CN202633382U - Light-emitting diode (LED) lamp assembly and silicon substrate LED lamp thereof - Google Patents
Light-emitting diode (LED) lamp assembly and silicon substrate LED lamp thereof Download PDFInfo
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- CN202633382U CN202633382U CN2012202855570U CN201220285557U CN202633382U CN 202633382 U CN202633382 U CN 202633382U CN 2012202855570 U CN2012202855570 U CN 2012202855570U CN 201220285557 U CN201220285557 U CN 201220285557U CN 202633382 U CN202633382 U CN 202633382U
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Abstract
The utility model relates to a light-emitting diode (LED) lamp assembly and a silicon substrate LED lamp thereof. The silicon substrate LED lamp comprises a carrier, an LED crystal chip, an electrode electrically connected with the LED crystal chip, and sealing glue. The carrier is a silicon substrate. The electrode is arranged on the silicon substrate. The electrode and the LED crystal chip are located on the same one surface. The LED assembly comprises the silicon substrate LED lamp and a heat-dissipation device. The silicon substrate of the silicon substrate LED lamp is directly connected with the surface of the heat-dissipation device in an abutting mode. The silicon substrate LED lamp is good in heat-dissipation property and long in service life. The LED assembly facilitates heat dissipation of the LED lamp and can save production cost.
Description
Technical field
The utility model relates to the LED field, especially a kind of silicon substrate led board and use the LED lamp assembly of this silicon substrate LED lamp.
Background technology
Existing LED lamp 1 ' generally comprises the carrier 11 ' of plastic rubber bracket; Be located at the LED wafer 12 ' of carrier end face, with the adhesive body 13 ' of LED wafer 12 ' encapsulation and be located at electrode 14 ', electrode 14 ' is located at carrier 11 ' bottom surface and need be used metal substrate 2 ' to conduct electricity.In addition, LED lamp 1 ' need be used with radiator 3 ' when work, and also need use metal substrate 2 ' as connecting layer this moment.
There is following problem in existing LED lamp: adopt plastic rubber bracket as carrier 11 ', this kind carrier 11 ' conductive coefficient is very low, and thermal resistance is very high, has seriously hindered the conduction of LED wafer 12 ' heat.In LED lamp 1 ' and radiator 3 ' cohesive process, need to use metal substrate 2 '; Because a layer insulating 21 ' is arranged in the middle of the metal substrate 2 '; The conductive coefficient of this metal substrate 2 ' is very low, and thermal resistance is very high, has increased the thermal resistance of total greatly; LED lamp 1 ' internal heat is conducted rapidly distribute, and then influence the lux maintenance and the useful life of LED lamp 1 '.
The utility model content
The utility model technical problem to be solved is: a kind of silicon substrate LED lamp is provided, and its perfect heat-dissipating, and can prolong useful life of LED lamp.
For solving the problems of the technologies described above; The utility model adopts following technical scheme: a kind of silicon substrate LED lamp, comprise carrier, LED wafer, the electrode and the sealing that are electrically connected with the LED wafer, and said carrier is a silicon substrate; Electrode is located on the silicon substrate, and electrode and LED wafer are on the same surface.
Further, said electrode comprises positive electrode and the negative electrode that lays respectively at the LED both sides of wafers, and said positive electrode and negative electrode all are positioned at the outside of said adhesive body.
Further, the utilization of said LED wafer be located in advance on the silicon substrate conductor wire directly be located at silicon substrate on electrode electricity be connected.
Further, said electrode is positioned at the end face of said silicon substrate.
The utility model the technical problem that will further solve be: a kind of LED lamp assembly is provided, and it is convenient to the heat radiation of LED lamp, and can save production cost.
For solving the problems of the technologies described above, the utility model adopts following technical scheme: a kind of LED lamp assembly,, comprising aforesaid silicon substrate LED lamp and radiator, the silicon substrate of said silicon substrate LED lamp surface direct and radiator connects.
The beneficial effect of the utility model is: adopt the carrier of silicon substrate as the LED wafer; Electrode is arranged at the end face of carrier, is on the same surface with said LED wafer, need not to use the metal substrate conduction; This its perfect heat-dissipating of LED lamp can prolong useful life of LED; And when being used, directly place on the radiator, need not to use insulation board to insulate separately, reduce processing and material cost, and be convenient to the heat radiation of LED with radiator.
Below in conjunction with accompanying drawing the utility model is done further to describe in detail.
Description of drawings
Fig. 1 is the sketch map of existing LED lamp.
Fig. 2 is the sketch map of the utility model first embodiment silicon substrate LED lamp.
Fig. 3 is the application drawing of the utility model first embodiment silicon substrate LED lamp.
Fig. 4 is the sketch map of the utility model second embodiment silicon substrate LED lamp.
Fig. 5 is the application drawing of the utility model second embodiment silicon substrate LED lamp.
Embodiment
As shown in Figure 2, the utility model first embodiment provides a kind of silicon substrate LED lamp 1, comprises silicon substrate 11, LED wafer 12, adhesive body 13 and electrode 14 as the carrier of LED lamp 1.
Said silicon substrate 11 is processed for adopting silica-based material, because silica-based material 11 has very high conductive coefficient, it can reduce the thermal resistance of LED lamp 1, improves the heat dispersion of LED lamp 1, prolongs the useful life of LED lamp; In addition, hard, corrosion-resistant, the insulation of silica-based material own, and low price.Certainly, other and silicon substrate 11 same or analogous materials also can be used as the carrier of LED lamp 1.
The direction of representing with Fig. 2 is a benchmark, and said LED wafer 12 is fixed on the silicon substrate 11, is positioned at the end face of silicon substrate 11, reserves conductor wire on the silicon substrate 11 and is used for being electrically connected with electrode 14, utilizes then on said adhesive body 13 encapsulation and the silicon substrate 11.
Said electrode 14 is located on the silicon substrate 11; Electrode 14 is on the same surface with LED wafer 12; Electrode 14 and said LED wafer 12 are in the end face of silicon substrate 11 together in the present embodiment, and it utilizes the conductor wire of said reservation directly to be electrically connected with LED wafer 12 and need not to use metal substrate to conduct electricity, and has so not only reduced processing and material cost; Also eliminated the obstruction of metal substrate, be convenient to the heat radiation of LED lamp the conduction of LED lamp 1 heat.Said electrode 14 comprises the positive electrode and the negative electrode of the both sides that are positioned at LED wafer 12, and positive electrode and negative electrode all are positioned at the outside of said adhesive body 13, and.
As shown in Figure 3, the utility model provides a kind of LED lamp assembly, comprises the silicon substrate LED lamp 1 and radiator 3 of said first embodiment.The surface that the said silicon substrate 11 of stating silicon substrate LED lamp 1 directly is laminated on the said radiator 3 with radiator 3 connects; Need not to use metal substrate or other insulating material to insulate between the two, and the heat that silicon substrate 11 directly distributes LED lamp 1 conduct on the radiator 3 as the intermediate layer.So not only greatly reduce the thermal resistance of whole LED lamp assembly, be convenient to heat radiation, also reduced the use of metal substrate, reduced processing and cost of material.
As shown in Figure 4, the utility model second embodiment provides another kind of silicon substrate LED lamp 4, comprises silicon substrate 41, LED wafer 42, adhesive body 43, electrode 44 and enclosure wall glue 45 as the carrier of LED lamp 4.Silicon substrate LED lamp 4, basic identical with the structure of said silicon substrate LED lamp 1, different is, and adhesive body 43 peripheries also are provided with enclosure wall glue 45, and said adhesive body 43 is positioned at the inner chamber that enclosure wall glue 45 forms.
As shown in Figure 5, the utility model provides another kind of LED lamp assembly, comprises the silicon substrate LED lamp 4 and radiator 3 of said second embodiment.The surface that the said silicon substrate 41 of stating silicon substrate LED lamp 4 directly is laminated on the said radiator 3 with radiator 3 connects; Need not to use metal substrate or other insulating material to insulate between the two, and the heat that silicon substrate 41 directly distributes LED lamp 4 conduct on the radiator 3 as the intermediate layer.So not only greatly reduce the thermal resistance of whole LED lamp assembly, be convenient to heat radiation, also reduced the use of metal substrate, reduced processing and cost of material.
The above is the embodiment of the utility model; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; Can also make some improvement and retouching, these improvement and retouching also are regarded as the protection range of the utility model.
Claims (5)
1. silicon substrate LED lamp; The adhesive body that comprises carrier, is located at the LED wafer on the carrier, the electrode that is electrically connected with the LED wafer and encapsulates said LED wafer; It is characterized in that: said carrier is a silicon substrate, and electrode is located on the silicon substrate, and electrode and LED wafer are on the same surface.
2. silicon substrate LED lamp as claimed in claim 1 is characterized in that said electrode comprises positive electrode and the negative electrode that lays respectively at the LED both sides of wafers, and said positive electrode and negative electrode all are positioned at the outside of said adhesive body.
3. according to claim 1 or claim 2 silicon substrate LED lamp is characterized in that, the utilization of said LED wafer be located in advance on the silicon substrate conductor wire directly be located at silicon substrate on electrode electricity be connected.
4. silicon substrate LED lamp as claimed in claim 1 is characterized in that said electrode is positioned at the end face of said silicon substrate.
5. a LED lamp assembly comprises LED lamp and radiator, it is characterized in that, said LED lamp is like each described silicon substrate LED lamp of claim 1 to 4, and the silicon substrate of said silicon substrate LED lamp surface direct and radiator connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202855570U CN202633382U (en) | 2012-06-15 | 2012-06-15 | Light-emitting diode (LED) lamp assembly and silicon substrate LED lamp thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202855570U CN202633382U (en) | 2012-06-15 | 2012-06-15 | Light-emitting diode (LED) lamp assembly and silicon substrate LED lamp thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633382U true CN202633382U (en) | 2012-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202855570U Expired - Fee Related CN202633382U (en) | 2012-06-15 | 2012-06-15 | Light-emitting diode (LED) lamp assembly and silicon substrate LED lamp thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633382U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103822143A (en) * | 2014-02-18 | 2014-05-28 | 江苏新广联绿色照明工程有限公司 | LED (light emitting diode) street lamp light source module with silicon substrates |
-
2012
- 2012-06-15 CN CN2012202855570U patent/CN202633382U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103822143A (en) * | 2014-02-18 | 2014-05-28 | 江苏新广联绿色照明工程有限公司 | LED (light emitting diode) street lamp light source module with silicon substrates |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GUANGDONG ZHOUMING ENERGY SAVING TECHNOLOGY CO., L Free format text: FORMER NAME: HUIZHOU ZHOUMING ENERGY SAVING TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 516000 No. 5, science and technology innovation road, west science and Technology Park, Dayawan, Guangdong, Huizhou Patentee after: Guangdong Zhouming Energy Conservation Technology Co., Ltd. Address before: 516000 No. 5, science and technology innovation road, west science and Technology Park, Dayawan, Guangdong, Huizhou Patentee before: Huizhou Zhouming Energy-saving Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20190615 |