CN203147431U - Epitaxial wafer-type optical-mechanical module of light-emitting diode (LED) bulb - Google Patents
Epitaxial wafer-type optical-mechanical module of light-emitting diode (LED) bulb Download PDFInfo
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- CN203147431U CN203147431U CN2013202048932U CN201320204893U CN203147431U CN 203147431 U CN203147431 U CN 203147431U CN 2013202048932 U CN2013202048932 U CN 2013202048932U CN 201320204893 U CN201320204893 U CN 201320204893U CN 203147431 U CN203147431 U CN 203147431U
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Abstract
The utility model discloses an epitaxial wafer-type optical-mechanical module of a light-emitting diode (LED) bulb. The epitaxial wafer-type optical-mechanical module of the LED bulb comprises a thin-type epitaxial wafer (46). The epitaxial wafer (46) comprises an LED substrate and a transitional epitaxial layer on the LED substrate; the epitaxial wafer (46) is provided with an LED related component (41); the LED related component (41) comprises LED wafers and related circuits and related components; the epitaxial wafer (46) and the optical-mechanical module (43) are bonded; the epitaxial wafer (46) and the optical-mechanical module (43) are same in appearance; and both sides of the optical-mechanical module (43) and both sides of the epitaxial wafer (46) are respectively provided with a gap, or the epitaxial wafer-type optical-mechanical module of the LED bulb comprises an optical-mechanical template (43). The optical-mechanical template (43) is provided with the transitional epitaxial layer; the transitional epitaxial layer is provided with the LED related component (41); a transparent sealing compound and/or a transparent cover plate (42) cover/covers on the LED related component (41); and only a related bonding pad on the LED related component (41) is exposed.
Description
Technical field
The utility model relates to a kind of LED bulb ray machine module of extension chip, particularly a kind of LED bulb ray machine module for the extension chip that makes up the LED bulb.
Background technology
Application number be 201210253590.X, 201210253702.1,201210253639.1,201210253844.8, Chinese patent application such as 201210255564 disclose a plurality of organization plans, can be general and the LED bulb that exchanges, on address the LED bulb that relevant patent is described, be to adopt LED as illuminator, can independently use, interchangeable and change, the light-source structure that can not be split with the non-destructive means.These technology are for setting up the Lighting Industry framework centered by the LED bulb, and the basic concept that makes LED bulb (lighting source), light fixture, illumination control become the end product of independent production, application is laid a good foundation.Further creation idea advanced person, easier standardized LED bulb structure parts are of far-reaching significance for large-scale promotion LED illumination, especially as the ray machine module of LED bulb core component.
The utility model content
The purpose of this utility model is, a kind of LED bulb ray machine module of extension chip is provided.It can be the LED bulb provide universal strong, specification few, be convenient to the ray machine module that standardization and scale are made, easier extensiveization of LED bulb and standardization are made.
The technical solution of the utility model: a kind of LED bulb ray machine module of extension chip, be characterized in: comprise slim epitaxial wafer, described epitaxial wafer comprises the transition epitaxial loayer on LED substrate and the LED substrate, described epitaxial wafer is provided with the relevant components and parts of LED, the relevant components and parts of LED comprise LED wafer and interlock circuit and relevant components and parts, described epitaxial wafer and ray machine template are bonding, and described epitaxial wafer is identical with the profile of ray machine template, and the both sides of ray machine template and epitaxial wafer are equipped with breach; Perhaps the LED bulb ray machine module of described extension chip comprises the ray machine template, and the ray machine template is provided with the transition epitaxial loayer, and described transition epitaxial loayer is provided with the relevant components and parts of LED, and the relevant components and parts of LED comprise LED wafer and interlock circuit and relevant components and parts; Be coated with transparent sealing and/or transparent cover plate on the relevant components and parts of described LED, only expose the pass connected bonding pads on the relevant components and parts of LED.
The production method of above-mentioned two schemes arranged side by side is respectively, first kind of scheme is to do the slim epitaxial wafer that the transition epitaxial loayer forms at existing LED substrate, epitaxial wafer enters reacting furnace and divides layer growth to form LED wafer and line related on the ad-hoc location, after finishing, the growth of LED wafer do not cut apart, detect qualified after, and the solid brilliant components and parts of being correlated with of going up (carry out solid crystalline substance to elements such as wafer scale driving power chips, if any.Also can form by direct growth in reacting furnace), beat gold thread again and connect LED wafer and relevant components and parts (if necessary); LED wafer, interlock circuit and relevant components and parts have formed the relevant components and parts of LED, and epitaxial wafer and ray machine template are bonding, and described epitaxial wafer is identical with the profile of ray machine template, and the both sides of ray machine template and epitaxial wafer are equipped with breach; Second kind of scheme is, directly do the transition epitaxial loayer in the ray machine template, entering reacting furnace grows thereon and forms LED wafer and line related on the ad-hoc location, after finishing, the growth of LED wafer do not cut apart, detect qualified after, and the solid brilliant components and parts of being correlated with of going up (carry out solid crystalline substance to elements such as wafer scale driving power chips, if any.Also can form by direct growth in reacting furnace), beat gold thread again and connect LED wafer and relevant components and parts (if necessary).LED wafer, interlock circuit and relevant components and parts have formed the relevant components and parts of LED.All use transparent sealing and/or transparent cover plate to cover on the relevant components and parts of LED described in two kinds of schemes, only expose the pass connected bonding pads on the relevant components and parts of LED.Backing material can be selected existing LED backing material for use, and the transition epitaxial loayer can be according to the wafer that generates as materials such as employing GaN.Because scheme of the present utility model all need not be considered the LED wafer and processing such as cut, and ray machine module of the present utility model can be used for the bulb scheme of liquid heat radiation, production LED wafer requires to have bigger reduction to the material of substrate, such as the easy relatively poor SiC substrate of Si substrate, processing characteristics of be full of cracks, even polycrystalline high purity aluminium oxide, HIGH-PURITY SILICON sill etc. also can enter in the selection inventory of the ray machine template substrate of epitaxial wafer (or in the first string) material of second scheme.
In the LED bulb ray machine module of aforesaid extension chip, the transparent sealing of described use and/or transparent cover plate to the method that the relevant components and parts of LED cover are respectively: the interelement at the relevant components and parts of LED is filled a little transparent adhesive tape levelling, make and form transparent adhesive tape between LED wafer surface and the transparent cover plate as few as possible, adopt the profile transparent cover plate identical with the ray machine template to add a cover on it again, transparent cover plate is provided with the open area, is used for exposed pad; Perhaps, interelement at the relevant components and parts of LED is filled a little transparent adhesive tape levelling, adopt profile to add a cover on it less than the transparent cover plate of ray machine template again, around transparent cover plate, coat transparent sealing then, the profile of transparent sealing is flushed with the ray machine template, transparent cover plate is provided with the open area, is used for exposed pad; Perhaps, directly coat transparent sealing on the relevant components and parts of LED, the profile of transparent sealing is flushed with the ray machine template, transparent adhesive tape is provided with the open area, is used for exposed pad.
Described ray machine template adopts the ray machine template of transparent material, the following emergent light of LED wafer can see through transparent ray machine template like this, reflecting surface reflection by the LED bulb appears the bulb inner cover again, obtains the bigger lifting of led chip luminous efficiency and reduces led chip junction temperature good result, referring to Figure 21.
Described ray machine template adopts different materials to two kinds of different schemes; the effect of ray machine template is equal to transparent cover plate in first kind of scheme; can adopt different other nonmetal transparent Heat Conduction Materials with the epitaxial wafer substrate to support epitaxial wafer, but the one side of epitaxial wafer coating fluorescent powder and add stopping off also dorsad.Perhaps described ray machine template is formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are that 5 ~ 30:100 makes by weight.And the ray machine template adopts the LED backing material in second kind of scheme.
In the LED bulb ray machine module of aforesaid extension chip, for undersized ray machine template, described ray machine template is circular slab, and the bilateral symmetry of circular slab is provided with two interior arc gaps, and the center of circle of arc gap is on the concentric circles of circular slab outside; Also be provided with the circular hole that links to each other for the contact pin of electric connector on the described ray machine template, described pad is on the relevant components and parts of LED and be positioned at place, circular hole place, and the contact pin of electric connector welds mutually with pad after inserting circular hole.
In the LED bulb ray machine module of aforesaid extension chip, ray machine template for medium size, described ray machine template is circular slab, be provided with to the circular substrate bilateral symmetry two arc breach, two arc breach are by two arc formation at circular substrate bilateral symmetry ground excision circular substrate place circle; Also be provided with the circular hole of band alignment pin on the described ray machine template, circular hole is used for being connected with the electric connector contraposition; The relevant components and parts of described LED are arranged at place, circular hole place by flexible built-up circuit with pad, described electric connector insert behind the circular hole with flexible built-up circuit on pad weld mutually.
In the LED bulb ray machine module of aforesaid extension chip, ray machine template for relatively large size, described ray machine template is circular slab, the both sides of circular slab are provided with two symmetric windows, the shape of each breach includes a string (each breach all be a flat-cut along circular substrate place circle cut form) of circular substrate place circle, and it is outward-dipping 120 degree in described string two ends, and round to the circular slab place by arc transition; Described pad is positioned at the breach inboard of circular slab, and pad is located at inboard or concentrated one of them the breach inboard that is located at of two breach respectively.
In the LED bulb ray machine module of aforesaid extension chip, for undersized ray machine template, described circular slab place diameter of a circled
G Be 11 mm or 16mm; When circular slab place diameter of a circled
G During for 11mm, the center of circle of two arc gaps is (i.e. the spacing in two centers of circle) on the circle of 13mm at diameter, and the radius of two arc gaps is 3.2mm; When circular slab place diameter of a circled
G When being 16 mm, the center of circle of two arc gaps is (i.e. the spacing in two centers of circle) on the circle of 19mm at diameter, and the radius of two arc gaps is 3.6mm.The described circular hole that links to each other with the contact pin of electric connector is 4, equidistantly is symmetrically distributed, and spacing 3.5mm, 2mm place, the circular slab center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes equates with the distance of two breach.
In the LED bulb ray machine module of aforesaid extension chip, for the ray machine template of medium size, described circular slab place diameter of a circled
G Be 18mm or 25mm; When circular slab place diameter of a circled
G During for 18mm, two cut arc chord lengths are 8.2mm, and the distance between two strings is 16mm; When circular slab place diameter of a circled
G During for 25mm, two cut arc chord lengths are 9.8mm, and the distance between two strings is 23mm, and 2mm place, the circular slab center of circle is being departed from its center of circle, and the circular hole center equates with the distance of two breach.
In the LED bulb ray machine module of aforesaid extension chip, for the ray machine template of large-size, described circular slab place diameter of a circled
G Be 20mm, 38mm or 50mm, the chord length in the described breach deducts that length is 10mm after the outward-dipping part in two ends, and the radius of the circular arc that transition is used is 1mm; Two corresponding two strings of breach are parallel to each other; When circular slab place diameter of a circled
G During for 20mm, the distance between two strings is 15mm; When circular slab place diameter of a circled
G During for 38mm, the distance between two strings is 33mm; When circular slab place diameter of a circled
G During for 50mm, the distance between two strings is 45mm.
In the LED bulb ray machine module of aforesaid extension chip, also be coated with fluorescent material on described transparent cover plate and/or the ray machine template, fluorescent material is coated with protective layer outward; Perhaps described transparent cover plate and/or ray machine template (43) are formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are that 5 ~ 30:100 makes by weight.
In the LED bulb ray machine module of aforesaid extension chip, also be provided with on the described ray machine template for fixing fixing hole, the quantity of described fixing hole is two, and two fixing holes are based on the circular central symmetry of circular slab, and the distance between two fixing holes is d
G
-6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers; Work as d
G
During=20mm, monolaterally open a fixing hole.
Compared with prior art, existing LED Lighting Industry has continued the thoughtcast of traditional semiconductor industry, could satisfy the requirement of very strange integral LED illuminating lamp with chip form, and then chip becomes the center of LED Lighting Industry, extend upward related industries such as having formed chip base material and epitaxial wafer, formed related industries such as chip encapsulation, driving power, light fixture manufacturing, accessory downwards, but from Analysis of Industrial Structure, such industrial structure drawback is more.At first: based on chip growth with cut apart, the base material of chip has been proposed high requirement, had only the high signle crystal alumina of manufacturing technique requirent etc. just can meet the demands for number different materials seldom at present; Secondly: it is fragmentary and tediously long that processes such as the light fixture of packing into, driving power, control be supporting are grown, cut, sieve, are encapsulated into to substrate and epitaxial wafer, chip; Its three: the general and interchangeability of monoblock type illuminating lamp is relatively poor, and user object is fragmentary and disperse in the process of producing productization, and intensive degree is extremely low.And the utility model is based on aforementioned lamps foam method case; and what bulb had covered the majority of illumination environment uses the lamp requirement; the technical solution of the utility model falls sharply the ray machine module of all LED bulbs and focuses on 3 types; amount on 7 specific products; because the specification total amount of ray machine module is few, has so just possessed and allow LED middle and upper reaches enterprise will research and develop the condition of adjusting to size of the organizationization and intensive production on the ray machine module of limited specification kind with center of production.LED wafer of the present utility model and interlock circuit are directly to obtain in the epitaxial wafer growth, be that led chip processing enterprise only needs behind direct growth LED wafer and interlock circuit on epitaxial wafer or the ray machine template, need not only needs simple welding and stickup can directly obtain core component---the ray machine module of producing for the LED bulb through technologies such as cuttings again, can obtain the LED bulb by simple assembling again.LED illuminator centre-of gravity shift solves the general and interchangeability problem that current LED industry exists easily on bulb rather than chip, also external patent barrier has been eliminated in reduction and part in essence, for China's LED Lighting Industry provides fine development space; Simultaneously on other concrete technique effects, the utility model is by being sealed in the relevant components and parts of LED between transparent ray machine template and the transparent cover plate, the adjacent transparent cover plate of led chip, transparent sealing less and fluorescent material is located at that transparent cover plate is outer can be away from led chip, fluorescent material and transparent adhesive tape are difficult for wearing out like this, stablize, efficiently move significant to guaranteeing the LED bulb; The following emergent light of chip can see through transparent ray machine template in addition, and the reflecting surface reflection by the LED bulb appears the bulb inner cover again, referring to Figure 20 and Figure 21, obtains the bigger lifting of chip light emitting efficient and reduces the junction temperature of chip good result; And the breach of both sides designs on the ray machine template, be convenient to connect outer lead, can well in the liquid atmosphere, work simultaneously, after the ray machine module is installed in the inner cover of LED bulb band transparent insulation conductive fluid, the transparent insulation conductive fluid of being heated can be passed breach and be finished unimpeded flowing in order to carry out thermal cycle, so just make ray machine module of the present utility model when work, can have extremely excellent radiating effect, thereby improved the luminous efficiency of LED.And applicant of the present utility model is through studying repeatedly, test and summing up, offer all different breach of shape size for the ray machine template of different size, make it under the situation of the arrangement space that does not influence the relevant components and parts of LED, can reach best liquid flow effect, and then realize best radiating effect.
Description of drawings
Fig. 1 is the profile schematic diagram that uses the ray machine module of the profile transparent cover plate identical with the ray machine template among the embodiment 1;
Fig. 2 is the broken away view of ray machine module shown in Figure 1;
Fig. 3 is the ray machine module outline drawing that embodiment 1 uses transparent sealing;
Fig. 4 uses profile less than the ray machine modular structure schematic diagram of the transparent cover plate of ray machine template among the embodiment 1;
Fig. 5 is the broken away view of ray machine module shown in Figure 4;
Fig. 6 is the ray machine template perforate schematic diagram of embodiment 1;
Fig. 7 is the ray machine template of embodiment 1 and the scheme of installation of connector;
Fig. 8 is the application structure schematic diagram of embodiment 1;
Fig. 9 is the ray machine module outline drawing that embodiment 2 uses transparent sealing;
Figure 10 is the broken away view of using the ray machine module of the profile transparent cover plate identical with the ray machine template among the embodiment 2;
Figure 11 uses profile less than the ray machine modular structure schematic diagram of the transparent cover plate of ray machine template among the embodiment 2;
Figure 12 is the ray machine template of embodiment 2 and the scheme of installation of connector;
Figure 13 is the perforate schematic diagram of the ray machine template of embodiment 2;
Figure 14 is the application structure schematic diagram of embodiment 2;
Figure 15 is the ray machine module outline drawing that embodiment 3 uses transparent sealing;
Figure 16 is the broken away view of using the ray machine module of the profile transparent cover plate identical with the ray machine template among the embodiment 3;
Figure 17 uses profile less than the ray machine modular structure schematic diagram of the transparent cover plate of ray machine template among the embodiment 3;
Figure 18 is the ray machine template perforate schematic diagram of embodiment 3;
Figure 19 is the application structure schematic diagram of embodiment 3;
The LED bulb structure schematic diagram that Figure 20 is to use ray machine module of the present utility model to set up;
Figure 21 is based on the principle of luminosity schematic diagram of GaN base LED of the present utility model.
Being labeled as in the accompanying drawing: 2-heat conductive pad, 3-heat conduction support, 4-ray machine module, 7-luminous intensity distribution optical lens, 8-lens snap ring, 11-electric connector, 15-stiff end, 16-waterproof apron, 31-reflector layer, the 41-LED components and parts of being correlated with, 42-transparent cover plate, 43-ray machine template, the flexible built-up circuit of 44-, the transparent sealing of 45-, 46-epitaxial wafer, 61-bulb spill inner cover, the 61.1-pressure relief vent, 61.2 – unload press mold, snap ring in the 81-, 105-bulb hold-down screw, 431-alignment pin.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described, but not as the foundation to the utility model restriction.
Embodiment 1: a kind of LED bulb ray machine module of the extension chip for small size LED bulb, be included in and do the slim epitaxial wafer 46 that the transition epitaxial loayer forms on the existing LED substrate, epitaxial wafer 46 enters reacting furnace and divides layer growth to form LED wafer and line related on the ad-hoc location, after finishing, the growth of LED wafer do not cut apart, detect qualified after, and the solid brilliant relevant components and parts of, beat gold thread again and connect LED wafer and relevant components and parts.LED wafer, interlock circuit and relevant components and parts have formed the relevant components and parts 41 of LED, and epitaxial wafer 46 is bonding with ray machine template 43, and described ray machine template 43 is identical with the profile of epitaxial wafer 46, and the both sides of ray machine template 43 and epitaxial wafer 46 are equipped with breach; Perhaps directly do the transition epitaxial loayer in ray machine template 43, enter reacting furnace and divide layer growth to form LED wafer and line related on the ad-hoc location thereon, after finishing, the growth of LED wafer do not cut apart, detect qualified after, and the solid brilliant relevant components and parts of, beat gold thread again and connect LED wafer and relevant components and parts.LED wafer, interlock circuit and relevant components and parts have formed the relevant components and parts 41 of LED; Use transparent sealing 45 and/or transparent cover plate 42 to cover on the relevant components and parts 41 of described LED, only expose the pass connected bonding pads on the relevant components and parts 41 of LED.The transparent sealing 45 of described use and/or transparent cover plate 42 transparent cover plates have the method that the relevant components and parts 41 of LED cover: as depicted in figs. 1 and 2, interelement at the relevant components and parts 41 of LED is filled a little transparent adhesive tape levelling, make and form transparent adhesive tape between LED wafer surface and the transparent cover plate as few as possible, adopt profile and ray machine template 43 identical transparent cover plates 42 to add a cover on it again, transparent cover plate 42 is provided with the open area, is used for exposed pad; Perhaps, shown in Figure 4 and 5, interelement at the relevant components and parts 41 of LED is filled a little transparent adhesive tape levelling, make and form transparent adhesive tape between LED wafer surface and the transparent cover plate as few as possible, adopt profile to add a cover on it less than the transparent cover plate 42 of ray machine template 43 again, around transparent cover plate 42, coat transparent sealing 45 then, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent cover plate 42 is provided with the open area, is used for exposed pad; Perhaps, as shown in Figure 3, directly coat transparent sealing 45 on the relevant components and parts 41 of LED, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent adhesive tape 45 is provided with the open area, is used for exposed pad.
Also be coated with fluorescent material on described transparent cover plate 42 and/or the ray machine template 43, fluorescent material is coated with protective layer outward; Perhaps described transparent cover plate 42 and/or ray machine template 43 are formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are that 5 ~ 30:100 makes by weight.
The shape of described ray machine template 43 is circular slab as shown in Figure 6, and the bilateral symmetry of circular slab is provided with two interior arc gaps, the center of circle of arc gap on the concentric circles of circular slab outside, during its cutting mode with d G Diameter, symmetrical X-axis is with l G Be length, R is radius, w G Be chord length, the both sides of downcutting circle form two round breach that radius is R.The purposes of breach is for when the ray machine module is used for liquid heat sink conception, and heated transparent insulation conductive fluid can be carried out thermal cycle from indentation, there; Also be provided with the circular hole that links to each other for the contact pin with electric connector 11 on the described ray machine template 43, centered by the positive 2mm of the X-axis of ray machine template 43 place, 3.5 to be spacing, the circular hole of 4 the diameter 1.4mm that are symmetrically distributed; Described pad is on the relevant components and parts 41 of LED and be positioned at place, circular hole place, and the contact pin of electric connector 11 welds mutually with pad after inserting circular hole, as shown in Figure 7.The circular hole that contact pin described and electric connector 11 links to each other is 4, equidistantly is symmetrically distributed, and spacing 3.5mm, 2mm place, the circular slab center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes equates with the distance of two breach.Namely centered by the positive 2mm of the X-axis of ray machine template 43 place, 3.5 being spacing, the circular hole of 4 the diameter 1.4mm that are symmetrically distributed.Described circular substrate place diameter of a circled
G Be 11 mm or 16mm; When circular substrate place diameter of a circled
G During for 11mm, the center of circle of two arc gaps is on the circle of 13mm at diameter, and the radius of two arc gaps is 3.2mm; When circular substrate place diameter of a circled
G When being 16 mm, the center of circle of two arc gaps is on the circle of 19mm at diameter, and the radius of two arc gaps is 3.6mm.
The application of the LED bulb ray machine module of extension chip of the present utility model: electric connector 11 passes heat conduction support 3 and bonding, pad welding on the relevant components and parts 41 with LED of circular hole of the contact pin insertion ray machine template 43 of electric connector 11, the LED bulb ray machine module of extension chip is provided with spill inner cover 61 outward, the LED bulb ray machine module of final extension chip is suspended between heat conduction support 3 and the spill inner cover 61 in the confined space, and the ray machine template external diameter of the LED bulb ray machine module of extension chip and the internal diameter of spill inner cover 61 fit tightly.So just constitute the core texture of a LED bulb, in spill inner cover 61, injected transparent insulation conductive fluid (spill inner cover 61 is provided with the pressure release film 61.2 of relief hole 61.1 and sealing usefulness) at last, as shown in Figure 8.Fig. 7 and structure shown in Figure 8 all are directly to do the scheme of transition epitaxial loayer in the ray machine template.
Embodiment 2: a kind of LED bulb ray machine module of the extension chip for medium size LED bulb, be included in and do the slim epitaxial wafer 46 that the transition epitaxial loayer forms on the existing LED substrate, epitaxial wafer 46 enters reacting furnace and divides layer growth to form LED wafer and line related on the ad-hoc location, after finishing, the growth of LED wafer do not cut apart, detect qualified after, and the solid brilliant relevant components and parts of, beat gold thread again and connect LED wafer and relevant components and parts.LED wafer, interlock circuit and relevant components and parts have formed the relevant components and parts 41 of LED.Epitaxial wafer 46 is bonding with ray machine template 43, and described ray machine template 43 is identical with the profile of epitaxial wafer 46, and the both sides of ray machine template 43 and epitaxial wafer 46 are equipped with breach; Perhaps directly do the transition epitaxial loayer in ray machine template 43, enter reacting furnace and grow thereon and form LED wafer and line related on the ad-hoc location, do not cut apart after the growth of LED wafer is finished, detect qualified after, and the solid brilliant relevant components and parts of, beat gold thread again and connect LED wafer and relevant components and parts.LED wafer, interlock circuit and relevant components and parts have formed the relevant components and parts 41 of LED; Use transparent sealing 45 and/or transparent cover plate 42 to cover on the relevant components and parts 41 of described LED, only expose the pass connected bonding pads on the relevant components and parts 41 of LED.Described transparent sealing 45 and/or transparent cover plate 42 transparent cover plates to the method that the relevant components and parts 41 of LED cover are: the interelement at the relevant components and parts 41 of LED is filled a little transparent adhesive tape levelling, make and form transparent adhesive tape between LED wafer surface and the transparent cover plate as few as possible, adopt profile and ray machine template 43 identical transparent cover plates 42 to add a cover on it again, transparent cover plate 42 is provided with the open area, be used for exposed pad, as shown in figure 10; Perhaps, interelement at the relevant components and parts 41 of LED is filled a little transparent adhesive tape levelling, make and form transparent adhesive tape between LED wafer surface and the transparent cover plate as few as possible, adopt profile to add a cover on it less than the transparent cover plate 42 of ray machine template 43 again, coat transparent sealing 45 then around transparent cover plate 42, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent cover plate 42 is provided with the open area, be used for exposed pad, as shown in figure 11; Perhaps, as shown in Figure 9, directly coat transparent sealing 45 on the relevant components and parts 41 of LED, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent adhesive tape 45 is provided with the open area, is used for exposed pad.Also be coated with fluorescent material on described transparent cover plate 42 and/or the ray machine template 43, fluorescent material is coated with protective layer outward; Perhaps described transparent cover plate 42 and/or ray machine template 43 are formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are that 5 ~ 30:100 makes by weight.
Described ray machine template 43 is circular slab, and as shown in figure 13, two of circular slab bilateral symmetry ground excision circular slab place circle are arc, form two symmetric windows; Also be provided with the circular hole of band alignment pin on the described ray machine template 43, circular hole is used for being connected with electric connector 11 contrapositions; With d
G
Diameter, symmetrical X-axis is with l
G
Be length, w
G
Be chord length, the both sides of downcutting circle form breach.The purposes of breach is for when the ray machine module is used for liquid heat sink conception, and heated transparent insulation conductive fluid can be carried out thermal cycle from indentation, there, referring to Figure 14.Be the center of circle at the positive 2mm of the X-axis of ray machine template 43 place, leave the 8mm diameter circle, circle is provided with the alignment pin 431 of electric connector 11, as shown in figure 13; The relevant components and parts 41 contacts welding with LED of flexible built-up circuit 44.Described circular slab place diameter of a circle d
G
Be 18mm or 25mm; As circular slab place diameter of a circle d
G
During for 18mm, two cut arc chord lengths are 8.2mm, and the distance between two strings is 16mm; As circular slab place diameter of a circle d
G
During for 25mm, two cut arc chord lengths are 9.8mm,, the distance between two strings is 23mm; The Circularhole diameter of described band alignment pin is 8mm, 2mm place, the circular slab center of circle is being departed from its center of circle, and the circular hole center equates with the distance of two breach, is the center of circle at the positive 2mm of the X-axis of ray machine template 43 place namely, leave the 8mm diameter circle, circle is provided with the alignment pin 431 of electric connector 11.The relevant components and parts 41 of described LED are arranged at place, circular hole place by flexible built-up circuit 44 with pad, weld mutually with pad after described electric connector 11 inserts circular hole, as shown in figure 12.
The application of the LED bulb ray machine module of extension chip of the present utility model: electric connector 11 is fixed on the heat conduction support 3 by stiff end 15, electric connector 11 inserts circular hole and the welding of the pad on the flexible built-up circuit 44 of the band alignment pin of ray machine template 43, the LED bulb ray machine module of extension chip is provided with spill inner cover 61 outward, the LED bulb ray machine module of final extension chip is suspended between heat conduction support 3 and the spill inner cover 61 in the confined space, and ray machine template 43 external diameters of the LED bulb ray machine module of extension chip and the internal diameter of spill inner cover 61 fit tightly.So just constitute the core texture of a LED bulb, in spill inner cover 61, injected transparent insulation conductive fluid (spill inner cover 61 is provided with the pressure release film 61.2 of relief hole 61.1 and sealing usefulness) at last, as Figure 14 and shown in Figure 20.Figure 12 and structure shown in Figure 14 all are directly to do the scheme of transition epitaxial loayer in the ray machine template.
Embodiment 3: a kind of LED bulb ray machine module of extension chip, be included in and do the slim epitaxial wafer 46 that the transition epitaxial loayer forms on the existing LED substrate, epitaxial wafer 46 enters reacting furnace and divides layer growth to form LED wafer and interlock circuit, and the upward relevant components and parts of welding, beat gold thread again and connect LED wafer and relevant components and parts.LED wafer, interlock circuit and relevant components and parts have formed the relevant components and parts 41 of LED, and epitaxial wafer 46 is bonding with ray machine template 43, and described ray machine template 43 is identical with the profile of epitaxial wafer 46, and the both sides of ray machine template 43 and epitaxial wafer 46 are equipped with breach; Perhaps directly do the transition epitaxial loayer in ray machine template 43, enter reacting furnace and divide layer growth to form LED wafer and interlock circuit thereon, and the relevant components and parts of welding, beat gold thread again and connect LED wafer and relevant components and parts.LED wafer, interlock circuit and relevant components and parts have formed the relevant components and parts 41 of LED; Use transparent sealing 45 and/or transparent cover plate 42 to cover on the relevant components and parts 41 of described LED, only expose the pass connected bonding pads on the relevant components and parts 41 of LED.Described transparent sealing 45 and/or transparent cover plate 42 transparent cover plates to the method that the relevant components and parts 41 of LED cover are: the interelement at the relevant components and parts 41 of LED is filled a little transparent adhesive tape levelling, make between LED wafer surface and the transparent cover plate 42 and form transparent adhesive tape as few as possible, adopt profile and ray machine template 43 identical transparent cover plates 42 to add a cover on it again, transparent cover plate 42 is provided with the open area, be used for exposed pad, as shown in figure 16; Perhaps, interelement at the relevant components and parts 41 of LED is filled a little transparent adhesive tape levelling, make between LED wafer surface and the transparent cover plate 42 and form transparent adhesive tape as few as possible, adopt profile to add a cover on it less than the transparent cover plate 42 of ray machine template 43 again, coat transparent sealing 45 then around transparent cover plate 42, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent cover plate 42 is provided with the open area, be used for exposed pad, as shown in figure 17; Perhaps, directly coat transparent sealing 45 on the relevant components and parts 41 of LED, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent adhesive tape 45 is provided with the open area, is used for exposed pad and fixing hole, as Figure 15.
Described ray machine template 43 as shown in figure 18, be circular slab, the both sides of circular slab are provided with two symmetric windows, and each breach cuts along a flat-cut of circular slab place circle and forms, and it is outward-dipping 120 degree in described string two ends, and round to the circular slab place by arc transition.Its shape is, with d
G
Diameter, symmetrical X-axis is with l
G
Be length, w
G
Be chord length, at chord length w
G
Hold outward-dipping 120 the degree, with the R=1.0mm circular arc to diameter d
G
Excessively, downcut the both sides formation breach of circle.The purposes of breach is for when the ray machine module is used for liquid heat sink conception, and heated transparent insulation conductive fluid can be carried out thermal cycle from indentation, there.Circular slab place diameter of a circle d as described in Figure 18
G
Be 20mm, 38mm or 50mm, the chord length in the described breach deducts that length is 10mm after the outward-dipping part in two ends, and the radius of the circular arc that transition is used is 1mm; Two corresponding two strings of breach are parallel to each other; As circular slab place diameter of a circle d
G
During for 20mm, the distance between two strings is 15mm; As circular slab place diameter of a circle d
G
During for 38mm, the distance between two strings is 33mm; As circular slab place diameter of a circle d
G
During for 50mm, the distance between two strings is 45mm.Described pad is positioned at the breach inboard of circular slab, and each pad is located at inboard or concentrated one of them the breach inboard that is located at of two breach respectively, and connector 11 links to each other with pad by flexible built-up circuit 44.
Also be coated with fluorescent material on described transparent cover plate 42 and/or the ray machine template 43, fluorescent material is coated with protective layer outward; Perhaps described transparent cover plate 42 and/or ray machine template 43 are formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are that 5 ~ 30:100 makes by weight; Also be provided with on the described ray machine template 43 for fixing fixing hole.The quantity of described fixing hole is two, and two fixing holes are about the circular central symmetry of circular slab, and the distance between two fixing holes is d
G
-6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers, as Figure 18; Work as d
G
During=20mm, monolaterally open a fixing hole.
The application of the LED bulb ray machine module of extension chip of the present utility model: heat conduction support 3 be provided with perforate, connector 11 inserts perforate and is fixed on the heat conduction support 3 by stiff end 15, electric connector 11 is by the welding of the pad on the relevant components and parts 41 with LED of flexible built-up circuit 44, the LED bulb ray machine module of extension chip is located between heat conduction support 3 and the spill inner cover 61 in the confined space, spill inner cover 61 is provided with step, the LED bulb ray machine module of extension chip is shelved on the step, and use by ray machine template outer and step and fix, and the ray machine template external diameter of the LED bulb ray machine module of extension chip and the internal diameter of spill inner cover 61 fit tightly.The place that is different from embodiment 1 and 2 is, connector is positioned at outside the spill inner cover 61, it is continuous by the pad of the relevant components and parts 41 of LED in flexible built-up circuit 44 and the spill inner cover 61, in spill inner cover 61, inject transparent insulation conductive fluid (spill inner cover 61 is provided with the pressure release film 61.2 of relief hole 61.1 and sealing usefulness) at last, so just constituted the core texture of a LED bulb, as shown in figure 19, its structure is directly to do the scheme of transition epitaxial loayer in the ray machine template.
Figure 20 is the application legend of the utility model in a kind of bulb, also luminous intensity distribution optical lens 7 can be set outside spill inner cover 61, and luminous intensity distribution optical lens 7 is fixed on the heat conduction support 3 by interior snap ring 81 and lens snap ring 8; Bulb hold-down screw 105 is done to fix when bulb is installed.
More than three embodiment, realized the LED ray machine module of following 7 kinds of specifications, the ray machine module of these 7 kinds of specifications can satisfy most lighting requirement:
Principle of luminosity of the present utility model as shown in figure 21.
Claims (9)
1. the LED bulb ray machine module of an extension chip, it is characterized in that: comprise slim epitaxial wafer (46), described epitaxial wafer (46) comprises the transition epitaxial loayer on LED substrate and the LED substrate, described epitaxial wafer (46) is provided with the relevant components and parts (41) of LED, the LED components and parts (41) of being correlated with comprise LED wafer and interlock circuit and relevant components and parts, described epitaxial wafer (46) is bonding with ray machine template (43), described epitaxial wafer (46) is identical with the profile of ray machine template (43), and the both sides of ray machine template (43) and epitaxial wafer (46) are equipped with breach; Perhaps the LED bulb ray machine module of described extension chip comprises ray machine template (43), ray machine template (43) is provided with the transition epitaxial loayer, described transition epitaxial loayer is provided with the relevant components and parts (41) of LED, and the LED components and parts (41) of being correlated with comprise LED wafer and interlock circuit and relevant components and parts; Described LED is correlated with and is coated with transparent sealing (45) and/or transparent cover plate (42) on the components and parts (41), only exposes the pass connected bonding pads on the relevant components and parts (41) of LED.
2. the LED bulb ray machine module of extension chip according to claim 1, it is characterized in that: described ray machine template (43) is circular slab, the bilateral symmetry of circular slab is provided with two interior arc gaps, and the center of circle of arc gap is on the concentric circles of circular slab outside; Also be provided with the circular hole that links to each other for the contact pin with electric connector (11) on the described ray machine template (43), described pad is gone up and is positioned at the circular hole place at the relevant components and parts (41) of LED and locates, and the contact pin of electric connector (11) welds mutually with pad after inserting circular hole.
3. the LED bulb ray machine module of extension chip according to claim 1 is characterized in that: described ray machine template (43) is circular slab, is provided with to the circular slab bilateral symmetry two arc breach; Also be provided with the circular hole of band alignment pin on the described ray machine template (43), circular hole is used for being connected with electric connector (11) contraposition; The described LED components and parts (41) of being correlated with are arranged at circular hole place place by flexible built-up circuit (44) with pad, described electric connector (11) insert behind the circular hole with flexible built-up circuit (44) on pad weld mutually.
4. the LED bulb ray machine module of extension chip according to claim 1, it is characterized in that: described ray machine template (43) is circular slab, the both sides of circular slab are provided with two symmetric windows, the shape of each breach includes a string of circular substrate place circle, and it is outward-dipping 120 degree in described string two ends, and round to the circular slab place by arc transition; Described pad is positioned at the breach inboard of circular slab, and pad is located at inboard or concentrated one of them the breach inboard that is located at of two breach respectively.
5. the LED bulb ray machine module of extension chip according to claim 2 is characterized in that: described circular slab place diameter of a circle d
GBe 11mm or 16mm; As circular slab place diameter of a circle d
GDuring for 11mm, the center of circle of two arc gaps is on the circle of 13mm at diameter, and the radius of two arc gaps is 3.2mm; As circular slab place diameter of a circle d
GDuring for 16mm, the center of circle of two arc gaps is on the circle of 19mm at diameter, and the radius of two arc gaps is 3.6mm; The circular hole that contact pin described and electric connector (11) links to each other is 4, equidistantly is symmetrically distributed, and spacing 3.5mm, 2mm place, the circular slab center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes equates with the distance of two breach.
6. the LED bulb ray machine module of extension chip according to claim 3 is characterized in that: described circular slab place diameter of a circle d
GBe 18mm or 25mm; As circular slab place diameter of a circle d
GDuring for 18mm, described two arc chord lengths are 8.2mm, and the distance between two strings is 16mm; As circular slab place diameter of a circle d
GDuring for 25mm, described two arc chord lengths are 9.8mm, and the distance between two strings is 23mm; The Circularhole diameter of described band alignment pin is 8mm, and 2mm place, the circular slab center of circle is being departed from its center of circle, and the circular hole center equates with the distance of two breach.
7. the LED bulb ray machine module of extension chip according to claim 4 is characterized in that: described circular slab place diameter of a circle d
GBe 20mm, 38mm or 50mm, the chord length in the described breach deducts that length is 10mm after the outward-dipping part in two ends, and the radius of the circular arc that transition is used is 1mm; Two corresponding two strings of breach are parallel to each other; As circular slab place diameter of a circle d
GDuring for 20mm, the distance between two strings is 15mm; As circular slab place diameter of a circle d
GDuring for 38mm, the distance between two strings is 33mm; As circular slab place diameter of a circle d
GDuring for 50mm, the distance between two strings is 45mm.
8. the LED bulb ray machine module of extension chip according to claim 1, it is characterized in that: also be coated with fluorescent material on described transparent cover plate (42) and/or the ray machine template (43), fluorescent material is coated with protective layer outward; Perhaps described transparent cover plate (42) and/or ray machine template (43) are formed in mould transparent phosphor.
9. the LED bulb ray machine module of extension chip according to claim 7, it is characterized in that: also be provided with on the described ray machine template (43) for fixing fixing hole, the quantity of described fixing hole is two, two fixing holes are based on the circular central symmetry of circular slab, and the distance between two fixing holes is d
G-6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers; Work as d
GDuring=20mm, monolaterally open a fixing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202048932U CN203147431U (en) | 2013-04-22 | 2013-04-22 | Epitaxial wafer-type optical-mechanical module of light-emitting diode (LED) bulb |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202048932U CN203147431U (en) | 2013-04-22 | 2013-04-22 | Epitaxial wafer-type optical-mechanical module of light-emitting diode (LED) bulb |
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| Publication Number | Publication Date |
|---|---|
| CN203147431U true CN203147431U (en) | 2013-08-21 |
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ID=48974951
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| CN (1) | CN203147431U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206637A (en) * | 2013-04-22 | 2013-07-17 | 贵州光浦森光电有限公司 | Epitaxial wafer type LED (Light Emitting Diode) bulb light machine module |
| CN104776402A (en) * | 2015-05-04 | 2015-07-15 | 周玉红 | Aluminum substrate installation frame |
-
2013
- 2013-04-22 CN CN2013202048932U patent/CN203147431U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206637A (en) * | 2013-04-22 | 2013-07-17 | 贵州光浦森光电有限公司 | Epitaxial wafer type LED (Light Emitting Diode) bulb light machine module |
| CN103206637B (en) * | 2013-04-22 | 2015-04-22 | 贵州光浦森光电有限公司 | Epitaxial wafer type LED (Light Emitting Diode) bulb light machine module |
| CN104776402A (en) * | 2015-05-04 | 2015-07-15 | 周玉红 | Aluminum substrate installation frame |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130821 Effective date of abandoning: 20150422 |