CN202549921U - Light-emitting diode (LED) packaging device with silver colloid guide structure - Google Patents
Light-emitting diode (LED) packaging device with silver colloid guide structure Download PDFInfo
- Publication number
- CN202549921U CN202549921U CN2012200506363U CN201220050636U CN202549921U CN 202549921 U CN202549921 U CN 202549921U CN 2012200506363 U CN2012200506363 U CN 2012200506363U CN 201220050636 U CN201220050636 U CN 201220050636U CN 202549921 U CN202549921 U CN 202549921U
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- led
- elargol
- chip
- hole
- heat sink
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Abstract
The utility model discloses a light-emitting diode (LED) packaging device with a silver colloid guide structure, relates to an LED packaging technology, and is used for solving the problem of electricity leakage which is possibly generated between an LED chip and silver colloid. The technical scheme is that the LED chip is fixed on a heat sink through the silver colloid; a circle of annular grooves are formed on the heat sink and around the periphery of the LED chip; a through hole which penetrates through the heat sink is formed in the annular grooves; and through holes are formed in each direction at the periphery of the chip. According to the LED packaging device with the silver colloid guide structure, the problem of electricity leakage generated between the stacked silver colloid and the electrode of the LED chip can be solved, and the chip has small possibility of degumming in a resonance environment.
Description
Technical field
The utility model relates to a kind of LED matrix, particularly relates to the LED encapsulation technology.
Background technology
Existing high-power adopting surface mounted LED device is that led chip is bonded on copper (or copper-clad) heat sink through elargol.Though though the elargol amount that this class formation uses is very little; But because very thin of the Sapphire Substrate of led chip; In bonding led chip, because operation factors, if the elargol that is deposited in around the chip is inhomogeneous; The elargol that particularly is deposited in a certain side of chip is too high, and the problem that electric leakage takes place for elargol and chip electrode can take place.
The utility model content
The technical problem that the utility model will solve provides a kind of LED packaging with elargol flow-guiding structure, is used to solve contingent electric leakage problem between led chip and the elargol.
For solving the problems of the technologies described above, the utility model proposes a kind of LED packaging with elargol flow-guiding structure, comprises led chip, led chip through elargol be fixed on heat sink on; And said heat sink on, around said led chip, be provided with a circle annular groove, be provided with in the annular groove and pass heat sink through hole, be equipped with through hole on each direction around the chip.
Preferably: said through hole is vertical through hole.Through hole can also be the hole of bending.
Preferably: the inboard wall of said annular groove is the slope.The angle on slope is preferably 45 °, also can be the angle of different angle such as 60 ° and 30 °.The slope helps elargol and flows in the annular groove.
Preferably: said annular groove is square groove or circular recess.
Preferably: the aperture of said through hole in annular groove is uncovered.The uncovered elargol that helps flows in the through hole.
Preferably: said chip is located on the convexity.Convexity is preferably metallic copper material, perhaps ag material.
The beneficial effect of the utility model:
Compare prior art, the utility model on heat sink, led chip around be provided with annular groove, be provided with through hole in the groove, this annular groove and through hole can hold certain elargol.When elargol is excessive; Only need to use the Eyedropper tool; Opening part below through hole is through a small amount of elargol of negative pressure suck-back; Make elargol can avoid the phenomenon of around substrate, piling up too high elargol, get into the electric leakage problem that takes place between the electrode of the elargol avoiding piling up and led chip by getting in the groove in the through hole or being siphoned away by the Eyedropper tool.Owing to there is an annular groove, the elargol below the chip also is not easy to pile up, and elargol is after curing, because the existence of annular groove, elargol piece and the heat sink contact area of curing are big, even under the environment that resonates, or under the situation of ultrasonic bond, chip also is not easy to come unstuck.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Fig. 2 is the plan structure figure of the utility model.
Fig. 3 is the structural representation of second embodiment of the utility model.
Embodiment
The utility model proposes a kind of LED packaging with elargol flow-guiding structure, comprises led chip, led chip through elargol be fixed on heat sink on; And on heat sink, around led chip, be provided with a circle annular groove, be provided with in the annular groove and pass heat sink through hole, on each direction around the chip, be equipped with through hole.
Below through embodiment the utility model is described, but below embodiment as to the qualification of the utility model technical protection scope, the expansion scheme that any relevant the utility model can be known by inference is all in the protection range of the utility model.
Referring to Fig. 1 and Fig. 2, this LED packaging with elargol flow-guiding structure comprises led chip 1, and chip 1 is fixed on heat sink 4 through elargol 2.On heat sink 4, around chip 1, be provided with a circle annular groove 3, be provided with in the annular groove 3 and pass heat sink 4 through hole 5, on each direction around the chip 1, be equipped with through hole, through hole is vertical through hole.As shown in Figure 2, annular groove 3 is a square groove, is equipped with a through hole on each square limit.Through hole on each limit can discharge the elargol in each trough rim of square groove, makes around the chip that the elargol amount can balancedly discharge on the four direction.The centre of annular groove 3 is the island 6 that is used for fixing chip.Annular groove 3 inboard walls are slope 7.The angle on slope 7 is preferably 45 °, and slope 7 helps elargol and flows in the annular groove.
Another embodiment of the utility model is as shown in Figure 3, and chip is located on the convexity 60 on the island.Protruding 60 are preferably metallic copper material, perhaps ag material.The inboard walls of annular groove 30 are slope 70, the aperture of through hole 50 in annular groove be water conservancy diversion use uncovered 80.
Claims (6)
1. the LED packaging with elargol flow-guiding structure comprises led chip, led chip through elargol be fixed on heat sink on; It is characterized in that:
Said heat sink on, around said led chip, be provided with a circle annular groove, be provided with in the annular groove and pass heat sink through hole, be equipped with through hole on each direction around the chip.
2. the LED packaging with elargol flow-guiding structure according to claim 1 is characterized in that: said through hole is vertical through hole.
3. the LED packaging with elargol flow-guiding structure according to claim 1 is characterized in that: the inboard wall of said annular groove is the slope.
4. the LED packaging with elargol flow-guiding structure according to claim 1 is characterized in that: said annular groove is square groove or circular recess.
5. the LED packaging with elargol flow-guiding structure according to claim 1 is characterized in that: the aperture of said through hole in annular groove is uncovered.
6. the LED packaging with elargol flow-guiding structure according to claim 1 is characterized in that: said chip is located on the convexity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200506363U CN202549921U (en) | 2012-02-16 | 2012-02-16 | Light-emitting diode (LED) packaging device with silver colloid guide structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200506363U CN202549921U (en) | 2012-02-16 | 2012-02-16 | Light-emitting diode (LED) packaging device with silver colloid guide structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202549921U true CN202549921U (en) | 2012-11-21 |
Family
ID=47170502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200506363U Expired - Fee Related CN202549921U (en) | 2012-02-16 | 2012-02-16 | Light-emitting diode (LED) packaging device with silver colloid guide structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202549921U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489746A (en) * | 2014-09-19 | 2016-04-13 | 展晶科技(深圳)有限公司 | Light emitting chip module, light emitting diode and manufacturing method for light emitting chip module |
-
2012
- 2012-02-16 CN CN2012200506363U patent/CN202549921U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489746A (en) * | 2014-09-19 | 2016-04-13 | 展晶科技(深圳)有限公司 | Light emitting chip module, light emitting diode and manufacturing method for light emitting chip module |
| US9748445B2 (en) | 2014-09-19 | 2017-08-29 | Advanced Optoelectronic Technology, Inc. | Light emitting diode (LED) die module, LED element with the LED die module and method of manufacturing the LED die module |
| CN105489746B (en) * | 2014-09-19 | 2018-02-23 | 展晶科技(深圳)有限公司 | The manufacture method of light emitting chip module, light emitting diode and light emitting chip module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, 95, Fifth Industrial Zone, Mashan village, Gongming Town, Shenzhen, Guangdong, Baoan District Patentee after: SHENZHEN LIGHT ELECTRONICS CO., LTD. Address before: 518000, 95, Fifth Industrial Zone, Mashan village, Gongming Town, Shenzhen, Guangdong, Baoan District Patentee before: Shenzhen LIGHT Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121121 Termination date: 20160216 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |