CN203085530U - LED illuminating element - Google Patents
LED illuminating element Download PDFInfo
- Publication number
- CN203085530U CN203085530U CN2013200470474U CN201320047047U CN203085530U CN 203085530 U CN203085530 U CN 203085530U CN 2013200470474 U CN2013200470474 U CN 2013200470474U CN 201320047047 U CN201320047047 U CN 201320047047U CN 203085530 U CN203085530 U CN 203085530U
- Authority
- CN
- China
- Prior art keywords
- led
- led illuminating
- utility
- luminescence unit
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model brings forward an LED illuminating element comprising a substrate and a plurality of LED illuminating units distributed on the substrate. The LED illuminating units with LED supports include pedestal bodies and recessed portions arranged in the pedestal bodies; the body walls of the recessed portions have smooth light concentration reflection planes and the bottoms of the recessed portions are light reflection surfaces for placing chips. The recessed portions include annular bosses and conduction portions, wherein the annular bosses and conduction portions are integrated into one; and the recessed portions are in overall step shapes. First leads of the chips are arranged at one sides of the annular bosses and second leads thereof are arranged at the other sides of the annular bosses. According to the utility model, the beneficial effects of the LED illuminating element are as follows: the thermal-electric separation is realized; the conduction portion is protected; and the service life of the chip is prolonged.
Description
Technical field
The utility model relates to the LED field, particularly a kind of LED illuminating part.
Background technology
LED(LightEmitting Diode), light-emitting diode mainly is made up of support, elargol, wafer, gold thread, five kinds of materials of epoxy resin.
LED is a kind of semiconductor that electric energy can be converted into luminous energy, and it has changed the luminous and luminous principle of electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, and adopts electroluminescence.According to one's analysis, the characteristics of LED are very obvious, and the life-span is long, light efficiency is high, radiation is hanged down with low in energy consumption.The spectrum of white light LEDs almost all concentrates on visible light frequency band, and its luminous efficiency can surpass 150lm/W.
Led support, the bottom susceptor of LED lamp pearl before encapsulation on the basis of led support, fixedly entered chip, and the positive and negative electrode of burn-oning is once in package shape with packaging plastic again.
Led support generally be copper do (iron material is arranged also at present, aluminium and pottery etc.), because the conductivity of copper is fine, its the inside can be leaded, the electrode that connects led lamp pearl inside, after LED lamp bead seal was dressed up shape, the lamp pearl can take off from support, the copper pin at lamp pearl two promptly becomes the both positive and negative polarity of lamp pearl, is used to be welded to LED light fixture or other LED finished product.
In the prior art, the LED illuminating part does not have thermoelectric separating mechanism, and the heat that causes led chip to produce constantly is gathered in conducting portion, and the heat that conducting portion often occurs can not in time distribute and quicken the aging of led chip.
The utility model content
The utility model proposes a kind of LED illuminating part, having solved needs other radiation fin, the cost problem of higher.
The technical solution of the utility model is achieved in that
The utility model discloses a kind of LED illuminating part, comprise substrate and be distributed in plurality of LEDs luminescence unit on the substrate, described LED luminescence unit has led support, comprise the recess in base body and the described base body, the body wall of described recess has smooth optically focused reflecting surface, the bottom surface of described recess is the light reflection surface that is used to place chip, described recess has annular boss and conducting portion, described annular boss and bottom surface are one-body molded, described recess integral body is stepped, first lead of described chip is arranged at a side of described annular boss, and second lead is arranged at the opposite side of described annular boss.
In LED illuminating part described in the utility model, described conducting portion bottom has fin, and the upper surface of described fin contacts with conducting portion, and lower surface contacts with air.
In LED illuminating part described in the utility model, described plurality of LEDs luminescence unit is evenly distributed on described substrate.
In LED illuminating part described in the utility model, described LED luminescence unit has 14 at row on direction.
In LED illuminating part described in the utility model, described LED luminescence unit power is 0.5W～0.7W.
Implement a kind of LED illuminating part of the present utility model, have following beneficial technical effects:
Difference is the structure of the thermoelectric one of prior art, and the technical program is thermoelectric separates, and has protected the turning part, has improved the life-span of chip.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 a is the vertical view of the utility model first embodiment LED luminescence unit;
Fig. 1 b is the vertical view of the utility model second embodiment LED luminescence unit;
Fig. 2 is the profile of led support;
Fig. 3 is the light path schematic diagram of LED luminescence unit of the present utility model;
Fig. 4 is the front view of a kind of LED illuminating part of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
See also Fig. 1 a, Fig. 1 b and Fig. 2, embodiment of the present utility model, a kind of LED luminescence unit 120, comprise the recess 5 in base body 1 and the base body 1, the body wall of recess 5 has smooth optically focused reflecting surface 10, the bottom surface 8 of recess 5 is for being used to place the light reflection surface of chip 15, recess 5 has annular boss 25 and conducting portion, annular boss 25 is one-body molded with bottom surface 8, recess 5 is whole stepped, first lead of chip 15 is arranged at a side of annular boss 25, and second lead is arranged at the opposite side of annular boss 25.
Further, bottom surface 8 has fin, and the upper surface of fin contacts with bottom surface 8, and lower surface contacts with air,
Further, bottom surface 8 has silver coating, and bottom surface 8 can be circular, and is also square, illumination effect as shown in Figure 3, the direction of the direction indication light path of arrow among Fig. 3.
Further, on the annular boss 25 insulating tape 30 is set.
Wherein, being provided with of insulating tape 30 can be arranged on one side, as shown in Figure 1a, 15, two chip 15 pins of two chips also can be installed be arranged at two insulating tape 30 both sides respectively, shown in Fig. 1 b.
Further, fin is a copper sheet, and fin thickness is: 0.1～0.3mm, fin thickness is: 0.25mm.
Wherein, base body 1 has plastic cement portion and conducting portion, and plastic cement portion adopts resistant to elevated temperatures PPA material, and conducting portion adopts thermal conductivity to reach the C194 copper material of corrosion resistance well.
The course of work of this LED luminescence unit 120 is: after powering up startup, light-emitting diode chip for backlight unit 15 leads of annular boss 25 begin heating, the heat conduction of heat process is to conducting portion bottom surface 8, the fin that has by bottom surface 8, be radiated in the ambient air, thereby independently finished heat radiation, need not other thermal component.
See also Fig. 4, a kind of embodiment of the present utility model, a kind of LED illuminating part comprises substrate 100 and is distributed in plurality of LEDs luminescence unit 120 on the substrate 100 that LED luminescence unit 120 has aforesaid LED luminescence unit 120.
Wherein, the conducting portion bottom has fin, and the upper surface of fin contacts with conducting portion, and lower surface contacts with air.
Further, plurality of LEDs luminescence unit 120 is evenly distributed on substrate 100.
Implement a kind of LED spare of the present utility model, have following beneficial technical effects:
Difference is the structure of the thermoelectric one of prior art, and the technical program is thermoelectric separates, and has protected the turning part, has improved the life-span of chip.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (5)
1. LED illuminating part, comprise substrate and be distributed in plurality of LEDs luminescence unit on the substrate, described LED luminescence unit has led support, comprise the recess in base body and the described base body, the body wall of described recess has smooth optically focused reflecting surface, the bottom surface of described recess is the light reflection surface that is used to place chip, it is characterized in that, described recess has annular boss and conducting portion, described annular boss and bottom surface are one-body molded, described recess integral body is stepped, and first lead of described chip is arranged at a side of described annular boss, and second lead is arranged at the opposite side of described annular boss.
2. LED illuminating part according to claim 1 is characterized in that, described conducting portion bottom has fin, and the upper surface of described fin contacts with conducting portion, and lower surface contacts with air.
3. LED illuminating part according to claim 1 is characterized in that, described plurality of LEDs luminescence unit is evenly distributed on described substrate.
4. LED illuminating part according to claim 1 is characterized in that, described LED luminescence unit has 14 at row on direction.
5. according to each described LED illuminating part of claim 1 to 4, it is characterized in that described LED luminescence unit power is 0.5W～0.7W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200470474U CN203085530U (en) | 2013-01-28 | 2013-01-28 | LED illuminating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200470474U CN203085530U (en) | 2013-01-28 | 2013-01-28 | LED illuminating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203085530U true CN203085530U (en) | 2013-07-24 |
Family
ID=48831342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013200470474U Expired - Lifetime CN203085530U (en) | 2013-01-28 | 2013-01-28 | LED illuminating element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203085530U (en) |
-
2013
- 2013-01-28 CN CN2013200470474U patent/CN203085530U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130724 |
|
| CX01 | Expiry of patent term |