CN103236434B - A kind of LED bulb light machine module of transparency carrier - Google Patents

A kind of LED bulb light machine module of transparency carrier Download PDF

Info

Publication number
CN103236434B
CN103236434B CN201310140136.8A CN201310140136A CN103236434B CN 103236434 B CN103236434 B CN 103236434B CN 201310140136 A CN201310140136 A CN 201310140136A CN 103236434 B CN103236434 B CN 103236434B
Authority
CN
China
Prior art keywords
light machine
led
circle
circular substrate
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310140136.8A
Other languages
Chinese (zh)
Other versions
CN103236434A (en
Inventor
张继强
张哲源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guizhou Guangpusen Photoelectric Co Ltd
Original Assignee
Guizhou Guangpusen Photoelectric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guizhou Guangpusen Photoelectric Co Ltd filed Critical Guizhou Guangpusen Photoelectric Co Ltd
Priority to CN201310140136.8A priority Critical patent/CN103236434B/en
Publication of CN103236434A publication Critical patent/CN103236434A/en
Priority to PCT/CN2014/075242 priority patent/WO2014173238A1/en
Application granted granted Critical
Publication of CN103236434B publication Critical patent/CN103236434B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

<b> the invention discloses a kind of LED bulb light machine module of transparency carrier, comprise both sides and establish light machine template jaggy (43), light machine template (43) is arranged LED to be correlated with components and parts (41), then use transparent sealing (45) and/or transparent cover plate (42) to cover LED components and parts (41) of being correlated with, only expose the pass connected bonding pads that LED is correlated with on components and parts (41).The present invention can be LED bulb and provides the ray machine module that universal strong, specification are few, be convenient to standardization and scale making, and the easier large-scale of LED bulb and standardization are made.</b>

Description

A kind of LED bulb light machine module of transparency carrier
Technical field
the present invention relates to a kind of LED bulb light machine module of transparency carrier, particularly a kind of LED bulb light machine module of the transparency carrier for building LED bulb.
Background technology
application number be 201210253590.X, 201210253702.1,201210253639.1,201210253844.8, the Chinese patent application such as 201210255564 disclose multiple organization plan, can the general and LED bulb of exchanging, on address Patents describe LED bulb, adopt LED as luminous element, can independently use, interchangeable and change, the light-source structure that can not be split by non-destructive means.These technology are set up Lighting Industry framework centered by LED bulb, make LED bulb (lighting source), light fixture, Lighting control become independent production, the basic concept of end product of application lays a good foundation.Further creation idea is advanced, easier standardized LED bulb structure member is of far-reaching significance for large-scale promotion LED illumination, especially as the ray machine module of LED bulb core component.
and traditional LED illumination technology is mounted in aluminum base PCB substrate or ceramic base PCB substrate with LED chip, substrate back connects radiator.Because substrate is non-transparent material, current LED illumination is that one side is unidirection luminous.For the LED structure of GaN base, luminous efficiency depends on internal quantum efficiency and the external quantum efficiency of LED, and current internal quantum efficiency is more than 90%, and room for promotion is less, but external quantum efficiency, namely light extraction efficiency is but extremely low.The LED chip although the upper emergent light of LED chip and lower outgoing luminous energy are escaped out, most light is propagated in chip internal refraction, is finally converted in the chip of heat retention.Because current programme chip is arranged in nontransparent substrate attachment, lower emergent light also will disappear in mounting structure.Improve LED luminous efficiency, will increase chip front side emergent light on the one hand, the reflection of the light of directive substrate will be allowed on the other hand to pass through chip again and penetrate from front, difficulty is very big, and effect is also poor.Effective mode how is taked to make this part light chip of escaping out be the emphasis of the research of current LED chip.The scheme such as roughening, substrate pattern, optical grating diffraction, filling photon crystal material, flip-chip is on a sapphire substrate adopted to be the major measure of current raising chip light-emitting efficiency, the utilization of these aggregate measures is at the current light emission rate that chip can be made to reach about 30%, and the energy of 70% finally becomes heat and jeopardizes the safety of chip conversely in the internal refraction of light is propagated.Under the LED illumination structure of the unidirectional attachment of one side, increase substantially chip light emitting efficiency difficulty comparatively large, the efficiency of giving out light improving LED illumination needs to be adjusted from the arrangement of chip.
Summary of the invention
the object of the invention is to, a kind of LED bulb light machine module of transparency carrier is provided.It significantly can improve LED chip and to give out light efficiency, and it also for LED bulb provide universal strong, specification few, be convenient to the ray machine module that standardization and scale make, the easier large-scale of LED bulb and standardization are made.
technical scheme of the present invention: a kind of LED bulb light machine module of transparency carrier, be characterized in: comprise both sides and establish light machine template jaggy, described light machine template is transparency carrier, light machine template is arranged LED to be correlated with components and parts, described LED components and parts of being correlated with comprise LED chip group and relevant components and parts and circuit, then use transparent sealing and/or transparent cover plate to cover LED components and parts of being correlated with, only expose the pass connected bonding pads that LED is correlated with on components and parts.Because ray machine module of the present invention is that leaching is placed in transparent insulation conductive fluid when deployed, require to reduce to the material heat conductivility of light machine template and transparent cover plate.Therefore the present invention can select transparency better, and the silica type material that price is lower carrys out the materials such as the higher transparent alumina of alternative traditional thermal conductivity and comes production light machine template and transparent cover plate.
in the LED bulb light machine module of above-mentioned transparency carrier, the transparent sealing of described use and/or transparent cover plate are correlated with method that components and parts cover respectively to LED: on LED is correlated with components and parts, to fill a little transparent adhesive tape levelling for interelement, make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate, the profile transparent cover plate identical with light machine template is adopted to add a cover on it again, transparent cover plate is provided with open area, for exposed pad; Or, on LED is correlated with components and parts, to fill a little transparent adhesive tape levelling for interelement, the transparent cover plate adopting profile to be less than light machine template is again added a cover on it, then coated transparent sealing around transparent cover plate, the profile of transparent sealing is flushed with light machine template, transparent cover plate is provided with open area, for exposed pad; Or direct coated transparent sealing on LED is correlated with components and parts, make the profile of transparent sealing flush with light machine template, transparent adhesive tape is provided with open area, for exposed pad.
in the LED bulb light machine module of aforesaid transparency carrier, for undersized light machine template, described light machine template is circular substrate, and the bilateral symmetry of circular substrate is provided with two Inner arc breach, and the center of circle of arc gap is on the concentric circles of circular substrate outside; Described light machine template is also provided with the circular hole for being connected with the contact pin of electric connector, described pad is on LED is correlated with components and parts and be positioned at circular hole place place, welds mutually after the contact pin of electric connector inserts circular hole with pad.
in the LED bulb light machine module of aforesaid transparency carrier, for the light machine template of medium size, described light machine template is circular substrate, and two of excision circular substrate place, circular substrate bilateral symmetry ground circle arc, forms two symmetric windows; Described light machine template is also provided with the circular hole of band alignment pin, circular hole is used for being connected with electric connector contraposition; Pad is arranged at circular hole place place by flexible built-up circuit by described LED components and parts of being correlated with, and described electric connector welds mutually with the pad on flexible built-up circuit 44 after inserting circular hole.
in the LED bulb light machine module of aforesaid transparency carrier, for the light machine template of relatively large size, described light machine template is circular substrate, the both sides of circular substrate are provided with two symmetric windows, the flat-cut that each breach is justified along circular substrate place cuts, and outward-dipping 120 degree of described string two ends, and by arc transition to circular substrate place circle; Described pad is positioned at the inner side of circular substrate, and pad is located at two inner side respectively or concentrates and is located at one of them inner side.
in the LED bulb light machine module of aforesaid transparency carrier, for undersized light machine template, described circular substrate place diameter of a circled g for 11mm or 16mm; When circular substrate place diameter of a circled g during for 11mm, the center of circle of two arc gaps at diameter be 13mm circle on (i.e. the spacing in two centers of circle), the radius of two arc gaps is 3.2mm; When circular substrate place diameter of a circled g during for 16mm, the center of circle of two arc gaps at diameter be 19mm circle on (i.e. the spacing in two centers of circle), the radius of two arc gaps is 3.6mm.The described circular hole be connected with the contact pin of electric connector is 4, equidistantly symmetrical, spacing 3.5mm, and 2mm place, the circular substrate center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes is equal with the distance of two breach.
in the LED bulb light machine module of aforesaid transparency carrier, for the light machine template of medium size, described circular substrate place diameter of a circled g for 18mm or 25mm; When circular substrate place diameter of a circled g during for 18mm, cut two arc chord lengths are 8.2mm, and the distance between two strings is 16mm; When circular substrate place diameter of a circled g during for 25mm, cut two arc chord lengths are 9.8mm, and the distance between two strings is 23mm, and 2mm place, the circular substrate center of circle is being departed from its center of circle, and center of circular hole is equal with the distance of two breach.
in the LED bulb light machine module of aforesaid transparency carrier, for the light machine template of large-size, described circular substrate place diameter of a circled g for 20mm, 38mm or 50mm, after the chord length in described breach deducts the outward-dipping part in two ends, length is 10mm, and the radius of the circular arc of transition is 1mm; Two strings corresponding to two breach are parallel to each other; When circular substrate place diameter of a circled g during for 20mm, the distance between two strings is 15mm; When circular substrate place diameter of a circled g during for 38mm, the distance between two strings is 33mm; When circular substrate place diameter of a circled g during for 50mm, the distance between two strings is 45mm.
in the LED bulb light machine module of aforesaid transparency carrier, described transparent cover plate is also coated with fluorescent material and adds stopping off; Or described transparent cover plate is outward formed in mould transparent phosphor.Transparent phosphor is fluorescent material and transparent material is that 5 ~ 30:100 makes by weight.
in the LED bulb light machine module of aforesaid transparency carrier, described light machine template is also provided with for fixing fixing hole, the quantity of described fixing hole is two, and two fixing holes are symmetrical about the circular central of circular substrate, and the distance between two fixing holes is d g -6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers; Work as d g during=20mm, monolaterally open a fixing hole.
compared with prior art, the present invention is sealed between transparent light machine template and transparent sealing or transparent cover plate by components and parts of being correlated with by LED, the adjacent transparent cover plate of LED chip, transparent sealing is less and be located at by fluorescent material can away from LED chip outside transparent cover plate, such fluorescent material and transparent adhesive tape are not easily aging, to ensureing that LED bulb is stable, Effec-tive Function is significant; The lower emergent light of chip can pass through transparent light machine template in addition, then appears bulb inner cover by the reflective surface of LED bulb, see Figure 21, obtains the larger lifting of chip light emitting efficiency and reduces junction temperature of chip good result.And the breach of both sides designs in light machine template, be convenient to connect outer lead, can well work in liquid atmosphere simultaneously, ray machine module is arranged on after in the inner cover of LED bulb band transparent insulation conductive fluid, the transparent insulation conductive fluid of being heated can complete unimpeded flowing to carry out thermal cycle through breach, so just make ray machine module of the present invention operationally can have extremely excellent radiating effect, ensure that the high-luminous-efficiency of LED.And applicant of the present invention is through repeatedly studying, test and summing up, light machine template for different size offers all different breach of shape size, make its when do not affect LED be correlated with the arrangement space of components and parts, best liquid flow effect can be reached, and then realize best radiating effect.After what is more important LED illumination adopts aforementioned bulb scheme, LED illumination achieves general and exchanges, and ray machine module wherein falls sharply and focuses on 3 types, amount on 7 specific products, because the specification total amount of ray machine module is few, and cover majority of illumination environment use lamp requirement, so just possessed allow LED middle and upper reaches enterprise and encapsulation enterprise that limited specification kind is adjusted in research and development and center of production ray machine module on carry out the condition of scale and intensive manufacture, this structure of the present invention, LED chip is encapsulated between transparent light machine template and transparent cover plate, the ray machine module light transmittance of composition is high, cheap, production procedure is short, finished product standard degree is high, LED illumination device manufacturing cost can be reduced on a large scale.
Accompanying drawing explanation
fig. 1 is the appearance schematic diagram of the ray machine module of the transparent cover plate using profile identical with light machine template in embodiment 1;
fig. 2 is the broken away view of the ray machine module shown in Fig. 1;
fig. 3 is the ray machine module outline drawing that embodiment 1 uses transparent sealing;
fig. 4 is the ray machine modular structure schematic diagram using profile to be less than the transparent cover plate of light machine template in embodiment 1;
fig. 5 is the broken away view of the ray machine module shown in Fig. 4;
fig. 6 is the light machine template perforate schematic diagram of embodiment 1;
fig. 7 is the light machine template of embodiment 1 and the scheme of installation of connector;
fig. 8 is the application structure schematic diagram of embodiment 1;
fig. 9 is the ray machine module outline drawing that embodiment 2 uses transparent sealing;
figure 10 is the broken away view of the ray machine module of the transparent cover plate using profile identical with light machine template in embodiment 2;
figure 11 is the ray machine modular structure schematic diagram using profile to be less than the transparent cover plate of light machine template in embodiment 2;
figure 12 is the light machine template of embodiment 2 and the scheme of installation of connector;
figure 13 is the perforate schematic diagram of the light machine template of embodiment 2;
figure 14 is the application structure schematic diagram of embodiment 2;
figure 15 is the ray machine module outline drawing that embodiment 3 uses transparent sealing;
figure 16 is the broken away view of the ray machine module of the transparent cover plate using profile identical with light machine template in embodiment 3;
figure 17 is the ray machine modular structure schematic diagram using profile to be less than the transparent cover plate of light machine template in embodiment 3;
figure 18 is the light machine template perforate schematic diagram of embodiment 3;
figure 19 is the application structure schematic diagram of embodiment 3;
figure 20 is the LED bulb structural representation using ray machine module of the present invention to set up;
figure 21 is the principle of luminosity schematic diagram of GaN base LED of the present invention.
being labeled as in accompanying drawing: 3-heat conduction support, 4-ray machine module, 8-lens snap ring, 7-luminous intensity distribution optical lens, 11-electric connector male, 15-stiff end, 16-waterproof apron, 31-reflector layer, 41-LED is correlated with components and parts, 42-transparent cover plate, 43-light machine template, the flexible built-up circuit of 44-, the transparent sealing of 45-, 61-bulb spill inner cover, 61.1-pressure relief vent, 61.2 – unload press mold, snap ring in 81-, 105-bulb hold-down screw, 431-alignment pin.
Embodiment
below in conjunction with drawings and Examples, the present invention is further illustrated, but not as the foundation limited the present invention.
embodiment 1: a kind of LED bulb light machine module of the transparency carrier for small size LED bulb, comprise both sides and establish light machine template 43 jaggy, described light machine template 43 is transparency carrier, light machine template 43 is arranged LED to be correlated with components and parts 41, described LED components and parts 41 of being correlated with comprise LED chip group and relevant components and parts and circuit, then use transparent sealing 45 and/or transparent cover plate 42, LED components and parts 41 of being correlated with are covered, only expose LED and to be correlated with the pad of components and parts 41.Described transparent sealing 45 and/or transparent cover plate 42 transparent cover plate have the LED method that components and parts 41 cover of being correlated with: as depicted in figs. 1 and 2, on LED is correlated with components and parts 41, to fill a little transparent adhesive tape levelling for interelement, make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate, the transparent cover plate 42 that profile is identical with light machine template 43 is adopted to add a cover on it again, transparent cover plate 42 is provided with open area, for exposed pad; Or, as shown in Figures 4 and 5, on LED is correlated with components and parts 41, to fill a little transparent adhesive tape levelling for interelement, make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate, the transparent cover plate 42 adopting profile to be less than light machine template 43 is again added a cover on it, and then coated transparent sealing 45 around transparent cover plate 42, makes the profile of transparent sealing 45 flush with light machine template 43, transparent cover plate 42 is provided with open area, for exposed pad; Or as shown in Figure 3, direct coated transparent sealing 45 on LED is correlated with components and parts 41, make the profile of transparent sealing 45 flush with light machine template 43, transparent adhesive tape 45 is provided with open area, for exposed pad.
described transparent cover plate 42 is also coated with fluorescent material and adds stopping off; Or described transparent cover plate 42 is formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are made by weight for 1:10.
the shape of described light machine template 43 as shown in Figure 6, is circular substrate, and the bilateral symmetry of circular substrate is provided with two Inner arc breach, the center of circle of arc gap on the concentric circles of circular substrate outside, with d during its cutting mode g diameter, symmetrical X-axis is with l g for length, R is radius, w g for chord length, cut round both sides and form the round breach that two radiuses are R.The purposes of breach, for when ray machine module is used for liquid heat sink conception, can be carried out thermal cycle from indentation, there by the transparent insulation conductive fluid heated; Described light machine template 43 is also provided with the circular hole for being connected with the contact pin of electric connector 11, centered by the positive 2mm place of the X-axis of light machine template 43, with 3.5 for spacing, the circular hole of symmetrical 4 diameter 1.4mm; Described pad is on LED is correlated with components and parts 41 and be positioned at circular hole place place, welds mutually, as shown in Figure 7 after the contact pin of electric connector 11 inserts circular hole with pad.The described circular hole be connected with the contact pin of electric connector 11 is 4, equidistantly symmetrical, spacing 3.5mm, and 2mm place, the circular substrate center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes is equal with the distance of two breach.Namely centered by the positive 2mm place of the X-axis of light machine template 43, with 3.5 for spacing, the circular hole of symmetrical 4 diameter 1.4mm.Described circular substrate place diameter of a circled g for 11mm or 16mm; When circular substrate place diameter of a circled g during for 11mm, the center of circle of two arc gaps is on the circle of 13mm at diameter, and the radius of two arc gaps is 3.2mm; When circular substrate place diameter of a circled g during for 16mm, the center of circle of two arc gaps is on the circle of 19mm at diameter, and the radius of two arc gaps is 3.6mm.
the application of the LED bulb light machine module of transparency carrier of the present invention: electric connector 11 is bonding through heat conduction support 3, the contact pin of electric connector 11 inserts the pad solder on the circular hole components and parts 41 relevant to LED of light machine template 43, spill inner cover 61 is provided with outside the LED bulb light machine module of transparency carrier, the LED bulb light machine module of final transparency carrier is suspended between heat conduction support 3 and spill inner cover 61 in confined space, and the light machine template external diameter of the LED bulb light machine module of transparency carrier and the internal diameter of spill inner cover 61 fit tightly.Constitute the core texture of a LED bulb, in spill inner cover 61, finally inject transparent insulation conductive fluid (spill inner cover 61 being provided with the pressure release film 61.2 of relief hole 61.1 and sealing), as shown in Figure 8.
embodiment 2: a kind of LED bulb light machine module of the transparency carrier for medium size LED bulb, comprise both sides and establish light machine template 43 jaggy, described light machine template 43 is transparency carrier, light machine template 43 is arranged LED to be correlated with components and parts 41, then transparent sealing 45 and/or transparent cover plate 42 is used, LED components and parts 41 of being correlated with are covered, only exposes the pass connected bonding pads that LED is correlated with on components and parts 41.Described transparent sealing 45 and/or transparent cover plate 42 transparent cover plate to the LED method that components and parts 41 cover of being correlated with are: on LED is correlated with components and parts 41, to fill a little transparent adhesive tape levelling for interelement, make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate, the transparent cover plate 42 that profile is identical with light machine template 43 is adopted to add a cover on it again, transparent cover plate 42 is provided with open area, for exposed pad, as shown in Figure 10; Or, on LED is correlated with components and parts 41, to fill a little transparent adhesive tape levelling for interelement, make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate, the transparent cover plate 42 adopting profile to be less than light machine template 43 is again added a cover on it, then coated transparent sealing 45 around transparent cover plate 42, the profile of transparent sealing 45 is flushed with light machine template 43, and transparent cover plate 42 is provided with open area, for exposed pad, as shown in figure 11; Or as shown in Figure 9, direct coated transparent sealing 45 on LED is correlated with components and parts 41, make the profile of transparent sealing 45 flush with light machine template 43, transparent adhesive tape 45 is provided with open area, for exposed pad.Described transparent cover plate 42 is also coated with fluorescent material and adds stopping off; Or described transparent cover plate 42 is formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are made by weight for 1:10.
described light machine template 43 is circular substrate, and as shown in figure 13, two of excision circular substrate place, circular substrate bilateral symmetry ground circle arc, forms two symmetric windows; Described light machine template 43 is also provided with the circular hole of band alignment pin, circular hole is used for being connected with electric connector 11 contraposition; With d g diameter, symmetrical X-axis is with l g for length, w g for chord length, cut round both sides and form breach.The purposes of breach, for when ray machine module is used for liquid heat sink conception, can be carried out thermal cycle from indentation, there by the transparent insulation conductive fluid heated, see Figure 14.In the X-axis of light machine template 43, positive 2mm place is the center of circle, outputs 8mm diameter circle, and circle is provided with the alignment pin 431 of electric connector 11, as shown in figure 13; Flexible built-up circuit 44 components and parts 41 relevant to LED contact welds.Described circular substrate place diameter of a circle d g for 18mm or 25mm; As circular substrate place diameter of a circle d g during for 18mm, cut two arc chord lengths are 8.2mm, and the distance between two strings is 16mm; As circular substrate place diameter of a circle d g during for 25mm, cut two arc chord lengths are 9.8mm, and the distance between two strings is 23mm; The Circularhole diameter of described band alignment pin is 8mm, 2mm place, the circular substrate center of circle is being departed from its center of circle, and center of circular hole is equal with the distance of two breach, is namely the center of circle at the positive 2mm place of the X-axis of light machine template 43, output 8mm diameter circle, circle is provided with the alignment pin 431 of electric connector 11.Pad is arranged at circular hole place place by flexible built-up circuit 44 by described LED components and parts 41 of being correlated with, and welds mutually, as shown in figure 12 after described electric connector 11 inserts circular hole with pad.
the application of the LED bulb light machine module of transparency carrier of the present invention: electric connector 11 is fixed on heat conduction support 3 by stiff end 15, electric connector 11 inserts the pad solder on the circular hole of the band alignment pin of light machine template 43 and flexible built-up circuit 44, spill inner cover 61 is provided with outside the LED bulb light machine module of transparency carrier, the LED bulb light machine module of final transparency carrier is suspended between heat conduction support 3 and spill inner cover 61 in confined space, and light machine template 43 external diameter of the LED bulb light machine module of transparency carrier and the internal diameter of spill inner cover 61 fit tightly.Constitute the core texture of a LED bulb, in spill inner cover 61, finally inject transparent insulation conductive fluid (spill inner cover 61 being provided with the pressure release film 61.2 of relief hole 61.1 and sealing), as shown in Figure 14 and Figure 20.
embodiment 3: a kind of LED bulb light machine module of transparency carrier, comprise both sides and establish light machine template 43 jaggy, described light machine template 43 is transparency carrier, light machine template 43 is arranged LED to be correlated with components and parts 41, then transparent sealing 45 and/or transparent cover plate 42 transparent cover plate is used, LED components and parts 41 of being correlated with are covered, only exposes LED and to be correlated with the pass connected bonding pads of components and parts 41.Described transparent sealing 45 and/or transparent cover plate 42 transparent cover plate to the LED method that components and parts 41 cover of being correlated with are: on LED is correlated with components and parts 41, to fill a little transparent adhesive tape levelling for interelement, make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate 42, the transparent cover plate 42 that profile is identical with light machine template 43 is adopted to add a cover on it again, transparent cover plate 42 is provided with open area, for exposed pad, as shown in figure 16; Or, on LED is correlated with components and parts 41, to fill a little transparent adhesive tape levelling for interelement, make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate 42, the transparent cover plate 42 adopting profile to be less than light machine template 43 is again added a cover on it, then coated transparent sealing 45 around transparent cover plate 42, the profile of transparent sealing 45 is flushed with light machine template 43, and transparent cover plate 42 is provided with open area, for exposed pad, as shown in figure 17; Or direct coated transparent sealing 45 on LED is correlated with components and parts 41, make the profile of transparent sealing 45 flush with light machine template 43, transparent adhesive tape 45 is provided with open area, for exposed pad and fixing hole, as Figure 15.
described light machine template 43 as shown in figure 18, for circular substrate, the both sides of circular substrate are provided with two symmetric windows, and the flat-cut that each breach is justified along circular substrate place cuts, and outward-dipping 120 degree of described string two ends, and by arc transition to circular substrate place circle.Its shape is, with d g diameter, symmetrical X-axis is with l g for length, w g for chord length, at chord length w g hold outward-dipping 120 degree, with R=1.0mm circular arc to diameter d g excessively, cut round both sides and form breach.The purposes of breach, for when ray machine module is used for liquid heat sink conception, can be carried out thermal cycle from indentation, there by the transparent insulation conductive fluid heated.Circular substrate place diameter of a circle d as described in Figure 18 g for 20mm, 38mm or 50mm, after the chord length in described breach deducts the outward-dipping part in two ends, length is 10mm, and the radius of the circular arc of transition is 1mm; Two strings corresponding to two breach are parallel to each other; As circular substrate place diameter of a circle d g during for 20mm, the distance between two strings is 15mm; As circular substrate place diameter of a circle d g during for 38mm, the distance between two strings is 33mm; As circular substrate place diameter of a circle d g during for 50mm, the distance between two strings is 45mm.Described pad is positioned at the inner side of circular substrate, and each pad is located at two inner side respectively or concentrates and is located at one of them inner side, and connector 11 is connected with pad by flexible built-up circuit 44.
described transparent cover plate 42 is also coated with fluorescent material and adds stopping off; Or described transparent cover plate 42 is formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are made by weight for 1:10; Described light machine template 43 is also provided with for fixing fixing hole.The quantity of described fixing hole is two, and two fixing holes are symmetrical about the circular central of circular substrate, and the distance between two fixing holes is d g -6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers; Work as d g during=20mm, monolaterally open a fixing hole, as Figure 18.
the application of the LED bulb light machine module of transparency carrier of the present invention: heat conduction support 3 be provided with perforate, electric connector 11 inserts perforate and is fixed on heat conduction support 3 by stiff end 15, electric connector 11 is by the pad solder on flexible built-up circuit 44 components and parts 41 relevant to LED, the LED bulb light machine module of transparency carrier to be located between heat conduction support 3 and spill inner cover 61 in confined space, spill inner cover 61 is provided with step, the LED bulb light machine module of transparency carrier is shelved on step, and fix with by light machine template outer and step, and the light machine template external diameter of the LED bulb light machine module of transparency carrier and the internal diameter of spill inner cover 61 fit tightly.The place being different from embodiment 1 and 2 is, connector is positioned at outside spill inner cover 61, it is connected by the pad of flexible built-up circuit 44 components and parts 41 relevant to the LED in spill inner cover 61, in spill inner cover 61, finally inject transparent insulation conductive fluid (spill inner cover 61 being provided with the pressure release film 61.2 of relief hole 61.1 and sealing), constitute the core texture of a LED bulb, as shown in figure 19.
figure 20 is the application legend of the present invention in a kind of bulb, and outside spill inner cover 61, also can arrange luminous intensity distribution optical lens 7, luminous intensity distribution optical lens 7 is fixed on heat conduction support 3 by interior snap ring 81 and lens snap ring 8.
above three embodiments, achieve the LED light machine module of following 7 kinds of specifications, the ray machine module of these 7 kinds of specifications can meet most lighting requirement:
principle of luminosity of the present invention as shown in figure 21.

Claims (9)

1. the LED bulb light machine module of a transparency carrier, it is characterized in that: comprise both sides and establish light machine template jaggy (43), described light machine template (43) is transparency carrier, and light machine template (43) is arranged LED and to be correlated with components and parts (41), described LED components and parts (41) of being correlated with comprise LED chip group and relevant components and parts and circuit, described LED upper transparent sealing (45) and/or the transparent cover plate (42) of using of components and parts (41) of being correlated with covers LED components and parts (41) of being correlated with, only expose the pass connected bonding pads that LED is correlated with on components and parts (41), the transparent sealing of described use (45) and/or transparent cover plate (42) to the LED method that components and parts (41) cover of being correlated with are: fill a little transparent adhesive tape at the LED interelement of being correlated with on components and parts (41) levelling, make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate (42), the transparent cover plate (42) adopting profile identical with light machine template (43) is again added a cover on it, transparent cover plate (42) is provided with open area, for exposed pad, or, a little transparent adhesive tape is filled levelling at the LED interelement of being correlated with on components and parts (41), make to form transparent adhesive tape as few as possible between LED chip surface and transparent cover plate (42), the transparent cover plate (42) adopting profile to be less than light machine template (43) is again added a cover on it, then coated transparent sealing (45) around transparent cover plate (42), the profile of transparent sealing (45) is flushed with light machine template (43), transparent cover plate (42) is provided with open area, for exposed pad, or, direct coated transparent sealing (45) on LED is correlated with components and parts (41), the profile of transparent sealing (45) is flushed with light machine template (43), and transparent adhesive tape (45) is provided with open area, for exposed pad.
2. the LED bulb light machine module of transparency carrier according to claim 1, it is characterized in that: described light machine template (43) is circular substrate, the bilateral symmetry of circular substrate is provided with two Inner arc breach, and the center of circle of arc gap is on the concentric circles of circular substrate outside; Described light machine template (43) is also provided with the circular hole for being connected with the contact pin of electric connector (11), described pad is gone up at LED components and parts (41) of being correlated with and is positioned at circular hole place place, welds mutually after the contact pin of electric connector (11) inserts circular hole with pad.
3. the LED bulb light machine module of transparency carrier according to claim 1, it is characterized in that: described light machine template (43) is circular substrate, two of excision circular substrate place, circular substrate bilateral symmetry ground circle arc, forms two symmetric windows; Described light machine template (43) is also provided with the circular hole of band alignment pin, circular hole is used for being connected with electric connector (11) contraposition; Pad is arranged at circular hole place place by flexible built-up circuit (44) by described LED components and parts (41) of being correlated with, and described electric connector (11) welds mutually with the pad on flexible built-up circuit (44) after inserting circular hole.
4. the LED bulb light machine module of transparency carrier according to claim 1, it is characterized in that: described light machine template (43) is circular substrate, the both sides of circular substrate are provided with two symmetric windows, the flat-cut that each breach is justified along circular substrate place cuts, and outward-dipping 120 degree of described string two ends, and by arc transition to circular substrate place circle; Described pad is positioned at the inner side of circular substrate, and pad is located at two inner side respectively or concentrates and is located at one of them inner side.
5. the LED bulb light machine module of transparency carrier according to claim 2, is characterized in that: described circular substrate place diameter of a circle d gfor 11mm or 16mm; As circular substrate place diameter of a circle d gduring for 11mm, the center of circle of two arc gaps is on the circle of 13mm at diameter, and the radius of two arc gaps is 3.2mm; As circular substrate place diameter of a circle d gduring for 16mm, the center of circle of two arc gaps is on the circle of 19mm at diameter, and the radius of two arc gaps is 3.6mm; The described circular hole be connected with the contact pin of electric connector (11) is 4, equidistantly symmetrical, spacing 3.5mm, and 2mm place, the circular substrate center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes is equal with the distance of two breach.
6. the LED bulb light machine module of transparency carrier according to claim 3, is characterized in that: described circular substrate place diameter of a circle d gfor 18mm or 25mm; As circular substrate place diameter of a circle d gduring for 18mm, cut two arc chord lengths are 8.2mm, and the distance between two strings is 16mm; As circular substrate place diameter of a circle d gduring for 25mm, cut two arc chord lengths are 9.8mm, and the distance between two strings is 23mm; The Circularhole diameter of described band alignment pin is 8mm, and 2mm place, the circular substrate center of circle is being departed from its center of circle, and center of circular hole is equal with the distance of two breach.
7. the LED bulb light machine module of transparency carrier according to claim 4, is characterized in that: described circular substrate place diameter of a circle d gfor 20mm, 38mm or 50mm, after the chord length in described breach deducts the outward-dipping part in two ends, length is 10mm, and the radius of the circular arc of transition is 1mm; Two strings corresponding to two breach are parallel to each other; As circular substrate place diameter of a circle d gduring for 20mm, the distance between two strings is 15mm; As circular substrate place diameter of a circle d gduring for 38mm, the distance between two strings is 33mm; As circular substrate place diameter of a circle d gduring for 50mm, the distance between two strings is 45mm.
8. the LED bulb light machine module of transparency carrier according to claim 1, is characterized in that: described transparent cover plate (42) is also coated with fluorescent material and adds stopping off; Or described transparent cover plate (42) is formed in mould transparent phosphor.
9. the LED bulb light machine module of transparency carrier according to claim 7, it is characterized in that: described light machine template (43) is also provided with for fixing fixing hole, the quantity of described fixing hole is two, two fixing holes are symmetrical based on the circular central of circular substrate, and the distance between two fixing holes is d g-6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers; Work as d gduring=20mm, monolaterally open a fixing hole.
CN201310140136.8A 2013-04-22 2013-04-22 A kind of LED bulb light machine module of transparency carrier Active CN103236434B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310140136.8A CN103236434B (en) 2013-04-22 2013-04-22 A kind of LED bulb light machine module of transparency carrier
PCT/CN2014/075242 WO2014173238A1 (en) 2013-04-22 2014-04-14 Light engine module for led light bulb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310140136.8A CN103236434B (en) 2013-04-22 2013-04-22 A kind of LED bulb light machine module of transparency carrier

Publications (2)

Publication Number Publication Date
CN103236434A CN103236434A (en) 2013-08-07
CN103236434B true CN103236434B (en) 2016-01-20

Family

ID=48884464

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310140136.8A Active CN103236434B (en) 2013-04-22 2013-04-22 A kind of LED bulb light machine module of transparency carrier

Country Status (1)

Country Link
CN (1) CN103236434B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014173238A1 (en) * 2013-04-22 2014-10-30 贵州光浦森光电有限公司 Light engine module for led light bulb
CN105627124B (en) * 2016-03-11 2019-07-30 贵州光浦森光电有限公司 A kind of LED filament component, the method and LED filament light bulb for setting up LED filament light bulb

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102777797A (en) * 2012-07-23 2012-11-14 贵州光浦森光电有限公司 Method for forming LED bulb with high interchangeability and universality and flanged support LED bulb
CN102798005A (en) * 2012-07-23 2012-11-28 贵州光浦森光电有限公司 Construction method for universal-type LED (light-emitting diode) bulb and LED bulb of clamping ring structure
CN203179891U (en) * 2013-04-22 2013-09-04 贵州光浦森光电有限公司 LED bulb optical module employing transparent substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101510462B1 (en) * 2010-09-08 2015-04-08 쩌지앙 레디슨 옵토일렉트로닉스 씨오., 엘티디. LED lamp bulb and LED lighting bar capable of emitting light over 4Π

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102777797A (en) * 2012-07-23 2012-11-14 贵州光浦森光电有限公司 Method for forming LED bulb with high interchangeability and universality and flanged support LED bulb
CN102798005A (en) * 2012-07-23 2012-11-28 贵州光浦森光电有限公司 Construction method for universal-type LED (light-emitting diode) bulb and LED bulb of clamping ring structure
CN203179891U (en) * 2013-04-22 2013-09-04 贵州光浦森光电有限公司 LED bulb optical module employing transparent substrate

Also Published As

Publication number Publication date
CN103236434A (en) 2013-08-07

Similar Documents

Publication Publication Date Title
CN108899409B (en) Light emitting device
TWI594458B (en) Light-emitting device
CN201732785U (en) LED module and LED lighting fixture
CN203179891U (en) LED bulb optical module employing transparent substrate
JP6343812B2 (en) COATING TYPE STRUCTURED CIRCUIT MANUFACTURING METHOD, LED BULB LAMP AND ELECTRONIC COMPONENT WITHOUT CIRCUIT PANEL
CN102130111A (en) Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device
CN103824926B (en) A kind of manufacture method of multi-chip LED package body
CN103236434B (en) A kind of LED bulb light machine module of transparency carrier
CN103206637B (en) Epitaxial wafer type LED (Light Emitting Diode) bulb light machine module
CN202013881U (en) Integrated packaging structure with vertically structured LED chips
CN102980077A (en) LED (Light Emitting Diode) integrated light source with tubular structure
CN103196064B (en) A kind of LED bulb light machine module
CN103216757B (en) Production method of light emitting diode (LED) head lamp
CN103206636B (en) LED bulb production method
CN203147431U (en) Epitaxial wafer-type optical-mechanical module of light-emitting diode (LED) bulb
CN103196065B (en) Small LED bulb implementing liquid heat-dissipating method
CN103225756B (en) Liquid-state heat-radiation type medium-sized LED bulb
CN201425272Y (en) LED packaging structure
CN201681927U (en) High-power LED chip integrated encapsulating structure
CN101847624A (en) COB modularized LED encapsulation technology
CN203147428U (en) Light engine module for LED (Light Emitting Diode) bulb
CN203787425U (en) LED filament and illuminator
CN201638845U (en) LED structure with film structure
CN103185249B (en) A kind of large LED bulb of liquid-state heat-radiation type
CN202120907U (en) Leadless LED (Light-emitting Diode) module

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: 562400 Xingyi Qingshui River Economic Development Zone, Guizhou, Guizhou, Qingshui River new building materials circular economy industrial park

Patentee after: Guizhou Guangpusen Photoelectric Co., Ltd.

Address before: 550002 Guizhou Province, Guiyang city Nanming District South City Hongtai family 28D

Patentee before: Guizhou Guangpusen Photoelectric Co., Ltd.