CN203013711U - Smart card package frame - Google Patents
Smart card package frame Download PDFInfo
- Publication number
- CN203013711U CN203013711U CN 201220654491 CN201220654491U CN203013711U CN 203013711 U CN203013711 U CN 203013711U CN 201220654491 CN201220654491 CN 201220654491 CN 201220654491 U CN201220654491 U CN 201220654491U CN 203013711 U CN203013711 U CN 203013711U
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- layer
- gold
- nickel
- phosphorus
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 94
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims abstract description 54
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910052737 gold Inorganic materials 0.000 claims abstract description 53
- 239000010931 gold Substances 0.000 claims abstract description 53
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 50
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 239000002131 composite material Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 19
- 229910000531 Co alloy Inorganic materials 0.000 claims description 3
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract 4
- 238000003466 welding Methods 0.000 abstract 2
- 239000000654 additive Substances 0.000 description 9
- 230000000996 additive effect Effects 0.000 description 9
- 150000003839 salts Chemical class 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000003814 drug Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000012958 reprocessing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000001994 activation Methods 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 239000004902 Softening Agent Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Abstract
The utility model relates to a smart card package frame and belongs to the technical field of integrated circuits. The smart card package frame includes a substrate (5), a contact layer arranged on the substrate (5) and a welding layer below the substrate (5), wherein the contact layer and the welding layer both are composite structures which are successively provided a copper layer (1), a nickel layer (2) and a gold layer (4) from inside to outside respectively. The smart card package frame is characterized in that a phosphorus nickel alloy layer (3) is arranged between the nickel layer (2) and the gold layer (4), as a result, two sides of the substrate (5) are respectively provided with the copper layer (1), the nickel layer (2), the phosphorus nickel alloy layer (3) and the gold layer (4) from inside to outside. The smart card package frame of the utility model can assist in improving wear resistance and corrosion resistance of a product contact surface, and saving cost.
Description
Technical field
A kind of Intelligent card package framework belongs to technical field of integrated circuits.
Background technology
Smart card also claims IC-card (Integrated Circuit Card, integrated circuit card), smart card (intelligent card), microcircuit card (microcircuit card) or chip card etc.It is a microelectronic chip to be embedded meet in the card base of ISO 7816 standards, makes card form.Smart card is another the novel information instrument that occurs after magnetic card.General common smart card adopts radio-frequency technique and card reader to carry out communication.It has successfully solved passive (non-transformer in card) and this difficult problem of contact-free, is a quantum jump of field of electronic devices.Be mainly used in the automatic fare collection system of public transport, ferry, subway, also be applied in entrance guard management, proof of identification and stored value card.
The basic principle of smart card work is: frequency read/write is sent out the electromagnetic wave of one group of fixed frequency to smart card, a LC series resonant circuit is arranged in card, its frequency is identical with the frequency of read write line emission, like this under excitation of electromagnetic wave, the LC resonant circuit produces resonance, thereby make, electric charge has been arranged in electric capacity; The other end at this electric capacity, be connected to the electronic pump of an one-way conduction, the electric charge in electric capacity delivered to another capacitor memory storage, when the electric charge that accumulates reaches 2V, this electric capacity can be used as power supply and provides operating voltage for other circuit, data transmission in card is gone out or accepted the data of read write line.
It is higher that yet the shortcoming of conventional smart card is manufacturing cost, and traditional smart card framework is the layer structure of three layers, and innermost layer is the copper layer, the interposition nickel dam, and the surface is the gold layer.The thickness that requires under traditional handicraft is: the nickel contact layer: 3 ± 1 μ m, weld layer: 5 ± 2 μ m; Gold contact layer: 0.1 ± 0.05 μ m, weld layer: 0.3 ± 0.1 μ m.Otherwise will not reach corrosion resistance and the anti-wear performance of requirement.
Summary of the invention
The technical problems to be solved in the utility model is: overcome the deficiencies in the prior art, a kind of a kind of Intelligent card package framework of cost is provided.
The technical scheme that its technical problem that solves the utility model adopts is: this Intelligent card package framework, comprise the contact layer of base material, base material top and the weld layer of base material below, described contact layer and weld layer are composite construction, be followed successively by from inside to outside copper layer, nickel dam and gold layer, it is characterized in that: increase one deck phosphorus nickel alloy layer between described nickel dam and gold layer.Be that contact layer and weld layer are four layers of composite construction, be followed successively by from inside to outside copper layer, nickel dam, phosphorus nickel alloy layer and gold layer.
The nickel layer thickness of described contact layer is 1.8 ~ 2.2 μ m, and phosphorus nickel alloy layer thickness is 0.4 ~ 0.8 μ m, and golden layer thickness is 0.009 ~ 0.05 μ m.
Described weld layer nickel dam and phosphorus nickel alloy layer total thickness are 5 ± 2 μ m, and golden layer thickness is 0.3 ± 0.1 μ m.
The gold layer of contact layer is the hard gold layer of gold cobalt alloy.
In described phosphorus nickel alloy layer, to account for mass fraction be 4% ~ 8% to phosphorus, and surplus is nickel.
Carried out the plating of nickel, 2 kinds of coats of metal of gold in the utility model manufacturing process at electroplating work procedure, major effect be outward appearance and the thickness of product, product functional played conclusive impact.What affect the corrosion-resistant and resistance to wear of product is mainly the contact layer of product.
The copper layer is basic unit, re-plating electronickelling, phosphorus nickel, gold.Wherein gold is different at the composition of positive and negative, because the functional difference of positive and negative, wherein the gold layer of contact layer is the hard gold layer of gold cobalt alloy, and the gold layer of weld layer is soft gold layer.
The making flow process of a kind of Intelligent card package framework of the utility model is: oil removing, activation, plating semi-bright nickel, electroplate the phosphorus nickel alloy, in advance the hard gold of gold-plated, plating, plate soft gold, hot water wash, oven dry.Compare with traditional handicraft, manufacturing process of the present utility model has added plating phosphorus nickel alloy, has cancelled the use of reprocessing.
Because the Intelligent card package framework has high-accuracy property and strict appearance requirement.The utility model will be electroplated the phosphorus nickel alloy and be applied to Intelligent card package framework technique, compare with half traditional bright nickel plating, and the compactness of electroplating of phosphorus nickel alloy is better, and good corrosion resistance and the physical characteristic of abrasion resisting are arranged.The utility model is with the phosphorus nickel one-tenth-value thickness 1/10 an of the best; reduce the hard golden thickness of smart card contact layer; and cancel the reprocessing of common process; it is hole-sealing technology; utilize the advantage coating performance of phosphorus nickel alloy; what substitute former common process is the measure that the surface protection effect is done that obtains; come Decrease production cost; after the 96h salt mist test of carrying out; the performance of product is very good; passed through salt mist test, represented that its corrosion resistance reaches requirement fully: and the bonding wire of weld layer is functional, fully without any harmful effect.
Compared with prior art, the beneficial effect that a kind of Intelligent card package framework of the present utility model has is: 1. replace the intermediate layer of former semi-bright nickel with the phosphorus nickel alloy, improved resistance to wear and the corrosion resistance of product contact surface.We take current density, temperature, the PH condition concerning the phosphorus nickel alloy, the possibility that can avoid the phosphorus nickel alloy plating leakage to be arranged and burn obtains well behaved coating.Find by test, nickel is combined firmly with the phosphorus nickel dam, the possibility that may separate without coating.2. due to the high compactness of phosphorus nickel alloy coating, so product has good physical property and chemical property.The hard gold layer of the Surface Contact of smart card and the purpose of the post-treatment measure in technique are exactly a kind of protective effect to product, and have adopted the phosphorus nickel alloy, can reduce accordingly the thickness of hard gold, and cancel the use of reprocessing, greatly save cost.In a series of tests of carrying out, the product of having removed reprocessing and having reduced hard golden thickness, the salt mist test performance is good.
Description of drawings
Fig. 1 is a kind of layer structure schematic diagram of Intelligent card package framework.
Wherein 1, copper layer 2, nickel dam 3, phosphorus nickel alloy layer 4, gold layer 5, base material.
Embodiment
Below by specific embodiment, a kind of Intelligent card package framework of the utility model is described further, wherein embodiment 1 is most preferred embodiment.
A kind of Intelligent card package framework, contact layer and the weld layer of described Intelligent card package framework are four-layer structure, are base material 5 between contact layer and weld layer, and base material 5 both sides are followed successively by copper layer 1, nickel dam 2, phosphorus nickel alloy layer 3, gold layer 4 from inside to outside; Wherein nickel dam 2 thickness of contact layer are 2.0 μ m, and phosphorus nickel alloy layer 3 thickness are 0.4 μ m, and hard gold layer 4 thickness are 0.025 μ m; Weld layer nickel dam 2 is 5 μ m with phosphorus nickel alloy layer 3 total thicknesses, and soft gold layer 4 thickness are 0.3 μ m.In described phosphorus nickel alloy layer 3, to account for mass fraction be 6% to phosphorus.
A kind of Intelligent card package framework, contact layer and the weld layer of described Intelligent card package framework are four-layer structure, are base material 5 between contact layer and weld layer, and base material 5 both sides are followed successively by copper layer 1, nickel dam 2, phosphorus nickel alloy layer 3, gold layer 4 from inside to outside; Wherein nickel dam 2 thickness of contact layer are 2.2 μ m, and phosphorus nickel alloy layer 3 thickness are 0.42 μ m, and gold layer 4 thickness are 0.035 μ m; Weld layer nickel dam 2 is 5.5 μ m with phosphorus nickel alloy layer 3 total thicknesses, and soft gold layer 4 thickness are 0.32 μ m.In described phosphorus nickel alloy layer 3, to account for mass fraction be 7% to phosphorus.
A kind of Intelligent card package framework, contact layer and the weld layer of described Intelligent card package framework are four-layer structure, and the copper layer is attached on base material 5, and base material 5 both sides are followed successively by copper layer 1, nickel dam 2, phosphorus nickel alloy layer 3, gold layer 4 from inside to outside; Wherein nickel dam 2 thickness of contact layer are 2.0 μ m, and phosphorus nickel alloy layer 3 thickness are 0.35 μ m, and hard gold layer 4 thickness are 0.028 μ m; Weld layer nickel dam 2 is 4.5 μ m with phosphorus nickel alloy layer 3 total thicknesses, and soft gold layer 4 thickness are 0.28 μ m.In described phosphorus nickel alloy layer 3, to account for mass fraction be 5% to phosphorus.
A kind of Intelligent card package framework, contact layer and the weld layer of described Intelligent card package framework are four-layer structure, and the copper layer is attached on base material 5, and base material 5 both sides are followed successively by copper layer 1, nickel dam 2, phosphorus nickel alloy layer 3, gold layer 4 from inside to outside; Wherein nickel dam 2 thickness of contact layer are 2.0 μ m, and phosphorus nickel alloy layer 3 thickness are 0.5 μ m, and hard gold layer 4 thickness are 0.05 μ m; Weld layer nickel dam 2 is 7 μ m with phosphorus nickel alloy layer 3 total thicknesses, and soft gold layer 4 thickness are 0.4 μ m.In described phosphorus nickel alloy layer 3, to account for mass fraction be 8% to phosphorus.
A kind of Intelligent card package framework, contact layer and the weld layer of described Intelligent card package framework are four-layer structure, and the copper layer is attached on base material 5, and base material 5 both sides are followed successively by copper layer 1, nickel dam 2, phosphorus nickel alloy layer 3, gold layer 4 from inside to outside; Wherein nickel dam 2 thickness of contact layer are 1.8 μ m, and phosphorus nickel alloy layer 3 thickness are 0.3 μ m, and hard gold layer 4 thickness are 0.009 μ m; Weld layer nickel dam 2 is 3 μ m with phosphorus nickel alloy layer 3 total thicknesses, and soft gold layer 4 thickness are 0.2 μ m.In described phosphorus nickel alloy layer 3, to account for mass fraction be 4% to phosphorus.
Embodiment 6
A kind of Intelligent card package framework, contact layer and the weld layer of described Intelligent card package framework are four-layer structure, and the copper layer is attached on base material 5, and base material 5 both sides are followed successively by copper layer 1, nickel dam 2, phosphorus nickel alloy layer 3, gold layer 4 from inside to outside; Wherein nickel dam 2 thickness of contact layer are 2.0 μ m, and phosphorus nickel alloy layer 3 thickness are 0.5 μ m, and hard gold layer 4 thickness are 0.025 μ m; Weld layer nickel dam 2 is 7 μ m with phosphorus nickel alloy layer 3 total thicknesses, and soft gold layer 4 thickness are 0.4 μ m.In described phosphorus nickel alloy layer 3, to account for mass fraction be 17% to phosphorus.
Concrete electroplating technology of the present utility model is: wherein activator salt uses Act9600 activator salt or the prosperous ZA-200 of the trade Co., Ltd micro-etching agent of Kunshan pavilion of capable Co., Ltd (Technic).Wherein 40CS conducting salt, 80orosene-RC open cylinder agent # 1,80orosene-RC and open cylinder agent # 2,80orosene-RC brightener, S-1 additive, 434HS conducting salt, 434HS electrolysis additive, 434HS additive A, S-1 additive and be capable Co., Ltd (Technic) production model; The nickel wetting agent, the nickel softening agent, phosphorus nickel alloy additive is provided by Kunshan pavilion prosperous trade Co., Ltd.
1, oil removing: adopted the technique of sonic oscillation and electrolytic degreasing to do oil removal treatment to the copper face of shaping frame, used the alkaline degreasing powder, compound concentration is the solution of 70g/L, and temperature is under 55 ℃ of conditions, and controlling the electrolytic degreasing current density is 10ASD; Dip time is 18s;
2, activation: the copper face after oil removing is done activation process, the ZA-200 micro-etching agent of the 70g/L of employing and the sulfuric acid mixed solution of mass fraction 3%, under 35 ℃ of conditions of temperature, dip time is 12s;
3, nickel plating: the copper face at the shaping frame contact layer is electroplated 1.8 ~ 2.2 thick nickel dams of μ m, and the electroplating liquid medicine composition is nickel sulfamic acid 100g/L, nickel chloride 10g/L, boric acid 35g/L, nickel softening agent 4ml/L, nickel wetting agent 3ml/L; PH=3.8, temperature is 60 ℃, current density is controlled at 10 ~ 30ASD, dip time 48s;
4, electroplate phosphorus nickel: electroplate the phosphorus nickel alloy layer of 0.4 ~ 0.8 μ m on the basis of nickel dam,, the electroplating liquid medicine composition is nickel sulfamic acid 100g/L, nickel chloride 40g/L, boric acid 35g/L, 20% phosphorous acid solution 50ml/L, temperature is 50 ℃, PH=1.5, and current density is controlled at 5 ~ 15ASD.Identical liquid medicine is electroplated nickel dam and the phosphorus nickel alloy layer of total thickness 5 ± 2 μ m, dip time 48s on the second contact layer copper face;
5, gold-plated in advance: the liquid medicine composition is gold content 2g/L, uses the 40CS conducting salt to control proportion 9, PH=4.0, temperature 45 C; Dip time 9s, current density 0.3ASD;
6, the hard gold of plating: be the hard gold layer of 0.009 ~ 0.05 μ m at the foreign-plated thickness of contact layer phosphorus nickel alloy layer, the liquid medicine composition is gold content 5g/L, use 80orosene-RC to open cylinder agent # 1 and control proportion 15, it is 30g/L that 80orosene-RC opens cylinder agent # 2, and the 80orosene-RC brightener is controlled Co content at 1.0g/L, S-1 additive 4ml/L, PH=4.7, temperature is 60 ℃, dip time 12s, current density 0.2 ~ 0.72ASD;
7, plate soft gold: be the soft gold layer of 0.2 ~ 0.4 μ m at the foreign-plated thickness of weld layer phosphorus nickel alloy layer, liquid medicine composition gold content 8g/L uses 434HS conducting salt control ratio to focus on 14,434HS electrolysis additive 30g/L, 434HS additive A 2ml/L, S-1 additive 3ml/L; PH=6.0, temperature is 65 ℃, dip time 12s, current density is 2 ~ 4ASD.
The above, it is only preferred embodiment of the present utility model, be not to be the utility model to be done the restriction of other form, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solutions of the utility model content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment does, still belongs to the protection range of technical solutions of the utility model according to technical spirit of the present utility model.
Claims (4)
1. Intelligent card package framework, comprise the contact layer of base material (5), base material (5) top and the weld layer of base material (5) below, described contact layer and weld layer are composite construction, be followed successively by from inside to outside copper layer (1), nickel dam (2) and gold layer (4), it is characterized in that: increase one deck phosphorus nickel alloy layer (3) between described nickel dam (2) and gold layer (4).
2. a kind of Intelligent card package framework according to claim 1, it is characterized in that: the nickel dam of described contact layer (2) thickness is 1.8 ~ 2.2 μ m, and phosphorus nickel alloy layer (3) thickness is 0.4 ~ 0.8 μ m, and gold layer (4) thickness is 0.009 ~ 0.05 μ m.
3. a kind of Intelligent card package framework according to claim 1 and 2 is characterized in that: described weld layer nickel dam (2) is 5 ± 2 μ m with phosphorus nickel alloy layer (3) total thickness, and gold layer (4) thickness is 0.3 ± 0.1 μ m.
4. a kind of Intelligent card package framework according to claim 1 is characterized in that: the gold layer (4) of contact layer is the hard gold layer of gold cobalt alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220654491 CN203013711U (en) | 2012-12-03 | 2012-12-03 | Smart card package frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220654491 CN203013711U (en) | 2012-12-03 | 2012-12-03 | Smart card package frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203013711U true CN203013711U (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220654491 Expired - Lifetime CN203013711U (en) | 2012-12-03 | 2012-12-03 | Smart card package frame |
Country Status (1)
| Country | Link |
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| CN (1) | CN203013711U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983115A (en) * | 2012-12-03 | 2013-03-20 | 山东恒汇电子科技有限公司 | Intelligent card packaging framework |
| CN104485317A (en) * | 2014-12-24 | 2015-04-01 | 恒汇电子科技有限公司 | IC (integrated circuit) packaged carrier tape and preparation method thereof |
-
2012
- 2012-12-03 CN CN 201220654491 patent/CN203013711U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983115A (en) * | 2012-12-03 | 2013-03-20 | 山东恒汇电子科技有限公司 | Intelligent card packaging framework |
| CN102983115B (en) * | 2012-12-03 | 2015-10-28 | 恒汇电子科技有限公司 | A kind of smart card package frame |
| CN104485317A (en) * | 2014-12-24 | 2015-04-01 | 恒汇电子科技有限公司 | IC (integrated circuit) packaged carrier tape and preparation method thereof |
| CN104485317B (en) * | 2014-12-24 | 2017-06-16 | 恒汇电子科技有限公司 | A kind of IC package carrier band and preparation method thereof |
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Address after: 255086 No. 187, run Avenue, Zibo hi tech Industrial Development Zone, Shandong, China Patentee after: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 255086 No. 187, run Avenue, Zibo hi tech Industrial Development Zone, Shandong, China Patentee before: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
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Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee after: New Henghui Electronics Co.,Ltd. Address before: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee before: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
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| CX01 | Expiry of patent term |