CN205752139U - A kind of ultrathin SMA encapsulates diode tablet - Google Patents
A kind of ultrathin SMA encapsulates diode tablet Download PDFInfo
- Publication number
- CN205752139U CN205752139U CN201620170348.XU CN201620170348U CN205752139U CN 205752139 U CN205752139 U CN 205752139U CN 201620170348 U CN201620170348 U CN 201620170348U CN 205752139 U CN205752139 U CN 205752139U
- Authority
- CN
- China
- Prior art keywords
- tablet
- horizontal bar
- sma
- longitudinal rib
- ultrathin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a kind of ultrathin SMA and encapsulate diode tablet, including upper tablet and lower tablet, described upper tablet is identical with the structure of described lower tablet, described upper tablet includes two longitudinal rib material be arrangeding in parallel, described longitudinal rib material is provided with several locating slots, being provided with several horizontal bar material between two described longitudinal rib material, described horizontal bar material connects slide glass, described upper slide glass is provided with both positive and negative polarity pin.This utility model uses the tablet of matrix form, adds the quantity of diode on tablet, has saved production cost, improve production efficiency.
Description
Technical field
This utility model belongs to field of semiconductor devices, particularly relates to a kind of ultrathin SMA and encapsulates diode tablet.
Background technology
The encapsulation forward chip type of new electronic component, miniaturization, slimming, low power consumption development, it is all a piece of that SMA encapsulates existing technology
Only having 20 on tablet, and the thickness of tablet is the thickest, produce very inconvenient, production efficiency is low.
Existing SMA selects strip tablet mostly, uses manual scraper plate to scrape tin cream, and manual sucker loads chip, and the technique of manual welding resistance hinders
Weldering, efficiency is low, low precision, and yields is low.
Summary of the invention
The purpose of this utility model is the problem above overcoming prior art to exist, it is provided that a kind of ultrathin SMA encapsulates diode tablet, saves
Cost.
For realizing above-mentioned technical purpose, reaching above-mentioned technique effect, this utility model is achieved through the following technical solutions:
A kind of ultrathin SMA encapsulates diode tablet, and including upper tablet and lower tablet, described upper tablet is identical with the structure of described lower tablet, institute
Stating tablet and include two longitudinal rib material be arrangeding in parallel, described longitudinal rib material is provided with several locating slots, sets between two described longitudinal rib material
Having several horizontal bar material, described horizontal bar material connects slide glass, described upper slide glass is provided with both positive and negative polarity pin.
As optimize, the thickness of described upper tablet is 0.065.
As optimize, horizontal bar material is 29.
As optimize, the upper slide counts that described horizontal bar material is arranged is 18.
The beneficial effects of the utility model are:
This utility model uses the tablet of matrix form, adds the quantity of diode on tablet, has saved production cost, improve production efficiency.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing being further appreciated by of the present utility model, constitutes the part of the application, signal of the present utility model
Property embodiment and explanation thereof are used for explaining this utility model, are not intended that improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 overall structure schematic diagram.
Label declaration in figure: 1, upper slide glass, 2, locating slot, 3, longitudinal rib material, 4, horizontal bar material.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments, this utility model is described in detail.
With reference to shown in Fig. 1, a kind of ultrathin SMA encapsulates diode tablet, including upper tablet and lower tablet, described upper tablet and described lower tablet
Structure identical, described upper tablet includes two longitudinal rib material 3 be arrangeding in parallel, and described longitudinal rib material 3 is provided with several locating slots 2, two
Being provided with several horizontal bar material 4 between described longitudinal rib material 3, described horizontal bar material 4 connects slide glass 1, described upper slide glass 1 is provided with positive and negative
Pole pin, the slide glass on described lower tablet is corresponding with the pin on described upper slide glass 1, and upper tablet and lower tablet are bonded together.
The thickness of described upper tablet is 0.065, and the width of whole tablet is 74.5, a length of 215.6.
Horizontal bar material 4 is 29.
Upper slide glass 1 quantity arranged on described horizontal bar material 4 is 18, and the diode on whole tablet is 504, and existing tablet is typically all bar
Shape, only 20 diodes, therefore this technology improves production efficiency.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, those skilled in the art is come
Saying, this utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment, the equivalent made are replaced
Change, improvement etc., within should be included in protection domain of the present utility model.
Claims (2)
1. a ultrathin SMA encapsulates diode tablet, it is characterized in that: include tablet and lower tablet, described upper tablet is identical with the structure of described lower tablet, described upper tablet includes two longitudinal rib material (3) be arrangeding in parallel, described longitudinal rib material (3) is provided with several locating slots (2), it is provided with several horizontal bar material (4) between two described longitudinal rib material (3), slide glass (1) is connected on described horizontal bar material (4), described upper slide glass (1) is provided with both positive and negative polarity pin, horizontal bar material (4) is 29, upper upper slide glass (1) quantity arranged of described horizontal bar material (4) is 18.
Ultrathin SMA the most according to claim 1 encapsulates diode tablet, it is characterised in that: the thickness of described upper tablet is 0.065.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620170348.XU CN205752139U (en) | 2016-03-04 | 2016-03-04 | A kind of ultrathin SMA encapsulates diode tablet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620170348.XU CN205752139U (en) | 2016-03-04 | 2016-03-04 | A kind of ultrathin SMA encapsulates diode tablet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752139U true CN205752139U (en) | 2016-11-30 |
Family
ID=57373913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620170348.XU Expired - Fee Related CN205752139U (en) | 2016-03-04 | 2016-03-04 | A kind of ultrathin SMA encapsulates diode tablet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752139U (en) |
-
2016
- 2016-03-04 CN CN201620170348.XU patent/CN205752139U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20190304 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |