CN202598167U

CN202598167U - LED lighting-set structure

Info

Publication number: CN202598167U
Application number: CN2011204658962U
Authority: CN
Inventors: 方学智; 邓焕平; 洪迪恩
Original assignee: Taiwan Puritic Corp
Current assignee: Taiwan Puritic Corp
Priority date: 2011-11-16
Filing date: 2011-11-16
Publication date: 2012-12-12
Anticipated expiration: 2021-11-16

Abstract

The utility model discloses a LED lighting-set structure, and the LED lighting-set structure comprises a circuit substrate, a metal circuit, and a LED, wherein the circuit substrate comprises a metal base and a ceramic layer bonded on a surface of the metal base in a coated manner; the metal circuit is arranged on the ceramic layer; and the LED is fixed on the ceramic layer and is electrically connected to the metal circuit. The circuit substrate comprises the metal base and the ceramic layer coated on the metal base surface, enables the LED lighting-set structure to have good heat radiation efficiency, thereby improving usage life as a whole.

Description

LED lamp group structure

Technical field

The utility model relates to a kind of lighting, relates in particular to a kind of LED lamp group structure.

Background technology

Based on low power consuming, power saving, long service life, characteristics such as volume is little, reaction is fast; Add the lifting of luminosity technology; LED (light emitting diode; Light emitting diode) it is more and more general to be applied to lighting use, replaces conventional bulb gradually and in various lightings of extensive use or the light-emitting device.In addition, compared to traditional incandescent lamp bulb, because LED usually must be by chip for driving (Driver IntegratedCircuit; Driver IC) drive, so LED must be positioned on the circuit board, and need collocation one radiator to dispel the heat constantly, to guarantee that LED is unlikely under too high temperature, to operate.

Traditional LED light fixture; As shown in Figure 1; It mainly comprises a cooling base 10, a power supply unit 20, a circuit board 30 and is installed in a plurality of LED40 on the circuit board 30; This cooling base 10 has a heat conduction placed side 101, and with circuit board 30 utilize screw 50 with locking on heat conduction placed side 101, and circuit board 30 electrically connects with the power supply units 20 that are contained in the cooling base 10; By this, circuit board 30 amplexiforms heat conduction placed side 101, and the heat that LED40 is produced dispels the heat via cooling base 10 constantly, crosses cause thermal damage to avoid circuit board 30 and LED40.

Yet, above-mentionedly directly wear and the mode of the circuit board 30 that locks with screw 50, different because of the pressure that locking degree difference causes oppressing in circuit board 30, too tightly cause the damage of circuit board 30 easily; Otherwise too pine causes circuit board 30 to be close to heat conduction placed side 101 easily, and influences the heat conduction, and the radiating efficiency of LED light fixture is reduced.In addition; Again because of circuit board 30 and heat conduction placed side 101 all can't reach true plane, thus how much there is gapped generation between the two, and radiating efficiency problem is slowly arranged; Under the long-term operation; Cause the electronic component generation high heat accumulation on the circuit board 30, the time one is of a specified duration, promptly causes decay of electronic component efficient even damage.

Prior art

10 ... Cooling base

101 ... The heat conduction placed side

20 ... Power supply unit

30 ... Circuit board

40…LED

50 ... Screw

The utility model

1 ... Circuit substrate

11 ... Metallic matrix

12 ... Ceramic layer

13 ... Perforation

2 ... Metallic circuit

3…LED

4 ... Lamp socket

41 ... First room

42 ... Second room

5 ... Power supply unit

51 ... Electric wire

6 ... Lampshade

7 ... Heat-conducting block

71 ... Radiating fin

72 ... Through hole

The utility model content

One purpose of the utility model is to provide a kind of LED lamp group structure, and it is the ceramic layer that utilizes circuit substrate to comprise metallic matrix and be coated on metal base surface, has good radiating efficiency to reach LED lamp group structure, and improves whole service life.

In order to reach above-mentioned purpose, the utility model provides a kind of LED lamp group structure, comprising:

One circuit substrate comprises a metallic matrix and reaches a ceramic layer that is combined in this metal base surface with the coating mode;

One metallic circuit is laid on this ceramic layer; And

One LED is fixed on this ceramic layer and and this metallic circuit electric connection.

Above-mentioned LED lamp group structure, wherein this metallic circuit is to be laid in this ceramic layer with printing, spraying or sputtering way.

Above-mentioned LED lamp group structure; Wherein also comprise a lamp socket and a power supply unit; Be provided with first room and one second room that are interconnected in this lamp socket, this circuit substrate is contained in this first room, and this power supply unit is contained in this second room and and this metallic circuit electric connection.

Above-mentioned LED lamp group structure wherein also comprises a lampshade, and this lampshade is fixed on this lamp socket and a corresponding LED cover cap.

Above-mentioned LED lamp group structure wherein also comprises a heat-conducting block, and this heat-conducting block connects the side of this circuit substrate away from this LED.

Above-mentioned LED lamp group structure; Wherein this circuit substrate is provided with a perforation, and this power supply unit has an electric wire, and this electric wire wears this perforation and is connected with this metallic circuit; This heat-conducting block is provided with a through hole that should perforation, and this perforation and this through hole provide this electric wire to wear jointly.

Above-mentioned LED lamp group structure, wherein this heat-conducting block is extended with a plurality of radiating fins towards the direction away from this circuit substrate.

Above-mentioned LED lamp group structure, wherein this heat-conducting block is to connect this circuit substrate with one-body molded mode.

Above-mentioned LED lamp group structure, wherein this LED is the light emitting diode of a SMD LED surface-mount device LED, this LED encapsulates with the sealing mode to be fixed in this ceramic layer.

Above-mentioned LED lamp group structure, wherein the thickness of this circuit substrate is more than the 6mm.

The utility model also has following effect; The utility model circuit substrate itself is a heat dissipation conductor; And the heat that LED is produced can dispel the heat uniformly, has good radiating efficiency to reach the utility model LED lamp group structure, and then improves whole service life; In addition, circuit substrate thickness is more than the 6mm, and the demand that can reduce radiating fin is to reduce cost of manufacture; But during for the LED3 of high wattage, the utility model heat-conducting block capable of using with the heat that LED was produced with high wattage, is done heat radiation on a large scale, and then more strengthens the heat dissipation of the utility model LED lamp group structure.

Below in conjunction with accompanying drawing and specific embodiment the utility model is described in detail, but not as the qualification to the utility model.

Description of drawings

The cross-sectional schematic of the existing LED light fixture of Fig. 1;

The three-dimensional exploded view of Fig. 2 the utility model LED lamp group structure;

The cross-sectional schematic of Fig. 3 the utility model led circuit substrate;

The combination sketch map of Fig. 4 the utility model LED lamp group structure;

The cross-sectional schematic of Fig. 5 the utility model LED lamp group structure;

The cross-sectional schematic of another embodiment of Fig. 6 the utility model LED lamp group structure.

Wherein, Reference numeral

The specific embodiment

Detailed description of relevant the utility model and technology contents, with the conjunction with figs. explanation as follows, yet appended accompanying drawing is not to be used to limit to the utility model only as illustrative purposes.

Please refer to Fig. 2 to shown in Figure 5, the utility model provides a kind of LED lamp group structure, and this LED lamp group structure mainly comprises a circuit substrate 1, a metallic circuit 2 and one or more LED3.

Circuit substrate 1 comprises a metallic matrix 11 and a ceramic layer 12, and ceramic layer 12 is combined in metallic matrix 11 surfaces with the coating mode, and circuit substrate 1 middle is provided with a perforation 13; Wherein, ceramic layer 12 is to be coated in metallic matrix 11 with spraying or sputtering way; In addition, the thickness of metallic matrix 11 is more than the 6mm, and the thickness that makes circuit substrate 1 is relatively also for more than the 6mm.

Metallic circuit 2 is laid on the ceramic layer 12, and this metallic circuit 2 is directly to be laid in ceramic layer 12 with mode of printing, but in fact, metallic circuit 2 is laid in the mode of ceramic layer 12, can adjust according to circumstances, does not exceed with present embodiment.

LED3 can be one or more, and one or more LED3 is separately fixed at ceramic layer 12 and and metallic circuit 2 electric connections.Wherein, LED3 can connect metallic circuit 2 with welding manner, but LED3 sticks together on circuit substrate 1 with scolding tin, normal situation because of expanding with heat and contract with cold for a long time and causing solder crack or drop; Make LED3 if can't be close to circuit substrate 1 or tin point generation crack, the heat conduction efficiency of LED3 will reduce; Therefore, the LED3 of the utility model most preferred embodiment is the light emitting diode of a SMD LED surface-mount device LED, and LED3 encapsulates with the sealing mode to be fixed in ceramic layer 12, and this sealing mode is to utilize the adhesive body of materials such as epoxy resin, acrylic or silica gel to surround each LED3.

The utility model also comprises a lamp socket 4 and a power supply unit 5, is provided with first room 41 and one second room 42 that are interconnected in the lamp socket 4; Circuit substrate 1 is contained in first room 41, power supply unit 5 be contained in second room 42 and with metallic circuit 2 electric connections; In addition, power supply unit 5 has an electric wire 51, and electric wire 51 wears perforation 13 and is connected with metallic circuit 2; In addition, lamp socket 4 offers a plurality of passages, but not as limit.

The utility model also comprises a lampshade 6, and this lampshade 6 is transparent hemisphere housing, and lampshade 6 offers a plurality of passages, but not as limit; This lampshade 6 is fixed on lamp socket 4 and to should the LED3 cover cap.

The combination of the utility model LED lamp group structure; It is the ceramic layer 12 that utilizes circuit substrate 1 to comprise metallic matrix 11 and be coated on metallic matrix 11 surfaces; Metallic circuit 2 is laid on the ceramic layer 12, and LED3 is separately fixed at ceramic layer 12 and and metallic circuit 2 electric connections.

Compare down; Existing LED light fixture is to utilize screw directly to wear and lock circuit board on cooling base, and its locking degree too tightly causes the damage of circuit board easily, otherwise; Locking degree too pine then causes circuit board to be close to cooling base easily, and the radiating efficiency of LED light fixture is reduced; In addition, all can't reach true plane because of circuit board and cooling base again, thus how much there is gapped generation between the two, and radiating efficiency problem is slowly arranged; Moreover place, the position, hole of screw has the accumulation of heat, and around the position, hole of screw, the causus situation of tool takes place, and makes the LED around the position, hole shorten the aurora phenomenon that declines because of causus influence causes the life-span.

By this; The utility model circuit substrate 1 itself is a heat dissipation conductor, therefore, and the clearance issues that does not have element to amplexiform; Simultaneously also need not design the position, hole locatees for screw; And the heat that LED3 is produced can dispel the heat uniformly, has good radiating efficiency to reach the utility model LED lamp group structure, and then improves whole service life.

Please refer to shown in Figure 6ly, the utility model LED lamp group structure also comprises a heat-conducting block 7, and this heat-conducting block 7 mode that can be formed in one extends to form on circuit substrate 1, or heat-conducting block 7 can be single element and heat posted connection circuit substrate 1 away from the side of LED3; Wherein, heat-conducting block 7 is extended with a plurality of radiating fins 71 towards the direction away from circuit substrate 1; Again, heat-conducting block 7 is provided with a through hole 72 of corresponding perforation 13, and perforation 13 and through hole 72 provide electric wire 51 to wear jointly.

By this, above-mentioned Fig. 2 is to circuit substrate 1 shown in Figure 5, and its thickness is more than the 6mm, and with the cooling base of existing relatively LED light fixture, the demand that can reduce radiating fin is to reduce cost of manufacture; But for the LED3 of high wattage, the utility model heat-conducting block 7 also capable of using with the heat that LED3 was produced with high wattage, is done heat radiation on a large scale, and then more strengthens the heat dissipation of the utility model LED lamp group structure.

Certainly; The utility model also can have other various embodiments; Under the situation that does not deviate from the utility model spirit and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.

Claims

1. a LED lamp group structure is characterized in that, comprising:

One metallic circuit is laid on this ceramic layer; And

2. LED lamp group structure according to claim 1 is characterized in that this metallic circuit is to be laid in this ceramic layer with printing, spraying or sputtering way.

3. LED lamp group structure according to claim 1; It is characterized in that; Also comprise a lamp socket and a power supply unit; Be provided with first room and one second room that are interconnected in this lamp socket, this circuit substrate is contained in this first room, and this power supply unit is contained in this second room and and this metallic circuit electric connection.

4. LED lamp group structure according to claim 3 is characterized in that, also comprises a lampshade, and this lampshade is fixed on this lamp socket and a corresponding LED cover cap.

5. LED lamp group structure according to claim 3 is characterized in that, also comprises a heat-conducting block, and this heat-conducting block connects the side of this circuit substrate away from this LED.

6. LED lamp group structure according to claim 5; It is characterized in that; This circuit substrate is provided with a perforation, and this power supply unit has an electric wire, and this electric wire wears this perforation and is connected with this metallic circuit; This heat-conducting block is provided with a through hole that should perforation, and this perforation and this through hole provide this electric wire to wear jointly.

7. LED lamp group structure according to claim 5 is characterized in that, this heat-conducting block is extended with a plurality of radiating fins towards the direction away from this circuit substrate.

8. LED lamp group structure according to claim 7 is characterized in that this heat-conducting block is to connect this circuit substrate with one-body molded mode.

9. LED lamp group structure according to claim 1 is characterized in that this LED is the light emitting diode of a SMD LED surface-mount device LED, and this LED encapsulates with the sealing mode to be fixed in this ceramic layer.

10. LED lamp group structure according to claim 1 is characterized in that the thickness of this circuit substrate is more than the 6mm.