CN102943290A - Method for electroplating of nickel-cobalt alloy on electronic packaging casing - Google Patents
Method for electroplating of nickel-cobalt alloy on electronic packaging casing Download PDFInfo
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- CN102943290A CN102943290A CN201210486279XA CN201210486279A CN102943290A CN 102943290 A CN102943290 A CN 102943290A CN 201210486279X A CN201210486279X A CN 201210486279XA CN 201210486279 A CN201210486279 A CN 201210486279A CN 102943290 A CN102943290 A CN 102943290A
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- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910000531 Co alloy Inorganic materials 0.000 title claims abstract description 23
- 238000009713 electroplating Methods 0.000 title abstract description 8
- 238000004100 electronic packaging Methods 0.000 title abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 113
- 238000007747 plating Methods 0.000 claims abstract description 105
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 56
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 53
- 239000010941 cobalt Substances 0.000 claims abstract description 53
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 53
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 239000011780 sodium chloride Substances 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims description 33
- 241000080590 Niso Species 0.000 claims description 10
- 238000005868 electrolysis reaction Methods 0.000 claims description 8
- 238000007689 inspection Methods 0.000 claims description 8
- 238000002203 pretreatment Methods 0.000 claims description 8
- 238000004458 analytical method Methods 0.000 abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010931 gold Substances 0.000 abstract description 7
- 229910052737 gold Inorganic materials 0.000 abstract description 7
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 3
- 229910005911 NiSO4-6H2O Inorganic materials 0.000 abstract 1
- 238000012805 post-processing Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 58
- 238000000576 coating method Methods 0.000 description 58
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- 150000001868 cobalt Chemical class 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 8
- 229910052721 tungsten Inorganic materials 0.000 description 8
- 239000010937 tungsten Substances 0.000 description 8
- 229910000833 kovar Inorganic materials 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000004327 boric acid Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012669 liquid formulation Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 235000015598 salt intake Nutrition 0.000 description 2
- 241000894007 species Species 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910001361 White metal Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 239000010969 white metal Substances 0.000 description 1
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- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a method for electroplating of a nickel-cobalt alloy on an electronic packaging casing. The method includes the following steps that (1) checking and preparing before plating are conducted; (2) processing before plating is conducted and includes that a surface to be plated is washed; (3) nickel is pre-plated; (4) nickel is plated; (5) the nickel-cobalt alloy is plated: an anode is a sheet nickel, electroplating liquid is composed of 180-220g/L NiSO4-6H2O, 35-45 g/L H3BO3, 10-18 g/L NaCl and 3-8 g/L CoSO4-7H2O3, and the electroplating conditions are that pH is 5-6, current density is 1-2A/dm2, and the temperature is 50-60 DEG C; (6) gold is pre-plated; (7) gold is plated; (8) post-processing is conducted. Samples are plated by using the electroplating liquid and the electroplating conditions, cobalt content in the nickel-cobalt plating can be controlled to be 15%-30% stably, and a requirement that a theoretical analysis value of cobalt content in the plating is larger than or equal to 10.5% can be met.
Description
Technical field
The present invention relates to a kind of method of nickel-cobalt alloy plating, especially a kind of method of electronic encapsulation shell nickel-cobalt alloy plating.
Background technology
Nickel-cobalt alloy plating in industrial application usually as fancy alloy and magneticalloy.The nickel cobalt (alloy) of cobalt contents below 30% has the white metal outward appearance, and hardness is moderate, and good wear resistance and chemical stability are arranged.At present, disclosed Application to Electronic Industry is mainly used in the disk of computer storage system, the surface magnetism coating of magnetic drum at home.From the 90's of 20th century, some countries successively adopt the nickel-cobalt alloy plating of w (Co) 5%～40% to replace nickel coating in ceramic packing.Nickel cobalt (alloy) is than the more efficiently diffusion impervious layer of nickel.The present invention has researched and developed a kind of Ni-Co alloy electroplating process, this process application is in the manufacturing of electronic encapsulation shell, with the prime coat of nickel-cobalt alloy plating as the electronic encapsulation shell Gold plated Layer, can effectively improve the reliability of electronic encapsulation shell chip high-temperature soldering, and improve its high temperature resistance metachrosis, nickel improves performance and the reliability step of ceramic packing shell to gold layer surface diffusion problem under brittle cracking problem when effectively avoiding by pure nickel as gold layer prime coat and the high temperature.
For the electronic encapsulation shell application requiring, cobalt contents in the nickel cobalt (alloy) is vital, the present invention realizes the control of cobalt contents in the nickel-cobalt alloy plating by the preparation of nickel-cobalt alloy plating plating bath, electroplating current density control, reaches the electronic encapsulation shell application requiring.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of method of electronic encapsulation shell nickel-cobalt alloy plating, and nickel cobalt coating cobalt contents can be stablized and is controlled between 15%～30%, can satisfy the theoretical analysis value requirement of coating cobalt contents 〉=10.5%.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of method of electronic encapsulation shell nickel-cobalt alloy plating may further comprise the steps: prepare before plating front inspection and plating (1); (2) plating pre-treatment: surface to be plated is cleaned; (3) nickel preplating; (4) nickel plating; (5) nickel plating cobalt: anode is sheet nickel,
Consisting of of electroplate liquid:
NiSO
4·6H
2O 180～220 g/L
H
3BO
3 35～45g/L
CoSO
4·7H
2O 3～8g/L；
The plating condition is: pH is that 5～6 current densities are 1～2A/dm
2Temperature is 50～60 ℃;
(6) gold-plated in advance; (7) gold-plated; (8) aftertreatment.
The purity of anode electrolysis nickel plate is 99.99%.
CoSO in the electroplate liquid
47H
2The optimum content of O is 5g/L.
Optimum current density is 1A/dm
2
Use electroplate liquid of the present invention and plating condition to carry out the sample plating, its nickel cobalt coating cobalt contents can be stablized and is controlled between 15%～30%, can satisfy the theoretical analysis value requirement of the theoretical minimum cobalt contents 10.5% of the reliable welding of electronic encapsulation shell chip.
The electronickelling cobalt liquor adopts single nickel salt and rose vitriol for the main salt of two metal ion species is provided, and the advantage of two kinds of main salt is low prices, is easy to buying, reliable in quality.It is the PH buffer reagent that plating bath adopts boric acid, and sodium-chlor is the anode activator, and these two kinds of solution additives are that nickel plating solution is used ripe additive, and are reliable and stable.High-purity sheet nickel of employing 99.99% avoids metallic impurity to introduce as anode.
The effect of boric acid is the PH of buffering plating bath, and its content range is that the pH value that need control with plating bath is relevant, and the concentration range in the prescription can guarantee the pH value of plating bath in 5～6 scopes, and plays preferably PH shock absorption in this scope.The too high levels of boric acid can cause the solution pH value to reduce, the pH value buffering range is offset to low value, and boric acid content is crossed the low plating bath pH value that then causes and raise, and the pH value buffering range is offset to the high value, can cause like this plating bath pH value to exceed the processing parameter requirement, affect the plating bath plating performance.
The effect of sodium-chlor is the anode activator, prevents anode (sheet nickel) passivation in the plating process, promotes the nickel plate normally to dissolve.Sodium chloride concentration is excessively low, can not well guarantee the activity of anode nickel plates, and passivation phenomenon can occur; Sodium chloride concentration is too high can to cause the positive plate excessive erosion again, causes the problems such as coating grain raising.
More than the concentration range of two kinds of salt are optimum ranges suitable of the present invention that contrast draws through lot of experiments, can guarantee solution stability, can guarantee again the reliability of nickel cobalt coating.
Opening the cylinder plating bath namely is the plating bath for preparing for the first time, the plating bath of for the first time plating use.Require the new plating bath of preparation all to call off the cylinder plating bath according to prescription at every turn.
One, the control techniques of coating cobalt contents
In the electronickelling cobalt liquor of the present invention system, its coating cobalt contents mainly relies in the plating bath cobalt salt concentration to control, the cobalt salt change in concentration, and the cobalt contents that then deposits in the coating also can correspondingly change.In addition, because coexistence two metal ion species (nickel ion and cobalt ion) in the plating bath, the sedimentation potential of the two is differentiated, the electropotential of nickel is-0.250V, the electropotential of cobalt is-0.277V that in the plating process, the variation of current density can cause that also nickel cobalt deposition ratio changes.
More than the variation of two kinds of factors determined the variation of cobalt contents in the coating, therefore, respectively the cobalt contents corresponding relation in cobalt salt concentration, plating current density and the coating in the plating bath is studied, draw the optimal processing parameter span of control.
By accompanying drawing 1 as can be known, along with the raising of cobalt salt concentration in the plating bath, the corresponding raising of the cobalt contents in the coating, after cobalt salt concentration reached 4g/L in the plating bath, the cobalt contents in the coating slowed down, and is relatively stable, wherein NiSO
46H
2The content of O is 200g/L, H
3BO
3Content be 40g/L, the content of NaCl is 15g/L, the plating condition is: pH is 5, current density is 1A/dm
2, temperature is 50 ℃; In conjunction with the plating bath cost consideration, open in the cylinder electroplate liquid formulation cobalt salt concentration take 5g/L as best, both guaranteed that cobalt contents was stable in the coating, be convenient to again save the cobalt salt consumption, cobalt salt concentration is controlled with the chemical titration analysis method in the plating bath, when plating bath of the present invention and other given parameters of plating condition during in above-mentioned range cobalt salt concentration 5g/L all be optimum value.
By accompanying drawing 2 as can be known, in whole current density parameters of test, the coating cobalt contents all can satisfy 〉=10.5% requirement, and therefore, the current density parameter affects less to the coating cobalt contents comparatively speaking.Current density is at 1.5～2 A/dm
2In the interval, cobalt contents changes steadily in the coating, but under the exploitation bath system determined, high current density was unfavorable for the thickness of coating homogeneity, and lower current densities can cause that again Deposit appearance changes, as at 0.5 A/dm
2Under the current density, obfuscation appears in coating, and pin hole is arranged, wherein NiSO
46H
2The content of O is 200 g/L, H
3BO
3Content be 40g/L, the content of NaCl is 15g/L, CoSO
47H
2O 5g/L, the plating condition is: pH is 5, temperature is 50 ℃.Synthetic study current density optimum controlling point is with 1 A/dm
2Be advisable, under this current density, the coating cobalt contents can meet the reliable welding requirements of chip, and the coating deposition is even simultaneously, well-crystallized, bright appearance.As plating bath of the present invention and other given parameters of plating condition current density 1 A/dm during in above-mentioned range
2It all is optimum value.
The used nickel cobalt of the present invention coating is the block of having used the anti-dissimilar metal diffusion of nickel cobalt coating, is the extraordinary coating of developing according to electronic encapsulation shell self material structure characteristics and subsequent applications condition.
Electronic encapsulation shell need to carry out 420 ℃ of sinterable silicon chips, under 420 ℃ of high temperature actions, silicon in the silicon can be diffused in the nickel layer of electronic encapsulation shell, cause nickel coating embrittlement cracking, and after in electronic encapsulation shell coating, introducing nickel cobalt coating, nickel cobalt coating can prevent the thermodiffusion of silicon, thereby prevents from occurring nickel coating brittle cracking problem in the shell coating structure, improves its application reliability.
Have 300 ℃ in the electronic encapsulation shell subsequent applications, the bake process of 30min, with this understanding, nickel in the shell nickel layer can be diffused rapidly in the Gold plated Layer of case surface, affects the Gold plated Layer function and uses, and adds nickel cobalt coating, nickel in the nickel cobalt coating can be subject to the constraint of cobalt, can guarantee under the follow-up high temperature application conditions of shell, the diffusion of the golden layer function that do not make a difference, thus improve the shell application reliability.
Electronic encapsulation shell is to be made of a variety of materials, and substantially can be divided into two classes, and a class is metallic substance, and common metal is kovar alloy (iron, cobalt, nickelalloy), oxygen free copper; Another kind of is stupalith, and pottery is alumina-ceramic, the tungsten metal paste of surperficial sintering conduction, and the first plating in tungsten metal paste surface has one deck to electroplate pure nickel or chemical plating nickel-phosphorus alloy, plated nickel cobalt again on it.
The beneficial effect that adopts technique scheme to produce is: electroplate liquid of the present invention and plating condition are carried out the sample plating, and nickel cobalt coating cobalt contents can be stablized and is controlled between 15%～30%, can satisfy the theoretical analysis value requirement of coating cobalt contents 〉=10.5%.It is stable to open when cobalt salt concentration is 5g/L in the cylinder electroplate liquid formulation coating cobalt contents, is convenient to again save the cobalt salt consumption; Current density 1 A/dm
2The time coating cobalt contents can meet the reliable welding requirements of chip, simultaneously the coating deposition evenly, well-crystallized, bright appearance.
Introduce nickel cobalt coating in electronic encapsulation shell coating after, nickel cobalt coating can prevent the thermodiffusion of silicon, thereby prevents from occurring nickel coating brittle cracking problem in the shell coating structure, improves its application reliability.Nickel in the nickel cobalt coating can be subject to the constraint of cobalt, can guarantee under the follow-up high temperature application conditions of shell, and the diffusion of the golden layer function that do not make a difference, thus improve the shell application reliability.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is the corresponding relation curve of plating bath cobalt salt concentration and coating cobalt contents;
Fig. 2 is current density and the corresponding curve of coating cobalt contents.
Embodiment
Embodiment 1
A kind of method of electronic encapsulation shell nickel-cobalt alloy plating may further comprise the steps: prepare before electronic encapsulation shell to be plated (material is kovar alloy+ceramic tungsten metallization) is plated front inspection and plating (1); (2) plating pre-treatment: surface to be plated is cleaned; (3) nickel preplating; (4) nickel plating; (5) nickel plating cobalt: the purity of anode electrolysis nickel plate is 99.99%,
Consisting of of electroplate liquid:
NiSO
4·6H
2O 200 g/l
H
3BO
3 40g/L
NaCl 15g/L
CoSO
4·7H
2O 5g/L；
The plating condition is: pH is that 5 current densities are 1A/dm
2Temperature is 50 ℃;
(6) gold-plated in advance; (7) gold-plated; (8) aftertreatment.
Nickel cobalt coating cobalt contents is 24.9%, satisfies the theoretical analysis value requirement of coating cobalt contents 〉=10.5%.
Embodiment 2
A kind of method of electronic encapsulation shell nickel-cobalt alloy plating may further comprise the steps: prepare before electronic encapsulation shell to be plated (material is kovar alloy+ceramic tungsten metallization) is plated front inspection and plating (1); (2) plating pre-treatment: surface to be plated is cleaned; (3) nickel preplating; (4) nickel plating; (5) nickel plating cobalt: the purity of anode electrolysis nickel plate is 99.99%,
Consisting of of electroplate liquid:
NiSO
4·6H
2O 180 g/L
H
3BO
3 45g/L
NaCl 10g/L
CoSO
4·7H
2O 3g/L；
The plating condition is: pH is that 6 current densities are 1.5A/dm
2Temperature is 60 ℃;
(6) gold-plated in advance; (7) gold-plated; (8) aftertreatment.
Nickel cobalt coating cobalt contents is 17.3%, satisfies the theoretical analysis value requirement of coating cobalt contents 〉=10.5%.
Embodiment 3
A kind of method of electronic encapsulation shell nickel-cobalt alloy plating may further comprise the steps: prepare before electronic encapsulation shell to be plated (material is kovar alloy+ceramic tungsten metallization) is plated front inspection and plating (1); (2) plating pre-treatment: surface to be plated is cleaned; (3) nickel preplating; (4) nickel plating; (5) nickel plating cobalt: the purity of anode electrolysis nickel plate is 99.99%,
Consisting of of electroplate liquid:
NiSO
4·6H
2O 220 g/L
H
3BO
3 35g/L
NaCl 18g/L
CoSO
4·7H
2O 8g/L；
The plating condition is: pH is that 5 current densities are 1A/dm
2Temperature is 60 ℃;
(6) gold-plated in advance; (7) gold-plated; (8) aftertreatment.
Nickel cobalt coating cobalt contents is 26.9%, satisfies the theoretical analysis value requirement of coating cobalt contents 〉=10.5%.
Embodiment 4
A kind of method of electronic encapsulation shell nickel-cobalt alloy plating may further comprise the steps: prepare before electronic encapsulation shell to be plated (material is kovar alloy+ceramic tungsten metallization) is plated front inspection and plating (1); (2) plating pre-treatment: surface to be plated is cleaned; (3) nickel preplating; (4) nickel plating; (5) nickel plating cobalt: the purity of anode electrolysis nickel plate is 99.99%,
Consisting of of electroplate liquid:
NiSO
4·6H
2O 190 g/L
H
3BO
3 42g/L
NaCl 16g/L
CoSO
4·7H
2O 4g/L；
The plating condition is: pH is that 5.5 current densities are 1.5A/dm
2Temperature is 50 ℃;
(6) gold-plated in advance; (7) gold-plated; (8) aftertreatment.
Nickel cobalt coating cobalt contents is 23.3%, satisfies the theoretical analysis value requirement of coating cobalt contents 〉=10.5%.
A kind of method of electronic encapsulation shell nickel-cobalt alloy plating may further comprise the steps: prepare before electronic encapsulation shell to be plated (material is kovar alloy+ceramic tungsten metallization) is plated front inspection and plating (1); (2) plating pre-treatment: surface to be plated is cleaned; (3) nickel preplating; (4) nickel plating; (5) nickel plating cobalt: the purity of anode electrolysis nickel plate is 99.99%,
Consisting of of electroplate liquid:
NiSO
4·6H
2O 210 g/L
H
3BO
3 38g/L
NaCl 14g/L
CoSO
4·7H
2O 6g/L；
The plating condition is: pH is that 5 current densities are 1A/dm
2Temperature is 50 ℃;
(6) gold-plated in advance; (7) gold-plated; (8) aftertreatment.
Nickel cobalt coating cobalt contents is 24.2%, satisfies the theoretical analysis value requirement of coating cobalt contents 〉=10.5%.
A kind of method of electronic encapsulation shell nickel-cobalt alloy plating may further comprise the steps: prepare before electronic encapsulation shell to be plated (material is kovar alloy+ceramic tungsten metallization) is plated front inspection and plating (1); (2) plating pre-treatment: surface to be plated is cleaned; (3) nickel preplating; (4) nickel plating; (5) nickel plating cobalt: the purity of anode electrolysis nickel plate is 99.99%,
Consisting of of electroplate liquid:
NiSO
4·6H
2O 200 g/L
H
3BO
3 41g/L
NaCl 16g/L
CoSO
4·7H
2O 5g/L；
The plating condition is: pH is that 5 current densities are 1A/dm
2Temperature is 50 ℃;
(6) gold-plated in advance; (7) gold-plated; (8) aftertreatment.
Nickel cobalt coating cobalt contents is 25.3%, satisfies the theoretical analysis value requirement of coating cobalt contents 〉=10.5%.
Claims (4)
1. the method for an electronic encapsulation shell nickel-cobalt alloy plating is characterized in that may further comprise the steps: prepare before plating front inspection and plating (1); (2) plating pre-treatment: surface to be plated is cleaned; (3) nickel preplating; (4) nickel plating; (5) nickel plating cobalt: anode is sheet nickel,
Consisting of of electroplate liquid:
NiSO
4·6H
2O 180～220 g/L
H
3BO
3 35～45g/L
NaCl 10～18g/L
CoSO
4·7H
2O 3～8g/L；
The plating condition is: pH is that 5～6 current densities are 1～2A/dm
2Temperature is 50～60 ℃;
(6) gold-plated in advance; (7) gold-plated; (8) aftertreatment.
2. the method for electronic encapsulation shell nickel-cobalt alloy plating as claimed in claim 1, it is characterized in that: the purity of anode electrolysis nickel plate is 99.99%.
3. the method for electronic encapsulation shell nickel-cobalt alloy plating as claimed in claim 1 is characterized in that: CoSO in the electroplate liquid
47H
2The content of O is 5g/L.
4. the method for electronic encapsulation shell nickel-cobalt alloy plating as claimed in claim 1, it is characterized in that: current density is 1A/dm
2
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| CN201210486279.XA CN102943290B (en) | 2012-11-26 | 2012-11-26 | Method for electroplating of nickel-cobalt alloy on electronic packaging casing |
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|---|---|---|---|
| CN201210486279.XA CN102943290B (en) | 2012-11-26 | 2012-11-26 | Method for electroplating of nickel-cobalt alloy on electronic packaging casing |
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|---|---|
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| CN102943290B CN102943290B (en) | 2015-06-10 |
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| CN103510084A (en) * | 2013-09-24 | 2014-01-15 | 宜兴市吉泰电子有限公司 | Preoxidation method of kovar leads for metal housings |
| CN103757674A (en) * | 2013-12-20 | 2014-04-30 | 中国电子科技集团公司第五十五研究所 | Nickel plating method for tungsten-copper composite material |
| CN103911634A (en) * | 2014-03-06 | 2014-07-09 | 中国电子科技集团公司第五十五研究所 | Surface nickel plating method for molybdenum-based composite material |
| CN109321957A (en) * | 2018-10-24 | 2019-02-12 | 中国电子科技集团公司第五十五研究所 | A kind of environment-friendly type shell plating pre-treatment etching solution technique and coating method |
| CN109628964A (en) * | 2018-12-28 | 2019-04-16 | 浙江长兴电子厂有限公司 | A kind of no lead ceramic package case electroplating technique |
| CN114686942A (en) * | 2022-03-31 | 2022-07-01 | 华源隆精密五金制造(惠州)有限公司 | Production method of high-strength battery shell metal material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102618894A (en) * | 2012-04-01 | 2012-08-01 | 昆明理工大学 | Method for preparing thin-wall parts by using electroforming nickel-cobalt alloy |
-
2012
- 2012-11-26 CN CN201210486279.XA patent/CN102943290B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102618894A (en) * | 2012-04-01 | 2012-08-01 | 昆明理工大学 | Method for preparing thin-wall parts by using electroforming nickel-cobalt alloy |
Non-Patent Citations (1)
| Title |
|---|
| 李玮: "用于锂离子电池钢壳的镀镍钴钢带制备工艺及耐蚀性研究", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 * |
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| CN103510084A (en) * | 2013-09-24 | 2014-01-15 | 宜兴市吉泰电子有限公司 | Preoxidation method of kovar leads for metal housings |
| CN103757674A (en) * | 2013-12-20 | 2014-04-30 | 中国电子科技集团公司第五十五研究所 | Nickel plating method for tungsten-copper composite material |
| CN103757674B (en) * | 2013-12-20 | 2017-01-04 | 中国电子科技集团公司第五十五研究所 | A kind of nickel plating process of tungsten-copper composite material |
| CN103911634A (en) * | 2014-03-06 | 2014-07-09 | 中国电子科技集团公司第五十五研究所 | Surface nickel plating method for molybdenum-based composite material |
| CN103911634B (en) * | 2014-03-06 | 2016-09-21 | 中国电子科技集团公司第五十五研究所 | A kind of plating nickel on surface method of molybdenum-base composite material |
| CN109321957A (en) * | 2018-10-24 | 2019-02-12 | 中国电子科技集团公司第五十五研究所 | A kind of environment-friendly type shell plating pre-treatment etching solution technique and coating method |
| CN109321957B (en) * | 2018-10-24 | 2023-01-17 | 中国电子科技集团公司第五十五研究所 | Environment-friendly shell plating pretreatment etching solution process and plating method |
| CN109628964A (en) * | 2018-12-28 | 2019-04-16 | 浙江长兴电子厂有限公司 | A kind of no lead ceramic package case electroplating technique |
| CN114686942A (en) * | 2022-03-31 | 2022-07-01 | 华源隆精密五金制造(惠州)有限公司 | Production method of high-strength battery shell metal material |
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