CN111945202B - Blind hole electroplating method for ceramic leadless shell - Google Patents
Blind hole electroplating method for ceramic leadless shell Download PDFInfo
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- CN111945202B CN111945202B CN202010706302.6A CN202010706302A CN111945202B CN 111945202 B CN111945202 B CN 111945202B CN 202010706302 A CN202010706302 A CN 202010706302A CN 111945202 B CN111945202 B CN 111945202B
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- electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Abstract
The invention provides a blind hole electroplating method of a ceramic leadless shell, belonging to the technical field of electronic packaging, comprising the steps of raw ceramic punching, metallized pattern printing, hole metallization, lamination, electroplating, cutting and separation; in the green ceramic punching, a manufacturing area of a green ceramic chip of a lower structure layer is obtained, a first electroplating hole is punched outside the manufacturing area, and a side blind hole of a ceramic leadless shell to be prepared is formed at the inner end of the first electroplating hole; obtaining a manufacturing area of the green ceramic chip of the upper structure layer, and punching a second electroplating hole outside the manufacturing area; punching up and down through electroplating wire binding holes on the peripheral side surface of the green ceramic chip of the upper structure layer and the peripheral side surface of the green ceramic chip of the lower structure layer; and after the upper structural layer and the lower structural layer are laminated, the second electroplating hole outside the same manufacturing area is communicated with the first electroplating hole up and down. The blind hole electroplating method of the ceramic leadless shell improves the uniformity of the side wall blind hole plating layer and improves the yield and the electroplating efficiency.
Description
Technical Field
The invention belongs to the technical field of electronic packaging, and particularly relates to a blind hole electroplating method for a ceramic leadless shell.
Background
Typical structures of the ceramic leadless package are shown in fig. 8 to 10. Most of the shells are provided with hollow metallized holes connected with the lead-out bonding pads, the hollow metallized holes are used for interconnection or enhancing the welding reliability with a printed circuit board, the holes are mostly of blind hole structures, and the plating is realized through an electroplating process in the product preparation process.
However, because the shell has no external lead and is small in size, the yield and the efficiency are extremely low by adopting the traditional single shell wire-binding electroplating process.
Disclosure of Invention
The invention aims to provide a blind hole electroplating method of a ceramic leadless shell, and aims to solve the problems of low yield and low efficiency when blind holes are electroplated on the conventional ceramic leadless shell.
In order to achieve the purpose, the invention adopts the technical scheme that: a blind hole electroplating method of a ceramic leadless shell is provided, which comprises the following steps:
punching the raw porcelain:
obtaining a manufacturing area of a green ceramic chip of a lower structure layer, punching a first electroplating hole outside the manufacturing area, and forming a side blind hole of a ceramic leadless shell to be prepared at the inner end of the first electroplating hole;
obtaining a manufacturing area of the green ceramic chip of the upper structure layer, and punching a second electroplating hole outside the manufacturing area;
punching up and down through electroplating wire binding holes on the peripheral side surfaces of the green ceramic chips of the upper structure layer and the lower structure layer;
after the upper structural layer and the lower structural layer are laminated, the second electroplating holes outside the same manufacturing area are communicated with the first electroplating holes in the vertical direction;
printing a metallized pattern: electroplating lines are printed on the buried layer of the green ceramic chip, so that the manufacturing areas and the electroplated wire binding holes are electrically interconnected;
hole metallization: metallizing the first plated hole, the second plated hole, the side blind hole and the plated wire binding hole;
laminating: pressing and molding the green ceramic chip of the upper structure layer and the green ceramic chip of the lower structure layer;
electroplating: binding and electroplating by using a metal wire to penetrate through the electroplating wire binding holes on two opposite sides, wherein during electroplating, electroplating solution flows through the first electroplating hole and the second electroplating hole to realize the plating of side blind holes;
cutting and separating: and cutting along four sides of the laminated manufacturing area to manufacture the single ceramic leadless shell.
As another embodiment of the present application, the first electroplating hole is a long hole, both ends of the long hole are semicircular, and a length direction of the long hole is perpendicular to a side corresponding to the fabrication region.
As another embodiment of the present application, the second electroplating hole is a circular hole, and a center of the circular hole is coaxial with a semicircular hole at an end of the elongated hole away from the manufacturing area.
As another embodiment of the present application, a plurality of manufacturing areas arranged in an array are disposed on the green ceramic sheet, and the first electroplating holes or the second electroplating holes are disposed around each of the manufacturing areas.
As another embodiment of the application, the electroplating wire binding holes are symmetrically arranged on the peripheral side surface of the green ceramic chip, and at least two electroplating wire binding holes are respectively arranged on each side surface of the green ceramic chip.
As another embodiment of the application, the electroplating wire binding hole is an arc-shaped hole.
As another embodiment of the present application, in the laminating process, after the green ceramic sheet is press-molded, the green ceramic sheet is cut into a plurality of green ceramic pieces including a plurality of manufacturing areas, and then the green ceramic pieces are sintered into a mature ceramic piece, and the plating wire binding holes are formed in the peripheral side surface of each green ceramic piece.
As another embodiment of the application, the shape of the green ceramic piece is square or rectangular.
As another example of the present application, the plating solution is a nickel plating solution or a gold plating solution.
The blind hole electroplating method of the ceramic leadless shell provided by the invention has the beneficial effects that: compared with the prior art, the blind hole electroplating method of the ceramic leadless shell is characterized in that the upper and lower communicated electroplating holes are correspondingly arranged outside the manufacturing area of the ceramic leadless shell, the side blind hole of the ceramic leadless shell is the inner side wall of the first electroplating hole, a plurality of ceramic leadless shells distributed in an array are electroplated, and electroplating solution flows through the first electroplating hole and the second electroplating hole during electroplating to realize electroplating on the side wall and the bottom of the side blind hole; meanwhile, a plurality of ceramic leadless shells can be electroplated, so that the electroplating efficiency is greatly improved, and the manufacturing efficiency of finished products is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a lower structural layer after green porcelain punching in a blind hole electroplating method for a ceramic leadless housing according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an upper structure layer after green porcelain punching in a blind hole electroplating method for a ceramic leadless housing according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a lower structural layer after a metallization pattern is printed in a blind hole electroplating method for a ceramic leadless package according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an upper structural layer after a metallization pattern is printed in a blind hole electroplating method for a ceramic leadless package according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a backside structure of a laminated fabrication region in a blind via electroplating method for a ceramic leadless package according to an embodiment of the present invention;
FIG. 6 is a schematic front view of a laminated fabrication region in a blind via plating method for a ceramic leadless package in accordance with an embodiment of the present invention;
FIG. 7 is a schematic view of a sectional structure taken along line A-A of FIG. 6;
FIG. 8 is a front view structural diagram of a ceramic leadless package provided by an embodiment of the present invention;
FIG. 9 is a schematic diagram of a backside structure of the ceramic leadless package provided in FIG. 8;
fig. 10 is a schematic diagram of a front side structure of the ceramic leadless package provided in fig. 8.
In the figure: 1. electroplating a wire binding hole; 2. a first plated hole; 3. manufacturing an area; 4. a lower structural layer; 5. a second plated hole; 6. an upper structural layer; 7. leading out a bonding pad; 8. a chip mounting area; 9. contour lines of the shape; 10. blind holes;
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 10, a method for electroplating a blind hole of a ceramic leadless package according to the present invention will now be described. The blind hole electroplating method of the ceramic leadless shell comprises the following steps: punching raw porcelain, printing a metalized pattern, metallizing holes, laminating, electroplating, cutting and separating;
referring to fig. 1 and 2, the green porcelain punching process is as follows: obtaining a manufacturing area 3 of a green ceramic chip of a lower structure layer 4, punching a first electroplating hole 2 outside the manufacturing area 3, and forming a side blind hole 10 of a ceramic leadless shell to be prepared at the inner end of the first electroplating hole 2; side blind holes 10 are also hollow metallized holes;
obtaining a manufacturing area 3 of the green ceramic chip of the upper structure layer 6, and punching a second electroplating hole 5 outside the manufacturing area 3;
the peripheral side surface of the green ceramic chip of the upper structure layer 6 and the peripheral side surface of the green ceramic chip of the lower structure layer 4 are punched with electroplating binding wire holes 1 which are through up and down;
after the upper structural layer 6 and the lower structural layer 4 are laminated, the second electroplating holes 5 outside the same manufacturing area 3 are communicated with the first electroplating holes 2 up and down;
the process of printing the metallization pattern is as follows: electroplating lines are printed on the buried layer of the green ceramic chip, so that the manufacturing regions 3 and the electroplating wire binding holes 1 are electrically interconnected;
the hole metallization process is as follows: metallizing the first plated hole 2, the second plated hole 5, the side blind hole 10 and the plated wire-binding hole 1;
referring to fig. 3 and 4, during lamination, the green ceramic sheets of the upper structure layer 6 and the green ceramic sheets of the lower structure layer 4 are pressed and formed;
during electroplating, binding electroplating is carried out by utilizing a metal wire to pass through the electroplating wire binding hole 1, and during electroplating, electroplating solution flows through the first electroplating hole 2 and the second electroplating hole 5 to realize the plating of the side blind hole 10; see fig. 5-7;
in the cutting separation, the individual ceramic leadless packages are produced by cutting along the four sides of the laminated production region 3, see fig. 8 to 10. Wherein, the back of the ceramic leadless shell is provided with a lead-out bonding pad 7, and the front cavity is internally provided with a chip mounting area 8.
Compared with the prior art, the blind hole electroplating method of the ceramic leadless shell, provided by the invention, is characterized in that the vertically communicated electroplating holes are correspondingly arranged outside the manufacturing area 3 of the ceramic leadless shell, and the side blind hole 10 of the ceramic leadless shell is the inner side wall of the first electroplating hole 2, during electroplating, electroplating solution flows through the first electroplating hole 2 and the second electroplating hole 5 to realize electroplating on the side wall and the bottom of the side blind hole 10, and because the electroplating solution flows in the side blind hole, the uniformity of the coating of the side wall blind hole 10 is improved, the electroplating quality is improved, and the yield is further improved; meanwhile, a plurality of ceramic leadless shells can be electroplated, so that the electroplating efficiency is greatly improved, and the manufacturing efficiency of finished products is improved.
Wherein, a plurality of manufacturing areas 3 are arranged on the green ceramic chip in an array way, and each manufacturing area 3 is correspondingly provided with a ceramic leadless shell. The lower structure layer 4 and the upper structure layer 6 both comprise a plurality of ceramic sheets, the lower structure layer 4 corresponds to the back surface of the finished ceramic leadless shell, and the upper structure layer 6 corresponds to the front surface of the finished ceramic leadless shell. The ceramic wafer is made by adopting a tape casting process.
In the cutting and separating process, the first plated hole 2 and the second plated hole 5 are cut off along the outer contour line 9 shown in fig. 6.
In printing the metallization pattern, electrical interconnections to the plating tie holes 1 are required to facilitate plating.
The electroplating method provided by the embodiment of the invention only comprises the steps related to the invention, the ceramic leadless shell is prepared, and the complete manufacturing method comprises the following steps: casting, screening, blanking and punching, metallization printing, hollow metallization, lamination molding, sintering, nickel plating, gold plating and separation.
Wherein, the hollow metallization adopts metal tungsten, and nickel gold is electroplated to form a protective layer.
Referring to fig. 1 to 4, as a specific embodiment of the blind hole electroplating method for a ceramic leadless housing provided by the present invention, the first electroplating hole 2 is a long hole, both ends of the long hole are semicircular, and the length direction of the long hole is perpendicular to the corresponding side of the manufacturing area 3.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 2 and 4, the second electroplating hole 5 is a circular hole, and a center of the circular hole is coaxial with a semicircular hole at an end of the elongated hole far from the manufacturing area 3.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 1 to 4, a plurality of manufacturing areas 3 arranged in an array are disposed on the green ceramic chip, and the first electroplating holes 2 or the second electroplating holes 5 are disposed around each of the manufacturing areas 3. The first plated holes 2 and the second plated holes 5 correspond to the side blind holes 10 of the ceramic leadless casing to be prepared one by one.
Referring to fig. 1 to 4, as a specific implementation manner of the embodiment of the present invention, the plating binding holes 1 are symmetrically formed on the peripheral side surfaces of the green ceramic chip, and each side surface of the green ceramic chip is respectively provided with at least two plating binding holes 1.
Referring to fig. 1 to 4, as a specific implementation manner of the embodiment of the present invention, the plating tie-wire hole 1 is an arc-shaped hole.
Referring to fig. 1 to 4, in the lamination process, after the green ceramic sheet is pressed and formed, the green ceramic sheet is cut into a plurality of green ceramic pieces including a plurality of manufacturing areas 3, and then the green ceramic pieces are sintered into a mature ceramic piece, wherein the plating binding holes 1 are formed in the peripheral side surface of each green ceramic piece. When the size of the green ceramic chip formed after casting is large, sintering and wire-binding electroplating are inconvenient, therefore, in the manufacturing process, the initially manufactured green ceramic chip is cut into the green ceramic pieces with the size of the manufacturing area 3 still including array distribution smaller than that of the green ceramic chip after punching, metalizing and laminating, fig. 1 to 4 of the embodiment are the structures after cutting the green ceramic pieces, and each green ceramic piece is provided with a ceramic leadless shell arranged in a 3 × 3 array.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 1 to 4, the shape of the green ceramic element is square.
In one embodiment of the present invention, the plating solution is a nickel plating solution or a gold plating solution.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. The blind hole electroplating method of the ceramic leadless shell is characterized by comprising the following steps:
punching the raw porcelain:
obtaining a manufacturing area of a green ceramic chip of a lower structure layer, punching a first electroplating hole outside the manufacturing area, and forming a side blind hole of a ceramic leadless shell to be prepared at the inner end of the first electroplating hole;
obtaining a manufacturing area of the green ceramic chip of the upper structure layer, and punching a second electroplating hole outside the manufacturing area;
punching up and down through electroplating wire binding holes on the peripheral side surfaces of the green ceramic chips of the upper structure layer and the lower structure layer;
after the upper structural layer and the lower structural layer are laminated, the second electroplating holes outside the same manufacturing area are communicated with the first electroplating holes in the vertical direction;
printing a metallized pattern: electroplating lines are printed on the buried layer of the green ceramic chip, so that the manufacturing areas and the electroplated wire binding holes are electrically interconnected;
hole metallization: metallizing the first plated hole, the second plated hole, the side blind hole and the plated wire binding hole;
laminating: pressing and molding the green ceramic chip of the upper structure layer and the green ceramic chip of the lower structure layer;
electroplating: binding and electroplating by using a metal wire to penetrate through the electroplating wire binding holes on two opposite sides, wherein during electroplating, electroplating solution flows through the first electroplating hole and the second electroplating hole to realize the plating of side blind holes;
cutting and separating: cutting along four sides of the laminated manufacturing area to manufacture a single ceramic leadless shell;
a plurality of manufacturing areas arranged in an array are arranged on the green ceramic chip, and the first electroplating holes or the second electroplating holes are formed in the periphery of each manufacturing area; and correspondingly manufacturing a ceramic leadless shell in each manufacturing area.
2. The method for electroplating a blind hole in a ceramic leadless package according to claim 1, wherein said first electroplating hole is a long hole, both ends of said long hole are semicircular, and the length direction of said long hole is perpendicular to the side corresponding to said fabrication region.
3. The method for electroplating blind holes in a ceramic leadless package according to claim 2, wherein said second electroplating hole is a circular hole having a center coaxial with a semicircular hole at an end of said elongated hole remote from said fabrication area.
4. The blind hole plating method for ceramic leadless packages of claim 1 wherein said green ceramic sheets are symmetrically provided with said plating binding holes on the peripheral side surfaces thereof, and each side surface of said green ceramic sheets is provided with at least two said plating binding holes, respectively.
5. The method for blind hole plating of a ceramic leadless package according to claim 1, wherein said plating tie-wire hole is an arc-shaped hole.
6. The method for blind hole plating of a ceramic leadless housing of claim 1, wherein during said laminating, after said green ceramic sheet is press molded, said green ceramic sheet is cut into a plurality of green ceramic pieces including a plurality of manufacturing areas, and then said green ceramic pieces are sintered into a mature ceramic piece, and said plated wire binding holes are formed in a peripheral side surface of each of said green ceramic pieces.
7. The method for blind hole plating of ceramic leadless packages of claim 6, wherein said green ceramic member has a square or rectangular outer shape.
8. The method for plating blind vias of a ceramic leadless package according to claim 1, wherein said plating solution is a nickel plating solution or a gold plating solution.
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| CN202010706302.6A CN111945202B (en) | 2020-07-21 | 2020-07-21 | Blind hole electroplating method for ceramic leadless shell |
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| CN202010706302.6A CN111945202B (en) | 2020-07-21 | 2020-07-21 | Blind hole electroplating method for ceramic leadless shell |
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