CN109628964A - A kind of no lead ceramic package case electroplating technique - Google Patents
A kind of no lead ceramic package case electroplating technique Download PDFInfo
- Publication number
- CN109628964A CN109628964A CN201811620847.4A CN201811620847A CN109628964A CN 109628964 A CN109628964 A CN 109628964A CN 201811620847 A CN201811620847 A CN 201811620847A CN 109628964 A CN109628964 A CN 109628964A
- Authority
- CN
- China
- Prior art keywords
- ceramic package
- gold
- nickel
- lead
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
The invention discloses a kind of no lead ceramic package case electroplating techniques, with following steps: the pretreatment of step 1, no lead ceramic package shell is cleaned to filling electro-insulating rubber column in the accommodating chamber seal mouth ring of no lead ceramic package shell and in alkaline degreaser；Pickling, nickel preplating, nickel plating, heat treatment is repeated to ceramic package shell nickel plating in step 2, Nickel Plating Treatment；Electro-insulating rubber column is taken out from seal mouth ring and carries out fastness detection by step 3, subsequent processing；The step of gold-plated processing being added in step 2 and step 3, carries out pre- gold-plated, gold-plated processing to the ceramic package shell after Nickel Plating Treatment.The present invention has the beneficial effect for preventing sealing blocking ring and electroplating velocity block in electroplating process, is mainly used for the plating to the ceramic package shell of no lead.
Description
Technical field
The invention belongs to ceramic package case electroplating technical field more particularly to a kind of no lead ceramic package case electroplatings
Technique.
Background technique
The plating nickel cobalt technique of semiconductive ceramic package casing routine uses the sulfamate solution of nickel as electroplate liquid,
And sulfamic acid cobalt is added in the solution to realize nickel-cobalt alloy plating coating.The ceramic package shell installed additional for no lead
The upper seal mouth ring existed for installing lead, is easy to block seal mouth ring in the plating process；Simultaneously because to ceramics
The processing of package casing is repeatedly lasting plating, therefore electroplating efficiency is lower.
Summary of the invention
The present invention provides a kind of no lead ceramic package case electroplating technique, it is intended to solve above-mentioned to make pottery to no lead
The technical problem for carrying out blocking and electroplating technology is slower to its seal mouth ring is easy when porcelain package casing is electroplated.
The invention is realized in this way a kind of no lead ceramic package case electroplating technique, has following steps:
Step 1, the pretreatment of no lead ceramic package shell
Electro-insulating rubber column will be filled in the accommodating chamber seal mouth ring of no lead ceramic package shell first closely to block seal mouth ring, institute
Both ends one end length of electro-insulating rubber column pass-out seal mouth ring is stated, will be cleaned in alkaline degreaser without lead ceramic package shell；
Step 2, Nickel Plating Treatment
1) pickling is handled, and cleaning is completed dry as clearing up after impregnating in hydrochloric acid solution it without lead ceramic package shell
Only；
2) it will be placed in pre-nickel plating solution without lead ceramic package shell and carry out nickel plating, taken out after 1~10min of nickel plating and cleaned dry
Only；
3) nickel plating is carried out in nickel system mixed solution, is taken out and is cleaned up after 0.5~15min of nickel plating；
4) it is heated to 120~600 DEG C under hydrogen or nitrogen atmosphere, is heat-treated 1.5~5h；
5) by 1) thickening to step 4) to nickel coating in repeating said steps two, make 0.5~10 μm of nickel layer thickness；
Step 3, subsequent processing
1) to no lead ceramics after the electro-insulating rubber column filled in the accommodating chamber seal mouth ring of no lead ceramic package shell being taken out
Package casing and accommodating chamber seal mouth ring are cleaned；
2) fastness detection is carried out to nickel coating, whether determination is qualified without lead ceramic package shell after Nickel Plating Treatment.
Continue after the completion of the step of the step of gold-plated processing can be added after the completion of the step 2, the gold-plated processing into
The respective handling of the row step 3, the specific steps of the gold-plated processing are as follows:
1) will be gold-plated as being carried out in pre- gold plating solution without lead ceramic package shell by Nickel Plating Treatment, gold-plated 0.5~
It takes out and cleans up after 10min；
2) it is carried out in gold plating solution gold-plated, takes out and clean up after gold-plated 1~30min, plated thickness is made to be set as 0.1
~20 μm.
The sectional dimension of electro-insulating rubber column used in the step 1 is identical as the size of the seal mouth ring, the insulation
Rubber column uses thermoset rubber, and the length of the electro-insulating rubber column pass-out seal mouth ring is greater than or equal to nickel coating and Gold plated Layer
Overall thickness.
The same end of the electro-insulating rubber column, which is fixedly connected, constitutes unified entirety, to no lead ceramic package shell
Each group electro-insulating rubber column carries out unified closure when accommodating chamber seal mouth ring is blocked.
The concentration of hydrochloric acid of hydrochloric acid solution used in the step 2 be set as 10~30%, pH value be set as 0~4.0 it
Between, temperature setting be 20~90 DEG C, pickling handle 1~20min after taking-up cleaned up with clear water.
Pre-nickel plating solution uses the mixed solution of nickel chloride and hydrochloric acid in the step 2, wherein nickel concentration be set as 75~
90g/L, pH are set as 2.6~5.0,0.1~20.0A/dm2 of current density, and 0.5~10min is electroplated at 20~80 DEG C of temperature
It is cleaned up afterwards with clear water.
Nickel system mixed solution uses nickel sulfamic acid solution in the step 2, and wherein nickel concentration is set as 80~90g/
L, PH are set as 2.6~5.0, according at 0.1~20.0A/dm2 of current density, 30~60 DEG C of temperature, nickel plating 0.5 wherein
Taking-up is cleaned up with clear water after~15min.
Gold content is set as 2~4g/L in pre- gold plating solution in the gold-plated processing step, and pH is set as 3.5~
4.5, specific gravity is set as 11~14 Be, takes out according under 1~2A/dm2 of current density, after pre- gold-plated 0.5~10min with clear
Water cleans up.
Gold content is set as 6~8g/L in gold plating solution in the gold-plated processing step, and pH is set as 5.0~
7.0, specific gravity is set as 11~16 Be, and according under 0.1~2A/dm2 of current density, 1~30min of gold-plated processing is taken out with clear
Water is rinsed and is dried.
Fastness detection is carried out to nickel coating or nickel plating, layer gold in the step 3, through 470 DEG C ± 10 DEG C of nitrogen atmosphere
Lower heating 60s is heated 120s examination under 450 DEG C ± 10 DEG C of air atmosphere, the fried porcelain of nothing, bubbling and spallation problems, that is, generation
Table is qualified without lead ceramic package shell.
Compared with prior art, the beneficial effects of the present invention are: in the accommodating chamber seal mouth ring without lead ceramic package shell
Filling electro-insulating rubber column closely blocks seal mouth ring, guarantees that electro-insulating rubber column carries out stabilized seal to seal mouth ring, avoids nickel, gold electricity
It is plating to the inside of seal mouth ring, electro-insulating rubber column uses thermoset rubber, the guarantor when heating to no lead ceramic package shell
It demonstrate,proves electro-insulating rubber column and seal mouth ring is in close contact；It will be in the accommodating chamber seal mouth ring of no lead ceramic package shell after the completion of plating
The electro-insulating rubber column of filling carries out clear realization electroplating process to no lead ceramic package shell and accommodating chamber seal mouth ring after taking out
In do not block the purpose of seal mouth ring；By increasing nickel, gold concentration ratio and electricity when to no lead ceramic package case electroplating
It is electroplated in solution temperature, current density acceleration.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
Embodiment 1
A kind of no lead ceramic package case electroplating technique has following steps:
Step 1, the pretreatment of no lead ceramic package shell
Electro-insulating rubber column will be filled in the accommodating chamber seal mouth ring of no lead ceramic package shell first closely to block seal mouth ring, absolutely
Both ends one end length of edge rubber column pass-out seal mouth ring will clean in alkaline degreaser without lead ceramic package shell；
Step 2, Nickel Plating Treatment
1) pickling is handled, and cleaning is completed dry as clearing up after impregnating in hydrochloric acid solution it without lead ceramic package shell
Only；
2) it will be placed in pre-nickel plating solution without lead ceramic package shell and carry out nickel plating, taken out after 1~10min of nickel plating and cleaned dry
Only；
3) nickel plating is carried out in nickel system mixed solution, is taken out and is cleaned up after 0.5~15min of nickel plating；
4) it is heated to 120~600 DEG C under hydrogen or nitrogen atmosphere, is heat-treated 1.5~5h；
5) by 1) thickening to step 4) to nickel coating in repetition step 2, make 0.5~10 μm of nickel layer thickness；
Step 3, subsequent processing
1) to no lead ceramics after the electro-insulating rubber column filled in the accommodating chamber seal mouth ring of no lead ceramic package shell being taken out
Package casing and accommodating chamber seal mouth ring are cleaned；
2) fastness detection is carried out to nickel coating, whether determination is qualified without lead ceramic package shell after Nickel Plating Treatment.
Continue after the completion of the step of the step of gold-plated processing can be added in the present invention, after the completion of step 2, gold-plated processing
Carry out the respective handling of step 3, the specific steps of gold-plated processing are as follows:
1) will be gold-plated as being carried out in pre- gold plating solution without lead ceramic package shell by Nickel Plating Treatment, gold-plated 0.5~
It takes out and cleans up after 10min；
2) it is carried out in gold plating solution gold-plated, takes out and clean up after gold-plated 1~30min, plated thickness is made to be set as 0.1
~20 μm；
Carry out gold-plated processing without lead ceramic package shell to after Nickel Plating Treatment, according to the model of ceramic package shell come
Determine whether to carry out gold-plated processing；
The sectional dimension of electro-insulating rubber column and the size of seal mouth ring used in step 1 are identical, guarantee electro-insulating rubber column to sealing
Ring carries out stabilized seal, and nickel, gold is avoided to be electroplated to the inside of seal mouth ring, and electro-insulating rubber column uses thermoset rubber, draws to nothing
Guarantee that electro-insulating rubber column and seal mouth ring are in close contact when line ceramic package shell is heated, electro-insulating rubber column pass-out seal mouth ring
Length is greater than or equal to the overall thickness of nickel coating and Gold plated Layer, stablizes nickel coating, Gold plated Layer along electro-insulating rubber column and is electroplated, keeps away
Exempt to block seal mouth ring after the completion of plating；
The same end of electro-insulating rubber column, which is fixedly connected, constitutes unified entirety, in the accommodating chamber envelope to no lead ceramic package shell
Each group electro-insulating rubber column carries out unified closure when choma is blocked, and facilitates the installation and removal of electro-insulating rubber column；
The concentration of hydrochloric acid of hydrochloric acid solution used in step 2 is set as that 10~30%, pH value is set as between 0~4.0, temperature is set
20~90 DEG C are set to, taking-up is cleaned up with clear water after pickling handles 1~20min；
Pre-nickel plating solution uses the mixed solution of nickel chloride and hydrochloric acid in step 2, and wherein nickel concentration is set as 75~90g/L, pH
It is set as 2.6~5.0,0.1~20.0A/dm2 of current density, uses clear water after 0.5~10min is electroplated at 20~80 DEG C of temperature
It cleans up；
Nickel system mixed solution uses nickel sulfamic acid solution in step 2, and wherein nickel concentration is set as 80~90g/L, and PH is set
2.6~5.0 are set to, according at 0.1~20.0A/dm2 of current density, 30~60 DEG C of temperature, wherein after 0.5~15min of nickel plating
Taking-up is cleaned up with clear water；
Gold content is set as 2~4g/L in pre- gold plating solution in gold-plated processing step, and pH is set as 3.5~4.5, ratio
It resets and is set to 11~14 Be, according under 1~2A/dm2 of current density, taking-up is cleaned dry with clear water after pre- gold-plated 0.5~10min
Only；
Gold content is set as 6~8g/L in gold plating solution in gold-plated processing step, and pH is set as 5.0~7.0, specific gravity
11~16 Be are set as, according under 0.1~2A/dm2 of current density, 1~30min of gold-plated processing, taking-up clear water is rinsed and dried
It is dry；
Fastness detection is carried out to nickel coating or nickel plating, layer gold in step 3, through heating under 470 DEG C ± 10 DEG C of nitrogen atmospheres
60s is examined through heating 120s under 450 DEG C ± 10 DEG C of air atmosphere, is to represent nothing to draw without porcelain, bubbling and spallation problems are fried
Line ceramic package shell is qualified.
Embodiment 2
A kind of no lead ceramic package case electroplating technique has following steps:
Step 1, the pretreatment of no lead ceramic package shell
Electro-insulating rubber column will be filled in the accommodating chamber seal mouth ring of no lead ceramic package shell first closely to block seal mouth ring, absolutely
Both ends one end length of edge rubber column pass-out seal mouth ring will clean in alkaline degreaser without lead ceramic package shell；
Step 2, Nickel Plating Treatment
1) pickling is handled, and cleaning is completed dry as clearing up after impregnating in hydrochloric acid solution it without lead ceramic package shell
Only, the concentration of hydrochloric acid of hydrochloric acid solution be set as 30%, pH value be set as 1.0 between, temperature setting be 90 DEG C, pickling handle 2min after
Taking-up is cleaned up with clear water；
2) it will be placed in pre-nickel plating solution without lead ceramic package shell and carry out nickel plating, pre-nickel plating solution uses nickel chloride and hydrochloric acid
Mixed solution, wherein nickel concentration is set as 90g/L, and pH is set as 2.6, and current density is set as 20.0A/dm2, at 80 DEG C
It is cleaned up after plating 1min with clear water；
3) nickel plating is carried out in nickel system mixed solution, nickel system mixed solution uses nickel sulfamic acid solution, wherein nickel concentration
It is set as 90g/L, PH is set as 2.6, according under current density 20.0A/dm2, temperature 60 C, takes after nickel plating 1min wherein
It is cleaned up out with clear water；
4) it is heated to 300 DEG C under hydrogen or nitrogen atmosphere, is heat-treated 3h, avoids the excessively high influence electro-insulating rubber column of temperature and sealing
The close contact of ring；
5) by 1) thickening to step 4) to nickel coating in repetition step 2, make 0.5~10 μm of nickel layer thickness；
Step 3, subsequent processing
1) to no lead ceramics after the electro-insulating rubber column filled in the accommodating chamber seal mouth ring of no lead ceramic package shell being taken out
Package casing and accommodating chamber seal mouth ring are cleaned；
2) fastness detection is carried out to nickel coating, whether determination is qualified without lead ceramic package shell after Nickel Plating Treatment,
60s is heated under 470 DEG C ± 10 DEG C of nitrogen atmospheres or through heating 120s examination, nothing under 450 DEG C ± 10 DEG C of air atmosphere
It is qualified without lead ceramic package shell that fried porcelain, bubbling and spallation problems are represented.
Embodiment 3
A kind of no lead ceramic package case electroplating technique has following steps:
Step 1, the pretreatment of no lead ceramic package shell
Electro-insulating rubber column will be filled in the accommodating chamber seal mouth ring of no lead ceramic package shell first closely to block seal mouth ring, absolutely
Both ends one end length of edge rubber column pass-out seal mouth ring will clean in alkaline degreaser without lead ceramic package shell；
Step 2, Nickel Plating Treatment
1) pickling is handled, and cleaning is completed dry as clearing up after impregnating in hydrochloric acid solution it without lead ceramic package shell
Only, the concentration of hydrochloric acid of hydrochloric acid solution be set as 30%, pH value be set as 1.0 between, temperature setting be 90 DEG C, pickling handle 2min after
Taking-up is cleaned up with clear water；
2) it will be placed in pre-nickel plating solution without lead ceramic package shell and carry out nickel plating, pre-nickel plating solution uses nickel chloride and hydrochloric acid
Mixed solution, wherein nickel concentration is set as 90g/L, and pH is set as 2.6, and current density is set as 20.0A/dm2, at 80 DEG C
It is cleaned up after plating 1min with clear water；
3) nickel plating is carried out in nickel system mixed solution, nickel system mixed solution uses nickel sulfamic acid solution, wherein nickel concentration
It is set as 90g/L, PH is set as 2.6, according under current density 20.0A/dm2, temperature 60 C, takes after nickel plating 1min wherein
It is cleaned up out with clear water；
4) it is heated to 300 DEG C under hydrogen or nitrogen atmosphere, is heat-treated 3h, avoids the excessively high influence electro-insulating rubber column of temperature and sealing
The close contact of ring；
5) by 1) thickening to step 4) to nickel coating in repetition step 2, make 0.5~10 μm of nickel layer thickness；
Step 3, gold-plated processing
1) the gold-plated as carrying out in pre- gold plating solution without lead ceramic package shell of Nickel Plating Treatment will be passed through, in pre- gold plating solution
Gold content is set as 4g/L, and pH is set as 3.5, and specific gravity is set as 11~14 Be, according under 1~2A/dm2 of current density,
Taking-up is cleaned up with clear water after pre- gold-plated 1min；
2) carried out in gold plating solution gold-plated, gold content is set as 8g/L in gold plating solution, and pH is set as 5.0, than reseting
11~16 Be are set to, according under 0.1~2A/dm2 of current density, gold-plated processing 5min, taking-up clear water is rinsed and dried, makes
Plated thickness is set as 0.1~20 μm；
Step 4, subsequent processing
1) to no lead ceramics after the electro-insulating rubber column filled in the accommodating chamber seal mouth ring of no lead ceramic package shell being taken out
Package casing and accommodating chamber seal mouth ring are cleaned；
2) to nickel coating carry out fastness detection, determine by nickel plating, it is gold-plated treated without lead ceramic package shell whether
Qualification is heated 60s or is examined through heating 120s under 450 DEG C ± 10 DEG C of air atmosphere under 470 DEG C ± 10 DEG C of nitrogen atmospheres
Core is represented without porcelain, bubbling and spallation problems are fried without lead ceramic package shell qualification.
Embodiment 4
The beneficial effects of the present invention are: filling electro-insulating rubber column in the accommodating chamber seal mouth ring without lead ceramic package shell will seal
Ring closely blocks, and guarantees that electro-insulating rubber column carries out stabilized seal to seal mouth ring, avoids nickel, gold from being electroplated to the inside of seal mouth ring, absolutely
Edge rubber column uses thermoset rubber, guarantees electro-insulating rubber column and seal mouth ring when heating to no lead ceramic package shell
It is in close contact；The electro-insulating rubber column filled in the accommodating chamber seal mouth ring of no lead ceramic package shell is taken out after the completion of plating
The purpose for not blocking seal mouth ring in clear realization electroplating process is carried out to no lead ceramic package shell and accommodating chamber seal mouth ring afterwards；
By increasing nickel, gold concentration ratio and electrolysis temperature, current density acceleration pair when to no lead ceramic package case electroplating
It is electroplated.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (10)
1. a kind of no lead ceramic package case electroplating technique, which is characterized in that have following steps:
Step 1, the pretreatment of no lead ceramic package shell
Electro-insulating rubber column will be filled in the accommodating chamber seal mouth ring of no lead ceramic package shell first closely to block seal mouth ring, institute
Both ends one end length of electro-insulating rubber column pass-out seal mouth ring is stated, will be cleaned in alkaline degreaser without lead ceramic package shell；
Step 2, Nickel Plating Treatment
1) pickling is handled, and cleaning is completed dry as clearing up after impregnating in hydrochloric acid solution it without lead ceramic package shell
Only；
2) it will be placed in pre-nickel plating solution without lead ceramic package shell and carry out nickel plating, taken out after 1~10min of nickel plating and cleaned dry
Only；
3) nickel plating is carried out in nickel system mixed solution, is taken out and is cleaned up after 0.5~15min of nickel plating；
4) it is heated to 120~600 DEG C under hydrogen or nitrogen atmosphere, is heat-treated 1.5~5h；
5) by 1) thickening to step 4) to nickel coating in repeating said steps two, make 0.5~10 μm of nickel layer thickness；
Step 3, subsequent processing
1) to no lead ceramics after the electro-insulating rubber column filled in the accommodating chamber seal mouth ring of no lead ceramic package shell being taken out
Package casing and accommodating chamber seal mouth ring are cleaned；
2) fastness detection is carried out to nickel coating, whether determination is qualified without lead ceramic package shell after Nickel Plating Treatment.
2. a kind of no lead ceramic package case electroplating technique according to claim 1, which is characterized in that the step 2
Continue the corresponding of the step 3 after the completion of the step of the step of gold-plated processing can be added after the completion, the gold-plated processing
Processing, the specific steps of the gold-plated processing are as follows:
1) will be gold-plated as being carried out in pre- gold plating solution without lead ceramic package shell by Nickel Plating Treatment, gold-plated 0.5~
It takes out and cleans up after 10min；
2) it is carried out in gold plating solution gold-plated, takes out and clean up after gold-plated 1~30min, plated thickness is made to be set as 0.1
~20 μm.
3. a kind of no lead ceramic package case electroplating technique according to claim 1 or 2, it is characterised in that: the step
The sectional dimension of electro-insulating rubber column used in rapid one is identical as the size of the seal mouth ring, and the electro-insulating rubber column uses thermosetting
Property rubber, the length of the electro-insulating rubber column pass-out seal mouth ring is greater than or equal to the overall thickness of nickel coating and Gold plated Layer.
4. a kind of no lead ceramic package case electroplating technique according to claim 1, it is characterised in that: the insulation rubber
The same end of rubber column gel column, which is fixedly connected, constitutes unified entirety, seals in the accommodating chamber seal mouth ring to no lead ceramic package shell
Each group electro-insulating rubber column carries out unified closure when stifled.
5. a kind of no lead ceramic package case electroplating technique according to claim 1, it is characterised in that: the step 2
Used in hydrochloric acid solution concentration of hydrochloric acid be set as 10~30%, pH value be set as between 0~4.0, temperature setting be 20~90
DEG C, taking-up is cleaned up with clear water after pickling handles 1~20min.
6. a kind of no lead ceramic package case electroplating technique according to claim 1, it is characterised in that: the step 2
Middle pre-nickel plating solution uses the mixed solution of nickel chloride and hydrochloric acid, and wherein nickel concentration is set as 75~90g/L, and pH is set as 2.6
~5.0,0.1~20.0A/dm2 of current density are cleaned up after 0.5~10min is electroplated at 20~80 DEG C of temperature with clear water.
7. a kind of no lead ceramic package case electroplating technique according to claim 1, it is characterised in that: the step 2
Middle nickel system mixed solution uses nickel sulfamic acid solution, and wherein nickel concentration is set as 80~90g/L, and PH is set as 2.6~
5.0, according at 0.1~20.0A/dm2 of current density, 30~60 DEG C of temperature, taken out after 0.5~15min of nickel plating wherein with clear
Water cleans up.
8. a kind of no lead ceramic package case electroplating technique according to claim 2, it is characterised in that: the gold-plated place
Gold content is set as 2~4g/L in pre- gold plating solution in reason step, and pH is set as 3.5~4.5, and specific gravity is set as 11
~14 Be, according under 1~2A/dm2 of current density, taking-up is cleaned up with clear water after pre- gold-plated 0.5~10min.
9. a kind of no lead ceramic package case electroplating technique according to claim 2, it is characterised in that: the gold-plated place
Gold content is set as 6~8g/L in gold plating solution in reason step, and pH is set as 5.0~7.0, and specific gravity is set as 11~
16 Be, according under 0.1~2A/dm2 of current density, 1~30min of gold-plated processing, taking-up clear water is rinsed and is dried.
10. a kind of no lead ceramic package case electroplating technique according to claim 1 or 2, it is characterised in that: the step
Fastness detection is carried out to nickel coating or nickel plating, layer gold in rapid three, heated under 470 DEG C ± 10 DEG C of nitrogen atmospheres 60s or
It is to represent to seal without lead ceramics without porcelain, bubbling and spallation problems are fried through heating 120s examination under 450 DEG C ± 10 DEG C of air atmospheres
Casing is qualified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811620847.4A CN109628964A (en) | 2018-12-28 | 2018-12-28 | A kind of no lead ceramic package case electroplating technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811620847.4A CN109628964A (en) | 2018-12-28 | 2018-12-28 | A kind of no lead ceramic package case electroplating technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109628964A true CN109628964A (en) | 2019-04-16 |
Family
ID=66078641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811620847.4A Pending CN109628964A (en) | 2018-12-28 | 2018-12-28 | A kind of no lead ceramic package case electroplating technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109628964A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111945202A (en) * | 2020-07-21 | 2020-11-17 | 中国电子科技集团公司第十三研究所 | Blind hole electroplating method for ceramic leadless shell |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102943290A (en) * | 2012-11-26 | 2013-02-27 | 中国电子科技集团公司第十三研究所 | Method for electroplating of nickel-cobalt alloy on electronic packaging casing |
| CN103060870A (en) * | 2012-12-25 | 2013-04-24 | 江苏省宜兴电子器件总厂 | Selective electroplating process of packaging ceramic land grid array (LGA) shell and pad |
| CN105887149A (en) * | 2016-05-27 | 2016-08-24 | 中国电子科技集团公司第五十五研究所 | Metalized ceramic electroplating method |
-
2018
- 2018-12-28 CN CN201811620847.4A patent/CN109628964A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102943290A (en) * | 2012-11-26 | 2013-02-27 | 中国电子科技集团公司第十三研究所 | Method for electroplating of nickel-cobalt alloy on electronic packaging casing |
| CN103060870A (en) * | 2012-12-25 | 2013-04-24 | 江苏省宜兴电子器件总厂 | Selective electroplating process of packaging ceramic land grid array (LGA) shell and pad |
| CN105887149A (en) * | 2016-05-27 | 2016-08-24 | 中国电子科技集团公司第五十五研究所 | Metalized ceramic electroplating method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111945202A (en) * | 2020-07-21 | 2020-11-17 | 中国电子科技集团公司第十三研究所 | Blind hole electroplating method for ceramic leadless shell |
| CN111945202B (en) * | 2020-07-21 | 2021-10-15 | 中国电子科技集团公司第十三研究所 | Blind hole electroplating method for ceramic leadless shell |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104195518B (en) | A kind of black light-absorbing film and preparation method thereof | |
| CN107267967B (en) | A method of super-hydrophobic copper coating is prepared in aluminum alloy surface | |
| TWI421373B (en) | Tungsten coating method for metal base material | |
| CN109628964A (en) | A kind of no lead ceramic package case electroplating technique | |
| TW200533791A (en) | Plating apparatus and method | |
| CN110306214A (en) | A kind of reverse impulse copper-plating technique for high aspect ratio aperture printed wiring board the electroplates in hole | |
| CN105624749B (en) | A kind of method of ceramic base plate surface metallization | |
| US4093756A (en) | Process for electroless deposition of metals on zirconium materials | |
| CN107245736A (en) | A kind of auto parts and components electroplating technology | |
| CN107794554A (en) | A kind of carbon fiber surface electroplates the inserted preparation method of composite coating of cupro-nickel and application | |
| WO2018024181A1 (en) | Method for preparing graphene foam metal for carrying titanium dioxide-precious metal thin film | |
| CN102400195B (en) | Nickel plating method after metallization of aluminum oxide ceramic | |
| CN106449916A (en) | Vertical structure nonpolar LED (light emitting diode) chip on lithium gallium oxide substrate and preparation method of vertical structure nonpolar LED chip | |
| TWI470702B (en) | Substrate processing apparatus, and method for forming coating film on surface of reaction tube used for the substrate processing apparatus | |
| CN112934012B (en) | Tubular ceramic membrane surface super-hydrophobic modification method based on polytetrafluoroethylene | |
| US4137131A (en) | Process for electrolytic deposition of metals on zirconium materials | |
| CN102392279B (en) | Nickel electroplating method of ceramic metalized layer | |
| CN110684996B (en) | Preparation method of nickel-based super-hydrophobic corrosion-resistant coating on surface of sintered NdFeB magnet | |
| CN110616444B (en) | Platinum/cerium dioxide co-modified aluminide coating and preparation method thereof | |
| CN104135826A (en) | Method for plating thick gold on printed board | |
| CN104164684B (en) | A kind of method of oxygen-free copper plating nickel on surface | |
| CN106757242B (en) | A method of for porous mass electro plating device and plating or chemical deposition | |
| CN109400206A (en) | A kind of method of ceramic surface metallization | |
| CN108486527A (en) | A kind of nickel plating technology of molybdenum alloy substrate | |
| CN105369327B (en) | A kind of preparation method of conductive diamond combination electrode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190416 |
|
| RJ01 | Rejection of invention patent application after publication |