CN113324202B - Lamp strip, backlight unit and display device including lamp strip - Google Patents

Abstract

The application provides a light bar, a backlight module comprising the light bar and a display device, wherein the light bar comprises a substrate layer; the copper exposure layer comprises at least one group of copper piece units comprising a first copper piece and a second copper piece, and the first copper piece and the second copper piece respectively comprise a body part and an extension part; the part of the laminating layer is positioned on one side of the copper-exposed layer, which is far away from the base material layer; the soldering tin layer is positioned on the surface of the copper-exposed layer, which is far away from the surface of the base material layer, and the coated layer and the soldering tin layer are not overlapped in the orthographic projection of the base material layer; the light-emitting element is welded on one side of the soldering tin layer, which is far away from the base material layer; any light-emitting element and the main body parts of the first copper piece and the second copper piece in one group of copper piece units at least partially overlap in the orthographic projection of the base material layer, and any light-emitting element and the extension parts of the first copper piece and the second copper piece do not overlap in the orthographic projection of the base material layer. The areas of the copper exposed layer and the soldering tin layer are increased, the supporting strength around the light-emitting element is improved, and the problems of breakage of the light-emitting element in the backlight module, light leakage of the backlight module and the like can be reduced.

Description

Lamp strip, backlight unit and display device including lamp strip

Technical Field

The invention relates to the technical field of display, in particular to a light bar, a backlight module comprising the light bar and a display device.

Background

Along with the continuous development and progress of electronic technology, electronic products are more and more widely applied in the life of people, a circuit board is one of essential accessories in each electronic product, and electronic components, interface circuits and the like are arranged on the circuit board and serve as bearing objects of the electronic components, so that the electronic products have a great significance. The early circuit board adopts a PCB (printed circuit board), which is commonly called as a hard board in the industry, and has high strength and high hardness, but the PCB is thick and is not easy to bend; in order to solve this problem, those skilled in the art have invented a "flexible board", that is, an FPC (flexible circuit board), which is flexible and thin.

The backlight module of cell-phone, panel computer, luminous keyboard can adopt LED (light emitting diode) lamp strip as lighting means usually in, and LED lamp strip constitutes LED welding on FPC usually, because FPC belongs to flexible construction, when LED received the extrusion, FPC can't support LED, causes LED to take place more obvious offset easily, or causes the LED fracture, problem such as backlight module light leak. Therefore, it is desirable to provide a backlight structure that can solve the problem that the FPC cannot support the LED.

Disclosure of Invention

In view of the above, the invention provides a light bar, a backlight module including the light bar and a display device, which are used for solving the problems of LED fracture or backlight module light leakage and the like caused by the fact that an FPC cannot support an LED in the prior art.

In a first aspect, the present application provides a light bar, comprising:

a substrate layer;

the copper exposure layer is positioned on one side of the base material layer; the copper part unit comprises a first copper part and a second copper part; the first and second copper pieces each include a body portion and an extension portion;

the part of the film coating layer is positioned on one side of the copper-exposed layer, which is far away from the base material layer;

the soldering tin layer is positioned on the surface of the copper-exposed layer, which is far away from the base material layer, and the orthographic projection of the laminating layer on the base material layer is not overlapped with the orthographic projection of the soldering tin layer on the base material layer;

the light-emitting element is welded on one side of the soldering tin layer, which is far away from the base material layer;

the orthographic projection of any light-emitting element on the base material layer at least partially overlaps with the orthographic projection of the body parts of the first copper piece and the second copper piece in a group of copper piece units on the base material layer, and the orthographic projection of any light-emitting element on the base material layer does not overlap with the orthographic projection of the extension parts of the first copper piece and the second copper piece on the base material layer.

In a second aspect, the present application provides a backlight module, including the light bar;

the first copper piece and the second copper piece are alternately arranged along a first direction, and the first direction and the second direction are intersected;

the backlight module also comprises a light guide plate and a rubber frame; the light guide plate is positioned on one side of the light-emitting element, which is far away from the rubber frame, along the direction vertical to the light-emitting surface of the backlight module and along the second direction;

the orthographic projection of the soldering tin layer on the light-emitting surface of the backlight module is partially overlapped with the orthographic projection of the light guide plate on the light-emitting surface of the backlight module; and the orthographic projection of the soldering tin layer on the light-emitting surface of the backlight module is partially overlapped with the orthographic projection of the rubber frame on the light-emitting surface of the backlight module.

In a third aspect, the present application provides a display device, including the backlight module.

Compared with the prior art, the light bar, the backlight module comprising the light bar and the display device provided by the invention at least realize the following beneficial effects:

the application provides a light bar, backlight module and display device including the light bar, include a plurality of copper spare units that comprise first copper spare and second copper spare in the dew copper layer through setting up the light bar, each first copper spare and second copper spare all include body portion and extension, set up the orthographic projection and the first copper spare of light-emitting component at the lamp strip substrate layer, the orthographic projection at the substrate layer of body portion of second copper spare is at least partly overlapped, and set up the orthographic projection and the first copper spare of light-emitting component at the substrate layer, the orthographic projection of extension at the substrate layer of second copper spare is not overlapped, thereby realize the increase to copper spare unit area; because the soldering tin layer in the lamp strip sets up in the surface of dew copper layer, and then can realize the increase of soldering tin layer area for the soldering tin layer forms the support around light emitting component, thereby can further improve the support intensity to light emitting component, and then reduce or even eliminate the risk that light emitting component appears the fracture in backlight unit, backlight unit takes place the light leak etc..

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described technical effects simultaneously.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a perspective view of a film layer of a light bar provided by an embodiment of the present disclosure;

fig. 2 is a schematic view illustrating a copper exposed layer in a light bar according to an embodiment of the present disclosure;

fig. 3 is a perspective view of an exposed copper layer and a solder layer of a light bar according to an embodiment of the present disclosure;

fig. 4 is a schematic view of a copper unit in a light bar according to an embodiment of the present disclosure;

fig. 5 is a perspective view of another film layer of the light bar provided in the present application;

FIG. 6 is a cross-sectional view of AA' of FIG. 1 according to an embodiment of the present application;

fig. 7 is a perspective view of another film layer of the light bar provided in the present application;

FIG. 8 is a cross-sectional view of BB' of FIG. 7 according to an embodiment of the present disclosure;

fig. 9 is a perspective view of an exposed copper layer and a laminating layer of a light bar according to an embodiment of the present disclosure;

fig. 10 is a schematic view of a backlight module according to an embodiment of the disclosure;

fig. 11 is a schematic view of a display device according to an embodiment of the present disclosure.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be discussed further in subsequent figures.

In the prior art, an LED (light emitting diode) light bar is generally adopted as a lighting tool in a backlight module of a mobile phone, a tablet personal computer, a light emitting keyboard and the like, and the LED light bar is generally formed by welding an LED on an FPC. Therefore, it is desirable to provide a backlight structure that can solve the problem that the FPC cannot support the LED.

In view of the above, the invention provides a light bar, a backlight module including the light bar and a display device, so as to solve the problem of LED fracture or backlight module light leakage caused by the failure of FPC to support LED in the prior art.

Fig. 1 is a perspective view of a film layer of a light bar provided in an embodiment of the present application, fig. 2 is a schematic view of an exposed copper layer in the light bar provided in the embodiment of the present application, and fig. 3 is a perspective view of an exposed copper layer and a solder layer in the light bar provided in the embodiment of the present application, referring to fig. 1 to 3, a light bar 100 is provided in the present application, including:

a base material layer 10;

the copper exposure layer 20 is positioned on one side of the base material layer 10; comprises at least one group of copper piece units 21, wherein the copper piece units 21 comprise a first copper piece 211 and a second copper piece 212; the first copper piece 211 and the second copper piece 212 each include a body portion 22 and an extension portion 23;

the coated layer 30 is partially positioned on one side of the copper-exposed layer 20, which is far away from the base material layer 10;

the soldering tin layer 40 is positioned on the surface of the copper-exposed layer 20, which is far away from the substrate layer 10, and the orthographic projection of the coating layer 30 on the substrate layer 10 is not overlapped with the orthographic projection of the soldering tin layer 40 on the substrate layer 10;

the light-emitting element 50 is welded on one side of the soldering tin layer 40, which is far away from the base material layer 10;

the orthographic projection of any light-emitting element 50 on the substrate layer 10 at least partially overlaps the orthographic projection of the body parts 22 of the first copper piece 211 and the second copper piece 212 in the group of copper piece units 21 on the substrate layer 10, and the orthographic projection of any light-emitting element 50 on the substrate layer 10 does not overlap the orthographic projection of the extension parts 23 of the first copper piece 211 and the second copper piece 212 on the substrate layer 10.

Specifically, with continued reference to fig. 1-3, the present application provides a light bar 100, wherein the film structure of the light bar 100 at least includes a substrate layer 10, a copper-exposed layer 20, a film layer 30, a solder layer 40, and a light emitting element 50. The exposed copper layer 20 is disposed on one side of the substrate layer 10, and the substrate layer 10 is used for bearing the exposed copper layer 20. In order to clearly show the structure of the exposed copper layer 20, it can be shown with reference to fig. 2 that the exposed copper layer 20 includes a plurality of groups of copper unit units 21, each group of copper unit 21 includes a first copper piece 211 and a second copper piece 212 disposed oppositely, each first copper piece 211 and each second copper piece 212 includes a body portion 22 and an extension portion 23, wherein specific ranges corresponding to the body portion 22 and the extension portion 23 are described in the following with reference to the light emitting element 50. It should be noted that, in the present application, the first copper part 211 and the second copper part 212 are not limited to have a symmetrical structure or an asymmetrical structure, and a user can set the specific shapes of the first copper part 211 and the second copper part 212 according to the requirement of actually setting the light bar 100.

According to the application, the coated layer 30 in the light bar 100 is arranged on one side of the substrate layer 10, and the copper-exposed layer 20 is arranged on one side far away from the substrate layer 10; that is, the coating layer 30 covers the surface of the base material layer 10 except for the exposed copper layer 20, and also covers a small portion of the surface of the exposed copper layer 20. The surface of the exposed copper layer 20 covered by the coating layer 30 includes a partial surface of the first copper piece 211/the second copper piece 212 corresponding to the via hole 24 penetrating the exposed copper layer 20, a partial body portion 22 of the surface of the first copper piece 211 in the group of copper piece units 21 far from the second copper piece 212, a partial body portion 22 of the surface of the second copper piece 212 in the group of copper piece units 21 far from the first copper piece 211, and the like. The coating layer 30 has an insulating effect and can be used to protect the stability of the copper member unit 21.

The edge length and width of the coating layer 30 shown in fig. 1 are smaller than the edge size of the substrate layer 10, and are not intended to limit the actual production size thereof, but merely to clearly show the lamination relationship between the coating layer 30 and the substrate layer 10. The length and width of the edge of the coating layer 30 may be set to be generally the same as the edge size of the substrate layer 10; of course, the user may also adjust the set size according to actual requirements, which is not specifically limited in this application.

The soldering tin layer 40 in the light bar 100 is made of soldering tin materials, most of the melting point of the soldering tin is about 200 ℃, and the soldering tin has good solidity in the conventional use environment of the light bar 100; and the soldering tin has better tensile strength and shearing strength and is not easy to bend. Light emitting component 50 among lamp strip 100 welds in the one side that substrate layer 10 was kept away from to soldering tin layer 40, therefore, as shown in fig. 1, fig. 3, set up soldering tin layer 40 in this application and keep away from the surface of substrate layer 10 in dew copper layer 20, make soldering tin layer 40 can form the support around light emitting component 50, be favorable to improving light emitting component 50's compressive capacity, guarantee whole lamp strip 100's life, avoid light emitting component 50 to appear fracture or the problem of backlight unit light leak.

In the present application, the solder layer 40 is formed by printing solder on the surface of the copper member unit 21 of the exposed copper layer 20 exposed after the coating layer 30 is attached, using a steel mesh. That is, as shown in fig. 3, the solder layer 40 is formed on most of the surface of the exposed copper layer 20, and the surface of the exposed copper layer 20 not covered with the solder layer 40 is actually covered with the coating layer 30 shown in fig. 1. It also needs to be supplemented that the maximum pressure value that light bar 100 that this application provided can bear is at 7.5N or even higher, compares the light bar among the prior art, and its compressive capacity has improved 30% -40%.

The soldering tin layer 40 is arranged on the surface of the exposed copper layer 20 far away from the base material layer 10, and the difference between the surface area of the soldering tin layer 40 and the surface area of the exposed copper layer 20 is only the part of the coating layer 30 covering the exposed copper layer 20; i.e. the solder layer 40, also presents a body portion 22 and an extension portion 23 corresponding to the copper exposed layer 20. Therefore, in the light bar 100 provided by the present application, when the orthographic projection of any light emitting element 50 on the substrate layer 10 is provided, and the main body portions 22 of the first copper piece 211 and the second copper piece 212 in one group of copper piece units 21 partially overlap with the orthographic projection of the substrate layer 10, that is, the main body portion 22 of the corresponding solder layer 40 partially overlaps with the orthographic projection of the substrate layer 10, which is equivalent to the orthographic projection of any light emitting element 50 on the substrate layer 10. In the present application, the orthographic projection of any light emitting element 50 on the substrate layer 10 does not overlap with the orthographic projection of the extension parts 23 of the first copper piece 211 and the second copper piece 212 on the substrate layer 10, which is equivalent to the orthographic projection of any light emitting element 50 on the substrate layer 10 and the orthographic projection of the extension part 23 of the solder layer 40 on the substrate layer 10 do not overlap. That is, when the light emitting element 50 is disposed in the light bar 100, the light emitting element 50 only occupies the area of the body portion 22 of the copper exposed layer 20/the solder layer 40, and the extending portion 23 of the solder layer 40 is used for assisting the body portion 22 to support the light emitting element 50, so as to improve the supporting strength of the light emitting element 50, and reduce or even eliminate the problems of easy breakage of the light emitting element 50 in the backlight module, light leakage of the backlight module, and the like.

Furthermore, need supplementarily be, be in the on-state when lamp strip 100, when light emitting component 50 is luminous, can produce certain heat, this heat can be transmitted to dew copper layer 20 through soldering tin layer 40, the soldering tin layer 40 and dew copper layer 20 that this application set up all have great surface area, are favorable to improving the heat-sinking capability to light emitting component 50, avoid lamp strip 100 in the local high temperature, influence the problem appearance of lamp strip 100 normal use effect. It should be noted that the highest temperature of light bar 100 that this application provided in the use can not exceed 40.5 ℃, compares the light bar among the prior art, and the radiating effect has improved 5% -10%.

It should be noted that fig. 1-3 only show an embodiment in which 3 copper units 21 are included in one light bar 100, but the embodiment is not intended to limit the number of copper units 21 included in the light bar 100, and the number of copper units 21 included in one light bar 100 can be adjusted accordingly according to actual requirements.

With reference to fig. 1-3, optionally, the first copper pieces 211 and the second copper pieces 212 are alternately arranged along the first direction.

Specifically, taking a strip-shaped light bar 100 as an example, the length direction of the light bar 100 is a first direction, and the first copper pieces 211 and the second copper pieces 212 of the exposed copper layers 20 are alternately arranged along the first direction of the light bar 100, that is, the exposed copper layers 20 are the arrangement manner of the first copper pieces 211, the second copper pieces 212, the first copper pieces 211, the second copper pieces 212 … …, the first copper pieces 211, and the second copper pieces 212, wherein the number of the first copper pieces 211 and the second copper pieces 212 is the same, so that the integrity of each copper piece unit 21 can be ensured, and each group of copper piece units 21 can be electrically connected with one light emitting element 50 above the corresponding soldering tin layer 40, so as to realize the arrangement of the light emitting elements 50 in the light bar 100.

Fig. 4 is a schematic view of a copper unit in a light bar provided in an embodiment of the present application, please refer to fig. 1-4, wherein optionally, the extension portion 23 at least includes a first sub-extension portion 231;

the first sub-extensions 231 of the first and second copper pieces 211 and 212 extend at least in the second direction; wherein the first direction and the second direction intersect.

Specifically, the first copper piece 211 and the second copper piece 212 in each copper piece unit 21 each include an extension portion 23, where an alternative embodiment is provided that the extension portion 23 is a first sub-extension portion 231, wherein the first sub-extension portions 231 of the first copper piece 211 and the second copper piece 212 may extend along the second direction, that is, the first copper piece 211 and the second copper piece 212 extend along the second direction based on their corresponding body portions 22 to obtain the corresponding first sub-extension portions 231. The main body 22 is disposed corresponding to the corresponding light emitting element 50, and the extended first sub-extension 231 is equivalent to increase the area of the copper unit 21, so that the area of the solder layer 40 formed on the surface of the copper unit 21 can be increased, the supporting strength for the light emitting element 50 is improved by the larger area of the solder layer 40, and the problems of breakage of the light emitting element 50 in the backlight module, light leakage of the backlight module, and the like are reduced or even eliminated.

It should be noted that the second direction may be a width direction of the elongated light bar 100, that is, the first direction intersects with the second direction, and an alternative embodiment is specifically provided that the first direction is perpendicular to the second direction.

With reference to fig. 4, continuing from fig. 1 to fig. 3, optionally, the extension portion 23 further includes a second sub-extension portion 232;

the second sub-extensions 232 of the first and second copper pieces 211 and 212 extend in the first direction on the side of the first sub-extension 231 away from the body 22.

Specifically, the first copper piece 211 and the second copper piece 212 in each copper piece unit 21 each include the extension portion 23, and in addition to the first copper piece 211 and the second copper piece 212 provided in the above embodiment each include the corresponding first sub-extension portion 231, on this basis, the first copper piece 211 and the second copper piece 212 may further include the second sub-extension portion 232, and the second sub-extension portion 232 may be disposed to extend in the first direction on the side of the first sub-extension portion 231 away from the body portion 22. That is, not only the first sub-extension 231 is added in the second direction of the main body 22 of the first copper piece 211 and the second copper piece 212, but also the second sub-extension 232 extending in the first direction is added on the side of the first sub-extension 231 away from the main body 22, so as to further increase the surface area of the copper piece unit 21, so that the area of the solder layer 40 formed on the surface of the copper piece unit 21 can be further increased, the supporting strength for the light emitting element 50 is further improved by the solder layer 40 having a larger area, and the problems of breakage of the light emitting element 50 in the backlight module, light leakage of the backlight module and the like can be further reduced or even eliminated.

With reference to fig. 1 to 4, optionally, in a set of copper units 21, the second sub-extension 232 of the first copper piece 211 extends toward one side of the second copper piece 212; the second sub-extension 232 of the second copper piece 212 extends toward the first copper piece 211.

Specifically, the copper unit 21 provided by the present application is in a shape of a square, and specifically, the second sub-extension portions 232 of the first copper pieces 211 in a group of the copper units 21 extend toward one side of the second copper pieces 212, and the second sub-extension portions 232 of the second copper pieces 212 extend toward one side of the first copper pieces 211. When the first sub-extensions 231 are disposed on both sides of the main body 22 of the first copper piece 211 and the second copper piece 212 along the second direction, and a second sub-extension 232 extending along the first direction is further added on one side of each first sub-extension 231 away from the main body 22, the second sub-extension 232 of the first copper piece 211 is defined to extend towards one side of the second copper piece 212, and the second sub-extension 232 of the second copper piece 212 extends towards one side of the first copper piece 211; with this arrangement, the unit 21 made of copper is formed like a square. In this case, the orthographic projection of the light emitting element 50 on the base material layer 10 is mostly positioned inside the rectangular copper member unit 21, and the partial orthographic projection of the light emitting element 50 on the base material layer 10 overlaps with the partial orthographic projection of the main body 22 of the copper member unit 21 in the first direction on the base material layer 10.

It should be noted that the first copper part 211 and the second copper part 212 in the same group of copper part units 21 are not allowed to be electrically connected to avoid short circuit of the light emitting element 50, thereby ensuring normal operation of the light emitting element 50.

It should be noted that the "square" copper component unit 21 provided in the present application is only for increasing the manufacturing area of the exposed copper layer 20 and the solder layer 40 as much as possible within a limited manufacturing area, thereby achieving the purpose of maximally improving the supporting effect on the light emitting element 50 within the limited area. The square copper part unit 21 provided by the present application is only an alternative embodiment provided by the present application, but is not used to limit the shape of one group of copper part units 21; for example, the first copper piece 211 in the copper piece unit 21 may be "|"; when the first copper piece 211 in the copper piece unit 21 is fabricated in a "|", specifically, based on the fabrication method of the exposed copper layer in the prior art, the fabrication area of the exposed copper is further increased along the second direction (the width direction of the light bar). It should be added that, based on the manufacturing method of the exposed copper layer in the prior art, it is preferable to further increase the manufacturing area of the exposed copper along the width direction of the light bar 100 only to provide an alternative embodiment, and the application is not limited thereto. As long as can increase the exposed area when the copper exposure layer 20 is manufactured and the exposed area of the solder layer 40 on the surface of the copper exposure layer 20 on the basis of the lamp strip in the prior art.

Fig. 5 is a perspective view of another film layer of the light bar provided in the present embodiment, please refer to fig. 5 in combination with fig. 1-4, and in addition to the square-shaped and i-shaped shapes, a manufacturing shape of a copper unit 21 is also provided in the present embodiment; as shown in fig. 5, since the light guide plate is disposed on the upper side of the light emitting element 50 along the second direction when the light bar 100 is installed in the corresponding backlight module, and the gap between the light emitting element 50 and the light guide plate disposed in the backlight module is generally substantially 0, the possibility of deformation of the side of the light emitting element 50 adjacent to the light guide plate is very small, and this application provides a method for enhancing the supporting strength of the light emitting element 50 along the second direction only on the lower side; at this time, the copper unit 21 is specifically manufactured by, based on the manufacturing method of the copper exposed layer in the prior art, further increasing the manufacturing area of the copper exposed layer only on one side (for example, the lower side) along the second direction (the width direction of the light bar), and further increasing the manufacturing area of the lower solder layer 40 of the light emitting element 50 along the second direction, so as to reduce or even eliminate the possibility of deformation of the side of the light emitting element 50 away from the light guide plate, thereby achieving the technical effects of reducing or even eliminating the possible breakage of the light emitting element 50 in the backlight module and the light leakage of the backlight module. That is, the design size and shape of the copper part unit 21 in the exposed copper layer 20 can be adjusted according to the requirement, as long as the supporting effect on the light emitting element 50 can be increased; the copper-exposed layer 20 may be formed with only the body portion 22.

With reference to fig. 1-4, optionally, at least a portion of the first copper part 211 and/or at least a portion of the second copper part 212 includes a via portion 24, and the via portion 24 penetrates through the exposed copper layer 20; the orthographic projection of the coating layer 30 on the substrate layer 10 overlaps with the orthographic projection of the via hole portion 24 on the substrate layer 10.

Specifically, since the plurality of copper units 21 need to be electrically connected, after the extension portions 23 of the copper units 21 with the exposed copper layer 20 are added, the copper-exposed copper layer 20 can be perforated, and the wiring (not shown) can be routed across the layers through the perforated portions, so as to electrically connect the positive and negative electrodes between the light emitting elements 50. Specifically, at least a portion of the first copper part 211 and/or at least a portion of the second copper part 212 required for cross-layer routing include via holes 24, the via holes 24 penetrate through the entire exposed copper layer 20, and the routing connecting the two copper part units 21 realizes electrical connection between the light emitting elements 50 through the corresponding via holes 24.

In the light bar 100, the multiple groups of copper units 21 are connected in multiple ways, for example, each group of copper units 21 can be independently arranged and then connected by routing wires, or first copper pieces 211 in two adjacent groups of copper units 21 can be connected together by exposed copper layers and then connected to another group of copper units 21 by a via hole. Specifically, in fig. 1 to fig. 3 shown in the present application, only 3 groups of copper component units 21 included in one light bar 100 are shown, and along a direction from left to right, a first copper component 211 in a 1 st group of copper component units 21 and a first copper component 211 in a 2 nd group of copper component units 21 are connected together, which is equivalent to making the 1 st group of copper component units 21 and the 2 nd group of copper component units 21 as a common anode in a circuit of the light bar 100, but this is only an alternative embodiment provided in the present application; the copper units 21 in the light bar 100 can also be made into independent structures (for example, the copper unit 21 shown on the rightmost side), and two adjacent copper units 21 are connected only by other structures such as via holes and routing lines.

One side that exposed copper layer 20 kept away from substrate layer 10 in this application includes tectorial membrane layer 30, and this application sets up this tectorial membrane layer 30 at the orthographic projection of substrate layer 10 and the orthographic projection overlap of hole portion 24 at substrate layer 10, covers the 24 positions of via hole portion in exposed copper layer 20 through tectorial membrane layer 30 promptly, plays insulating effect to walking the line through tectorial membrane layer 30, avoids walking the line and takes place risks such as short circuit in the course of the work.

FIG. 6 is a cross-sectional view of AA' in FIG. 1 provided in the present embodiment, and referring to FIGS. 1 and 6, optionally, the thickness of the coating layer 30 is D1, the sum of the thicknesses of the exposed copper layer 20 and the solder layer 40 is D2, and D1 is ≧ D2, along the direction perpendicular to the plane of the substrate layer 10.

Specifically, the application provides an alternative arrangement mode, in the direction perpendicular to the plane of the substrate layer 10, the thickness of the coating layer 30 is set to be D1, the total thickness sum of the exposed copper layer 20 and the soldering tin layer 40 is set to be D2, wherein D1 is more than or equal to D2; so set up for at exposed copper layer 20 of substrate layer 10 preparation, and attached laminating layer 30 after, there is the difference in height between exposed copper layer 20 that laminating layer 30 opening exposes and its laminating layer 30 on every side, can avoid soldering tin layer 40 to spill over outside laminating layer 30 when making soldering tin layer 40, be favorable to improving the preparation yield of lamp strip 100.

It should be noted that, in the present application, the thicknesses of the exposed copper layer 20 and the solder layer 40 and the thickness of the coating layer 30 can be selected to be equal to each other, so that the surface of the solder layer 40 away from the substrate layer 10 and the surface of the coating layer 30 away from the substrate layer 10 are on the same horizontal plane, which is beneficial to providing a planar structure for the subsequent film layer fabrication.

Fig. 7 is a perspective view of another film layer of the light bar provided in the present embodiment, and fig. 8 is a cross-sectional view of BB' in fig. 7 provided in the present embodiment, please refer to fig. 7 and 8, and optionally further includes a glue layer 60, where the glue layer 60 is located on the side of the solder layer 40 and the laminating layer 30 away from the substrate layer 10; and, the orthographic projection of the glue layer 60 on the substrate layer 10 and the orthographic projection of the light-emitting element 50 on the substrate layer 10 do not overlap.

Specifically, when light bar 100 is manufactured, in addition to the above-mentioned substrate layer 10, exposed copper layer 20, coating layer 30 and soldering tin layer 40, glue layer 60 is further included, this glue layer 60 is manufactured on one side of soldering tin layer 40 and coating layer 30 away from substrate layer 10, and this glue layer 60 exposes light-emitting element 50, that is, orthographic projection of glue layer 60 on substrate layer 10 and orthographic projection of light-emitting element 50 on substrate layer 10 are not overlapped, which is beneficial to avoiding influence of light-emitting effect of light-emitting element 50 in the using process.

Consequently, this application will expose copper layer 20 and tin layer 40's thickness and set up to the thickness that equals laminating layer 30, can be so that when one side coating lamp that base material layer 10 was kept away from on tin layer 40, laminating layer 30 glues, for the coating that the lamp was glued provides a plane, is favorable to improving the lamp and glues coated homogeneity, simplifies the preparation of lamp strip 100.

Fig. 9 is a perspective view of an exposed copper layer and a laminating layer in a light bar according to an embodiment of the present disclosure, please refer to fig. 9 on the basis of fig. 1 to fig. 3, and optionally, further includes an alignment mark 70 of the light emitting device 50;

the coating layer 30 includes a first projection group 71 and a second projection group 72 facing the light emitting element 50 side in the first direction; the first projecting part group 71 and the second projecting part group 72 form an alignment mark 70;

in the first direction, the first protrusion group 71 overlaps an edge portion of one side of the first copper piece 211 of the one set of copper piece units 21 away from the second copper piece 212, and the second protrusion group 72 overlaps an edge portion of one side of the second copper piece 212 of the one set of copper piece units 21 away from the first copper piece 211.

Specifically, the light bar 100 further includes a registration mark 70 for the light emitting element 50 during the manufacturing process, and the manufacturing of the registration mark 70 is described below. By processing the coating layer 30 in the light bar 100, the coating layer 30 includes a first protrusion group 71 and a second protrusion group 72 facing the light emitting element 50 side in the first direction, and the first protrusion group 71 and the second protrusion group 72 are used to form the alignment mark 70 corresponding to one light emitting element 50.

The alignment mark 70 is specifically configured such that, along the first direction, the first protrusion group 71 overlaps with an edge of one side of the first copper piece 211, which is far away from the second copper piece 212, in the one group of copper piece units 21, and the second protrusion group 72 overlaps with an edge of one side of the second copper piece 212, which is far away from the first copper piece 211, in the one group of copper piece units 21; that is, as shown in fig. 1 and 9, in the copper part unit 21 corresponding to one light emitting element 50, the outer edge of the first copper part 211 has two small protruding portions (71) formed by the two coating layers 30, the outer edge of the second copper part 212 has two small protruding portions (72) formed by the two coating layers 30, and the first protruding portion group 71 and the second protruding portion group 72 formed by the four small protruding portions being oppositely arranged form one alignment mark 70 for defining the assembling position of the light emitting element 50, so as to improve the accuracy of the assembling position of the light emitting element 50 and prevent the light emitting element 50 from being displaced during assembling.

Note that the present application does not limit the shapes of the first projecting portion group 71 and the second projecting portion group 72 in the alignment mark 70, as long as the coating layer 30 covers at least a portion of the exposed copper layer 20, which can be used to clearly define the assembly position of the light emitting element 50.

It should be noted that the present application provides a method for assembling the light emitting element 50, in order to solder the light emitting element 50 at the position defined by the alignment mark 70 by SMT (Surface mount Technology).

Referring to fig. 1 or fig. 7, optionally, the width of the substrate layer 10 along the second direction is D3, and D3 is greater than or equal to 2.56 mm.

Specifically, this application still sets up width of lamp strip 100 (substrate layer 10) on the second direction and is more than or equal to 2.56mm, in order to ensure that substrate layer 10 has sufficient space to increase the preparation of dew copper layer 20 on its width direction, thereby ensure that the preparation area on soldering tin layer 40 can promote by a wide margin, be favorable to improving lamp strip 100 to the support intensity of light emitting component 50, thereby be favorable to reducing or even eliminate light emitting component 50 and appear the fracture in backlight unit, backlight unit takes place the technological effect of light leak scheduling problem.

Fig. 10 is a schematic view of a backlight module according to an embodiment of the present application, please refer to fig. 10 on the basis of fig. 1 to 9, and based on the same inventive concept, the present application further provides a backlight module 200 including a light bar 100;

the first copper pieces 211 and the second copper pieces 212 are alternately arranged along a first direction, and the first direction and the second direction intersect;

the backlight module 200 further comprises a light guide plate 80 and a rubber frame 90; along a direction perpendicular to the light-emitting surface of the backlight module 200 and along a second direction, the light guide plate 80 is located on a side of the light-emitting element 50 away from the rubber frame 90;

the orthographic projection of the soldering tin layer 40 on the light-emitting surface of the backlight module 200 is partially overlapped with the orthographic projection of the light guide plate 80 on the light-emitting surface of the backlight module 200; moreover, the orthographic projection of the solder layer 40 on the light-emitting surface of the backlight module 200 is partially overlapped with the orthographic projection of the rubber frame 90 on the light-emitting surface of the backlight module 200.

Specifically, the present application further provides a backlight module 200 including the light bar 100, and the light bar 100 in the backlight module 200 is any one of the light bars 100 provided in the above.

The backlight module 200 further comprises a light guide plate 80 and a rubber frame 90; along the direction perpendicular to the light-emitting surface of the backlight module 200, and along the second direction, the light guide plate 80 is disposed on the side of the light-emitting element 50 away from the plastic frame 90, that is, the light-emitting element 50, the light guide plate 80, and the plastic frame 90 are disposed at the positions of the plastic frame 90, the light-emitting element 50, and the light guide plate 80.

In the light bar 100 provided by the application, the area of the solder layer 40 is increased, so that when the light bar 100 is assembled in the backlight module 200, the orthographic projection of the solder layer 40 on the light-emitting surface of the backlight module 200 is partially overlapped with the orthographic projection of the light guide plate 80 on the light-emitting surface of the backlight module 200, and the orthographic projection of the solder layer 40 on the light-emitting surface of the backlight module 200 is partially overlapped with the orthographic projection of the rubber frame 90 on the light-emitting surface of the backlight module 200; that is, the solder layer 40 spans the glue frame 90 and the light guide plate 80, so that the solder layer 40 can span the glue frame 90, the light emitting element 50 and the light guide plate 80, thereby further improving the supporting and pressure-resistant capabilities of the light emitting element 50, and reducing or even eliminating the risks of the problems of breakage of the light emitting element 50 in the backlight module 200, light leakage of the backlight module and the like.

Fig. 11 is a schematic view of a display device according to an embodiment of the present application, please refer to fig. 11 in combination with fig. 1 to 10, and based on the same inventive concept, the present application further provides a display device 300, where the display device 300 includes a backlight module 200, and the backlight module 200 is any one of the backlight modules 200 provided in the present application.

It should be noted that, for the embodiment of the display device 300 provided in the embodiment of the present application, reference may be made to the embodiment of the backlight module 200 described above, and repeated descriptions are omitted. The display device provided by the application can be: any product and component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a navigator and the like.

According to the embodiment, the light bar, the backlight module comprising the light bar and the display device provided by the invention at least realize the following beneficial effects:

the application provides a light bar, backlight module and display device including the light bar, include a plurality of copper spare units that comprise first copper spare and second copper spare in the dew copper layer through setting up the light bar, each first copper spare and second copper spare all include body portion and extension, set up the orthographic projection and the first copper spare of light-emitting component at the lamp strip substrate layer, the orthographic projection at the substrate layer of body portion of second copper spare is at least partly overlapped, and set up the orthographic projection and the first copper spare of light-emitting component at the substrate layer, the orthographic projection of extension at the substrate layer of second copper spare is not overlapped, thereby realize the increase to copper spare unit area; because the soldering tin layer in the lamp strip sets up in the surface of dew copper layer, and then can and then realize the increase of soldering tin layer area for the soldering tin layer forms the support around light emitting component, thereby can further improve the support intensity to light emitting component, and then reduce or even eliminate the risk that light emitting component appears the fracture in backlight unit, backlight unit takes place the light leak etc..

Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (12)

1. A light bar, comprising:

a substrate layer;

the copper exposure layer is positioned on one side of the base material layer; the device comprises at least one group of copper piece units, wherein each copper piece unit comprises a first copper piece and a second copper piece; the first and second copper pieces each include a body portion and an extension portion;

the part of the film coating layer is positioned on one side of the copper-exposed layer, which is far away from the base material layer;

the soldering tin layer is positioned on the surface of the copper-exposed layer, which is far away from the base material layer, and the orthographic projection of the laminating layer on the base material layer is not overlapped with the orthographic projection of the soldering tin layer on the base material layer;

the light-emitting element is welded on one side of the soldering tin layer, which is far away from the base material layer;

the orthographic projection of any light-emitting element on the base material layer at least partially overlaps the orthographic projection of the main body parts of the first copper piece and the second copper piece in a group of copper piece units on the base material layer, and the orthographic projection of any light-emitting element on the base material layer does not overlap the orthographic projection of the extension parts of the first copper piece and the second copper piece on the base material layer.

2. The light bar of claim 1, wherein the first and second copper pieces alternate along a first direction.

3. The light bar of claim 2, wherein the extension comprises at least a first sub-extension;

the first sub-extension portions of the first and second copper pieces extend at least in a second direction; wherein the first direction and the second direction intersect.

4. The light bar of claim 3, wherein the extension further comprises a second sub-extension;

the second sub-extension portions of the first and second copper pieces extend in the first direction on a side of the first sub-extension portion away from the body portion.

5. The light bar of claim 4, wherein in a set of the copper units, the second sub-extension of the first copper extends toward a side of the second copper; the second sub-extension part of the second copper piece extends towards one side of the first copper piece.

6. The light bar of claim 1,

at least part of the first copper piece and/or at least part of the second copper piece comprise a through hole part, and the through hole part penetrates through the copper-exposed layer; the orthographic projection of the coating layer on the substrate layer is overlapped with the orthographic projection of the through hole part on the substrate layer.

7. The light bar of claim 1, wherein the thickness of the coating layer in the direction perpendicular to the plane of the substrate layer is D1, the sum of the thicknesses of the copper exposure layer and the soldering tin layer is D2, and D1 is not less than D2.

8. The light bar of claim 1, further comprising an adhesive layer, wherein the adhesive layer is positioned on one side of the soldering tin layer and the film coating layer away from the substrate layer; and the orthographic projection of the adhesive layer on the substrate layer and the orthographic projection of the light-emitting element on the substrate layer do not overlap.

9. The light bar of claim 2, further comprising alignment marks for the light emitting elements;

the coating layer includes a first projection group and a second projection group facing the light emitting element side in the first direction; the first bulge group and the second bulge group form the alignment mark;

along the first direction, the first bulge group is overlapped with one side edge part, away from the second copper piece, of the first copper piece in one group of the copper piece units, and the second bulge group is overlapped with one side edge part, away from the first copper piece, of the second copper piece in one group of the copper piece units.

10. The light bar of claim 3, wherein the substrate layer has a width in the second direction of D3, D3 ≧ 2.56 mm.

11. A backlight module comprising the light bar of any one of claims 1 to 10;

the first copper piece and the second copper piece are alternately arranged along a first direction, and the first direction and the second direction are intersected;

the backlight module also comprises a light guide plate and a rubber frame; the light guide plate is positioned on one side of the light-emitting element, which is far away from the rubber frame, along the direction vertical to the light-emitting surface of the backlight module and along the second direction;

the orthographic projection of the soldering tin layer on the light-emitting surface of the backlight module is partially overlapped with the orthographic projection of the light guide plate on the light-emitting surface of the backlight module; and the orthographic projection of the soldering tin layer on the light-emitting surface of the backlight module is partially overlapped with the orthographic projection of the rubber frame on the light-emitting surface of the backlight module.

12. A display device comprising the backlight module according to claim 11.

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