CN103236434A - LED (Light Emitting Diode) lamp bulb bare engine module of transparent substrate - Google Patents
LED (Light Emitting Diode) lamp bulb bare engine module of transparent substrate Download PDFInfo
- Publication number
- CN103236434A CN103236434A CN2013101401368A CN201310140136A CN103236434A CN 103236434 A CN103236434 A CN 103236434A CN 2013101401368 A CN2013101401368 A CN 2013101401368A CN 201310140136 A CN201310140136 A CN 201310140136A CN 103236434 A CN103236434 A CN 103236434A
- Authority
- CN
- China
- Prior art keywords
- ray machine
- led
- circle
- transparent
- circular substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses an LED (Light Emitting Diode) lamp bulb bare engine module of a transparent substrate. The LED lamp bulb bare engine module comprises a bare engine module (43) provided with notches at two sides, wherein the bare engine module (43) is provided with an LED related component (41); the LED related component (41) is covered through using transparent sealing glue (45) and/or a transparent cover plate (42); and only a related welding disc on the LED related component (41) is exposed. According to the LED lamp bulb bare engine module disclosed by the invention, the bare engine module which is strong in universal type and small in specification and can conveniently realize standardized and scaled manufacturing is provided for an LED lamp bulb, so that the LED lamp bulb can be more easily manufactured in a standardized and scaled manner.
Description
Technical field
The present invention relates to a kind of LED bulb ray machine module of transparency carrier, particularly a kind of LED bulb ray machine module for the transparency carrier that makes up the LED bulb.
Background technology
Application number be 201210253590.X, 201210253702.1,201210253639.1,201210253844.8, Chinese patent application such as 201210255564 disclose a plurality of organization plans, can be general and the LED bulb that exchanges, on address the LED bulb that relevant patent is described, be to adopt LED as luminous element, can independently use, interchangeable and change, the light-source structure that can not be split with the non-destructive means.These technology are for setting up the Lighting Industry framework centered by the LED bulb, and the basic concept that makes LED bulb (lighting source), light fixture, illumination control become the end product of independent production, application is laid a good foundation.Further creation idea advanced person, easier standardized LED bulb structure parts are of far-reaching significance for large-scale promotion LED illumination, especially as the ray machine module of LED bulb core component.
And traditional LED lighting technology is mounted on aluminum base PCB substrate or the ceramic base PCB substrate substrate back connection radiator with led chip.Because substrate is non-transparent material, LED illumination at present is unidirection luminous for single face.LED structure with the GaN base is example, and luminous efficiency depends on internal quantum efficiency and the external quantum efficiency of LED, and current internal quantum efficiency surpasses 90%, and room for promotion is less, but external quantum efficiency, just light extraction efficiency is but extremely low.The led chip though the last emergent light of led chip and following outgoing luminous energy are escaped out, most light are propagated in the chip internal refraction, are finally converted in the chip of heat retention.Because the current programme chip mounts layout at nontransparent substrate, following emergent light also will disappear in and mount in the structure.Improve the LED luminous efficiency, will increase the chip front side emergent light on the one hand, will allow the light reflection of directive substrate pass through chip more on the other hand and penetrate from the front, difficulty is very big, and effect is also poor.How taking effective and efficient manner to make this part light chip of escaping out is the emphasis of the research of current led chip.Employing schemes such as roughening, substrate micrographicsization, optical grating diffraction, filling photon crystal material, flip-chip on Sapphire Substrate are the major measure of current raising chip light-emitting efficiency, the utilization of these aggregate measures reaches about 30% light emission rate at the current chip that can make, and 70% energy has finally become heat and the safety that jeopardizes chip conversely in the internal refraction of light is propagated.Under the unidirectional LED light structures that mounts of single face, it is bigger to increase substantially chip light emitting efficient difficulty, improves the efficient of giving out light of LED illumination and need be adjusted from the arrangement of chip.
Summary of the invention
The objective of the invention is to, a kind of LED bulb ray machine module of transparency carrier is provided.It can significantly improve the led chip efficient of giving out light, and it also for the LED bulb provide universal strong, specification few, be convenient to the ray machine module that standardization and scale are made, easier extensiveization of LED bulb and standardization are made.
Technical scheme of the present invention: a kind of LED bulb ray machine module of transparency carrier, be characterized in: comprise that both sides are provided with the ray machine template of breach, described ray machine template is transparency carrier, the relevant components and parts of LED are set on the ray machine template, the relevant components and parts of described LED comprise led chip group and relevant components and parts and circuit, use transparent sealing and/or transparent cover plate that the relevant components and parts of LED are covered then, only expose the pass connected bonding pads on the relevant components and parts of LED.Because ray machine module of the present invention is to soak to place the transparent insulation conductive fluid when using, to the material heat conductivility requirement reduction of ray machine template and transparent cover plate.Therefore the present invention can select transparency better, and the silica type material that price is lower substitutes the higher materials such as transparent alumina of traditional thermal conductivity and produces ray machine template and transparent cover plate.
In the LED bulb ray machine module of above-mentioned transparency carrier, the transparent sealing of described use and/or transparent cover plate to the method that the relevant components and parts of LED cover are respectively: interelement is filled a little transparent adhesive tape levelling on the relevant components and parts of LED, make and form transparent adhesive tape between led chip surface and the transparent cover plate as few as possible, adopt the profile transparent cover plate identical with the ray machine template to add a cover on it again, transparent cover plate is provided with the open area, is used for exposed pad; Perhaps, interelement is filled a little transparent adhesive tape levelling on the relevant components and parts of LED, adopt profile to add a cover on it less than the transparent cover plate of ray machine template again, around transparent cover plate, coat transparent sealing then, the profile of transparent sealing is flushed with the ray machine template, transparent cover plate is provided with the open area, is used for exposed pad; Perhaps, directly coat transparent sealing on the relevant components and parts of LED, the profile of transparent sealing is flushed with the ray machine template, transparent adhesive tape is provided with the open area, is used for exposed pad.
In the LED bulb ray machine module of aforesaid transparency carrier, for undersized ray machine template, described ray machine template is circular substrate, and the bilateral symmetry of circular substrate is provided with two interior arc gaps, and the center of circle of arc gap is on the concentric circles of circular substrate outside; Also be provided with the circular hole that links to each other for the contact pin of electric connector on the described ray machine template, described pad is on the relevant components and parts of LED and be positioned at place, circular hole place, and the contact pin of electric connector welds mutually with pad after inserting circular hole.
In the LED bulb ray machine module of aforesaid transparency carrier, for the ray machine template of medium size, described ray machine template is circular substrate, and two of circular substrate bilateral symmetry ground excision circular substrate place circle are arc, form two symmetric windows; Also be provided with the circular hole of band alignment pin on the described ray machine template, circular hole is used for being connected with the electric connector contraposition; The relevant components and parts of described LED are arranged at place, circular hole place by flexible built-up circuit with pad, described electric connector insert behind the circular hole with flexible built-up circuit 44 on pad weld mutually.
In the LED bulb ray machine module of aforesaid transparency carrier, ray machine template for relatively large size, described ray machine template is circular substrate, the both sides of circular substrate are provided with two symmetric windows, each breach cuts along a flat-cut of circular substrate place circle and forms, and it is outward-dipping 120 degree in described string two ends, and round to the circular substrate place by arc transition; Described pad is positioned at the breach inboard of circular substrate, and pad is located at inboard or concentrated one of them the breach inboard that is located at of two breach respectively.
In the LED bulb ray machine module of aforesaid transparency carrier, for undersized ray machine template, described circular substrate place diameter of a circled
G Be 11 mm or 16mm; When circular substrate place diameter of a circled
G During for 11mm, the center of circle of two arc gaps is (i.e. the spacing in two centers of circle) on the circle of 13mm at diameter, and the radius of two arc gaps is 3.2mm; When circular substrate place diameter of a circled
G When being 16 mm, the center of circle of two arc gaps is (i.e. the spacing in two centers of circle) on the circle of 19mm at diameter, and the radius of two arc gaps is 3.6mm.The described circular hole that links to each other with the contact pin of electric connector is 4, equidistantly is symmetrically distributed, and spacing 3.5mm, 2mm place, the circular substrate center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes equates with the distance of two breach.
In the LED bulb ray machine module of aforesaid transparency carrier, for the ray machine template of medium size, described circular substrate place diameter of a circled
G Be 18mm or 25mm; When circular substrate place diameter of a circled
G During for 18mm, two cut arc chord lengths are 8.2mm, and the distance between two strings is 16mm; When circular substrate place diameter of a circled
G During for 25mm, two cut arc chord lengths are 9.8mm, and the distance between two strings is 23mm, and 2mm place, the circular substrate center of circle is being departed from its center of circle, and the circular hole center equates with the distance of two breach.
In the LED bulb ray machine module of aforesaid transparency carrier, for the ray machine template of large-size, described circular substrate place diameter of a circled
G Be 20mm, 38mm or 50mm, the chord length in the described breach deducts that length is 10mm after the outward-dipping part in two ends, and the radius of the circular arc that transition is used is 1mm; Two corresponding two strings of breach are parallel to each other; When circular substrate place diameter of a circled
G During for 20mm, the distance between two strings is 15mm; When circular substrate place diameter of a circled
G During for 38mm, the distance between two strings is 33mm; When circular substrate place diameter of a circled
G During for 50mm, the distance between two strings is 45mm.
In the LED bulb ray machine module of aforesaid transparency carrier, also be coated with fluorescent material on the described transparent cover plate and add stopping off; Perhaps described transparent cover plate is formed in mould transparent phosphor outward.Transparent phosphor is that fluorescent material and transparent material are that 5 ~ 30:100 makes by weight.
In the LED bulb ray machine module of aforesaid transparency carrier, also be provided with on the described ray machine template for fixing fixing hole, the quantity of described fixing hole is two, and two fixing holes are about the circular central symmetry of circular substrate, and the distance between two fixing holes is d
G
-6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers; Work as d
G
During=20mm, monolaterally open a fixing hole.
Compared with prior art, the present invention is by being sealed in the relevant components and parts of LED between transparent ray machine template and transparent sealing or the transparent cover plate, the adjacent transparent cover plate of led chip, transparent sealing less and fluorescent material is located at that transparent cover plate is outer can be away from led chip, fluorescent material and transparent adhesive tape are difficult for wearing out like this, stablize, efficiently move significant to guaranteeing the LED bulb; The following emergent light of chip can see through transparent ray machine template in addition, and the reflecting surface reflection by the LED bulb appears the bulb inner cover again, referring to Figure 21, obtains the bigger lifting of chip light emitting efficient and reduces the junction temperature of chip good result.And the breach of both sides designs on the ray machine template, be convenient to connect outer lead, can well in the liquid atmosphere, work simultaneously, after the ray machine module is installed in the inner cover of LED bulb band transparent insulation conductive fluid, the transparent insulation conductive fluid of being heated can be passed breach and be finished unimpeded flowing in order to carry out thermal cycle, so just make ray machine module of the present invention when work, can have extremely excellent radiating effect, guaranteed the high-luminous-efficiency of LED.And applicant of the present invention is through studying repeatedly, test and summing up, offer all different breach of shape size for the ray machine template of different size, make it under the situation of the arrangement space that does not influence the relevant components and parts of LED, can reach best liquid flow effect, and then realize best radiating effect.After aforementioned lamps foam method case is adopted in what is more important LED illumination; the LED illumination has realized general and has exchanged; and ray machine module wherein falls sharply and focuses on 3 types; amount on 7 specific products; because the specification total amount of ray machine module is few; and what covered the majority of illumination environment uses the lamp requirement; so just possessed allow LED middle and upper reaches enterprise and the encapsulation enterprise will research and develop with center of production adjust to the condition of carrying out scale and intensive production on the ray machine module of limited specification kind; this structure of the present invention; led chip is encapsulated between transparent ray machine template and the transparent cover plate; the ray machine module light transmittance height of forming; cheap; production procedure is short; finished product standard degree height can reduce LED lighting apparatus manufacturing cost on a large scale.
Description of drawings
Fig. 1 is the profile schematic diagram that uses the ray machine module of the profile transparent cover plate identical with the ray machine template among the embodiment 1;
Fig. 2 is the broken away view of ray machine module shown in Figure 1;
Fig. 3 is the ray machine module outline drawing that embodiment 1 uses transparent sealing;
Fig. 4 uses profile less than the ray machine modular structure schematic diagram of the transparent cover plate of ray machine template among the embodiment 1;
Fig. 5 is the broken away view of ray machine module shown in Figure 4;
Fig. 6 is the ray machine template perforate schematic diagram of embodiment 1;
Fig. 7 is the ray machine template of embodiment 1 and the scheme of installation of connector;
Fig. 8 is the application structure schematic diagram of embodiment 1;
Fig. 9 is the ray machine module outline drawing that embodiment 2 uses transparent sealing;
Figure 10 is the broken away view of using the ray machine module of the profile transparent cover plate identical with the ray machine template among the embodiment 2;
Figure 11 uses profile less than the ray machine modular structure schematic diagram of the transparent cover plate of ray machine template among the embodiment 2;
Figure 12 is the ray machine template of embodiment 2 and the scheme of installation of connector;
Figure 13 is the perforate schematic diagram of the ray machine template of embodiment 2;
Figure 14 is the application structure schematic diagram of embodiment 2;
Figure 15 is the ray machine module outline drawing that embodiment 3 uses transparent sealing;
Figure 16 is the broken away view of using the ray machine module of the profile transparent cover plate identical with the ray machine template among the embodiment 3;
Figure 17 uses profile less than the ray machine modular structure schematic diagram of the transparent cover plate of ray machine template among the embodiment 3;
Figure 18 is the ray machine template perforate schematic diagram of embodiment 3;
Figure 19 is the application structure schematic diagram of embodiment 3;
The LED bulb structure schematic diagram that Figure 20 is to use ray machine module of the present invention to set up;
Figure 21 is the principle of luminosity schematic diagram of GaN base LED of the present invention.
Being labeled as in the accompanying drawing: 3-heat conduction support, 4-ray machine module, 8-lens snap ring, 7-luminous intensity distribution optical lens, 11-electric connector male, 15-stiff end, 16-waterproof apron, 31-reflector layer, the 41-LED components and parts of being correlated with, the 42-transparent cover plate, 43-ray machine template, the flexible built-up circuit of 44-, the transparent sealing of 45-, 61-bulb spill inner cover, the 61.1-pressure relief vent, 61.2 – unload press mold, snap ring in the 81-, 105-bulb hold-down screw, 431-alignment pin.
Embodiment
The present invention is further illustrated below in conjunction with drawings and Examples, but not as the foundation to the present invention's restriction.
Embodiment 1: a kind of LED bulb ray machine module of the transparency carrier for small size LED bulb, comprise that both sides are provided with the ray machine template 43 of breach, described ray machine template 43 is transparency carrier, the relevant components and parts 41 of LED are set on the ray machine template 43, the relevant components and parts 41 of described LED comprise led chip group and relevant components and parts and circuit, use transparent sealing 45 and/or transparent cover plate 42 then, the relevant components and parts 41 of LED are covered, only expose the pad of the relevant components and parts 41 of LED.Described transparent sealing 45 and/or transparent cover plate 42 transparent cover plates have the method that the relevant components and parts 41 of LED cover: as depicted in figs. 1 and 2, interelement is filled a little transparent adhesive tape levelling on the relevant components and parts 41 of LED, make and form transparent adhesive tape between led chip surface and the transparent cover plate as few as possible, adopt profile and ray machine template 43 identical transparent cover plates 42 to add a cover on it again, transparent cover plate 42 is provided with the open area, is used for exposed pad; Perhaps, shown in Figure 4 and 5, interelement is filled a little transparent adhesive tape levelling on the relevant components and parts 41 of LED, make and form transparent adhesive tape between led chip surface and the transparent cover plate as few as possible, adopt profile to add a cover on it less than the transparent cover plate 42 of ray machine template 43 again, around transparent cover plate 42, coat transparent sealing 45 then, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent cover plate 42 is provided with the open area, is used for exposed pad; Perhaps, as shown in Figure 3, directly coat transparent sealing 45 on the relevant components and parts 41 of LED, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent adhesive tape 45 is provided with the open area, is used for exposed pad.
Also be coated with fluorescent material on the described transparent cover plate 42 and add stopping off; Perhaps described transparent cover plate 42 is formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are made for 1:10 by weight.
The shape of described ray machine template 43 is circular substrate as shown in Figure 6, and the bilateral symmetry of circular substrate is provided with two interior arc gaps, the center of circle of arc gap on the concentric circles of circular substrate outside, during its cutting mode with d G Diameter, symmetrical X-axis is with l G Be length, R is radius, w G Be chord length, the both sides of downcutting circle form two round breach that radius is R.The purposes of breach is for when the ray machine module is used for liquid heat sink conception, and heated transparent insulation conductive fluid can be carried out thermal cycle from indentation, there; Also be provided with the circular hole that links to each other for the contact pin with electric connector 11 on the described ray machine template 43, centered by the positive 2mm of the X-axis of ray machine template 43 place, 3.5 to be spacing, the circular hole of 4 the diameter 1.4mm that are symmetrically distributed; Described pad is on the relevant components and parts 41 of LED and be positioned at place, circular hole place, and the contact pin of electric connector 11 welds mutually with pad after inserting circular hole, as shown in Figure 7.The circular hole that contact pin described and electric connector 11 links to each other is 4, equidistantly is symmetrically distributed, and spacing 3.5mm, 2mm place, the circular substrate center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes equates with the distance of two breach.Namely centered by the positive 2mm of the X-axis of ray machine template 43 place, 3.5 being spacing, the circular hole of 4 the diameter 1.4mm that are symmetrically distributed.Described circular substrate place diameter of a circled
G Be 11 mm or 16mm; When circular substrate place diameter of a circled
G During for 11mm, the center of circle of two arc gaps is on the circle of 13mm at diameter, and the radius of two arc gaps is 3.2mm; When circular substrate place diameter of a circled
G When being 16 mm, the center of circle of two arc gaps is on the circle of 19mm at diameter, and the radius of two arc gaps is 3.6mm.
The application of the LED bulb ray machine module of transparency carrier of the present invention: electric connector 11 passes heat conduction support 3 and bonding, pad welding on the relevant components and parts 41 with LED of circular hole of the contact pin insertion ray machine template 43 of electric connector 11, the LED bulb ray machine module of transparency carrier is provided with spill inner cover 61 outward, the LED bulb ray machine module of final transparency carrier is suspended between heat conduction support 3 and the spill inner cover 61 in the confined space, and the ray machine template external diameter of the LED bulb ray machine module of transparency carrier and the internal diameter of spill inner cover 61 fit tightly.So just constitute the core texture of a LED bulb, in spill inner cover 61, injected transparent insulation conductive fluid (spill inner cover 61 is provided with the pressure release film 61.2 of relief hole 61.1 and sealing usefulness) at last, as shown in Figure 8.
Embodiment 2: a kind of LED bulb ray machine module of the transparency carrier for medium size LED bulb, comprise that both sides are provided with the ray machine template 43 of breach, described ray machine template 43 is transparency carrier, the relevant components and parts 41 of LED are set on the ray machine template 43, use transparent sealing 45 and/or transparent cover plate 42 then, the relevant components and parts 41 of LED are covered, only expose the pass connected bonding pads on the relevant components and parts 41 of LED.Described transparent sealing 45 and/or transparent cover plate 42 transparent cover plates to the method that the relevant components and parts 41 of LED cover are: interelement is filled a little transparent adhesive tape levelling on the relevant components and parts 41 of LED, make and form transparent adhesive tape between led chip surface and the transparent cover plate as few as possible, adopt profile and ray machine template 43 identical transparent cover plates 42 to add a cover on it again, transparent cover plate 42 is provided with the open area, be used for exposed pad, as shown in figure 10; Perhaps, interelement is filled a little transparent adhesive tape levelling on the relevant components and parts 41 of LED, make and form transparent adhesive tape between led chip surface and the transparent cover plate as few as possible, adopt profile to add a cover on it less than the transparent cover plate 42 of ray machine template 43 again, coat transparent sealing 45 then around transparent cover plate 42, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent cover plate 42 is provided with the open area, be used for exposed pad, as shown in figure 11; Perhaps, as shown in Figure 9, directly coat transparent sealing 45 on the relevant components and parts 41 of LED, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent adhesive tape 45 is provided with the open area, is used for exposed pad.Also be coated with fluorescent material on the described transparent cover plate 42 and add stopping off; Perhaps described transparent cover plate 42 is formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are made for 1:10 by weight.
Described ray machine template 43 is circular substrate, and as shown in figure 13, two of circular substrate bilateral symmetry ground excision circular substrate place circle are arc, form two symmetric windows; Also be provided with the circular hole of band alignment pin on the described ray machine template 43, circular hole is used for being connected with electric connector 11 contrapositions; With d
G
Diameter, symmetrical X-axis is with l
G
Be length, w
G
Be chord length, the both sides of downcutting circle form breach.The purposes of breach is for when the ray machine module is used for liquid heat sink conception, and heated transparent insulation conductive fluid can be carried out thermal cycle from indentation, there, referring to Figure 14.Be the center of circle at the positive 2mm of the X-axis of ray machine template 43 place, leave the 8mm diameter circle, circle is provided with the alignment pin 431 of electric connector 11, as shown in figure 13; The relevant components and parts 41 contacts welding with LED of flexible built-up circuit 44.Described circular substrate place diameter of a circle d
G
Be 18mm or 25mm; As circular substrate place diameter of a circle d
G
During for 18mm, two cut arc chord lengths are 8.2mm, and the distance between two strings is 16mm; As circular substrate place diameter of a circle d
G
During for 25mm, two cut arc chord lengths are 9.8mm, and the distance between two strings is 23mm; The Circularhole diameter of described band alignment pin is 8mm, 2mm place, the circular substrate center of circle is being departed from its center of circle, and the circular hole center equates with the distance of two breach, is the center of circle at the positive 2mm of the X-axis of ray machine template 43 place namely, leave the 8mm diameter circle, circle is provided with the alignment pin 431 of electric connector 11.The relevant components and parts 41 of described LED are arranged at place, circular hole place by flexible built-up circuit 44 with pad, weld mutually with pad after described electric connector 11 inserts circular hole, as shown in figure 12.
The application of the LED bulb ray machine module of transparency carrier of the present invention: electric connector 11 is fixed on the heat conduction support 3 by stiff end 15, electric connector 11 inserts circular hole and the welding of the pad on the flexible built-up circuit 44 of the band alignment pin of ray machine template 43, the LED bulb ray machine module of transparency carrier is provided with spill inner cover 61 outward, the LED bulb ray machine module of final transparency carrier is suspended between heat conduction support 3 and the spill inner cover 61 in the confined space, and ray machine template 43 external diameters of the LED bulb ray machine module of transparency carrier and the internal diameter of spill inner cover 61 fit tightly.So just constitute the core texture of a LED bulb, in spill inner cover 61, injected transparent insulation conductive fluid (spill inner cover 61 is provided with the pressure release film 61.2 of relief hole 61.1 and sealing usefulness) at last, as Figure 14 and shown in Figure 20.
Embodiment 3: a kind of LED bulb ray machine module of transparency carrier, comprise that both sides are provided with the ray machine template 43 of breach, described ray machine template 43 is transparency carrier, the relevant components and parts 41 of LED are set on the ray machine template 43, use transparent sealing 45 and/or transparent cover plate 42 transparent cover plates then, the relevant components and parts 41 of LED are covered, only expose the pass connected bonding pads of the relevant components and parts 41 of LED.Described transparent sealing 45 and/or transparent cover plate 42 transparent cover plates to the method that the relevant components and parts 41 of LED cover are: interelement is filled a little transparent adhesive tape levelling on the relevant components and parts 41 of LED, make between led chip surface and the transparent cover plate 42 and form transparent adhesive tape as few as possible, adopt profile and ray machine template 43 identical transparent cover plates 42 to add a cover on it again, transparent cover plate 42 is provided with the open area, be used for exposed pad, as shown in figure 16; Perhaps, interelement is filled a little transparent adhesive tape levelling on the relevant components and parts 41 of LED, make between led chip surface and the transparent cover plate 42 and form transparent adhesive tape as few as possible, adopt profile to add a cover on it less than the transparent cover plate 42 of ray machine template 43 again, coat transparent sealing 45 then around transparent cover plate 42, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent cover plate 42 is provided with the open area, be used for exposed pad, as shown in figure 17; Perhaps, directly coat transparent sealing 45 on the relevant components and parts 41 of LED, the profile of transparent sealing 45 is flushed with ray machine template 43, transparent adhesive tape 45 is provided with the open area, is used for exposed pad and fixing hole, as Figure 15.
Described ray machine template 43 as shown in figure 18, be circular substrate, the both sides of circular substrate are provided with two symmetric windows, and each breach cuts along a flat-cut of circular substrate place circle and forms, and it is outward-dipping 120 degree in described string two ends, and round to the circular substrate place by arc transition.Its shape is, with d
G
Diameter, symmetrical X-axis is with l
G
Be length, w
G
Be chord length, at chord length w
G
Hold outward-dipping 120 the degree, with the R=1.0mm circular arc to diameter d
G
Excessively, downcut the both sides formation breach of circle.The purposes of breach is for when the ray machine module is used for liquid heat sink conception, and heated transparent insulation conductive fluid can be carried out thermal cycle from indentation, there.Circular substrate place diameter of a circle d as described in Figure 18
G
Be 20mm, 38mm or 50mm, the chord length in the described breach deducts that length is 10mm after the outward-dipping part in two ends, and the radius of the circular arc that transition is used is 1mm; Two corresponding two strings of breach are parallel to each other; As circular substrate place diameter of a circle d
G
During for 20mm, the distance between two strings is 15mm; As circular substrate place diameter of a circle d
G
During for 38mm, the distance between two strings is 33mm; As circular substrate place diameter of a circle d
G
During for 50mm, the distance between two strings is 45mm.Described pad is positioned at the breach inboard of circular substrate, and each pad is located at inboard or concentrated one of them the breach inboard that is located at of two breach respectively, and connector 11 links to each other with pad by flexible built-up circuit 44.
Also be coated with fluorescent material on the described transparent cover plate 42 and add stopping off; Perhaps described transparent cover plate 42 is formed in mould transparent phosphor.Transparent phosphor is that fluorescent material and transparent material are made for 1:10 by weight; Also be provided with on the described ray machine template 43 for fixing fixing hole.The quantity of described fixing hole is two, and two fixing holes are about the circular central symmetry of circular substrate, and the distance between two fixing holes is d
G
-6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers; Work as d
G
During=20mm, monolaterally open a fixing hole, as Figure 18.
The application of the LED bulb ray machine module of transparency carrier of the present invention: heat conduction support 3 be provided with perforate, electric connector 11 inserts perforate and is fixed on the heat conduction support 3 by stiff end 15, electric connector 11 is by the welding of the pad on the relevant components and parts 41 with LED of flexible built-up circuit 44, the LED bulb ray machine module of transparency carrier is located between heat conduction support 3 and the spill inner cover 61 in the confined space, spill inner cover 61 is provided with step, the LED bulb ray machine module of transparency carrier is shelved on the step, and use by ray machine template outer and step and fix, and the ray machine template external diameter of the LED bulb ray machine module of transparency carrier and the internal diameter of spill inner cover 61 fit tightly.The place that is different from embodiment 1 and 2 is, connector is positioned at outside the spill inner cover 61, it is continuous by the pad of the relevant components and parts 41 of LED in flexible built-up circuit 44 and the spill inner cover 61, in spill inner cover 61, inject transparent insulation conductive fluid (spill inner cover 61 is provided with the pressure release film 61.2 of relief hole 61.1 and sealing usefulness) at last, so just constituted the core texture of a LED bulb, as shown in figure 19.
Figure 20 is the application legend of the present invention in a kind of bulb, also luminous intensity distribution optical lens 7 can be set outside spill inner cover 61, and luminous intensity distribution optical lens 7 is fixed on the heat conduction support 3 by interior snap ring 81 and lens snap ring 8.
More than three embodiment, realized the LED ray machine module of following 7 kinds of specifications, the ray machine module of these 7 kinds of specifications can satisfy most lighting requirement:
Principle of luminosity of the present invention as shown in figure 21.
Claims (10)
1. the LED bulb ray machine module of a transparency carrier, it is characterized in that: comprise that both sides are provided with the ray machine template (43) of breach, described ray machine template (43) is transparency carrier, and the relevant components and parts (41) of LED are set on the ray machine template (43), the described LED components and parts (41) of being correlated with comprise led chip group and relevant components and parts and circuit, the described relevant components and parts (41) of LED of going up use transparent sealing (45) and/or transparent cover plate (42) to covering, and only expose the pass connected bonding pads on the relevant components and parts (41) of LED.
2. the LED bulb ray machine module of transparency carrier according to claim 1, it is characterized in that, the transparent sealing of described use (45) and/or transparent cover plate (42) to the method that the relevant components and parts (41) of LED cover are: the interelement on the relevant components and parts (41) of LED is filled a little transparent adhesive tape levelling, make between led chip surface and the transparent cover plate (42) and form transparent adhesive tape as few as possible, adopt the profile transparent cover plate (42) identical with ray machine template (43) to add a cover on it again, transparent cover plate (42) is provided with the open area, is used for exposed pad; Perhaps, interelement on the relevant components and parts (41) of LED is filled a little transparent adhesive tape levelling, make between led chip surface and the transparent cover plate (42) and form transparent adhesive tape as few as possible, adopt profile to add a cover on it less than the transparent cover plate (42) of ray machine template (43) again, coat transparent sealing (45) on every side at transparent cover plate (42) then, the profile of transparent sealing (45) is flushed with ray machine template (43), and transparent cover plate (42) is provided with the open area, is used for exposed pad; Perhaps, go up directly coating transparent sealing (45) at the relevant components and parts (41) of LED, the profile of transparent sealing (45) is flushed with ray machine template (43), transparent adhesive tape (45) is provided with the open area, is used for exposed pad.
3. the LED bulb ray machine module of transparency carrier according to claim 1, it is characterized in that: described ray machine template (43) is circular substrate, the bilateral symmetry of circular substrate is provided with two interior arc gaps, and the center of circle of arc gap is on the concentric circles of circular substrate outside; Also be provided with the circular hole that links to each other for the contact pin with electric connector (11) on the described ray machine template (43), described pad is gone up and is positioned at the circular hole place at the relevant components and parts (41) of LED and locates, and the contact pin of electric connector (11) welds mutually with pad after inserting circular hole.
4. the LED bulb ray machine module of transparency carrier according to claim 1 is characterized in that: described ray machine template (43) is circular substrate, and two of circular substrate bilateral symmetry ground excision circular substrate place circle are arc, form two symmetric windows; Also be provided with the circular hole of band alignment pin on the described ray machine template (43), circular hole is used for being connected with electric connector (11) contraposition; The described LED components and parts (41) of being correlated with are arranged at circular hole place place by flexible built-up circuit (44) with pad, described electric connector (11) insert behind the circular hole with flexible built-up circuit (44) on pad weld mutually.
5. the LED bulb ray machine module of transparency carrier according to claim 1, it is characterized in that: described ray machine template (43) is circular substrate, the both sides of circular substrate are provided with two symmetric windows, each breach cuts along a flat-cut of circular substrate place circle and forms, and it is outward-dipping 120 degree in described string two ends, and round to the circular substrate place by arc transition; Described pad is positioned at the breach inboard of circular substrate, and pad is located at inboard or concentrated one of them the breach inboard that is located at of two breach respectively.
6. the LED bulb ray machine module of transparency carrier according to claim 3 is characterized in that: described circular substrate place diameter of a circle d
GBe 11mm or 16mm; As circular substrate place diameter of a circle d
GDuring for 11mm, the center of circle of two arc gaps is on the circle of 13mm at diameter, and the radius of two arc gaps is 3.2mm; As circular substrate place diameter of a circle d
GDuring for 16mm, the center of circle of two arc gaps is on the circle of 19mm at diameter, and the radius of two arc gaps is 3.6mm; The circular hole that contact pin described and electric connector (11) links to each other is 4, equidistantly is symmetrically distributed, and spacing 3.5mm, 2mm place, the circular substrate center of circle is being departed from the center of 4 circular holes, and the center of 4 circular holes equates with the distance of two breach.
7. the LED bulb ray machine module of transparency carrier according to claim 4 is characterized in that: described circular substrate place diameter of a circle d
GBe 18mm or 25mm; As circular substrate place diameter of a circle d
GDuring for 18mm, two cut arc chord lengths are 8.2mm, and the distance between two strings is 16mm; As circular substrate place diameter of a circle d
GDuring for 25mm, two cut arc chord lengths are 9.8mm, and the distance between two strings is 23mm; The Circularhole diameter of described band alignment pin is 8mm, and 2mm place, the circular substrate center of circle is being departed from its center of circle, and the circular hole center equates with the distance of two breach.
8. the LED bulb ray machine module of transparency carrier according to claim 5 is characterized in that: described circular substrate place diameter of a circle d
GBe 20mm, 38mm or 50mm, the chord length in the described breach deducts that length is 10mm after the outward-dipping part in two ends, and the radius of the circular arc that transition is used is 1mm; Two corresponding two strings of breach are parallel to each other; As circular substrate place diameter of a circle d
GDuring for 20mm, the distance between two strings is 15mm; As circular substrate place diameter of a circle d
GDuring for 38mm, the distance between two strings is 33mm; As circular substrate place diameter of a circle d
GDuring for 50mm, the distance between two strings is 45mm.
9. the LED bulb ray machine module of transparency carrier according to claim 2 is characterized in that: also be coated with fluorescent material on the described transparent cover plate (42) and add stopping off; Perhaps described transparent cover plate (42) is formed in mould transparent phosphor.
10. the LED bulb ray machine module of transparency carrier according to claim 8, it is characterized in that: also be provided with on the described ray machine template (43) for fixing fixing hole, the quantity of described fixing hole is two, two fixing holes are based on the circular central symmetry of circular substrate, and the distance between two fixing holes is d
G-6, the diameter of fixing hole is 2.2mm; The line of two fixing holes, mutually orthogonal with the line at two breach centers; Work as d
GDuring=20mm, monolaterally open a fixing hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310140136.8A CN103236434B (en) | 2013-04-22 | 2013-04-22 | A kind of LED bulb light machine module of transparency carrier |
| PCT/CN2014/075242 WO2014173238A1 (en) | 2013-04-22 | 2014-04-14 | Light engine module for led light bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310140136.8A CN103236434B (en) | 2013-04-22 | 2013-04-22 | A kind of LED bulb light machine module of transparency carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103236434A true CN103236434A (en) | 2013-08-07 |
| CN103236434B CN103236434B (en) | 2016-01-20 |
Family
ID=48884464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310140136.8A Active CN103236434B (en) | 2013-04-22 | 2013-04-22 | A kind of LED bulb light machine module of transparency carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103236434B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014173238A1 (en) * | 2013-04-22 | 2014-10-30 | 贵州光浦森光电有限公司 | Light engine module for led light bulb |
| CN105627124A (en) * | 2016-03-11 | 2016-06-01 | 贵州光浦森光电有限公司 | LED lamp filament assembly, method for forming LED lamp filament bulb and LED lamp filament bulb |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102777797A (en) * | 2012-07-23 | 2012-11-14 | 贵州光浦森光电有限公司 | Method for forming LED bulb with high interchangeability and universality and flanged support LED bulb |
| CN102798005A (en) * | 2012-07-23 | 2012-11-28 | 贵州光浦森光电有限公司 | Construction method for universal-type LED (light-emitting diode) bulb and LED bulb of clamping ring structure |
| US20130058080A1 (en) * | 2010-09-08 | 2013-03-07 | Zhejiand Ledison Optoelectronics Co, Ltd. | Led light bulb and led light-emitting strip being capable of emitting 4tt light |
| CN203179891U (en) * | 2013-04-22 | 2013-09-04 | 贵州光浦森光电有限公司 | LED bulb optical module employing transparent substrate |
-
2013
- 2013-04-22 CN CN201310140136.8A patent/CN103236434B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130058080A1 (en) * | 2010-09-08 | 2013-03-07 | Zhejiand Ledison Optoelectronics Co, Ltd. | Led light bulb and led light-emitting strip being capable of emitting 4tt light |
| CN102777797A (en) * | 2012-07-23 | 2012-11-14 | 贵州光浦森光电有限公司 | Method for forming LED bulb with high interchangeability and universality and flanged support LED bulb |
| CN102798005A (en) * | 2012-07-23 | 2012-11-28 | 贵州光浦森光电有限公司 | Construction method for universal-type LED (light-emitting diode) bulb and LED bulb of clamping ring structure |
| CN203179891U (en) * | 2013-04-22 | 2013-09-04 | 贵州光浦森光电有限公司 | LED bulb optical module employing transparent substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014173238A1 (en) * | 2013-04-22 | 2014-10-30 | 贵州光浦森光电有限公司 | Light engine module for led light bulb |
| CN105627124A (en) * | 2016-03-11 | 2016-06-01 | 贵州光浦森光电有限公司 | LED lamp filament assembly, method for forming LED lamp filament bulb and LED lamp filament bulb |
| CN105627124B (en) * | 2016-03-11 | 2019-07-30 | 贵州光浦森光电有限公司 | A kind of LED filament component, the method and LED filament light bulb for setting up LED filament light bulb |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103236434B (en) | 2016-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20110148270A1 (en) | Spherical light output LED lens and heat sink stem system | |
| CN203179891U (en) | LED bulb optical module employing transparent substrate | |
| CN102226508A (en) | LED (light emitting diode) lamp and preparation method thereof | |
| CN103206637B (en) | Epitaxial wafer type LED (Light Emitting Diode) bulb light machine module | |
| CN103236434B (en) | A kind of LED bulb light machine module of transparency carrier | |
| CN202013881U (en) | Integrated packaging structure with vertically structured LED chips | |
| CN102980077A (en) | LED (Light Emitting Diode) integrated light source with tubular structure | |
| CN103216757B (en) | Production method of light emitting diode (LED) head lamp | |
| CN103206636B (en) | LED bulb production method | |
| CN103196064B (en) | A kind of LED bulb light machine module | |
| CN203147431U (en) | Epitaxial wafer-type optical-mechanical module of light-emitting diode (LED) bulb | |
| CN203147428U (en) | Light engine module for LED (Light Emitting Diode) bulb | |
| CN203784681U (en) | LED (Light-Emitting Diode) illumination light source | |
| CN103196065B (en) | Small LED bulb implementing liquid heat-dissipating method | |
| CN101847624A (en) | COB modularized LED encapsulation technology | |
| CN103225756B (en) | Liquid-state heat-radiation type medium-sized LED bulb | |
| CN106898684A (en) | A kind of multi-chip and UVLED array supports of connecting | |
| CN203787425U (en) | LED filament and illuminator | |
| CN104061464B (en) | High-power LED lamp | |
| JP2018032748A (en) | Light-emitting device, illumination apparatus and manufacturing method of light-emitting device | |
| CN105280627A (en) | Light source module and packaging method thereof, and lighting device using the light source module | |
| CN103872033A (en) | LED (light-emitting diode) lamp filament and illuminator | |
| CN205429008U (en) | Metal heat conduction post COB LED light source | |
| CN103185249B (en) | A kind of large LED bulb of liquid-state heat-radiation type | |
| JP2007088100A (en) | Luminaire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 562400 Xingyi Qingshui River Economic Development Zone, Guizhou, Guizhou, Qingshui River new building materials circular economy industrial park Patentee after: Guizhou Guangpusen Photoelectric Co., Ltd. Address before: 550002 Guizhou Province, Guiyang city Nanming District South City Hongtai family 28D Patentee before: Guizhou Guangpusen Photoelectric Co., Ltd. |