CN205194739U

CN205194739U - LED base plate of area reflection cup cover

Info

Publication number: CN205194739U
Application number: CN201520892294.3U
Authority: CN
Inventors: 黄琦; 黄强; 鲍量
Original assignee: GONGQINGCHENG CHAOQUN TECHNOLOGY Co Ltd
Current assignee: GONGQINGCHENG CHAOQUN TECHNOLOGY Co Ltd
Priority date: 2015-11-11
Filing date: 2015-11-11
Publication date: 2016-04-27
Anticipated expiration: 2025-11-11

Abstract

The utility model belongs to the technical field of the LED base plate, a LED base plate of area reflection cup cover is provided, setting up solid electro -coppering post in organic resin substrate, the LED substrate surface sets up reflection cup cover, and LED base plate cell size is 1.3mm1.3mm. At the practical application in -process, owing to adopt the copper post technique of switching on, a large amount of heats that make the LED chip produce pass through the metallic copper post and transmit the reverse side face of weld, greatly reduced the positive junction temperature of LED base plate, base plate positive installation reflection cup cover in front increases the reflection of light angle that the LED chip produced simultaneously, increases the light efficiency of encapsulation back LED device.

Description

With the LED-baseplate of reflector cover

Technical field

The utility model relates to a kind of illumination high-heat-dispersion LED substrate, belongs to LED technology field.

Background technology

LED is a kind of novel semi-conductor solid light source, have that security reliability is strong, power consumption is few, luminous efficiency is high, applicability is strong, good stability, response time are short, color changeable, be conducive to the advantages such as environmental protection, its performance is just constantly perfect, is widely used in illumination, the fields such as display.

Although LED has many merits, LED be made commercially can be widely used and still there are problems, wherein LED heat radiation is wherein one of problem.LED chip can produce a large amount of heats equally in the middle of use procedure, especially LED is point-like illuminating source, the heat produced concentrates in minimum region, if the heat produced cannot distribute timely and effectively, the junction temperature of PN junction can be caused to raise, thus speed-up chip and potting resin is aging, solder joint also may be caused to melt, make chip failure, and then directly affect useful life and the luminous efficiency of LED, particularly great power LED, in use produced heat is larger, require higher to heat dissipation technology, can say that LED heat dissipation problem is directly connected to its development prospect, therefore the heat-sinking capability of LED product will be promoted, crucial being still searches out a kind of method can accelerating LED heat radiation.

In order to solve LED heat dissipation problem, existing many technical schemes at present, but the basic difference of its general principle is little.The heat produced of LED chip, passes mainly through three kinds of paths, and these three kinds of paths comprise, upwards radiation, downwards conduction and sideways conduction.In order to ensure LED chip light extraction efficiency upwards, generally select silica gel to carry out packaging LED chips, but its thermal resistance is very large, therefore heat upwards radiation is little, so, only have the heat considering that two other path produces to conduct LED.Correlation theory and experiment show, the heat that LED chip produces mainly conducts downwards in heat-conducting substrate, and the cross conduction of heat is limited.

In LED illumination process, how to provide radiating efficiency and light efficiency to be the Focal point and difficult point that LED applies always.

Utility model content

The purpose of this utility model overcomes current LED heat radiation substrate to dispel the heat bad shortcoming, provides a kind of LED-baseplate with reflector cover.

For achieving the above object, the utility model have employed following technical proposals: a kind of LED-baseplate with reflector cover, it is characterized in that described LED-baseplate comprises organic resin substrate, LED-baseplate cell size is 1.3mm*1.3mm, be provided with the copper post running through organic resin substrate thickness direction, the upper and lower surface of described organic resin substrate is respectively equipped with upper strata Copper Foil, lower floor's Copper Foil, copper post connects upper strata Copper Foil and lower floor's Copper Foil, the surface of described upper strata Copper Foil and lower floor's Copper Foil is coated with nickel dam, described nickel dam is outer silver coated, is coated with reflector cover outside the silver layer of upper surface.

The color of resin of described organic resin substrate is white.Described upper strata Copper Foil and lower floor's Copper Foil make circuit.

As preferably, the glass transition temperature of described white organic resin substrate is 310 DEG C.

As preferably, described copper post is solid electro-coppering post, and the diameter of copper post is 0.10,0.15 or 0.20mm.

Technique effect of the present utility model: by arranging the copper post running through its thickness direction on organic resin substrate, improve the heat dispersion of organic resin substrate itself, copper post connects upper strata Copper Foil and lower floor's Copper Foil and improves heat dispersion between upper strata Copper Foil and lower floor's Copper Foil, thus ensures that LED-baseplate can meet the instructions for use of high heat dissipation technology as the support plate of electronic component in the application of reality.Substrate surface arranges reflector cover, increases the reflection angle of the light that LED chip produces, and increases the light efficiency of the rear LED component of encapsulation.

Accompanying drawing explanation

Fig. 1 is the utility model product side schematic view.

Fig. 2 is the utility model front appearance schematic diagram.

1. organic resin substrates in figure; 2. upper strata Copper Foil; 3. lower floor's Copper Foil; 4. copper post; 5. reflector cover 6. nickel dam; 7. silver layer.

Embodiment

For the ease of understanding, illustrate the utility model further below in conjunction with preferred embodiment.

Embodiment 1

A kind of LED-baseplate with reflector cover, its structure as shown in Figure 1, the glass transition temperature that described LED-baseplate comprises center is the organic resin substrate 1 of 270 DEG C, described organic resin substrate 1 is provided with the copper post 4 that the diameter running through its thickness direction is 0.10,0.15 or 0.20mm, described copper post 4 is solid electro-coppering posts, and the upper and lower surface of organic resin substrate 1 is respectively equipped with upper strata Copper Foil 2, lower floor's Copper Foil 3; Described upper strata Copper Foil 2 and lower floor's Copper Foil 2 make circuit; The surface of described upper strata Copper Foil 2 and lower floor's Copper Foil 3 is coated with nickel dam 6, and nickel dam 6 outer silver coated 7, has reflector cover 5 outside the silver layer 7 of upper surface.Reflector cover 5 can improve reflectivity, increases the reflection angle of the light that LED chip produces, and increases the light efficiency of the rear LED component of encapsulation.

The color of resin of described organic resin substrate 1 is white, and glass transition temperature is 310 DEG C.

The reflecting surface 30-60 degree of described reflector cover 5 tilts.

As shown in Figure 2, LED-baseplate cell size is 1.3mm*1.3mm.

Claims

1. the LED-baseplate with reflector cover, it is characterized in that described LED-baseplate comprises organic resin substrate, LED-baseplate cell size is 1.3mm*1.3mm, be provided with the copper post running through organic resin substrate thickness direction, described copper post is solid electro-coppering post, the upper and lower surface of described organic resin substrate is respectively equipped with upper strata Copper Foil, lower floor's Copper Foil, copper post connects upper strata Copper Foil and lower floor's Copper Foil, the surface of described upper strata Copper Foil and lower floor's Copper Foil is coated with nickel dam, described nickel dam is outer silver coated, is coated with reflector cover outside the silver layer of upper surface.

2. the LED-baseplate of band reflector cover according to claim 1, is characterized in that the diameter of described copper post can be 0.10,0.15 or 0.20mm.