 collet
500: wafer table 510: ejector holder
511: ejector 512: vertical drive cylinder
513: ejector pin 514: ejector driver
515: through hole 520: wafer
521: adhesive tape 522: die
600: Unloader

Claims (10)

A die pick-up method for separating a semiconductor die from a wafer attached to an adhesive tape,
(a) lowering the conveying unit to lower the bottom surface of the collet connected to the conveying unit from the standby level to the approach level, and decelerating the descending speed when the collet reaches the approach level;
(b) raising the ejector to raise the ejector pin associated with the ejector from the standby level to the first pinup level to contact the adhesive tape;
(c) if the bottom surface of the collet reaches the chip touch level according to the downward movement of the transfer unit and the bottom surface of the collet contacts the upper surface of the die, waiting for a touch delay time without giving vertical movement to the transfer unit and the ejector; ;
(d) waiting for a pick-up delay time without giving vertical movement to the conveyer, raising the ejector to raise the ejector pin to a second pinup level to push the die up;
(e) waiting for a pin down delay time without giving vertical movement to the ejector and raising the conveying portion to raise the die-collected collet; And
(f) lowering the ejector pin to lower the ejector pin; Die pickup control method comprising a.
The method of claim 1,
In the step (b), the buffering force of the LM guide which has a vertical movement in conjunction with the transfer unit and transmits the buffering force to the pickup portion is controlled to be reduced from the high force level to the middle force level,
And between step (b) and step (c), controlling the buffer force of the LM guide to be reduced from the middle force level to the pick force level again.
3. The method of claim 2,
The buffering force of the high force level is 195g to 205g, the buffering force of the middle force level is 115g to 125g, the buffering force of the pick force level is 25g to 35g.
The method of claim 1,
Between the steps (e) and (f), the buffering force of the LM guide which has a vertical movement in conjunction with the conveying unit and transmits a buffering force to the pickup unit is controlled to increase from a pick force level to a middle force level,
And in step (f), controlling the buffering force of the LM guide to be increased from the middle force level to the high force level again.
5. The method of claim 4,
The buffering force of the pick force level is 25g to 35g, the buffering force of the middle force level is 115g to 125g, the buffering force of the high force level is 195g to 205g.
The method of claim 1,
And wherein the touch delay of step (c) is performed for 8 to 12 ms.
The method of claim 1,
The pick-up delay of step (d) is characterized in that the 18 to 22 kHz die pickup method.
The method of claim 1,
The die down method of step (e) is characterized in that the die pick-up proceeds for 8 to 12 kHz.
Pick-up unit for vacuum suction and transfer the semiconductor die through the collet;
A transfer part configured to move the pickup part in a vertical direction;
An LM guide installed in the conveying unit and interlocked to provide a cushioning force to the vertical movement of the pickup unit; And
An ejector holder on which a semiconductor die fixed by an adhesive tape is placed and which lifts the semiconductor die through an ejector pin of an ejector installed therein; Including;
A die pick-up apparatus, which is driven by the die pick-up method according to any one of claims 1 to 8.
A die bonder comprising the die pick-up device of claim 9.
KR1020120079812A 2012-07-23 2012-07-23 Die pick-up control method, die pick-up device using the same, and die bonder including the same KR101360585B1 (en)

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CN201210395393.1A CN103579061A (en) 2012-07-23 2012-10-18 Die pick-up control method, die pick-up device using the same, and die bonder including the same

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KR20180016281A (en) * 2016-08-05 2018-02-14 도쿄엘렉트론가부시키가이샤 Substrate mounting method and substrate mounting device
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