CN202662598U - High-reliability integrated packaged LED chip - Google Patents
High-reliability integrated packaged LED chip Download PDFInfo
- Publication number
- CN202662598U CN202662598U CN2012200861789U CN201220086178U CN202662598U CN 202662598 U CN202662598 U CN 202662598U CN 2012200861789 U CN2012200861789 U CN 2012200861789U CN 201220086178 U CN201220086178 U CN 201220086178U CN 202662598 U CN202662598 U CN 202662598U
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- CN
- China
- Prior art keywords
- chip
- substrate
- recessed cup
- led chip
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The utility model relates to a high-reliability integrated packaged LED (Light-Emitting Diode) chip comprising a substrate and multiple concave cups formed on the substrate, wherein the bottom surfaces of the concave cups are a metal layer of the substrate. The high-reliability integrated packaged LED chip is characterized in that the bottom surface of each concave cup is respectively provided with at least two LED chips in parallel; a linkage chip, of which the front is electrically conductive and the back is electrically insulated, is arranged on the metal layer between the neighboring concave cups; and the LED chips in the neighboring concave cups are interconnected through the linkage chip, wherein the LED chip in the concave cup at the end part is connected to an electrode on the substrate in a routing manner. By the above technical scheme, according to the high-reliability integrated packaged LED chip, the chip group is redesigned, the problem of integral failure caused by failure of single chip is avoided, the reliability of an integrated packaged module is improved greatly, the circuit design of a metal substrate is avoided, and the whole electrical circuit is realized by the linkage between the chips.
Description
Technical field
The utility model relates to the led chip encapsulation field.
Background technology
Encapsulation technology is main toward high-luminous-efficiency, high reliability, high heat-sinking capability and the development of slimming four direction at present, wherein on the direction of encapsulation technology in high reliability, as shown in Figure 1, the normally directly series connection between each led chip of present LED multi-chip integration packaging, in case there is a chips to lose efficacy then whole chipset complete failure, cause the reliability of integration packaging low, risk is high.
Summary of the invention
The utility model purpose is the circuit design by rational deployment, and the product global reliability is improved.
According to an aspect, the utility model provides a kind of integration packaging led chip of high reliability, it comprises substrate and a plurality of recessed cup that is formed on the substrate, the bottom surface of recessed cup is the metal level of substrate, it is characterized in that: be arranged in parallel respectively at least two led chips on the bottom surface of each recessed cup, being provided with the front on the metal level between the adjacent recessed cup is and electrically conducts and the back is the connection chip that is electrically insulated, led chip in the adjacent recessed cup is realized interconnectedly by connecting chip, and the led chip routing that wherein is positioned at the recessed cup of end is connected in the electrode on the substrate.
As further improvement, connecting chip is the Si chip.
As further improvement, the high reflection of the silver-plated realization of the underrun of recessed cup.
According to an aspect, the utility model provides a kind of integration packaging led chip of high reliability, it comprises substrate and a plurality of recessed cup that is formed on the substrate, the bottom surface of recessed cup is the metal level of substrate, it is characterized in that: be respectively arranged with a pair of connection chip on bottom surface of each recessed cup and be parallel at least two led chips between a pair of connection chip, the front that connects chip is and electrically conducts and the back is and is electrically insulated, led chip in the adjacent recessed cup is realized interconnectedly by connecting chip, and the connection chip routing that wherein is positioned at the recessed cup of end is connected in the electrode on the substrate.
As further improvement, connecting chip is the Si chip.
As further improvement, the high reflection of the silver-plated realization of the underrun of recessed cup.
Owing to adopt technique scheme, the utility model is by redesigning chipset, and the global failure problem of avoiding one chip to lose efficacy and cause significantly promotes the reliability of integration packaging module, avoided the circuit design of metal substrate, connected by the chip chamber circuit and realize whole electricity loop.
Description of drawings
Accompanying drawing 1 is the structural representation of integration packaging led chip of the prior art;
Accompanying drawing 2 is the structural representation according to the integration packaging led chip of high reliability of the present utility model;
Wherein: 1, recessed cup; 2, led chip; 3, connect chip; 4, substrate.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that protection range of the present utility model is made more explicit defining.
Shown in accompanying drawing 2, the integration packaging led chip of the high reliability in the present embodiment comprises substrate 4 and a plurality of recessed cup 1 that is interconnected that is formed on the substrate 4, the bottom surface of recessed cup 1 is the metal level of substrate 4, the high reflection of the silver-plated realization of the underrun of recessed cup 1, two led chips 2 have been arranged in parallel respectively on the bottom surface of each recessed cup 1, be provided with on the metal level between the adjacent recessed cup 1 and connect chip 3, connecting chip 3 is the Si chip, and its front is and electrically conducts and the back is the short circuit that is electrically insulated to avoid with metal substrate.
In the present embodiment, the led chip 2 in the adjacent recessed cup 1 is realized interconnectedly by connecting chip 3, and the led chip 2 that wherein is positioned at the recessed cup 1 of end is connected in electrode (positive pole and negative pole) on the substrate 4 by connection chip 3 routings that are positioned at its glass.Here the led chip 2 that it is pointed out that the recessed cup 1 that is positioned at the end equally also directly routing be connected in electrode (positive pole and negative pole) on the substrate 4, to realize similar effect.Can realize area source by encapsulating in recessed cup at last.
This programme changes the chip in each recessed cup into parallel connection by series connection, then adds one at every group of chip chamber in parallel and connects chip, and connecting chip can be the Si chip, and requiring has metal electrode into the insulation chip in the front.By this design, avoided the circuit design of metal substrate, connect by the chip chamber circuit and realize whole electricity loop, it has following beneficial effect: 1, need not the design of metal substrate circuit, the high reflection of silver-plated realization is simplified and passed through to substrate; 2, the parallel connection LED chip has been avoided single chips to lose efficacy and has been caused the whole system inefficacy; 3, the direct die bond of chip has realized best radiating effect in metal substrate.
As selectable embodiment of the utility model, be formed with a plurality of recessed cups 1 that are separated from each other setting on the substrate 4, the bottom surface of recessed cup 1 is the metal level of substrate 4, be respectively arranged with a pair of connection chip 3 on bottom surface of each recessed cup 1 and be parallel at least two led chips 2 between a pair of connection chip 3, the front that connects chip 3 is and electrically conducts and the back is and is electrically insulated, led chip 2 in the adjacent recessed cup 1 is realized interconnectedly by connecting chip 3, and connection chip 3 routings that wherein are positioned at the recessed cup 1 of end are connected in the electrode (positive pole and negative pole) on the substrate 4.Connect chip 3 and be preferably the Si chip, high reflection can be realized by silver coating in the bottom surface of recessed cup 1.
Above execution mode only is explanation technical conceive of the present utility model and characteristics; its purpose is to allow the people that is familiar with technique understand content of the present utility model and is implemented; can not limit protection range of the present utility model with this; all equivalences of doing according to the utility model Spirit Essence change or modify, and all should be encompassed in the protection range of the present utility model.
Claims (6)
1. the integration packaging led chip of a high reliability, it comprises substrate (4) and a plurality of recessed cup (1) that is formed on the described substrate (4), the bottom surface of described recessed cup (1) is the metal level of described substrate (4), it is characterized in that: be arranged in parallel respectively at least two led chips (2) on the bottom surface of each described recessed cup (1), being provided with the front on the metal level between the adjacent recessed cup (1) is and electrically conducts and the back is the connection chip (3) that is electrically insulated, led chip (2) in the adjacent recessed cup (1) is realized interconnected by described connection chip (3), led chip (2) routing that wherein is positioned at recessed glass (1) of end is connected in the electrode on the described substrate (4).
2. the integration packaging led chip of high reliability according to claim 1, it is characterized in that: described connection chip (3) is the Si chip.
3. the integration packaging led chip of high reliability according to claim 1 is characterized in that: the bottom surface of described recessed cup (1) is silver coated.
4. the integration packaging led chip of a high reliability, it comprises substrate (4) and a plurality of recessed cup (1) that is formed on the described substrate (4), the bottom surface of described recessed cup (1) is the metal level of described substrate (4), it is characterized in that: be respectively arranged with a pair of connection chip (3) on the bottom surface of each described recessed cup (1) and be parallel at least two led chips (2) between the described a pair of connection chip (3), the front of described connection chip (3) is and electrically conducts and the back is and is electrically insulated, led chip (2) in the adjacent recessed cup (1) is realized interconnected by described connection chip (3), connection chip (3) routing that wherein is positioned at recessed glass (1) of end is connected in the electrode on the described substrate (4).
5. the integration packaging led chip of high reliability according to claim 4, it is characterized in that: described connection chip (3) is the Si chip.
6. the integration packaging led chip of high reliability according to claim 4 is characterized in that: the bottom surface of described recessed cup (1) is silver coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200861789U CN202662598U (en) | 2012-03-09 | 2012-03-09 | High-reliability integrated packaged LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200861789U CN202662598U (en) | 2012-03-09 | 2012-03-09 | High-reliability integrated packaged LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202662598U true CN202662598U (en) | 2013-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200861789U Expired - Fee Related CN202662598U (en) | 2012-03-09 | 2012-03-09 | High-reliability integrated packaged LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202662598U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593337A (en) * | 2012-03-09 | 2012-07-18 | 苏州玄照光电有限公司 | High-reliability integrated packaging LED (light-emitting diode) chip |
-
2012
- 2012-03-09 CN CN2012200861789U patent/CN202662598U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102593337A (en) * | 2012-03-09 | 2012-07-18 | 苏州玄照光电有限公司 | High-reliability integrated packaging LED (light-emitting diode) chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20160309 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |