CN205050831U - Ultra -thin shape SOD123FL encapsulation tablet for diode - Google Patents
Ultra -thin shape SOD123FL encapsulation tablet for diode Download PDFInfo
- Publication number
- CN205050831U CN205050831U CN201520844884.9U CN201520844884U CN205050831U CN 205050831 U CN205050831 U CN 205050831U CN 201520844884 U CN201520844884 U CN 201520844884U CN 205050831 U CN205050831 U CN 205050831U
- Authority
- CN
- China
- Prior art keywords
- underframe
- upper frame
- slide glass
- horizontal bar
- longitudinal rib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005538 encapsulation Methods 0.000 title abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 60
- 239000011521 glass Substances 0.000 claims abstract description 22
- GVVPGTZRZFNKDS-JXMROGBWSA-N geranyl diphosphate Chemical compound CC(C)=CCC\C(C)=C\CO[P@](O)(=O)OP(O)(O)=O GVVPGTZRZFNKDS-JXMROGBWSA-N 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims description 3
- 210000003205 muscle Anatomy 0.000 abstract 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000007115 recruitment Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses an ultra -thin shape SOD123FL encapsulation tablet for diode, it includes frame and underframe, go up frame and lower two formula tablet structures of framework components matrix type, go up the horizontal muscle of frame material on the vertical muscle of last frame material that the frame includes two parallel arrangement and a plurality of, between the horizontal muscle of frame is expected mutual parallel arrangement the vertical muscle of frame is expected on two on a plurality of, every it goes up equal symmetry and is provided with slide glass on a plurality of to go up the horizontal muscle of frame material, it includes that GPP chip P utmost point contact surface and diode P extremely go between to go up the slide glass, the underframe includes the horizontal muscle of the underframe material that vertical muscle material of two parallel arrangement's underframe and number are the same with the horizontal muscle of last frame material, the mutual parallel arrangement of the horizontal muscle of underframe material is between two the vertical muscle of underframe material, be provided with on the horizontal muscle of the underframe material with every on the corresponding lower slide glass of slide glass, the slide glass includes that GPP chip N utmost point contact surface and diode N extremely go between down.
Description
Technical field
The utility model relates to a kind of super-thin SOD123FL and encapsulates diode tablet, belongs to semiconductor stamp-mounting-paper diode encapsulation technology field.
Background technology
The encapsulation forward chip type of new electronic component, microminiaturization, thinness, low power consumption development, SOD123FL packing forms is the most typical representative of this trend, progressively will replace axial diode and SMA packing forms.
The shortcomings such as SOD123FL selects strip tablet mostly, and adopt manual scraper plate to scrape tin cream, chip loaded by manual sucker, and the technique of manual welding resistance carries out welding resistance, and its efficiency is low, low precision, yields are low.Therefore, a kind of new technical scheme is needed to solve the problems referred to above.
Utility model content
The utility model provides a kind of super-thin SOD123FL to encapsulate diode tablet, and it adopts matrix two-piece type structure, and the SOD123FL product utilizing it to produce has ultra-thin feature, can online design road tow sides, is convenient to the miniaturization of wiring board; Meanwhile, the operating efficiency utilizing it to produce SOD123FL product is high, can saving copper consumption and save recruitment cost.
The technical solution adopted in the utility model is:
A kind of super-thin SOD123FL encapsulates diode tablet, it comprises upper frame and underframe, described upper frame and underframe composition matrix type two-piece type web structure, described upper frame comprises two upper frame longitudinal rib material be arranged in parallel and several upper frame horizontal bar material, several upper frame horizontal bar material are arranged in parallel between two upper frame longitudinal rib material, each described upper frame horizontal bar material is all symmetrically arranged with slide glass on several, and described upper slide glass comprises GPP chip P pole contact-making surface and diode P pole lead-in wire; Described underframe comprises two underframe longitudinal rib material be arranged in parallel underframe horizontal bar material identical with upper frame horizontal bar material with number, described underframe horizontal bar material is arranged in parallel between two underframe longitudinal rib material, described underframe horizontal bar material is provided with the lower slide glass corresponding with each upper slide glass, and described lower slide glass comprises GPP chip N pole contact-making surface and diode N pole lead-in wire.
Further, one of them upper frame longitudinal rib material and underframe longitudinal rib material corresponding thereto are all staggeredly equipped with alignment pin circular hole and alignment pin elliptical aperture, another upper frame longitudinal rib material and underframe longitudinal rib material are corresponding thereto provided with fool proof alignment pin circular hole.
Further, described upper frame horizontal bar material has 12.
The utility model has the advantages that: adopt matrix two-piece type structure, the SOD123FL product utilizing it to produce has ultra-thin feature, can online design road tow sides, be convenient to the miniaturization of wiring board; Meanwhile, the operating efficiency utilizing it to produce SOD123FL product is high, can saving copper consumption and save recruitment cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of upper frame.
Fig. 2 is the structural representation of underframe.
Wherein: 1, upper frame longitudinal rib material, 2, upper frame horizontal bar material, 3, upper slide glass, 4, GPP chip P pole contact-making surface, 5, diode P pole lead-in wire, 6, underframe longitudinal rib material, 7, underframe horizontal bar material, 8, lower slide glass, 9, GPP chip N pole contact-making surface, 10, diode N pole lead-in wire, 11, alignment pin circular hole, 12, alignment pin elliptical aperture, 13, fool proof alignment pin circular hole.
Embodiment
As depicted in figs. 1 and 2, a kind of super-thin SOD123FL encapsulates diode tablet, it comprises upper frame and underframe, upper frame and underframe composition matrix type two-piece type web structure, upper frame comprises two upper frame longitudinal rib material 1 be arranged in parallel and 12 upper frame horizontal bar material 2,12 upper frame horizontal bar material 2 are arranged in parallel between two upper frame longitudinal rib material 1, each upper frame horizontal bar material 2 is all symmetrically arranged with 24 upper slide glasses 3, upper slide glass 3 comprises GPP chip P pole contact-making surface 4 and diode P pole lead-in wire 5; Underframe comprises two underframe longitudinal rib material 6 be arranged in parallel underframe horizontal bar material 7 identical with upper frame horizontal bar material with number, underframe horizontal bar material 7 is arranged in parallel between two underframe longitudinal rib material 6, underframe horizontal bar material 7 is provided with each on the corresponding lower slide glass 8 of slide glass, lower slide glass 8 comprises GPP chip N pole contact-making surface 9 and diode N pole lead-in wire 10.A upper frame longitudinal rib material 1 and underframe longitudinal rib material 6 corresponding thereto are all staggeredly equipped with alignment pin circular hole 11 and alignment pin elliptical aperture 12 wherein, on the other framework longitudinal rib material 1 and underframe longitudinal rib material 6 are corresponding thereto provided with fool proof alignment pin circular hole 13.
Claims (3)
1. a super-thin SOD123FL encapsulates diode tablet, it comprises upper frame and underframe, it is characterized in that: described upper frame and underframe composition matrix type two-piece type web structure, described upper frame comprises two upper frame longitudinal rib material be arranged in parallel and several upper frame horizontal bar material, several upper frame horizontal bar material are arranged in parallel between two upper frame longitudinal rib material, each described upper frame horizontal bar material is all symmetrically arranged with slide glass on several, and described upper slide glass comprises GPP chip P pole contact-making surface and diode P pole lead-in wire; Described underframe comprises two underframe longitudinal rib material be arranged in parallel underframe horizontal bar material identical with upper frame horizontal bar material with number, described underframe horizontal bar material is arranged in parallel between two underframe longitudinal rib material, described underframe horizontal bar material is provided with the lower slide glass corresponding with each upper slide glass, and described lower slide glass comprises GPP chip N pole contact-making surface and diode N pole lead-in wire.
2. a kind of super-thin SOD123FL according to claim 1 encapsulates diode tablet, it is characterized in that: one of them upper frame longitudinal rib material and underframe longitudinal rib material corresponding thereto are all staggeredly equipped with alignment pin circular hole and alignment pin elliptical aperture, another upper frame longitudinal rib material and underframe longitudinal rib material are corresponding thereto provided with fool proof alignment pin circular hole.
3. a kind of super-thin SOD123FL according to claim 1 encapsulates diode tablet, it is characterized in that: described upper frame horizontal bar material has 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520844884.9U CN205050831U (en) | 2015-10-26 | 2015-10-26 | Ultra -thin shape SOD123FL encapsulation tablet for diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520844884.9U CN205050831U (en) | 2015-10-26 | 2015-10-26 | Ultra -thin shape SOD123FL encapsulation tablet for diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205050831U true CN205050831U (en) | 2016-02-24 |
Family
ID=55344377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520844884.9U Expired - Fee Related CN205050831U (en) | 2015-10-26 | 2015-10-26 | Ultra -thin shape SOD123FL encapsulation tablet for diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205050831U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105336721A (en) * | 2015-10-26 | 2016-02-17 | 杨海林 | Material sheet for ultrathin SOD123FL encapsulation diode |
-
2015
- 2015-10-26 CN CN201520844884.9U patent/CN205050831U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105336721A (en) * | 2015-10-26 | 2016-02-17 | 杨海林 | Material sheet for ultrathin SOD123FL encapsulation diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160718 Address after: 226400, a group of Jincheng village, Hekou Town, Rudong County, Jiangsu, Nantong Patentee after: Nantong Hongjinbei Electronic Technology Co., Ltd. Address before: 226400, a group of Jincheng village, Hekou Town, Rudong County, Jiangsu, Nantong Patentee before: Yang Hailin |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160224 Termination date: 20181026 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |