CN202564437U - SMD-based LED lead frame - Google Patents
SMD-based LED lead frame Download PDFInfo
- Publication number
- CN202564437U CN202564437U CN2012201918873U CN201220191887U CN202564437U CN 202564437 U CN202564437 U CN 202564437U CN 2012201918873 U CN2012201918873 U CN 2012201918873U CN 201220191887 U CN201220191887 U CN 201220191887U CN 202564437 U CN202564437 U CN 202564437U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- functional areas
- plastic package
- led lead
- smd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
Disclosed is an SMD-based LED lead frame, comprising a plurality of functional blocks (1), wherein each functional block (1) is provided with a plastic packaging member (2), a welding leg functional block (3), a cup bottom functional block (4), a plastic packaging block (5), and an electrodeposition layer (6); the welding leg functional block (3) is connected with both the cup bottom functional block (4) and the plastic packaging block (5); the electrodeposition layer (6) is arranged upon the surfaces of the welding leg functional block (3) and the cup bottom functional block (4); and the plastic packaging member (2) is connected to the surface of the plastic packaging block (5). The SMD-based LED lead frame features low cost and high working reliability.
Description
Technical field
The utility model relates to the technical field that the LED semiconductor lead frame is made, and specifically is a kind of LED lead frame based on SMD (surface mount device).
Background technology
The production of LED lead frame at present is the punch forming of elder generation with copper material, on functional area, plates one deck silver through electroplating, and on each unit of framework, is processed into a glass bowl shape with special plastic through Shooting Technique again, cuts the section of folding pin at last and processes the LED lead frame.
Prior art comprises the several function piece based on the LED lead frame of SMD, and each functional block is equipped with leg functional areas, cup functional areas, the end and Plastic Package district, and described leg functional areas all are connected with cup functional areas, the end, Plastic Package district; Described LED lead frame is provided with an electrodeposited coating; Be connected with plastic package on the electrodeposited coating surface in said Plastic Package district.There is following defective: a in said structure, is equipped with an electrodeposited coating owing on the whole LED lead frame based on the LED lead frame of SMD in the use of reality, the consumption of therefore electroplating liquid medicine is very big, and the LED lead frame cost of producing is higher.B, since the Plastic Package district be provided with electrodeposited coating; And the electrodeposited coating surface is very smooth; Therefore relatively poor with the associativity of plastics; Thereby the long-term erosion of using both junctions, back to be vulnerable to aqueous vapor etc., thereby damage the LED lead frame, make that the functional reliability of prior art LED lead frame is relatively poor.
The utility model content
The technical problem that the utility model will solve is, overcomes the defective of above prior art, and the LED lead frame based on SMD that a kind of cost is low and functional reliability is high is provided.
The technical scheme of the utility model is; A kind of LED lead frame based on SMD is provided; Comprise the several function piece; Each functional block is equipped with plastic package, leg functional areas, cup functional areas, the end, Plastic Package district and electrodeposited coating, and described leg functional areas all are connected with cup functional areas, the end, Plastic Package district; Described electrodeposited coating is located on the surface of leg functional areas, cup functional areas, the end; Described plastic package is connected on the surface in Plastic Package district.
After adopting above structure, the utility model compared with prior art has the following advantages:
A, since the electrodeposited coating of the utility model be located on the surface of leg functional areas, cup functional areas, the end; Also only be coated on the surface of leg functional areas, cup functional areas, the end; And all do not apply electrodeposited coating except the position of these other local LED lead frames; The consumption of therefore electroplating liquid medicine is very little, and the LED lead frame cost of producing is very low.The plastic package of b, LED lead frame is connected on the surface in Plastic Package district; Reduced the existence of electrodeposited coating between the two; And, therefore utilized these textures to combine well well, thereby strengthened the adhesion between copper material and the plastics with plastics owing to kept the original texture in copper material surface; Solved long-term both junctions, back of using and received the problem that aqueous vapor etc. corrodes, made that the functional reliability of the utility model LED lead frame is higher.
Description of drawings
Fig. 1 is the structural representation of the utility model based on the LED lead frame of SMD.
Fig. 2 is the structural representation of functional block.
Fig. 3 is the sketch map of the plating area of functional block.
Shown in the figure 1, functional block, 2, plastic package, 3, the leg functional areas, 4, cup functional areas, the end, 5, the Plastic Package district, 6, electrodeposited coating.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is described further.
Like Fig. 1, Fig. 2, shown in Figure 3; A kind of LED lead frame of the utility model based on SMD; Comprise several function piece 1; Each functional block 1 is equipped with plastic package 2, leg functional areas 3, cup functional areas, the end 4, Plastic Package district 5 and electrodeposited coating 6, and described leg functional areas 3 all are connected with cup functional areas, the end 4, Plastic Package district 5, and wherein leg functional areas 3, cup functional areas, the end 4 and Plastic Package district 5 are made by a copper sheet; Described electrodeposited coating 6 is located on the surface of leg functional areas 3, cup functional areas, the end 4, one deck electrodeposited coating 6 that promptly on the surface of the leg functional areas 3 of copper sheet, cup functional areas, the end 4, applies; Described plastic package 2 is connected on the surface in Plastic Package district 5, i.e. plastic package 2 direct injection mouldings are connected on the upper surface in Plastic Package district 5.
Below only be described, but can not be interpreted as it is restriction claim with regard to the most preferred embodiment of the utility model.The utility model is not limited only to above embodiment, and its concrete structure allows variation.In every case the various variations of in the protection range of the utility model independent claims, being done are all in the protection range at the utility model.
Claims (1)
1. LED lead frame based on SMD; Comprise several function piece (1); Each functional block (1) is equipped with plastic package (2), leg functional areas (3), cup functional areas, the end (4), Plastic Package district (5) and electrodeposited coating (6), and described leg functional areas (3) all are connected with cup functional areas, the end (4), Plastic Package district (5); It is characterized in that: described electrodeposited coating (6) is located on the surface of leg functional areas (3), cup functional areas, the end (4); Described plastic package (2) is connected on the surface of Plastic Package district (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201918873U CN202564437U (en) | 2012-04-28 | 2012-04-28 | SMD-based LED lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201918873U CN202564437U (en) | 2012-04-28 | 2012-04-28 | SMD-based LED lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202564437U true CN202564437U (en) | 2012-11-28 |
Family
ID=47214062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201918873U Expired - Lifetime CN202564437U (en) | 2012-04-28 | 2012-04-28 | SMD-based LED lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202564437U (en) |
-
2012
- 2012-04-28 CN CN2012201918873U patent/CN202564437U/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203192845U (en) | Substrate and semiconductor structure | |
| CN202564437U (en) | SMD-based LED lead frame | |
| CN102963557A (en) | Protective film attaching device for mobile phone | |
| CN202503036U (en) | Led lead frame | |
| CN203968493U (en) | For the fixture of thin plate internal layer DES and brown production | |
| CN204966533U (en) | High light efficiency COB base plate | |
| CN202196807U (en) | LED support and LED light source using the LED support | |
| CN204335151U (en) | Metal laminate connecting circuit | |
| CN205194742U (en) | High light efficiency copper columnar order LED base plate | |
| CN203752603U (en) | Golden stainless steel coil tape with locally-gilded surface | |
| CN203697126U (en) | Cutting frame of separative elements | |
| CN202796929U (en) | Paster type lead frame | |
| CN202474030U (en) | Light-emitting diode (LED) supporting frame with heat dissipation plate and metal base plate integrated | |
| CN205752139U (en) | A kind of ultrathin SMA encapsulates diode tablet | |
| CN202662674U (en) | LED substrate | |
| CN204315624U (en) | A kind of flip-chip support | |
| CN202662675U (en) | LED substrate | |
| CN203553211U (en) | Light-emitting diode support | |
| CN205194739U (en) | LED base plate of area reflection cup cover | |
| CN205194733U (en) | High light efficiency LED base plate of area reflection cup cover | |
| CN203553220U (en) | LED nixie tube | |
| CN205194740U (en) | High heat dissipation LED base plate of illumination of area reflection cup cover | |
| CN204578890U (en) | A kind of single layer board | |
| CN205194744U (en) | Illumination is with high heat dissipation copper columnar order LED base plate | |
| CN205194743U (en) | Copper columnar order LED base plate of area reflection cup cover |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121128 |
|
| CX01 | Expiry of patent term |