CN206865817U - Backlight FPC, backlight module and mobile phone - Google Patents
Backlight FPC, backlight module and mobile phone Download PDFInfo
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- CN206865817U CN206865817U CN201720431080.5U CN201720431080U CN206865817U CN 206865817 U CN206865817 U CN 206865817U CN 201720431080 U CN201720431080 U CN 201720431080U CN 206865817 U CN206865817 U CN 206865817U
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Abstract
A kind of backlight FPC, backlight module and mobile phone; backlight FPC includes substrate layer, the first copper plate, the second copper plate, glue-line, cover layer protective layer and white ink layer; first copper plate and the second copper plate are located at the both sides of substrate layer respectively; glue-line connects side of first copper plate away from substrate layer; side of the cover layer protective layer connection glue-line away from substrate layer, white ink layer connect side of second copper plate away from substrate layer.Above-mentioned backlight FPC, by the way that directly white ink layer is arranged on side of second copper plate away from substrate layer, on the one hand, the use of the second glue-line and the second cover layer in tradition can be reduced, backlight FPC thickness can be greatly reduced, on the other hand, white ink layer has preferable reflecting effect, it can be reflected more LED lamplights, so as to further lift the brightness that LED sends light.When this is also applied for ultra-thin, for example, the as little as light guide plate of 0.098 mil.
Description
Technical field
Electronic technology field is the utility model is related to, more particularly to a kind of backlight FPC, backlight module and mobile phone.
Background technology
With the development of science and technology, the more and more thinner that mobile phone is done, display screen structure also between this short several years quietly
Ground is thinning.The thickness space of LCM (Liquid Crystal Display Module) module is less and less, and display is required
But more and more higher, such as higher brightness.
At present, more the LCM liquid crystal display die sets of main flow mainly include LCD display and BLU (back light unit)
Backlight module, under the trend of mobile phone slimming, there is provided the BLU backlight module thickness more and more thinners of backlight.How to be carried on the back in BLU
Strengthen the backlight illumination of backlight BLU backlight modules in the case of optical mode group thinner thickness, be a severe challenge to mobile phone production.
The thickness part of traditional BLU backlight modules is mainly made up of the thickness of backlight FPC, LED and light guide plate.Carried on the back in BLU
In the case that the thickness of optical mode group is certain, if backlight FPC (Flexible Printed Circuit, flexible PCB) designs are thick
Spend larger, light guide plate and LED thickness are then relatively small, and relatively low compared with the LED brightness of low thickness.Therefore, it is desirable to reduce
Backlight FPC thickness increases LED thickness, so as to improving the brightness of LED.Refer to Fig. 1 and Fig. 2, traditional backlight
FPC30, it is main including substrate layer 31, the first copper plate 32 being respectively arranged on the parallel two sides of substrate layer and the second plating
Layers of copper 33, the first glue-line 34 for connecting the first copper plate 32, the second glue-line 35 for connecting the second copper plate 33, the first glue-line of connection
The first cover layer 36 and connect the second cover layer 37 of the second glue-line, LED 38 is fixed on first cover layer
On 36.Traditional backlight FPC prints white ink layer bar 39 to strengthen the brightness of LED on the first cover layer 36
Improve LED luminosity and illumination effect.It is however, still poor using traditional backlight FPC LCM display brightness.
In addition, LED when being used cooperatively with relatively thin light guide plate, in order to lift the brightness of LED, is played and preferably led
Light effect, the anteposition of LED need to use wedge structure so that the light source that sends of more LED can by light-guide plate guides into
Area source.The thickness more and more thinner of light guide plate, thick bottom as little as 0.098 mil of light guide plate is required when ultra-thin so that backlight FPC is not
Can be too thick, otherwise, the easy bursting light guide plate of wedge structure of LED anteposition.
Utility model content
Based on this, it is necessary to provide a kind of thinner thickness, brightness is higher and can be applied to the back of the body of ultra-thin light guide plate
Light FPC and the backlight module and mobile phone for including backlight FPC.
A kind of backlight FPC, including substrate layer, the first copper plate, the second copper plate, glue-line, cover layer protective layer and white
Ink layer, first copper plate and second copper plate are located at the both sides of the substrate layer respectively, and the glue-line connects institute
Side of first copper plate away from the substrate layer is stated, the cover layer protective layer connects the glue-line away from the substrate layer
Side, the white ink layer connect the side of second copper plate away from the substrate layer.
In one of the embodiments, in addition to LED luminescence components, the LED luminescence components include multiple LEDs, more
The individual LED is arranged on side of the white ink layer away from second copper plate.
In one of the embodiments, multiple LEDs are arranged at intervals.
In one of the embodiments, the spacing of multiple LEDs is equal.
In one of the embodiments, it is fixed to be additionally provided with side of the white ink layer away from second copper plate
Bit line, the LED luminescence components align with the position line is fixed on the white ink layer away from second copper plate
On side.
In one of the embodiments, the thickness of the substrate layer is the mil of 0.5 mil~1.0, first copper plate
Thickness beThe thickness of second copper plate isThe cover layer protective layer
Thickness be the mil of 0.2 mil~1.0, the thickness of the white ink layer is the mil of 0.5 mil~1.0.
In one of the embodiments, the thickness of the substrate layer is 0.8 mil, and the thickness of first copper plate is
Ounce, the thickness of second copper plate areOunce, the thickness of the cover layer protective layer is 0.5 mil, the white oil
The thickness of layer of ink is 0.8 person of outstanding talent cun.
In one of the embodiments, the white ink layer includes SiO2Ink subgrade and TiO2Ink subgrade, it is described
SiO2Ink subgrade connects the side of second copper plate away from the substrate layer, the TiO2Described in the connection of ink subgrade
SiO2Side of the ink subgrade away from second copper plate.
In one of the embodiments, first copper plate and second copper plate are bonded are arranged at the base respectively
On the parallel two sides of material layer.
The utility model also provides a kind of backlight module, including light guide plate, and the as above back of the body described in any embodiment
Light FPC, the side of the light guide plate abut with the exit positions of each LED.
The utility model also provides a kind of mobile phone, including housing, circuit unit and liquid crystal display panel panel, in addition to such as
Backlight module described in upper any embodiment, the circuit unit, the backlight module and the liquid crystal display panel hold
The housing is placed in, the circuit unit is electrically connected the liquid crystal display panel and the backlight module.
Above-mentioned backlight FPC, by the way that the white ink layer directly is arranged at into second copper plate away from the base material
On the side of layer, on the one hand, the use of the second glue-line and the second cover layer in tradition can be reduced, backlight can be greatly reduced
FPC thickness, on the other hand, white ink layer has preferable reflecting effect, can be reflected more LED lamplights
Go, so as to further lift the brightness that LED sends light.When this is also applied for ultra-thin, for example, as little as 0.098 mil
Light guide plate.So that the height of the wedge structure of the anteposition of LED is less than the thickness of light guide plate, bursting light guide plate is not easy.Together
When, when by the thickness for reducing backlight FPC, the thickness of LED can also be lifted, larger thickness can select luminous power higher
LED, so as to improve the brightness of LED.
Brief description of the drawings
Fig. 1 is traditional backlight FPC structural representation；
Fig. 2 is cut-away views of Fig. 1 backlight FPC along line A-A；
Fig. 3 is the backlight FPC of the embodiment of the utility model one structural representation；
Fig. 4 is cut-away views of the backlight FPC along line B-B shown in Fig. 3.
Embodiment
For the ease of understanding the utility model, to enable above-mentioned purpose of the present utility model, feature and advantage brighter
It is aobvious understandable, specific embodiment of the present utility model is described in detail below in conjunction with the accompanying drawings.Illustrate in the following description
Many details give better embodiment of the present utility model in order to fully understanding the utility model in accompanying drawing.
But the utility model can be realized in many different forms, however it is not limited to embodiments described herein.Conversely
Ground, there is provided the purpose of these embodiments is the more thorough and comprehensive for making to understand disclosure of the present utility model.This practicality
New to be implemented with being much different from other manner described here, those skilled in the art can be without prejudice to this practicality
Similar improvement is done in the case of new intension, therefore the utility model is not limited by following public specific embodiment.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, such as two
It is individual, three etc., unless otherwise specifically defined.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " bag
Include the arbitrary and all combination of the Listed Items of one or more correlations.
For example, a kind of backlight FPC, including substrate layer, the first copper plate, the second copper plate, glue-line, cover layer protective layer and
White ink layer, first copper plate and second copper plate are located at the both sides of the substrate layer respectively, and the glue-line connects
The side of first copper plate away from the substrate layer is connect, the cover layer protective layer connects the glue-line away from the base material
The side of layer, the white ink layer connect the side of second copper plate away from the substrate layer.
In order to further illustrate above-mentioned backlight FPC, another example is, also referring to Fig. 3 and Fig. 4, backlight FPC10 bags
Include substrate layer 110, the first copper plate 120, the second copper plate 130, glue-line 140, cover layer protective layer 150 and white ink layer
160, first copper plate 120 and second copper plate 130 are located at the both sides of the substrate layer 110 respectively, it will be understood that
For, first copper plate 120 and second copper plate 130 are located on the parallel two sides of the substrate layer 110 respectively,
And for example, first copper plate 120 connects the substrate layer 110, and it is remote that second copper plate 130 connects the substrate layer 110
From the side of first copper plate 120, and for example, first copper plate 120 fits in the substrate layer 110, and described second
Copper plate 130 fits in side of the substrate layer 110 away from first copper plate 120, and for example, first copper plate
120 and second copper plate 130 be bonded be arranged on the parallel two sides of the substrate layer 110 respectively.The glue-line 140
Side of first copper plate 120 away from the substrate layer 110 is connected, the cover layer protective layer 150 connects the glue-line
140 sides away from the substrate layer 110, the glue-line 140 are used to the cover layer protective layer 150 being bonded to described first
On side of the copper plate 120 away from the substrate layer.The cover layer protective layer 150 is used to play insulation to the backlight FPC
With the effect of protection.And for example, the color of the cover layer protective layer is yellow, also is understood as, and the cover layer protective layer is
Yellow cover layer protective layer.
Also referring to Fig. 3 and Fig. 4, white ink layer 160 connects second copper plate 130 away from the substrate layer
110 side, it is used on side of the white ink layer 160 away from second copper plate 130 set LED.By straight
Connect and the white ink layer 160 be arranged on side of second copper plate 130 away from the substrate layer 110, on the one hand,
The use of the second glue-line and the second cover layer in tradition can be reduced, backlight FPC thickness, the opposing party can be greatly reduced
Face, white ink layer 160 have preferable reflecting effect, can be reflected more LED lamplights, so as to enter one
Step lifting LED sends the brightness of light, when this is also applied for ultra-thin, for example, the as little as light guide plate of 0.098 mil.So that
The height of the wedge structure of the anteposition of LED is less than the thickness of light guide plate, is not easy bursting light guide plate.Meanwhile reducing backlight FPC
Thickness when, the thickness of LED can also be lifted, larger thickness can select the higher LED of luminous power, so as to improve
The brightness of LED.
In one embodiment, the white ink layer includes SiO2Ink subgrade and TiO2Ink subgrade, the SiO2Ink is sub-
Layer connects the side of second copper plate away from the substrate layer, the TiO2Ink subgrade connects the SiO2Ink subgrade
Side away from second copper plate.And for example, the SiO2The material of ink subgrade is by SiO2Ink forms.And for example, it is described
TiO2Ink subgrade is by TiO2Ink forms.And for example, the material of the white ink layer is by SiO2Ink forms, and also is understood as,
The white ink layer is SiO2Ink layer.It so, it is possible further to improve the reflex of the white ink layer, the enhancing back of the body
The brightness of optical mode group.
In one embodiment, the thickness of the substrate layer 110 is the mil of 0.5 mil~1.0, and for example, first copper plate
120 thickness isAnd for example, the thickness of second copper plate 130 is And for example,
The thickness of the cover layer protective layer 150 is the mil of 0.2 mil~1.0, and and for example, the thickness of the white ink layer 160 is 0.5
The mil of mil~1.0, in such manner, it is possible to reduce backlight FPC thickness, additionally it is possible to increase the brightness of backlight module.
In one embodiment, the thickness of the substrate layer 110 is 0.8 mil, and for example, the thickness of first copper plate 120
ForOunce, and for example, the thickness of second copper plate 130 isOunce, and for example, the thickness of the cover layer protective layer 150 is
0.5 mil, and for example, the thickness of the white ink layer 160 is 0.8 person of outstanding talent cun.It so, it is possible to make above-mentioned backlight FPC be applied to surpass
Thin LCM, especially, light guide plate are less than the LCM of 0.098 mil.And for example, the symbol of the mil is mil, and for example, described
The symbol of ounce is oz.And for example, the 8.9g/cm 1oz weights (28.3495231 grams) is represented when long measure is 1 ounce3Density
Fine copper tiling to the thickness formed on the area of 1 square feet (=144inches).
In one embodiment, Fig. 3 and Fig. 4 is referred to, the backlight FPC also includes LED luminescence components 170, and the LED lights
Component includes multiple LEDs 171, and multiple LEDs 171 are arranged at the white ink layer 160 away from second copper facing
On the side of layer 130.And for example, multiple LEDs 171 are arranged at intervals.And for example, the spacing of multiple LEDs 171 is equal.
And for example, the LED 171 is blue LED lamp.So, by setting LED 171 on the backlight FPC so that backlight FPC
Packaging technology after mounted LED lamp is relatively simple.It should be noted that positive pole negative pole is provided with LED, positive pole in LED
The connected mode of negative pole and the first copper plate or the second copper plate refer to prior art and be realized, the utility model is herein not
Repeating.
In one embodiment, the white ink layer is additionally provided with position line (figure on the side away from second copper plate
Do not show), the LED luminescence components align with the position line is fixed on the white ink layer away from second copper plate
On side.So, by setting the position line, it is easy to that LED is installed.
Above-mentioned backlight FPC, by the way that the white ink layer directly is arranged at into second copper plate away from the base material
On the side of layer, on the one hand, the use of the second glue-line and the second cover layer in tradition can be reduced, backlight can be greatly reduced
FPC thickness, on the other hand, white ink layer has preferable reflecting effect, can be reflected more LED lamplights
Go, so as to further lift the brightness that LED sends light.When this is also applied for ultra-thin, for example, as little as 0.098 mil
Light guide plate.So that the height of the wedge structure of the anteposition of LED is less than the thickness of light guide plate, bursting light guide plate is not easy.Together
When, when by the thickness for reducing backlight FPC, the thickness of LED can also be lifted, larger thickness can select luminous power higher
LED, so as to improve the brightness of LED.
The utility model also provides a kind of backlight module, including light guide plate, and the as above back of the body described in any embodiment
Light FPC, the side of the light guide plate abut with each LED.And for example, the side of the light guide plate and each LED
The exit positions of lamp abut.The backlight module of the present embodiment is applicable to the luminous LED in all sides.
Above-mentioned backlight module, due to using above-mentioned backlight FPC, by the way that the white ink layer directly is arranged at into described the
On side of two copper plates away from the substrate layer, on the one hand, the second glue-line and the second cover layer in tradition can be reduced
Use, backlight FPC thickness can be greatly reduced, on the other hand, white ink layer has preferable reflecting effect, can made more
More LED lamplights are reflected, so as to further lift the brightness that LED sends light, when this is also applied for ultra-thin, example
Such as, the as little as light guide plate of 0.098 mil.So that the height of the wedge structure of the anteposition of LED is less than the thickness of light guide plate,
It is not easy bursting light guide plate.Meanwhile when reducing backlight FPC thickness, the thickness of LED can also be lifted, larger thickness can
From the higher LED of luminous power, so as to improve the brightness of LED.
The utility model also provides a kind of mobile phone, including housing, circuit unit and liquid crystal display panel, in addition to such as takes up an official post
Backlight module described in one embodiment, the circuit unit, the backlight module and the liquid crystal display panel are placed in
The housing, the circuit unit are electrically connected the liquid crystal display panel and the backlight module.
Above-mentioned mobile phone is by using above-mentioned backlight module, the backlight FPC in above-mentioned backlight module, by directly by the white
Ink layer is arranged on the side of second copper plate away from the substrate layer, on the one hand, can reduce the second glue in tradition
The use of layer and the second cover layer, backlight FPC thickness can be greatly reduced, on the other hand, white ink layer has preferable
Reflecting effect, can be reflected more LED lamplights, so as to further lift the brightness that LED sends light,
When this is also applied for ultra-thin, for example, the as little as light guide plate of 0.098 mil.So that the height of the wedge structure of the anteposition of LED
Degree is not easy bursting light guide plate less than the thickness of light guide plate.Meanwhile when reducing backlight FPC thickness, LED can also be lifted
Thickness, larger thickness can select the higher LED of luminous power, so as to improve the brightness of LED.
Current mobile phone the more does the more thin, and brightness the more is done the more high.Mobile phone keeps for the thickness space of LCM modules fewer and fewer.
The thickness design of light source part can be divided into：Backlight FPC, LED and light guide plate composition, it is guide-lighting if FPC design thickness is thick
Plate and LED thickness relative thins, the thin brightness of LED is low, so FPC thickness is thinned to increase LED thickness.
Traditional scheme is that white ink layer is printed on yellow cover layer to lift the such nothings of illumination effect of LED
Backlight FPC thickness is added again in shape, FPC is thicker, and the lozenges of LED front ends is higher, and the height maximum of lozenges can not exceed
Down polaroid thickness, otherwise, the easy bursting down polaroid of lozenges of LED front ends.When scheme is ultrathin design, down polaroid
Thickness only will get over Bao Yuehao with 0.098 mil, corresponding FPC.
The utility model, which removes traditional yellow cover layer and glue-line, to be made into print white ink, on the one hand, so may be used
Accomplish insulation protection circuit, on the other hand, the illumination effect of LED mouth can be lifted.The utility model is by lifting module wedge
Mesh generation space, FPC thickness is reduced, so as to reach the effect of enhancing backlight module brightness.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of backlight FPC, it is characterised in that including substrate layer, the first copper plate, the second copper plate, glue-line, cover layer protection
Layer and white ink layer, first copper plate and second copper plate are located at the both sides of the substrate layer, the glue respectively
Layer connects the side of first copper plate away from the substrate layer, and the cover layer protective layer connects the glue-line away from described
The side of substrate layer, the white ink layer connect the side of second copper plate away from the substrate layer.
2. backlight FPC according to claim 1, it is characterised in that also including LED luminescence components, the LED luminescence components
Including multiple LEDs, multiple LEDs are arranged on side of the white ink layer away from second copper plate.
3. backlight FPC according to claim 2, it is characterised in that multiple LEDs are arranged at intervals.
4. backlight FPC according to claim 3, it is characterised in that the spacing of multiple LEDs is equal.
5. backlight FPC according to claim 1, it is characterised in that the thickness of the substrate layer is the milli of 0.5 mil~1.0
Very little, the thickness of first copper plate isThe thickness of second copper plate is
The thickness of the cover layer protective layer is the mil of 0.2 mil~1.0, and the thickness of the white ink layer is the milli of 0.5 mil~1.0
It is very little.
6. backlight FPC according to claim 1, it is characterised in that the thickness of the substrate layer is 0.8 mil, described
The thickness of one copper plate isThe thickness of second copper plate isThe thickness of the cover layer protective layer is
0.5 mil, the thickness of the white ink layer is 0.8 person of outstanding talent cun.
7. backlight FPC according to claim 1, it is characterised in that the white ink layer includes SiO2Ink subgrade and
TiO2Ink subgrade, the SiO2Ink subgrade connects the side of second copper plate away from the substrate layer, the TiO2Oil
Black subgrade connects the SiO2Side of the ink subgrade away from second copper plate.
8. backlight FPC according to claim 1, it is characterised in that first copper plate and second copper plate point
It Tie He not be arranged on the parallel two sides of the substrate layer.
A kind of 9. backlight module, it is characterised in that including light guide plate, and the backlight as any one of claim 2 to 4
FPC, the side of the light guide plate abut with the exit positions of each LED.
10. a kind of mobile phone, including housing, circuit unit and liquid crystal display panel panel, it is characterised in that also including right such as will
The backlight module described in 9 is sought, the circuit unit, the backlight module and the liquid crystal display panel are placed in the shell
Body, the circuit unit are electrically connected the liquid crystal display panel and the backlight module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720431080.5U CN206865817U (en) | 2017-04-21 | 2017-04-21 | Backlight FPC, backlight module and mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720431080.5U CN206865817U (en) | 2017-04-21 | 2017-04-21 | Backlight FPC, backlight module and mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206865817U true CN206865817U (en) | 2018-01-09 |
Family
ID=60817283
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720431080.5U Active CN206865817U (en) | 2017-04-21 | 2017-04-21 | Backlight FPC, backlight module and mobile phone |
Country Status (1)
| Country | Link |
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| CN (1) | CN206865817U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110161753A (en) * | 2019-05-31 | 2019-08-23 | 厦门天马微电子有限公司 | A kind of backlight module and display device |
| CN113324202A (en) * | 2021-06-07 | 2021-08-31 | 厦门天马微电子有限公司 | Lamp strip, backlight unit and display device including lamp strip |
-
2017
- 2017-04-21 CN CN201720431080.5U patent/CN206865817U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110161753A (en) * | 2019-05-31 | 2019-08-23 | 厦门天马微电子有限公司 | A kind of backlight module and display device |
| CN113324202A (en) * | 2021-06-07 | 2021-08-31 | 厦门天马微电子有限公司 | Lamp strip, backlight unit and display device including lamp strip |
| CN113324202B (en) * | 2021-06-07 | 2022-05-17 | 厦门天马微电子有限公司 | Lamp strip, backlight unit and display device including lamp strip |
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