CN202695405U - Soldering flux feeding device of LED (Light Emitting Diode) wafer eutectic welding equipment - Google Patents
Soldering flux feeding device of LED (Light Emitting Diode) wafer eutectic welding equipment Download PDFInfo
- Publication number
- CN202695405U CN202695405U CN 201220254908 CN201220254908U CN202695405U CN 202695405 U CN202695405 U CN 202695405U CN 201220254908 CN201220254908 CN 201220254908 CN 201220254908 U CN201220254908 U CN 201220254908U CN 202695405 U CN202695405 U CN 202695405U
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- China
- Prior art keywords
- feeding device
- soldering flux
- welding equipment
- flux feeding
- eutectic welding
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a soldering flux feeding device of LED (Light Emitting Diode) wafer eutectic welding equipment. The soldering flux feeding device comprises a base, a slide guide and a mechanical arm, wherein the slide guide is arranged on the base, and the mechanical arm is arranged on the slide guide in a slidable manner; a front plate which horizontally and forward extends is arranged at the upper end of the mechanical arm; the end part of the front plate is provided with a hollow cylinder; and an adhesive dispensing barrel, the lower end of which is funneled, is sheathed in the hollow cylinder. The soldering flux feeding device has the advantages of realizing the function of dot printing scaling powder by adding an auxiliary welding effect before LED wafer eutectic welding and increasing the whole welding performance and efficiency.
Description
Technical field
The utility model relates to LED wafer eutectic solder technology, relates in particular to a kind of soldering flux feeding device of LED wafer eutectic welding equipment.
Background technology
The eutectic solder technology has widely in the Electronic Packaging industry to be used, such as bonding, shell sealing cap of bonding, the substrate of wafer and substrate and shell etc.Compare with traditional epoxy conducting is bonding, eutectic welding has advantages of that thermal conductivity is high, thermal resistance is low, heat transfer is fast, reliability is strong, bonding rear intensity is large, is applicable to the interconnected of wafer and substrate, substrate and shell in high frequency, the high power device.
High speed development along with the LED technology, LED wafer and encapsulation are more and more to high-power and integrated future development, traditional elargol technique for sticking has been difficult to satisfy the welding process requirement of LED wafer, thereby, increasing LED encapsulation producer begins to attempt other more advanced welding procedures and realizes the bonding of LED wafer and support, wherein, the eutectic solder technology is thought to have good application prospect by common.
In eutectic welding process fast, how to improve this auxiliary effect of eutectic welding performance, be again an important parameter that affect the welding process in time of support point seal scaling powder etc., and that the point of prior art prints scaling powder speed is slow, greatly affects whole welding progress.
The utility model content
Technical problem to be solved in the utility model is: the soldering flux feeding device that a kind of LED wafer eutectic welding equipment is provided, this device can increase by an auxiliary welding effect before the welding of LED eutectic, realize the function of some seal scaling powder, and can greatly improve a time of seal scaling powder, thereby improve whole welding performance and efficient.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of soldering flux feeding device of LED wafer eutectic welding equipment, include a base, be arranged on rail plate on this base, be slidably disposed on the mechanical arm on this rail plate, this mechanical arm upper end is provided with the header board that level is extended forward, the end of this header board is provided with hollow cylinder, is arranged with the lower end in this hollow cylinder and is funnel shaped some packing element.
Preferably, described hollow cylinder is positioned at the centre position of a packing element.
Preferably, top, the upper end of described some packing element is provided with the outside flange of level.
Preferably, described some packing element is positioned at the top of the slip eutectic jig on the described LED wafer eutectic welding equipment.
Preferably, the longitudinal rail under described rail plate and the described eutectic jig arranges in the same way.
Preferably, the material of described some packing element is plastic material.
The beneficial effects of the utility model are:
Embodiment of the present utility model realizes crawl and the conveyance of support by the convey mechanical arm of slip is set, thereby has greatly saved the time of some seal scaling powder, has improved the bulk velocity of eutectic welding.
Below in conjunction with accompanying drawing the utility model is described in further detail.
Description of drawings
Fig. 1 is the three-dimensional structure diagram of an embodiment of soldering flux feeding device of LED wafer eutectic welding equipment of the present utility model.
Embodiment
Describe an embodiment of the finished product conveyer of the LED wafer eutectic welding equipment that the utility model provides in detail below with reference to Fig. 1; As shown in the figure, the present embodiment mainly includes a base 1, be arranged on rail plate 2 on this base 1, be slidably disposed on the mechanical arm 3 on this rail plate 2, these mechanical arm 3 upper ends are provided with the header board 4 that level is extended forward, the end of this header board 4 is provided with hollow cylinder 5, is arranged with the lower end in this hollow cylinder 5 and is funnel shaped some packing element 6.
During specific implementation, described hollow cylinder 5 is positioned at the centre position of a packing element 6.
Further, described some packing element 6 is positioned at being used on the described LED wafer eutectic welding equipment (not shown) to be placed and treats a top of the slip eutectic jig 7 of the support of seal scaling powder, and slip eutectic jig 7 is arranged on longitudinal rail 9 and the cross slide way 8.Described rail plate 2 arranges in the same way with described longitudinal rail 9.
As a preferred implementation of the present embodiment, top, the upper end of described some packing element 6 is provided with the outside flange of level 61.
During specific implementation, the material of some packing element 6 can be plastic material.
The above is preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection range of the present utility model.
Claims (6)
1. the soldering flux feeding device of a LED wafer eutectic welding equipment, it is characterized in that: this device includes a base, be arranged on rail plate on this base, be slidably disposed on the mechanical arm on this rail plate, this mechanical arm upper end is provided with the header board that level is extended forward, the end of this header board is provided with hollow cylinder, is arranged with the lower end in this hollow cylinder and is funnel shaped some packing element.
2. the soldering flux feeding device of LED wafer eutectic welding equipment as claimed in claim 1, it is characterized in that: described hollow cylinder is positioned at the centre position of a packing element.
3. the soldering flux feeding device of LED wafer eutectic welding equipment as claimed in claim 2 is characterized in that: the top, upper end of described some packing element is provided with the outside flange of level.
4. such as the soldering flux feeding device of each described LED wafer eutectic welding equipment among the claim 1-3, it is characterized in that: described some packing element is positioned at the top of the slip eutectic jig on the described LED wafer eutectic welding equipment.
5. the soldering flux feeding device of LED wafer eutectic welding equipment as claimed in claim 4, it is characterized in that: the longitudinal rail under described rail plate and the described eutectic jig arranges in the same way.
6. the soldering flux feeding device of LED wafer eutectic welding equipment as claimed in claim 5, it is characterized in that: the material of described some packing element is plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220254908 CN202695405U (en) | 2012-05-30 | 2012-05-30 | Soldering flux feeding device of LED (Light Emitting Diode) wafer eutectic welding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220254908 CN202695405U (en) | 2012-05-30 | 2012-05-30 | Soldering flux feeding device of LED (Light Emitting Diode) wafer eutectic welding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202695405U true CN202695405U (en) | 2013-01-23 |
Family
ID=47550982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220254908 Expired - Fee Related CN202695405U (en) | 2012-05-30 | 2012-05-30 | Soldering flux feeding device of LED (Light Emitting Diode) wafer eutectic welding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202695405U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312228A (en) * | 2015-06-25 | 2017-01-11 | 安徽超威电源有限公司 | Scaling powder adding device |
| CN112477401A (en) * | 2020-12-21 | 2021-03-12 | 四川锐坤电子技术有限公司 | Pad printing equipment |
-
2012
- 2012-05-30 CN CN 201220254908 patent/CN202695405U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312228A (en) * | 2015-06-25 | 2017-01-11 | 安徽超威电源有限公司 | Scaling powder adding device |
| CN112477401A (en) * | 2020-12-21 | 2021-03-12 | 四川锐坤电子技术有限公司 | Pad printing equipment |
| CN112477401B (en) * | 2020-12-21 | 2023-10-20 | 四川锐坤电子技术有限公司 | Pad printing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20150530 |
|
| EXPY | Termination of patent right or utility model |