CN103151272A - Diode packaging device - Google Patents
Diode packaging device Download PDFInfo
- Publication number
- CN103151272A CN103151272A CN2013100940281A CN201310094028A CN103151272A CN 103151272 A CN103151272 A CN 103151272A CN 2013100940281 A CN2013100940281 A CN 2013100940281A CN 201310094028 A CN201310094028 A CN 201310094028A CN 103151272 A CN103151272 A CN 103151272A
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- Prior art keywords
- conveying mechanism
- support
- diode package
- glue applying
- package equipment
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 239000003292 glue Substances 0.000 claims description 53
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 230000000007 visual effect Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 abstract description 6
- 239000000047 product Substances 0.000 description 10
- 239000011265 semifinished product Substances 0.000 description 10
- 239000013078 crystal Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000007115 recruitment Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010068 moulding (rubber) Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000036651 mood Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention discloses a diode packaging device, which comprises a base, at least one conveying mechanism, a driving mechanism, a spot gluing mechanism and at least one mechanical hand mechanism, wherein the at least one conveying mechanism is slidably connected with the base; the driving mechanism is arranged on the base and used for driving the conveying mechanism to a plurality of stations; the spot gluing device is arranged on the base and above the moving direction of the conveying mechanism, and the spot gluing mechanism comprises at least one spot gluing head; the at least one mechanical hand mechanism is slidably and/or rotatably connected with the base; and the spot gluing mechanism and the at least one mechanical hand mechanism are provided with the stations along the moving direction of the conveying mechanism in sequence. According to the diode packaging device, the processing efficiency can be improved, and the consistency of diode finished products is improved.
Description
Technical field
The present invention relates to the semiconductor packaging field, particularly a kind of diode package equipment.
Background technology
In the encapsulation process of diode, chip being fitted between the upper and lower tablet of diode is a very important operation.
Realization for this operation in tradition is to realize by artificial or half artificial mode mostly.Concrete execution mode is: first workman uses point gum machine to carry out a glue on lower tablet, then the lower tablet that will put glue moves to the next bit workman, this workman carries out the die bond step this moment, generally crystal grain (being chip) to be sieved on the some glue position of lower tablet by shaking tray, complete die bond, the complete semi-finished product of die bond move to the next bit workman again, this workman re-uses point gum machine and carry out a glue on upper tablet, then own or by other people, upper tablet and this finished product are fitted, complete that chip is fitted to this operation between the upper and lower tablet of diode.
Now, a lot of die bond machines also occurred, it replaces the die bond mode of Traditional Man by machine.Be that 102543801 Chinese patent application discloses a kind of die bond machine as publication number, it has been installed die bond motion, die bond swing arm, die bond nation head, some rubber moulding piece, has got brilliant motion etc. on a machine.During operation, the die bond motion moves to the die bond position with lower tablet, getting brilliant motion moves to wafer and gets brilliant position, the lower tablet that this time point rubber moulding piece is opposite on the die bond motion carries out a glue operation, then die bond nation head drives the die bond swing arm and obtains on the some glue position that then crystal grain be placed in crystal grain lower tablet to getting brilliant position, completes die bond.As seen, this die bond machine has realized machine operation for lower tablet point glue and these two steps of die bond.
The existing shortcoming of above-described prior art is, traditional manual work mode, it needs 3-4 people to carry out operation at least, even assist operation with the die bond machine, also need at least 2-3 people to carry out operation, because the die bond machine has only been realized the machine operation to lower tablet point glue and die bond these two steps, and still need to be by means of manually completing for lower tablet being fitted on lower tablet and chip this step, so it remains larger for expending of human resources.On the one hand, in today that human cost day by day is expected to rise and the recruitment famine occurred, many enterprises are all doing one's utmost to compress number of workers, control the cost payout of enterprise or guarantee the normal production of enterprise, these above-mentioned operating types obviously are difficult to satisfy the demand of enterprise, and artificial or half artificial operating type, and its production efficiency is also obviously not high, and workman's mood just certainly will all can have influence on its work, makes working (machining) efficiency unstable; On the other hand, this artificial or half artificial operating type also can bring the conforming problem of product price, and dynamics as inhomogeneous in a glue, that fit is inadequate etc., and this inconsistent problem also can directly have influence on the quality of finished product.
Therefore, in order can be better the lower tablet of diode to be fitted on die bond complete upper tablet and chip, need a kind of equipment that can overcome above-mentioned shortcoming badly.
Summary of the invention
Purpose of the present invention is exactly for the problems referred to above, provides a kind of and can improve working (machining) efficiency and the conforming diode package equipment of diode finished product.
To achieve these goals, the invention provides following technical scheme: a kind of diode package equipment, be used for the lower tablet of diode is fitted in die bond complete upper tablet and chip, this sealed in unit comprises:
Support;
At least one conveying mechanism, it is slidably connected on above-mentioned support;
Driving mechanism, it is arranged on above-mentioned support, is used for driving above-mentioned conveying mechanism and arrives a plurality of stations;
Glue applying mechanism, it is arranged on above-mentioned support, the top of the above-mentioned conveying mechanism direction of motion, and this glue applying mechanism comprises at least one Glue dripping head;
At least one manipulator mechanism, it is slidably connected and/or is rotationally connected with on above-mentioned support;
Above-mentioned glue applying mechanism and at least one manipulator mechanism set gradually the above-mentioned a plurality of stations of formation along the direction of motion of above-mentioned conveying mechanism.
Further, above-mentioned sealed in unit also comprises shell, and it covers on above-mentioned support, is provided with visual window on this shell.
Further, above-mentioned sealed in unit also comprises cutting agency, and after it was set in turn in above-mentioned glue applying mechanism and manipulator mechanism, this cutting agency comprised the material grasping manipulator.
Further, above-mentioned sealed in unit also comprises at least one pallet, and it is arranged on above-mentioned conveying mechanism.
Again further, above-mentioned conveying mechanism comprises guide rail and is slidably connected to slide on this guide rail.
Further, above-mentioned driving mechanism comprises a plurality of cylinders, and its interval is arranged on a plurality of positions of above-mentioned support.
Further, above-mentioned glue applying mechanism also comprises the camera model corresponding with above-mentioned Glue dripping head.
Further, above-mentioned glue applying mechanism also comprises the transducer for detection of object, and it is electrically connected to this glue applying mechanism.
Adopt the beneficial effect of above technical scheme to be:
1) the present invention mainly comprises support, be slidably connected to the conveying mechanism on support, driving mechanism, glue applying mechanism and manipulator mechanism, wherein, glue applying mechanism and at least one manipulator mechanism all are arranged on support, the top of the conveying mechanism direction of motion, they set gradually a plurality of stations of formation along the direction of motion of conveying mechanism, the semi-finished product that die bond is complete (namely descending tablet and chip) are placed on conveying mechanism, under the driving of driving mechanism, conveying mechanism is delivered to semi-finished product on the station of the first glue applying mechanism the chip on lower tablet is carried out a glue operation, then be delivered on the station of manipulator mechanism, manipulator mechanism is placed in upper tablet on crystal grain, complete the encapsulation of whole diode, what can see is, this equipment fits to lower tablet in diode package that on the complete semi-finished product of die bond, this operation has realized the machine operation, reduced on the one hand artificial intensity, whole device just wanted a workman to watch and cooperate to get final product, process with respect to the traditional workman of 2-3 at least, quantitatively carried out larger reduction, just in time solved enterprise because human cost day by day is expected to rise and the worry that the recruitment famine is brought occurs, reduced manual intervention, guaranteed stable working (machining) efficiency, certainly also improved working (machining) efficiency, on the other hand, machine replaces the consistency that artificial mode of operation has also guaranteed product, guaranteed the quality of finished product,
2) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises shell, and it covers on support, is provided with visual window on this shell, can also facilitate the staff to observe inner operation situation when interior arrangement is protected;
3) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises cutting agency, and it is arranged at the other end of support, and this cutting agency comprises the material grasping manipulator, is used for the diode finished product that encapsulation is completed in crawl, convenient arrangement shipment;
4) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises at least one pallet, and it is arranged on conveying mechanism, is used for the drop target thing.
Description of drawings
Fig. 1 is the structural representation of angle before diode package equipment of the present invention.
Fig. 2 is the structural representation of diode package equipment depression angle of the present invention.
Fig. 3 is the structural representation that diode package equipment of the present invention adds casing.
Wherein, 1. support 2. conveying mechanism 21. guide rail 22. slide 3. glue applying mechanism 31. Glue dripping head 32. camera model 33. transducer 34. support 41. manipulator 411. mechanical arm 412. gripper 42. bearing 5. shell 51. visual window 61. material grasping manipulator 611. mechanical arm 612. gripper 62. bearing 7. pallet 8. cylinders.
Embodiment
Describe the preferred embodiment of the present invention in detail below in conjunction with accompanying drawing.
As shown in Figure 1 and Figure 2, the diode package equipment in the present embodiment comprises: support 1; Conveying mechanism 2, it is slidably connected on support 1; Driving mechanism, it is arranged on support 1, is used for driving conveying mechanism 2 and arrives a plurality of stations; Glue applying mechanism 3, it is arranged on support 1, the top of conveying mechanism 2 directions of motion, and this glue applying mechanism 3 comprises two Glue dripping heads 31; Manipulator mechanism, it is slidably connected and is rotationally connected with on support 1, realize the motion of manipulator mechanism all directions, be slidably connected and realize by slide rail and slide etc. are installed, be rotationally connected and realize by articulated elements etc. is installed, the connected mode of above-mentioned manipulator mechanism and support 1 also can be set to be slidably connected or be rotationally connected, to satisfy the use needs in practical operation; Above-mentioned glue applying mechanism 3 and manipulator mechanism set gradually the above-mentioned a plurality of stations of formation along the direction of motion of conveying mechanism 2.
Above-mentioned conveying mechanism 2 can also be set to more than one, adapts to more massive operation needs; Above-mentioned manipulator mechanism also can be set to more than one, adapts to equally more massive operation needs.
The quantity of above-mentioned Glue dripping head 31 also can be set to one or more than two, satisfies different operation needs, as less in cultivation scale can only arrange one, more can arrange more than two as cultivation scale, should arrange at least one.
As shown in Figure 1, above-mentioned manipulator mechanism comprises manipulator 41 and bearing 42.This manipulator 41 comprises mechanical arm 411 and gripper 412.Bearing 42 is slidably connected with support 1, and mechanical arm 411 is rotationally connected with bearing 42, can realize like this motion of manipulator 41 multiple directions.
As shown in Figure 3, above-mentioned sealed in unit also comprises shell 5, and it covers on support 1, is provided with visual window 51 on this shell 5, and visual window 51 can be offered a fan or many fans.
As shown in Figure 1 and Figure 2, above-mentioned sealed in unit also comprises cutting agency, and the other end that it is arranged at support 1 is used for the diode that encapsulation is completed is carried out blanking and readjusting operations, and this cutting agency comprises material grasping manipulator 61, has also comprised bearing 62.This material grasping manipulator 61 comprises mechanical arm 611 and gripper 612.Bearing 62 is slidably connected with support 1, and mechanical arm 611 is rotationally connected with bearing 62, can realize like this motion of manipulator multiple directions.
As shown in Figure 1, above-mentioned sealed in unit also comprises a pallet 7, and it is arranged on conveying mechanism 2, is used for taking up workpiece.
As shown in Figure 1 and Figure 2, above-mentioned conveying mechanism 2 comprises guide rail 21 and is slidably connected to slide 22 on this guide rail, makes conveying mechanism 2 to slide.Guide rail 21 and slide 22 also can replace implementing with modes of being slidably connected well known in the prior art such as chute and slide blocks.
As shown in Figure 1, above-mentioned driving mechanism comprises two cylinders 8, and its interval is arranged on two positions of support 1.
How much quantity of above-mentioned cylinder 11 should according to the adjusting of station, but at least all more than one.
As shown in Figure 1 and Figure 2, glue applying mechanism 3 also comprises the camera model corresponding with Glue dripping head 31 32, the accuracy of camera model 32 can guarantee point gluing mechanism 3 some glue position.Glue applying mechanism 3 can also comprise support 31.
As shown in Figure 1, the first above-mentioned glue applying mechanism 3 also comprises the transducer 33 for detection of object, and it is electrically connected to this first glue applying mechanism 3, can enter rear drive glue applying mechanism 3 workpiece is carried out a glue workpiece being detected.This transducer 33 can adopt the transducers more well known in the prior art such as infrared ray sensor to implement.
The below introduces operation principle of the present invention:
The semi-finished product that die bond is complete (i.e. applying lower tablet and chip together) are placed on conveying mechanism 2, under the driving of driving mechanism, conveying mechanism 2 is delivered to these semi-finished product on the station of glue applying mechanism 3 chip on it is carried out a glue operation, the semi-finished product that some glue is completed continue to be transported on the station of manipulator mechanism, manipulator mechanism is placed in upper tablet on chip on lower tablet, complete the applying of tablet and lower tablet, chip, make crystal grain can be fitted between upper and lower tablet.
The beneficial effect of above-described embodiment is:
1) the present invention mainly comprises support, be slidably connected to the conveying mechanism on support, driving mechanism, glue applying mechanism and manipulator mechanism, wherein, glue applying mechanism and at least one manipulator mechanism all are arranged on support, the top of the conveying mechanism direction of motion, they set gradually a plurality of stations of formation along the direction of motion of conveying mechanism, the semi-finished product that die bond is complete (namely descending tablet and chip) are placed on conveying mechanism, under the driving of driving mechanism, conveying mechanism is delivered to semi-finished product on the station of the first glue applying mechanism the chip on lower tablet is carried out a glue operation, then be delivered on the station of manipulator mechanism, manipulator mechanism is placed in upper tablet on crystal grain, complete the encapsulation of whole diode, what can see is, this equipment fits to lower tablet in diode package that on the complete semi-finished product of die bond, this operation has realized the machine operation, reduced on the one hand artificial intensity, whole device just wanted a workman to watch and cooperate to get final product, process with respect to the traditional workman of 2-3 at least, quantitatively carried out larger reduction, just in time solved enterprise because human cost day by day is expected to rise and the worry that the recruitment famine is brought occurs, reduced manual intervention, guaranteed stable working (machining) efficiency, certainly also improved working (machining) efficiency, on the other hand, machine replaces the consistency that artificial mode of operation has also guaranteed product, guaranteed the quality of finished product,
2) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises shell, and it covers on support, is provided with visual window on this shell, can also facilitate the staff to observe inner operation situation when interior arrangement is protected;
3) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises cutting agency, and it is arranged at the other end of support, and this cutting agency comprises the material grasping manipulator, is used for the diode finished product that encapsulation is completed in crawl, convenient arrangement shipment;
4) in the further embodiment of the present invention, above-mentioned sealed in unit also comprises at least one pallet, and it is arranged on conveying mechanism, is used for the drop target thing.
The present invention other NM contents are all can be learnt in prior art, does not therefore repeat them here.
Above-described is only the preferred embodiment of the present invention, should be pointed out that for the person of ordinary skill of the art, is not breaking away under the prerequisite of the invention design, can also make some distortion and this advances, and these all belong to protection scope of the present invention.
Claims (8)
1. a diode package equipment, be used for the lower tablet of diode is fitted in die bond complete upper tablet and chip, and it is characterized in that: described sealed in unit comprises:
Support;
At least one conveying mechanism, it is slidably connected on described support;
Driving mechanism, it is arranged on described support, is used for driving described conveying mechanism and arrives a plurality of stations;
Glue applying mechanism, it is arranged on described support, the top of the described conveying mechanism direction of motion, and described glue applying mechanism comprises at least one Glue dripping head;
At least one manipulator mechanism, it is slidably connected and/or is rotationally connected with on described support;
Described glue applying mechanism and at least one manipulator mechanism set gradually the described a plurality of stations of formation along the direction of motion of described conveying mechanism.
2. diode package equipment according to claim 1, it is characterized in that: described sealed in unit also comprises shell, it covers on described support, is provided with visual window on described shell.
3. diode package equipment according to claim 1, it is characterized in that: described sealed in unit also comprises cutting agency, after it was set in turn in described glue applying mechanism and manipulator mechanism, described cutting agency comprised the material grasping manipulator.
4. diode package equipment according to claim 1, it is characterized in that: described sealed in unit also comprises at least one pallet, it is arranged on described conveying mechanism.
5. according to claim 1 or 4 described diode package equipment is characterized in that: described conveying mechanism comprises guide rail and is slidably connected to slide on described guide rail.
6. diode package equipment according to claim 1, it is characterized in that: described driving mechanism comprises a plurality of cylinders, its interval is arranged on a plurality of positions of described support.
7. diode package equipment according to claim 1, it is characterized in that: described glue applying mechanism also comprises the camera model corresponding with described Glue dripping head.
8. according to claim 1 or 7 described diode package equipment, it is characterized in that: described glue applying mechanism also comprises the transducer for detection of object, it is electrically connected to described glue applying mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094028.1A CN103151272B (en) | 2013-03-22 | 2013-03-22 | A kind of diode encapsulation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094028.1A CN103151272B (en) | 2013-03-22 | 2013-03-22 | A kind of diode encapsulation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103151272A true CN103151272A (en) | 2013-06-12 |
| CN103151272B CN103151272B (en) | 2016-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310094028.1A Active CN103151272B (en) | 2013-03-22 | 2013-03-22 | A kind of diode encapsulation device |
Country Status (1)
| Country | Link |
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| CN (1) | CN103151272B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311171A (en) * | 2013-06-14 | 2013-09-18 | 邹志峰 | Multi-sucker chip fixing device |
| CN103594400A (en) * | 2013-11-29 | 2014-02-19 | 如皋市大昌电子有限公司 | Automated chip filling production system of axial diode chips |
| CN105921357A (en) * | 2016-06-07 | 2016-09-07 | 苏州天朋精密元器件有限公司 | Automatic adhesive dispensing device |
| CN108155129A (en) * | 2017-12-29 | 2018-06-12 | 山东才聚电子科技有限公司 | A kind of combinating machine structure for welding mould and recycling |
| CN109368210A (en) * | 2018-11-29 | 2019-02-22 | 东莞市柏尔电子科技有限公司 | A kind of diode swing steering collating unit |
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| CN201655772U (en) * | 2010-02-09 | 2010-11-24 | 东莞朗诚模具有限公司 | Full-automatic substrate arranging machine |
| CN201644323U (en) * | 2009-12-22 | 2010-11-24 | 全方位自动化股份有限公司 | Automatic glue dispensing mechanism |
| CN102543801A (en) * | 2012-02-20 | 2012-07-04 | 常熟艾科瑞思封装自动化设备有限公司 | Die bonder |
| CN203134760U (en) * | 2013-03-22 | 2013-08-14 | 常熟艾科瑞思封装自动化设备有限公司 | Diode packaging equipment |
-
2013
- 2013-03-22 CN CN201310094028.1A patent/CN103151272B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201644323U (en) * | 2009-12-22 | 2010-11-24 | 全方位自动化股份有限公司 | Automatic glue dispensing mechanism |
| CN201655772U (en) * | 2010-02-09 | 2010-11-24 | 东莞朗诚模具有限公司 | Full-automatic substrate arranging machine |
| CN102543801A (en) * | 2012-02-20 | 2012-07-04 | 常熟艾科瑞思封装自动化设备有限公司 | Die bonder |
| CN203134760U (en) * | 2013-03-22 | 2013-08-14 | 常熟艾科瑞思封装自动化设备有限公司 | Diode packaging equipment |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311171A (en) * | 2013-06-14 | 2013-09-18 | 邹志峰 | Multi-sucker chip fixing device |
| CN103311171B (en) * | 2013-06-14 | 2016-01-20 | 邹志峰 | A kind of many suction nozzles chip permanent plant |
| CN103594400A (en) * | 2013-11-29 | 2014-02-19 | 如皋市大昌电子有限公司 | Automated chip filling production system of axial diode chips |
| CN103594400B (en) * | 2013-11-29 | 2016-02-17 | 如皋市大昌电子有限公司 | A kind of axial diode chip automation chip filling production system |
| CN105921357A (en) * | 2016-06-07 | 2016-09-07 | 苏州天朋精密元器件有限公司 | Automatic adhesive dispensing device |
| CN108155129A (en) * | 2017-12-29 | 2018-06-12 | 山东才聚电子科技有限公司 | A kind of combinating machine structure for welding mould and recycling |
| CN109368210A (en) * | 2018-11-29 | 2019-02-22 | 东莞市柏尔电子科技有限公司 | A kind of diode swing steering collating unit |
| CN109368210B (en) * | 2018-11-29 | 2023-11-14 | 东莞市柏尔电子科技有限公司 | Swinging steering arrangement device for diode |
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| Publication number | Publication date |
|---|---|
| CN103151272B (en) | 2016-07-06 |
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Address after: Changshou City Science Park Changshu Economic Development Zone, Suzhou City, Jiangsu province 215500 Room 102 Applicant after: JIANGSU ACCURACY ASSEMBLY AUTOMATION EQUIPMENT CO., LTD. Address before: Changshou City Science Park Changshu Economic Development Zone, Suzhou City, Jiangsu province 215500 Room 102 Applicant before: Changshu Aikeruis Packaging Automation Equipment Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: CHANGSHU ACCURACY AUTOMATION EQUIPMENT CO., LTD. TO: JIANGSU ACCURACY ENCAPSULATION AUTOMATION EQUIPMENT CO., LTD. |
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Address after: Room 102, Kechuang Park, Changshu Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Aike Ruisi intelligent equipment Limited by Share Ltd Address before: Room 102, Kechuang Park, Changshu Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: JIANGSU ACCURACY ASSEMBLY AUTOMATION EQUIPMENT CO., LTD. |
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Denomination of invention: A diode packaging device Effective date of registration: 20200909 Granted publication date: 20160706 Pledgee: Shanghai Pudong Development Bank Co., Ltd. Changshu sub branch Pledgor: SUZHOU ACCURACY INTELLIGENT EQUIPMENT Co.,Ltd. Registration number: Y2020320010142 |
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Date of cancellation: 20211112 Granted publication date: 20160706 Pledgee: Shanghai Pudong Development Bank Co., Ltd. Changshu sub branch Pledgor: SUZHOU ACCURACY ASSEMBLY AUTOMATION Co.,Ltd. Registration number: Y2020320010142 |