CN203086839U - FPC structure and LCM - Google Patents

FPC structure and LCM Download PDF

Info

Publication number
CN203086839U
CN203086839U CN 201220705780 CN201220705780U CN203086839U CN 203086839 U CN203086839 U CN 203086839U CN 201220705780 CN201220705780 CN 201220705780 CN 201220705780 U CN201220705780 U CN 201220705780U CN 203086839 U CN203086839 U CN 203086839U
Authority
CN
China
Prior art keywords
lcm
adhesive tape
double faced
fpc
faced adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220705780
Other languages
Chinese (zh)
Inventor
罗剑
周海生
彭小宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Holitech Optoelectronics Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Priority to CN 201220705780 priority Critical patent/CN203086839U/en
Application granted granted Critical
Publication of CN203086839U publication Critical patent/CN203086839U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

An FPC structure comprises a substrate, wherein the first surface of the substrate is provided with the following components successively: a copper coil layer, a covering film and an epoxy adhesive layer. The first area of the second surface of the substrate is provided with the following components successively: a copper coil layer, a covering film and an epoxy adhesive layer. The second area of the second surface of the substrate is provided with double-sided adhesive. The utility model further discloses an LCM. Through directly equipping the double-sided adhesive on the second area of the second surface of the substrate, the thickness of the structure of the FPC is reduced. The LCM with the FPC structure can have smaller dimension.

Description

A kind of FPC structure and LCM
Technical field
The utility model relates to the FPC field, is specifically related to a kind of FPC structure and LCM.
Background technology
Along with human living standard's raising, also more and more higher to the requirement of life, the also corresponding development thereupon in digital market, mobile phone is as current communication essential product, and people are increasing to its demand, to its product appearance, display effect, the requirement of aspects such as quality parameter is also more and more higher.LCM is as the core component of mobile phone, and its inner each assembly all seems particularly most important.
Along with the intellectuality of mobile phone, mobile phone is more and more thinner, and for the core component LCM(LCD Module of mobile phone, LCD shows module) also requirement is more and more thinner naturally.Backlight, LCD and flexible PCB (FPC soft board) are the primary clusterings of LCM.The FPC of mobile phone LCM substantially is that bending is used at backlight or the chase back side at present, therefore need increase double faced adhesive tape on FPC fixes, the thickness of double faced adhesive tape has at first influenced the thickness of whole LCM, next is that double faced adhesive tape is too thick, can cause the out-of-flatness at the LCM back side, thereby influence the stability of the mechanical performance of mobile phone.
Fig. 1 is the structural representation that double-deck FPC increases double faced adhesive tape in the prior art LCM structure, Fig. 2 be among Fig. 1 A-A to.It is mainly by base material PI, and double-deck Copper Foil adds the coverlay composition.As indicate among the figure 1 for base material, 2 is Copper Foil, 3 is coverlay and epoxy glue, 4 is double faced adhesive tape.We can know from this figure, because common FPC is made up of two-layer Copper Foil and coverlay, increases double faced adhesive tape on coverlay, the position of double faced adhesive tape has exceeded the thickness of one deck double faced adhesive tape than the place of other no double faced adhesive tape, thereby cause LCM thickness to increase, and out-of-flatness.
The utility model content
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, thereby a kind of FPC structure and LCM that can reduce LCM thickness is provided.
For solving the problems of the technologies described above, the utility model provides following technical scheme:
A kind of FPC structure comprises: base material, and the first surface of described base material is disposed with copper foil layer, coverlay and epoxy adhesive layer; The first area of the second surface of described base material is disposed with copper foil layer, coverlay and epoxy adhesive layer, and the second area of the second surface of base material is provided with double faced adhesive tape.
Further, the thickness of described double faced adhesive tape is greater than the thickness of copper foil layer, coverlay and epoxy adhesive layer summation.
Further, the thickness of described double faced adhesive tape is more than or equal to 0.01mm, and smaller or equal to 0.1mm.
Further, the width of described second area is greater than the width of double faced adhesive tape.
Further, the difference between the width of described second area and the double faced adhesive tape width is more than or equal to 0.5mm, and smaller or equal to 1mm.
Further, described base material is a polyimides.
The invention also discloses a kind of LCM, comprise backlight module, LCD and above-mentioned FPC structure; The FPC structure connects LCD, and LCD is placed on the backlight module; The FPC structure is fixed by double faced adhesive tape and backlight module.
Compared with prior art, the utlity model has following beneficial effect: the disclosed a kind of FPC structure of the utility model, by second area double faced adhesive tape is set directly at the second surface of base material, make the structure attenuate of FPC.The LCM that comprises this FPC structure can have thin size.
Description of drawings
Fig. 1 prior art LCM structural representation.
Fig. 2 be among Fig. 1 A-A to generalized section.
Fig. 3 is the utility model embodiment LCM structural representation.
Fig. 4 be among Fig. 3 B-B to generalized section.
Embodiment
Clearer for technical problem, technical scheme and beneficial effect that the utility model is solved, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Fig. 3 is the utility model embodiment LCM structural representation, Fig. 4 be among Fig. 3 B-B to generalized section; With reference to figure 3 and Fig. 4, the utility model embodiment provides a kind of FPC structure, comprising: base material 10, the first surface of described base material 10 are disposed with copper foil layer 20, coverlay and epoxy adhesive layer 30; The first area of the second surface of described base material 10 is disposed with copper foil layer 20, coverlay and epoxy adhesive layer 30, and the second area 50 of the second surface of base material 10 is provided with double faced adhesive tape 40.By second area 50 double faced adhesive tape is set directly, makes the structure attenuate of FPC at the second surface of base material 10.Use in this FPC structure at LCM, guaranteed that not only the integral thickness recruitment of LCM reduces, also guaranteed the planarization at the LCM back side.Thereby strengthened the mechanical performance of structure greatly, improved the reliability of LCM greatly.Do not influence simultaneously the FPC bending and show the fixation at the back side, thereby guarantee the structural behaviour of LCM and client's mobile phone, guarantee its reasonable assembling, make things convenient for the employee to operate at LCM.
In the present embodiment, in assembling process and some reliability tests, because LCM thickness reduces, casing increases for the space of LCM LCD, improves the reliability of LCM to a great extent, satisfies the quality requirements of product, has guaranteed the yield of product.
In the present embodiment, in order to guarantee the stickup performance of double faced adhesive tape, the thickness of double faced adhesive tape 40 is greater than the thickness of copper foil layer 20, coverlay and epoxy adhesive layer 30 summations.The thickness of generally selecting double faced adhesive tape 40 for use is more than or equal to 0.01mm, and smaller or equal to 0.1mm.
In the present embodiment, the width of second area 50 is greater than the width of double faced adhesive tape 10.The width of general second area 50 and the difference C between double faced adhesive tape 40 width be more than or equal to 0.5mm, and smaller or equal to 1mm.The dislocation of the too little stickup double faced adhesive tape of difference C does not have the effect of attenuate LCM integral thickness, and too big FPC individual layer zone is softer and can only the individual layer cabling, influences FPC electric property and structural behaviour.Base material in the present embodiment is generally selected polyimide substrate for use.
The invention also discloses a kind of LCM, comprise backlight module, LCD and above-mentioned FPC structure; The FPC structure connects LCD, and LCD is placed on the backlight module; The FPC structure is fixed by double faced adhesive tape and backlight module.The LCM that comprises this FPC structure can have thin size.Owing to paste the position reduced thickness of double faced adhesive tape, thereby reduce LCM LCD thickness, casing increases for the space of LCM LCD, satisfies the quality requirements of product, thereby improves reliability of products.Prevent to make the demonstration that causes of being squeezed backlight bad because LCM thickness increases.Satisfy the designing requirement of client's mobile phone thickness, improved the structural behaviour of LCM.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.

Claims (7)

1. a FPC structure is characterized in that, comprising: base material, and the first surface of described base material is disposed with copper foil layer, coverlay and epoxy adhesive layer; The first area of the second surface of described base material is disposed with copper foil layer, coverlay and epoxy adhesive layer, and the second area of the second surface of base material is provided with double faced adhesive tape.
2. FPC structure according to claim 1 is characterized in that, the thickness of described double faced adhesive tape is greater than the thickness of copper foil layer, coverlay and epoxy adhesive layer summation.
3. FPC structure according to claim 2 is characterized in that, the thickness of described double faced adhesive tape is more than or equal to 0.01mm, and smaller or equal to 0.1mm.
4. FPC structure according to claim 1 is characterized in that the width of described second area is greater than the width of double faced adhesive tape.
5. FPC structure according to claim 4 is characterized in that, the difference between the width of described second area and the double faced adhesive tape width is more than or equal to 0.5mm, and smaller or equal to 1mm.
6. according to each described FPC structure of claim 1-5, it is characterized in that described base material is a polyimide substrate.
7. a LCM is characterized in that, comprises the described FPC structure of backlight module, LCD and claim 1-6; The FPC structure connects LCD, and LCD is placed on the backlight module; The FPC structure is fixed by double faced adhesive tape and backlight module.
CN 201220705780 2012-12-19 2012-12-19 FPC structure and LCM Expired - Fee Related CN203086839U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220705780 CN203086839U (en) 2012-12-19 2012-12-19 FPC structure and LCM

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220705780 CN203086839U (en) 2012-12-19 2012-12-19 FPC structure and LCM

Publications (1)

Publication Number Publication Date
CN203086839U true CN203086839U (en) 2013-07-24

Family

ID=48832634

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220705780 Expired - Fee Related CN203086839U (en) 2012-12-19 2012-12-19 FPC structure and LCM

Country Status (1)

Country Link
CN (1) CN203086839U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110471203A (en) * 2019-08-05 2019-11-19 Oppo(重庆)智能科技有限公司 Display device and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110471203A (en) * 2019-08-05 2019-11-19 Oppo(重庆)智能科技有限公司 Display device and electronic equipment

Similar Documents

Publication Publication Date Title
CN109215521B (en) Display module, electronic equipment and manufacturing method of display module
CN110600522A (en) Display module and display device
CN112822834A (en) Circuit board and electronic equipment
CN110120995A (en) Display component and mobile terminal
CN107092135B (en) Backlight module and liquid crystal display module
CN203086839U (en) FPC structure and LCM
CN201282594Y (en) Flexible circuit board
CN103313504B (en) A kind of without film flexible printed circuit board and preparation method thereof
CN203492267U (en) Printed circuit board
CN202222083U (en) Mobile phone and its circuit board formed by combining soft, hard plates
CN205902196U (en) Flexible printed -circuit board
CN115775499A (en) Display module and display device
CN203368929U (en) No-film flexible printed circuit board
JP2011205539A (en) Portable terminal
CN208029181U (en) A kind of flexible circuit doubling plate and display module
CN210405382U (en) Electronic equipment
CN203233593U (en) FPC flexible circuit double-layer board
CN210984954U (en) High-stability flexible antenna
CN206452595U (en) A kind of PDS days linear contact lays device
CN201910975U (en) Flexible circuit board
CN103260342A (en) Flexible printed circuit (FPC) double-layer board
CN221197299U (en) Transparent FPC, transparent FPC lamp strip and transparent display screen
CN213548119U (en) Conductive graphite heat dissipation film
CN216155779U (en) Rigid-flex board PI adhesive tape
CN113324202B (en) Lamp strip, backlight unit and display device including lamp strip

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD.

Free format text: FORMER OWNER: BIYADI CO., LTD.

Effective date: 20150831

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150831

Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co

Patentee after: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd.

Address before: 516083 Guangdong city of Huizhou province Dayawan xiangshuihe

Patentee before: BYD Co.,Ltd.

CP01 Change in the name or title of a patent holder

Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co

Patentee after: Shenzhen helitai photoelectric Co.,Ltd.

Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co

Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd.

CP01 Change in the name or title of a patent holder
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130724

Termination date: 20211219

CF01 Termination of patent right due to non-payment of annual fee