CN203553220U - LED nixie tube - Google Patents
LED nixie tube Download PDFInfo
- Publication number
- CN203553220U CN203553220U CN201320565641.2U CN201320565641U CN203553220U CN 203553220 U CN203553220 U CN 203553220U CN 201320565641 U CN201320565641 U CN 201320565641U CN 203553220 U CN203553220 U CN 203553220U
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- CN
- China
- Prior art keywords
- bonding pad
- wafer set
- wafer
- group
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Led Device Packages (AREA)
Abstract
The utility model relates to an LED nixie tube. A conventional LED nixie tube comprises an aluminium substrate, an insulating layer, a wiring bonding pad positive electrode, a wiring bonding pad negative electrode, and a plurality of wafers, a circuit is more complex, the effect of heat dissipation is poorer, and the performance is not reliable. The LED nixie tube provided by the utility model comprises an aluminium substrate, an insulating layer, a wiring bonding pad positive electrode, and a wiring bonding pad negative electrode. The insulating layer is fixed on the aluminium substrate. The LED nixie tube is characterized in that the LED nixie tube also comprises a die-bonding pad and a plurality of groups of wafers; each group of wafers is formed by the series connection of a plurality of wafers; each group of wafers are provided with a wafer group positive electrode and a wafer group negative electrode; the wiring bonding pad positive electrode, the wiring bonding pad negative electrode and the die-bonding pad are all fixed on the insulating layer; the plurality of groups of wafers are all fixed on the die-bonding pad; and the wafer group positive and negative electrodes of the wafer groups are respectively connected to the wiring bonding pad positive electrode and the wiring bonding pad negative electrode. The LED nixie tube provided by the utility model is reasonable in structural design, is reliable in performance, is good in effect of heat dissipation, and is simple in circuit.
Description
Technical field
The utility model relates to a kind of charactron, especially relates to a kind of LED charactron.
Background technology
Conventional LED charactron comprises aluminium base, insulating barrier, routing pad positive pole, routing pad negative pole and several wafer at present, wherein, insulating barrier is fixed on aluminium base, routing pad positive pole, routing pad negative pole and several wafer are all fixed on insulating barrier, parallel with one another between several wafers, positive pole in wafer is connected on routing pad positive pole, and the negative pole in wafer is connected on routing pad negative pole.Due to parallel with one another between several wafers, cause circuit comparatively complicated, in addition, the radiating effect of such LED charactron is poor, and performance is reliable not.
Utility model content
The purpose of this utility model is to overcome above shortcomings in prior art, and provides a kind of reasonable in design, dependable performance, good heat dissipation effect, the simple LED charactron of circuit.
The technical scheme in the invention for solving the above technical problem is: this LED charactron comprises aluminium base, insulating barrier, routing pad positive pole and routing pad negative pole, described insulating barrier is fixed on aluminium base, its design feature is: also comprise die bond pad and array wafer set, every group of wafer set forms by several wafer tandem, in every group of wafer set, be provided with wafer set positive pole and wafer set negative pole, described routing pad is anodal, routing pad negative pole and die bond pad are all fixed on insulating barrier, described array wafer set is all fixed on die bond pad, wafer set positive pole and wafer set negative pole in wafer set are connected on routing pad positive pole and routing pad negative pole.
As preferably, aluminium base described in the utility model is rectangle or square structure.
As preferably, in every group of wafer set described in the utility model, be in series with 4-20 wafer 61.
As preferably, the quantity of wafer set described in the utility model is 6-60 group.
The utility model compared with prior art, has the following advantages and effect: comprise array wafer set, every group of wafer set forms by several wafer tandem, between wafer set, is in parallel, and makes circuit comparatively simple.Array wafer set is all fixed on die bond pad, and bonding pad area is large, and good heat dissipation effect is conducive to promote the overall performance of LED charactron.The utility model can arrange on surface one deck reflector layer, forms reflective surface, is conducive to improve light effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED charactron in the utility model embodiment.
Fig. 2 is the local structure for amplifying schematic diagram of LED charactron after analysing and observe in the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing and by embodiment, the utility model is described in further detail, and following examples are to explanation of the present utility model and the utility model is not limited to following examples.
Embodiment.
Referring to Fig. 1 to Fig. 2, LED charactron in the present embodiment comprises aluminium base 1, insulating barrier 2, die bond pad 3, routing pad positive pole 4, routing pad negative pole 5, array wafer set 6, wherein, aluminium base 1 is square structure, and the aluminium base 1 in the utility model can be also rectangle structure.Die bond pad 3 in the present embodiment is rectangle structure.
Insulating barrier 2 in the present embodiment is fixed on aluminium base 1, and every group of wafer set 6 is in series by several wafers 61, generally, is in series with 4-20 wafer 61 in every group of wafer set 6.
In every group of wafer set 6 in the present embodiment, be provided with wafer set positive pole and wafer set negative pole, routing pad positive pole 4, routing pad negative pole 5 and die bond pad 3 are all fixed on insulating barrier 2, array wafer set 6 is all fixed on die bond pad 3, wafer set positive pole and wafer set negative pole in wafer set 6 are connected on routing pad anodal 4 and routing pad negative pole 5, make between array wafer set 6 parallel with one another.Generally, in the utility model, the quantity of wafer set 6 is between 6-60 group.
The present embodiment can arrange on surface one deck reflector layer, forms reflective surface, is conducive to improve light effect, and as one deck white paint layer 8 can be set on surface, the die bond pad 3 in the present embodiment, routing pad anodal 4 and routing pad negative pole 5 form one deck conductive layer 7.
In addition, it should be noted that, the specific embodiment described in this specification, the shape of its parts and components, institute's title of being named etc. can be different, and the above content described in this specification is only to the explanation of the utility model structure example.All equivalence variation or simple change of doing according to described structure, feature and the principle of the utility model patent design, are included in the protection range of the utility model patent.The utility model person of ordinary skill in the field can make various modifications or supplements or adopt similar mode to substitute described specific embodiment; only otherwise depart from structure of the present utility model or surmount this scope as defined in the claims, all should belong to protection range of the present utility model.
Claims (4)
1. a LED charactron, comprise aluminium base, insulating barrier, routing pad positive pole and routing pad negative pole, described insulating barrier is fixed on aluminium base, it is characterized in that: also comprise die bond pad and array wafer set, every group of wafer set forms by several wafer tandem, in every group of wafer set, be provided with wafer set positive pole and wafer set negative pole, described routing pad is anodal, routing pad negative pole and die bond pad are all fixed on insulating barrier, described array wafer set is all fixed on die bond pad, wafer set positive pole and wafer set negative pole in wafer set are connected on routing pad positive pole and routing pad negative pole.
2. LED charactron according to claim 1, is characterized in that: described aluminium base is rectangle or square structure.
3. LED charactron according to claim 1, is characterized in that: in described every group of wafer set, be in series with 4-20 wafer (61).
4. LED charactron according to claim 1, is characterized in that: the quantity of described wafer set is 6-60 group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320565641.2U CN203553220U (en) | 2013-09-12 | 2013-09-12 | LED nixie tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320565641.2U CN203553220U (en) | 2013-09-12 | 2013-09-12 | LED nixie tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553220U true CN203553220U (en) | 2014-04-16 |
Family
ID=50471297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320565641.2U Expired - Fee Related CN203553220U (en) | 2013-09-12 | 2013-09-12 | LED nixie tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553220U (en) |
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2013
- 2013-09-12 CN CN201320565641.2U patent/CN203553220U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20140912 |
|
| EXPY | Termination of patent right or utility model |