CN208752663U - A kind of IC card chip structure of double-interface card - Google Patents

A kind of IC card chip structure of double-interface card Download PDF

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Publication number
CN208752663U
CN208752663U CN201821409882.7U CN201821409882U CN208752663U CN 208752663 U CN208752663 U CN 208752663U CN 201821409882 U CN201821409882 U CN 201821409882U CN 208752663 U CN208752663 U CN 208752663U
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Prior art keywords
stainless steel
card
double
contact
chip structure
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CN201821409882.7U
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Chinese (zh)
Inventor
刘瑛
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Dongguan Three Smart Card Technology Co Ltd
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Dongguan Three Smart Card Technology Co Ltd
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Abstract

The utility model discloses a kind of IC card chip structure of double-interface card, the IC card chip structure includes substrate, the flexible circuit board set on substrate upper surface, the integrated circuit on flexible circuit board and several stainless steel contact chips being fixed on flexible circuit board and several is fixed on substrate lower end surface and stainless steel connection sheet in the same plane, the weld part of every stainless steel connection sheet all extends to integrated circuit lower end, and it is electrically connected with a pin of integrated circuit, and be electrically connected respectively with a piece of stainless steel contact chip per a piece of stainless steel connection sheet;Interval is formed between adjacent two stainless steels contact chip;Flexible circuit board lower end surface is additionally provided with the first, second antenna contacts being electrically connected with integrated circuit, first, second antenna contacts lower end surface is respectively equipped with the first, second thickening conductive layer, which protrudes from outside substrate and stainless steel connection sheet.

Description

A kind of IC card chip structure of double-interface card
Technical field:
The utility model relates to fields of communication technology, refer in particular to a kind of IC card chip structure of double-interface card.
Background technique:
IC card (Integrated Circuit Card, integrated circuit card), also referred to as smart card (Smart card), wisdom Card (Intelligent card), microcircuit card (Microcircuit card) or chip card etc..It is by a microelectronics Chip insertion meets in the card base of 7816 standard of ISO, is made into card form.Communication modes between IC card and reader can be with It is contact, is also possible to contactless.IC card is divided into Contact Type Ic Card, non-contact IC and double interfaces according to communication interface Block (being provided simultaneously with contact and contactless communication interface).
The advantages that IC card is due to its intrinsic information security, easy to carry, fairly perfect standardization, authentication, The fields such as bank, telecommunications, public transport, parking lot management are just more and more applied, such as the electricity of China second-generation identity card, bank Sub- wallet, the SIM cards of mobile phones of telecommunications, the bus card of public transport, subway card, parking card for collecting parking fee etc., all exist It plays an important role in people's daily life.
The antenna contacts that the IC card chip structure of double-interface card is all made of two planes in the prior art are contacted with antenna, and It needs to fix and be connected using scolding tin in the later period, this assembling structure is relatively complicated, and operates and be inconvenient, and the later period is also It needs to adhere to IC card chip structure on card by glue.In addition, the IC card chip structure of double-interface card in the prior art Be all made of copper sheet and carry out contact with the external world as terminal and be connected, but copper sheet material is at high cost, intensity not enough and wear-resisting property not Enough ideals, it is easy to wear, so that influencing conducting quality due to wearing larger after long-term use, and then influence communication quality.
In view of this, the utility model people proposes following technical scheme.
Utility model content:
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of IC card chip knot of double-interface card Structure.
In order to solve the above-mentioned technical problem, the utility model uses following technical proposals: the IC card core of the double-interface card Chip architecture include substrate, the flexible circuit board for being set to substrate upper surface, the integrated circuit being set on flexible circuit board and Several stainless steel contact chips for being fixed on the flexible circuit board by insulating cement water layer and being used as terminal and several it is fixed on base The stainless steel connection sheet of plate lower end surface, the weld part of every stainless steel connection sheet all extend to integrated circuit lower end, and with it is integrated One pin of circuit is electrically connected, and is electrically connected respectively with a piece of stainless steel contact chip per a piece of stainless steel connection sheet;Institute It is in the same plane to state stainless steel contact chip, and is formed with interval between adjacent two stainless steels contact chip;The flexible circuit Plate lower end surface is additionally provided with first antenna contact and the second antenna contacts, the first antenna contact and the second antenna contacts respectively with One pin of integrated circuit is electrically connected, and the first antenna contact and the second antenna contacts lower end surface are respectively arranged with first It thickeies conductive layer and second and thickeies conductive layer, the first thickening conductive layer and the second thickening conductive layer protrude from the substrate and not Outside steel connection sheet of becoming rusty.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are plating Metal layer passes through plating mode and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, the first thickening conductive layer and the second thickening conductive layer are tin cream Layer, passes through a process of tin and is fixed on the first antenna contact and the second antenna contacts lower end surface.
Furthermore, in above-mentioned technical proposal, stainless steel contact chip upper surface vacuum coating has one layer of brass Conductive film.
Furthermore, in above-mentioned technical proposal, the stainless steel connection sheet, substrate, flexible circuit board are provided with pair The blind hole answered, and conduction material stock column is filled in the blind hole, which contacts and is connected with stainless steel contact chip, make not Rust steel connection sheet electrically conducts with stainless steel contact chip.
Furthermore, in above-mentioned technical proposal, the conduction material stock column is conductive polymer rubber column gel column.
Furthermore, in above-mentioned technical proposal, the conduction material stock column is tin cream column.
Furthermore, in above-mentioned technical proposal, the quantity of the stainless steel contact chip is six or eight;Described The quantity of stainless steel connection sheet is six or eight, and is corresponded with stainless steel contact chip, and be connected.
Furthermore, in above-mentioned technical proposal, the stainless steel contact chip with a thickness of 0.02mm-0.07mm;It is described Conductive film with a thickness of 0.005mm-0.01mm.
Furthermore, in above-mentioned technical proposal, pass through welding gold thread between the weld part and the pin of integrated circuit Or implantation tin ball mode connects, and is formed and electrically conducted.
After adopting the above technical scheme, the utility model have the following beneficial effects: compared with prior art it is practical It is novel to be additionally provided with the first thickening conduction in the first antenna contact of IC card chip structure lower end surface setting and the second antenna contacts Layer and second thickeies conductive layer, and the first thickening conductive layer and the second thickening conductive layer protrude from the substrate and stainless steel connection Outside piece, so that the IC card chip structure later period, after being installed on card, which thickeies conductive layer Point contact directly is contacted with the antenna of card two respectively, without being welded and fixed, only passes through glue for IC card chip structure It adheres on card, structure is more simple, and makes more convenient.In addition, the utility model is in IC card chip The upper surface of structure and lower end surface difference composite stainless steel contact chip and stainless steel connection sheet, greatly enhance IC card chip knot with this The structural strength of structure, and IC card chip structure is used as terminal using stainless steel contact chip and connects with the external world, the stainless steel contact chip The cost of material is low, and intensity is big and wear-resisting property is ideal, wear-resisting, larger abrasion will not be caused after being used for a long time, so that can Guarantee conducting quality, and then improve communication quality, and the utility model structure is relatively simple, enables the utility model have extremely strong The market competitiveness.In addition, the weld part of every stainless steel connection sheet all extends to integrated circuit lower end, and one with integrated circuit A pin is electrically connected by weldering gold thread or implantation tin ball, is lowered gold thread length significantly with this, and can guarantee welding quality, is enabled The utility model has the extremely strong market competitiveness.
Detailed description of the invention:
Fig. 1 is the perspective view of the utility model;
Fig. 2 be Fig. 1 along A-A to cross-sectional view;
Fig. 3 is the installation diagram of stainless steel connection sheet in the utility model, stainless steel contact chip and integrated circuit.
Specific embodiment:
The present invention will be further described with attached drawing combined with specific embodiments below.
It as shown in figure 1 to 3, is a kind of IC card chip structure of double-interface card.The IC card chip structure 2 include substrate 1, The flexible circuit board 21 for being set to 1 upper surface of substrate, the integrated circuit 22 being set on flexible circuit board 21 and several pass through Insulating cement water layer 23 is fixed on the flexible circuit board 21 and is used as the stainless steel contact chip 24 of terminal and several is fixed on substrate 1 The stainless steel connection sheet 26 of lower end surface, the weld part 261 of every stainless steel connection sheet 26 all extend to 22 lower end of integrated circuit, and Be electrically connected with a pin of integrated circuit 22, and per a piece of stainless steel connection sheet 26 respectively with a piece of stainless steel contact chip 24 It is electrically connected;The stainless steel contact chip 24 is in the same plane, and between being formed between adjacent two stainless steels contact chip 24 Every;21 lower end surface of flexible circuit board is additionally provided with first antenna contact 28 and the second antenna contacts 29, first antenna touching Point 28 and the second antenna contacts 29 are electrically connected with a pin of integrated circuit 22 respectively, and the first antenna contact 28 and the Two antenna contacts, 29 lower end surface is respectively arranged with the first thickening conductive layer 281 and second and thickeies conductive layer 291, which leads Electric layer 281 and the second thickening conductive layer 291 protrude from outside the substrate 1 and stainless steel connection sheet 26.The utility model is in IC card The first antenna contact 28 of 2 lower end surface of chip structure setting and the second antenna contacts 29 are additionally provided with the first thickening conductive layer 281 Conductive layer 291 is thickeied with second, the first thickening conductive layer 281 and the second thickening conductive layer 291 protrude from the substrate 1 and not Become rusty steel connection sheet 26 outside so that 2 later period of IC card chip structure after being installed on card, this first thicken 281 He of conductive layer Second thickening conductive layer 291 directly contacts point contact with the antenna of card two respectively and only passes through glue without being welded and fixed Water adheres to IC card chip structure 2 on card, and structure is more simple, and makes more convenient.In addition, this reality Composite stainless steel contact chip 24 and stainless steel connection sheet 26 are distinguished with the novel upper surface in IC card chip structure 2 and lower end surface, The structural strength of IC card chip structure 2 is greatly enhanced with this, and IC card chip structure 2 is used as terminal using stainless steel contact chip 24 It being connected with the external world, the cost of material is low for the stainless steel contact chip 24, and intensity is big and wear-resisting property is ideal, and it is wear-resisting, even if being used for a long time After will not cause larger abrasion so that can guarantee conducting quality, and then improve communication quality, and the utility model structure is more Simply, enable the utility model that there is the extremely strong market competitiveness.In addition, the weld part 261 of every stainless steel connection sheet 26 prolongs 22 lower end of integrated circuit is extended to, and is electrically connected with a pin of integrated circuit 22 by weldering gold thread or implantation tin ball, with this Lower gold thread length significantly, and can guarantee welding quality, enables the utility model that there is the extremely strong market competitiveness.
The first thickening conductive layer 281 and the second thickening conductive layer 291 are electroplated metal layer, pass through plating side Formula is fixed on 29 lower end surface of the first antenna contact 28 and the second antenna contacts.Either, described first thickeies 281 He of conductive layer Second thickening conductive layer 291 is tin paste layer, passes through a process of tin and is fixed on the first antenna contact 28 and the second antenna 29 lower end surface of contact.
1 two sides of substrate are provided with several location holes 11, the location hole 11 be in rectangle, the location hole 11 be same as with outside The positioning mold on boundary is positioned, so as to the working process in later period.
The 24 upper surface vacuum coating of stainless steel contact chip has one layer of brassy conductive film 25, is further increased with this The electric conductivity of the utility model.Certainly, it not only can be equally electroplated according to actual requirement with the conductive film 25 of brass plating color The conductive film 25 of various different colours, these are all easily achieved.
The stainless steel connection sheet 26, substrate 1, flexible circuit board 21 are provided with corresponding blind hole, and fill out in the blind hole Filled with conduction material stock column, which contacts and is connected with stainless steel contact chip 24, make stainless steel connection sheet 26 with it is stainless Steel contact chip 24 electrically conducts.
The conduction material stock column is conductive polymer rubber column gel column;Either, the conduction material stock column is tin cream column.
The quantity of the stainless steel contact chip 24 is six or eight;The quantity of the stainless steel connection sheet 26 is six It is a or eight, and corresponded with stainless steel contact chip 24, and be connected;The stainless steel contact chip 24 with a thickness of 0.02mm- 0.07mm;The conductive film 25 with a thickness of 0.005mm-0.01mm.
It is connected between the weld part 261 and the pin of integrated circuit 22 by welding gold thread or implantation tin ball mode, and Formation electrically conducts.
In conclusion first antenna contact 28 that the utility model is arranged in 2 lower end surface of IC card chip structure and second day Line contact 29 is additionally provided with the first thickening conductive layer 281 and second and thickeies conductive layer 291, this first thickeies conductive layer 281 and the Two thickening conductive layers 291 protrude from outside the substrate 1 and stainless steel connection sheet 26, so that 2 later period of IC card chip structure is pacifying After on card, the first thickening conductive layer 281 and the second thickening conductive layer 291 are directly contacted with the antenna of card two respectively Point contact is only adhered to IC card chip structure 2 on card by glue, structure is more without being welded and fixed To be simple, and make more convenient.In addition, the utility model is distinguished in the upper surface of IC card chip structure 2 and lower end surface Composite stainless steel contact chip 24 and stainless steel connection sheet 26 greatly enhance the structural strength of IC card chip structure 2, and IC card with this Chip structure 2 is used as terminal using stainless steel contact chip 24 and connects with the external world, and the cost of material is low for the stainless steel contact chip 24, intensity Big and wear-resisting property is ideal, wear-resisting, will not cause larger abrasion after being used for a long time, so that can guarantee conducting quality, into And communication quality is improved, and the utility model structure is relatively simple, enable the utility model that there is the extremely strong market competitiveness.Separately Outside, the weld part 261 of every stainless steel connection sheet 26 all extends to 22 lower end of integrated circuit, and draws with one of integrated circuit 22 Foot is electrically connected by weldering gold thread or implantation tin ball, is lowered gold thread length significantly with this, and can guarantee welding quality, is enabled this reality There is the extremely strong market competitiveness with novel.
It certainly, is not to limit the utility model and implement the foregoing is merely specific embodiment of the utility model Range, all equivalent change or modifications done according to structure, feature and principle described in present utility model application the scope of the patents, should all wrap It includes in present utility model application the scope of the patents.

Claims (10)

1. a kind of IC card chip structure of double-interface card, it is characterised in that: the IC card chip structure (2) includes substrate (1), setting In the flexible circuit board (21) of substrate (1) upper surface, the integrated circuit (22) that is set on flexible circuit board (21) and several The stainless steel contact chip (24) of terminal and several is fixed on the flexible circuit board (21) and is used as by insulating cement water layer (23) It is fixed on the stainless steel connection sheet (26) of substrate (1) lower end surface, the weld part (261) of every stainless steel connection sheet (26) extends It is electrically connected to integrated circuit (22) lower end, and with a pin of integrated circuit (22), and per a piece of stainless steel connection sheet (26) it is electrically connected respectively with a piece of stainless steel contact chip (24);The stainless steel contact chip (24) is in the same plane, and Interval is formed between adjacent two stainless steels contact chip (24);Flexible circuit board (21) lower end surface is additionally provided with first antenna Contact (28) and the second antenna contacts (29), the first antenna contact (28) and the second antenna contacts (29) respectively with integrated circuit (22) a pin is electrically connected, and the first antenna contact (28) and the second antenna contacts (29) lower end surface are respectively arranged with First, which thickeies conductive layer (281) and second, thickeies conductive layer (291), which thickeies conduction Layer (291) protrudes from the substrate (1) and stainless steel connection sheet (26) outside.
2. a kind of IC card chip structure of double-interface card according to claim 1, it is characterised in that: first thickening is led Electric layer (281) and the second thickening conductive layer (291) are electroplated metal layer, pass through plating mode and are fixed on the first antenna Contact (28) and the second antenna contacts (29) lower end surface.
3. a kind of IC card chip structure of double-interface card according to claim 1, it is characterised in that: first thickening is led Electric layer (281) and the second thickening conductive layer (291) are tin paste layer, pass through a process of tin and are fixed on the first antenna contact (28) and the second antenna contacts (29) lower end surface.
4. a kind of IC card chip structure of double-interface card according to claim 2 or 3, it is characterised in that: the stainless steel Contact chip (24) upper surface vacuum coating has one layer of brassy conductive film (25).
5. a kind of IC card chip structure of double-interface card according to claim 4, it is characterised in that: the stainless steel connection Piece (26), substrate (1), flexible circuit board (21) are provided with corresponding blind hole, and conduction material stock column is filled in the blind hole, should Conduction material stock column is contacted and is connected with stainless steel contact chip (24), makes stainless steel connection sheet (26) and stainless steel contact chip (24) electricity Property conducting.
6. a kind of IC card chip structure of double-interface card according to claim 5, it is characterised in that: the conduction material stock column For conductive polymer rubber column gel column.
7. a kind of IC card chip structure of double-interface card according to claim 5, it is characterised in that: the conduction material stock column For tin cream column.
8. a kind of IC card chip structure of double-interface card according to claim 4, it is characterised in that: the stainless steel connects The quantity of contact (24) is six or eight;The quantity of the stainless steel connection sheet (26) be six or eight, and with it is stainless Steel contact chip (24) corresponds, and is connected.
9. a kind of IC card chip structure of double-interface card according to claim 4, it is characterised in that: the stainless steel contact Piece (24) with a thickness of 0.02mm-0.07mm;The conductive film (25) with a thickness of 0.005mm-0.01mm.
10. a kind of IC card chip structure of double-interface card according to claim 9, it is characterised in that: the weld part (261) it is connect between the pin of integrated circuit (22) by welding gold thread or implantation tin ball mode, and is formed and electrically conducted.
CN201821409882.7U 2018-08-28 2018-08-28 A kind of IC card chip structure of double-interface card Active CN208752663U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821409882.7U CN208752663U (en) 2018-08-28 2018-08-28 A kind of IC card chip structure of double-interface card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821409882.7U CN208752663U (en) 2018-08-28 2018-08-28 A kind of IC card chip structure of double-interface card

Publications (1)

Publication Number Publication Date
CN208752663U true CN208752663U (en) 2019-04-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821409882.7U Active CN208752663U (en) 2018-08-28 2018-08-28 A kind of IC card chip structure of double-interface card

Country Status (1)

Country Link
CN (1) CN208752663U (en)

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