CN203085649U - LED illuminating element - Google Patents
LED illuminating element Download PDFInfo
- Publication number
- CN203085649U CN203085649U CN2013200470686U CN201320047068U CN203085649U CN 203085649 U CN203085649 U CN 203085649U CN 2013200470686 U CN2013200470686 U CN 2013200470686U CN 201320047068 U CN201320047068 U CN 201320047068U CN 203085649 U CN203085649 U CN 203085649U
- Authority
- CN
- China
- Prior art keywords
- led
- led illuminating
- illuminating part
- luminescence unit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The utility model brings forward an LED illuminating element comprising a substrate and a plurality of LED illuminating units distributed on the substrate. The LED illuminating units with LED supports include pedestal bodies and recessed portions arranged in the pedestal bodies. The body walls of the recessed portions have smooth light concentration reflection planes; and the bottoms of the recessed portions are light reflection surfaces for placing chips and have conduction portions connected with the chips; and the recessed portions are provided with insulated tapes penetrating the recessed portions to the bottoms, wherein the insulated tapes are arranged under the light reflection surfaces. And first leads of the chips are arranged at one sides of the insulated tapes and second leads are arranged at the other sides of the insulated tapes. According to the technical scheme provided by the utility model, because the two pins of the chips are placed at the two sides of the insulated tapes, the short circuit phenomenon caused by mutual conduction of the anode and the cathode can be eliminated fundamentally, thereby prolonging the service life of the LED illuminating element.
Description
Technical field
The utility model relates to the LED field, particularly a kind of LED illuminating part.
Background technology
LED(Light Emitting Diode), light-emitting diode mainly is made up of support, elargol, wafer, gold thread, five kinds of materials of epoxy resin.
LED is a kind of semiconductor that electric energy can be converted into luminous energy, and it has changed the luminous and luminous principle of electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, and adopts electroluminescence.According to one's analysis, the characteristics of LED are very obvious, and the life-span is long, light efficiency is high, radiation is hanged down with low in energy consumption.The spectrum of white light LEDs almost all concentrates on visible light frequency band, and its luminous efficiency can surpass 150lm/W.
Led support, the bottom susceptor of LED lamp pearl before encapsulation on the basis of led support, fixedly entered chip, and the positive and negative electrode of burn-oning is once in package shape with packaging plastic again.
Led support generally be copper do (iron material is arranged also at present, aluminium and pottery etc.), because the conductivity of copper is fine, its the inside can be leaded, the electrode that connects led lamp pearl inside, after LED lamp bead seal was dressed up shape, the lamp pearl can take off from support, the copper pin at lamp pearl two promptly becomes the both positive and negative polarity of lamp pearl, is used to be welded to LED light fixture or other LED finished product.
In the prior art, the led support of LED illuminating part has three-decker, first plastic layer, middle conductting layer, second plastic layer, but that pin is provided with is unreasonable, and often the both positive and negative polarity mutual conduction causes short circuit phenomenon; Heat radiation need add mechanism in addition, and, have that light-emitting area is big inadequately, angle is big inadequately, need other radiation fin, cost is higher.
The utility model content
The utility model proposes a kind of LED illuminating part, solved the both positive and negative polarity mutual conduction, cause problem of short-circuit.
The technical solution of the utility model is achieved in that
The utility model discloses a kind of LED illuminating part, comprise substrate and be distributed in plurality of LEDs luminescence unit on the substrate, described LED luminescence unit has led support, described led support comprises the recess in base body and the described base body, the body wall of described recess has smooth optically focused reflecting surface, the bottom surface of described recess is the light reflection surface that is used to place chip, described bottom surface has the conducting portion that is connected with described chip, described recess has the insulating tape that is through to the bottom surface, described insulating tape is positioned under the described light reflection surface, first pin of described chip is arranged at a side of described insulating tape, and second pin is arranged at the opposite side of described insulating tape.
As the further improvement of the LED illuminating part described in the technical program, described conducting portion bottom has fin, and the upper surface of described fin contacts with conducting portion, and lower surface contacts with air.
As the further improvement of the LED illuminating part described in the technical program, described plurality of LEDs luminescence unit is evenly distributed on described substrate.
As the further improvement of the LED illuminating part described in the technical program, described LED luminescence unit has 14 at row on direction.
As the further improvement of the LED illuminating part described in the technical program, described LED luminescence unit power is not higher than 0.5W.
Implement a kind of led support of the present utility model and LED illuminating part, have following beneficial technical effects:
Difference is a prior art both positive and negative polarity mutual conduction, causes short circuit phenomenon, and the technical program is placed on the both sides of insulating tape with two pins of chip, fundamentally stops the both positive and negative polarity mutual conduction to occur, causes the generation of short circuit phenomenon, has improved the life-span of LED illuminating part.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the vertical view of led support of the present invention;
Fig. 2 is the profile on the led support A-A direction among Fig. 1;
Fig. 3 is a led support working state schematic representation of the present invention;
Fig. 4 is the front view of a kind of LED illuminating part of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
See also Fig. 1 and Fig. 2, embodiment of the present utility model, a kind of led support 50, comprise the recess 5 in base body 1 and the base body 1, the body wall of recess 5 has smooth optically focused reflecting surface 10, the bottom surface 8 of recess 5 is for being used to place the light reflection surface 20 of chip 15, bottom surface 8 has the conducting portion that is connected with chip 15, recess 5 has the insulating tape 25 that is through to bottom surface 8, insulating tape 25 is positioned at light reflection surface 20 times, in the practice, first pin of chip 15 is arranged at a side of insulating tape 25, and second pin is arranged at the opposite side of insulating tape 25.
Wherein, base body 1 adopts resistant to elevated temperatures PPA(Polyphthalamide, polyphthalamide) material, under humid tropical condition, the tensile strength of PPA is higher by 20% than nylon 6, and is higher than nylon 66; The bending modulus of PPA material is higher by 20% than nylon, and hardness is bigger, can resist long tensile creep; This material can anti-200 ℃ continuous high temperature, and can also keep good dimensional stability.
Further, the conducting portion bottom has fin, the upper surface of fin contacts with conducting portion, lower surface contacts with air, and described fin is a copper sheet, and practice confirms, C194 copper material effect is better preferably to adopt thermal conductivity and corrosion resistance, this support product carries heat sinking function, adopts this structure can guarantee that heat can in time scatter, so that the life-span of LED light-emitting component prolongs.
Practice confirms that fin thickness is: 0.1～0.3mm effect is better, and further, described fin thickness is: 0.25mm.
Further, insulating tape 25 shared areas be bottom surface 8 area 15%～30%.
Further, bottom surface 8 has silver coating.Illumination effect as shown in Figure 3, the direction of arrow among Fig. 3 is represented the direction of light path.
Wherein, recess 5 sides of can be cup also can be circle cup, the led support 50 in the technical program, as the carrier of light-emitting diode, it is big to have a light-emitting area, and angle is big, the characteristics of good heat dissipation, single on this support can weld the following chip of 0.5W, singlely produces 14 lamp pearls.
See also Fig. 4, a kind of LED illuminating part comprises substrate 100 and is distributed in plurality of LEDs luminescence unit 120 on the substrate that the led support that LED luminescence unit 120 has is above-mentioned led support 50.
Further, plurality of LEDs luminescence unit 120 is evenly distributed on substrate 100.
Further, LED luminescence unit 120 has 14 at row on direction.
Further, LED luminescence unit 120 power are not higher than 0.5W.
Implement a kind of led support of the present utility model and LED illuminating part, have following beneficial technical effects:
Difference is a prior art both positive and negative polarity mutual conduction, causes short circuit phenomenon, and the technical program is placed on the both sides of insulating tape with two pins of chip, fundamentally stops the both positive and negative polarity mutual conduction to occur, causes the generation of short circuit phenomenon, has improved the life-span of LED illuminating part.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (5)
1. LED illuminating part, comprise substrate and be distributed in plurality of LEDs luminescence unit on the substrate, described LED luminescence unit has led support, described led support comprises the recess in base body and the described base body, the body wall of described recess has smooth optically focused reflecting surface, the bottom surface of described recess is the light reflection surface that is used to place chip, described bottom surface has the conducting portion that is connected with described chip, it is characterized in that, described recess has the insulating tape that is through to the bottom surface, described insulating tape is positioned under the described light reflection surface, first pin of described chip is arranged at a side of described insulating tape, and second pin is arranged at the opposite side of described insulating tape.
2. LED illuminating part according to claim 1 is characterized in that, described conducting portion bottom has fin, and the upper surface of described fin contacts with conducting portion, and lower surface contacts with air.
3. LED illuminating part according to claim 1 is characterized in that, described plurality of LEDs luminescence unit is evenly distributed on described substrate.
4. LED illuminating part according to claim 1 is characterized in that, described LED luminescence unit has 14 at row on direction.
5. according to each described LED illuminating part of claim 1 to 4, it is characterized in that described LED luminescence unit power is not higher than 0.5W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200470686U CN203085649U (en) | 2013-01-28 | 2013-01-28 | LED illuminating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200470686U CN203085649U (en) | 2013-01-28 | 2013-01-28 | LED illuminating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203085649U true CN203085649U (en) | 2013-07-24 |
Family
ID=48831459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013200470686U Expired - Lifetime CN203085649U (en) | 2013-01-28 | 2013-01-28 | LED illuminating element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203085649U (en) |
-
2013
- 2013-01-28 CN CN2013200470686U patent/CN203085649U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130724 |