CN202423386U - Light emitting diode packaging structure - Google Patents
Light emitting diode packaging structure Download PDFInfo
- Publication number
- CN202423386U CN202423386U CN2011205005978U CN201120500597U CN202423386U CN 202423386 U CN202423386 U CN 202423386U CN 2011205005978 U CN2011205005978 U CN 2011205005978U CN 201120500597 U CN201120500597 U CN 201120500597U CN 202423386 U CN202423386 U CN 202423386U
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- light
- emitting diode
- blue
- package structure
- led chip
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Abstract
The utility model relates to a light emitting diode packaging structure. The light emitting diode packaging structure comprises a packaging base plate, a blue-light light emitting diode chip which is arranged on the packaging base plate, and a yellow fluorescent powder layer and a red fluorescent powder layer, which are sequentially formed on a light emergence surface of the blue-light light emitting diode chip, wherein part of blue light which is emitted by the blue-light light emitting diode chip in the light emitting diode packaging structure excites yellow fluorescent powder to obtain yellow light, and the yellow light and another part of blue light which is emitted by the blue-light light emitting diode chip can be mixed to form high-energy white light; and the high-energy white light excites red fluorescent powder, so the red fluorescent powder is prevented from being directly excited by low-energy blue light, the conversion efficiency of the red fluorescent powder is improved, the emergent light of the light emitting diode packaging structure has high color rendering index, and the light emergence efficiency of the whole light emitting diode packaging structure is improved.
Description
Technical field
The utility model relates to a kind of semiconductor light-emitting elements, relates in particular to a kind of package structure for LED.
Background technology
At present, light-emitting diode (Light Emitting Diode, LED) low in energy consumption because of having, the life-span is long, volume is little and characteristic such as brightness height has been widely applied to a lot of fields.
White light-emitting diode package structure generally adopts blue LED chip to excite yellow fluorescent powder; The color rendering of this kind white light-emitting diode package structure is relatively poor; In order to improve the color rendering of white light-emitting diode package structure; Prior art is generally through adding certain red fluorescence powder; Be about to fluorescent glue and mix the surface that the back is coated in light-emitting diode chip for backlight unit afterwards with yellow, red fluorescence powder, through blue LED chip excite yellow fluorescent powder and red fluorescence powder send gold-tinted and ruddiness again with blue light formation white light.Yet, because the energy of blue light is very low, cause the ruddiness conversion efficiency also lower, lose certain launching efficiency, thereby caused the light extraction efficiency of whole white light-emitting diode package structure lower.
The utility model content
In view of this, a kind of package structure for LED is provided, to solve the existing lower technical problem of package structure for LED light extraction efficiency.
The utility model is achieved in that
A kind of package structure for LED, it comprises base plate for packaging, is located at the blue LED chip on the said base plate for packaging and is formed at yellow fluorescence bisque and the red fluorescence bisque on the said blue LED chip exiting surface successively.
Preferably, an enterprising step of said red fluorescence bisque is formed with a green phosphor layer.
Further; Said blue LED chip comprises a bottom surface towards base plate for packaging, an end face relative with said bottom surface and the side that is connected said bottom surface and end face, and said blue LED chip exiting surface is positioned on said end face and/or the said side.
Preferably, said yellow fluorescence bisque comprises silica gel and is entrained in the yellow fluorescent powder in the said silica gel.
Preferably, said red fluorescence bisque comprises silica gel and is entrained in the red fluorescence powder in the said silica gel.
Preferably, said green phosphor layer comprises silica gel and is entrained in the green emitting phosphor in the said silica gel.
Further, said base plate for packaging comprises two metallic supports of electric separating, and said light-emitting diode chip for backlight unit and said two metallic supports electrically connect.
Preferably, said light-emitting diode chip for backlight unit is attached at said two metallic supports on one of them.
Preferably, said package structure for LED further comprises a packaging body, and said packaging body covers said blue LED chip.
Be formed with yellow fluorescence bisque and red fluorescence bisque on the exiting surface of the blue LED chip in the said package structure for LED successively; So; The gold-tinted that the blue-light excited yellow fluorescent powder of the part that blue LED chip sends obtains can form high-octane white light with other blue light that blue LED chip sends; Use high-octane white light excitated red fluorescent powder then; Thereby avoided directly with low-energy blue-light excited red fluorescence powder; Improved the conversion efficiency of red fluorescence powder, guaranteed that the package structure for LED emergent light has also improved the light extraction efficiency of whole package structure for LED when having high color rendering index.
Description of drawings
Below in conjunction with accompanying drawing the embodiment of the utility model is described, wherein:
Fig. 1 is the vertical view of the package structure for LED that provides of the utility model embodiment; And
Fig. 2 is that package structure for LED among Fig. 1 is along the cutaway view of II-II direction.
Embodiment
Below be further elaborated based on the specific embodiment of accompanying drawing to the utility model.Should be appreciated that specific embodiment described herein only as embodiment, and be not used in the protection range that limits the utility model.
See also Fig. 1 and Fig. 2, a kind of package structure for LED 100 that the utility model embodiment provides comprises base plate for packaging 10, blue LED chip 20 and packaging body 30.
Said base plate for packaging 10 is used to carry said light-emitting diode chip for backlight unit 20.In the present embodiment, said base plate for packaging 10 comprises two metallic supports 11 of electric separating and is arranged at the insulating material 12 between said two metallic supports 11.
Said blue LED chip 20 is arranged on the said base plate for packaging 10, and electrically connects with said two metallic supports 11.In the present embodiment, said blue LED chip 20 is arranged on said two metallic supports 11 on one of them, and electrically connects with said two metallic supports 11 respectively through two bonding lines 21.Be appreciated that the said blue LED chip 20 and the connected mode of metallic support 11 are not limited to present embodiment, for example, said blue LED chip 20 also can be through covering mode and metallic support 11 electric connections such as crystalline substance.Because metallic support 11 generally has good heat conductivility, through said blue LED chip 20 is arranged on the said metallic support 11, can improve the radiating efficiency of blue LED chip 20 greatly.Said blue LED chip 20 comprises a bottom surface towards base plate for packaging 10, an end face relative with said bottom surface and the side that is connected said bottom surface and end face.In the present embodiment, the exiting surface of said blue LED chip 20 is positioned on its end face.Be appreciated that in other embodiments the exiting surface of said blue LED chip 20 also can be positioned on its side, the side and the end face of perhaps said blue LED chip 20 are all exiting surface.
Said package structure for LED 100 also comprises yellow fluorescence bisque 40, red fluorescence bisque 50 and the green fluorescence layer 60 that is formed at successively on said blue LED chip 20 exiting surfaces.The part blue light that said yellow fluorescence bisque 40 is used for blue LED chip 20 is sent converts gold-tinted into, and said gold-tinted mixes the high-octane white light of formation with other blue lights (promptly not being converted into the blue light of gold-tinted) that blue LED chip 20 sends.It is ruddiness that said red fluorescence bisque 50 is used for said high-octane white light conversion, and said green fluorescence layer 60 can be a green glow with the part white light conversion.In the present embodiment, said yellow fluorescence bisque 40, red fluorescence bisque 50 and green fluorescence layer 60 are formed on the end face of said blue LED chip 20 successively.Be appreciated that when the exiting surface of said blue LED chip 20 is positioned at its side said yellow fluorescence bisque 40, red fluorescence bisque 50 and 60 on green fluorescence layer should be arranged on the side of said blue LED chip 20.Preferably, said yellow fluorescence bisque 40, red fluorescence bisque 50 and green fluorescence layer 60 coat the end face and the side of said blue LED chip 20 successively.In the present embodiment; Said yellow fluorescence bisque 40 comprises silica gel and is entrained in the yellow fluorescent powder in the said silica gel; Said red fluorescence bisque 50 comprises silica gel and is entrained in the red fluorescence powder in the said silica gel that said green phosphor layer 60 comprises silica gel and is entrained in the green emitting phosphor in the said silica gel.
Said packaging body 30 covers said blue LED chip 20, thereby can protect blue LED chip 20, prevents that blue LED chip 20 from receiving pollutions such as steam, dust.
The concrete manufacturing approach of the said package structure for LED 100 that present embodiment provides can may further comprise the steps: step 1 is fixed on blue LED chip 20 on the base plate for packaging 10; Step 2: utilize the mould meet base plate for packaging 10 structures at the mixture of blue LED chip 20 overmolded one deck yellow fluorescent powders and silica gel and solidify to form yellow fluorescence bisque 40; Step 3: the mixture of mold pressing one deck red fluorescence powder and silica gel and solidify to form red fluorescence bisque 50 on said yellow fluorescence bisque 40; Step 4: the mixture of mold pressing one deck green emitting phosphor and silica gel and solidify to form green phosphor layer 60 on said red fluorescence bisque 40; Carry out the technology of bonding wire and sealing at last.
Be formed with yellow fluorescence bisque 40 and red fluorescence bisque 50 on the exiting surface of the blue LED chip 20 in the said package structure for LED 100 successively; So; The gold-tinted that the blue-light excited yellow fluorescent powder of the part that blue LED chip 20 sends obtains can form high-octane white light with other blue light that blue LED chip 20 sends; Use high-octane white light excitated red fluorescent powder then; Thereby avoided directly with low-energy blue-light excited red fluorescence powder; Improved the conversion efficiency of red fluorescence powder, guaranteed that package structure for LED 100 emergent lights have also improved the light extraction efficiency of whole package structure for LED 100 when having high color rendering index.In addition, through on said red fluorescence bisque 50, covering one deck green phosphor layer 60, can in the very little light extraction efficiency of loss, further improve the color rendering of package structure for LED 100.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.
Claims (10)
1. package structure for LED; It comprises base plate for packaging and is located at the blue LED chip on the said base plate for packaging; It is characterized in that said package structure for LED also comprises yellow fluorescence bisque and the red fluorescence bisque that is formed at successively on the said blue LED chip exiting surface.
2. package structure for LED as claimed in claim 1 is characterized in that, an enterprising step of said red fluorescence bisque is formed with a green phosphor layer.
3. package structure for LED as claimed in claim 1; It is characterized in that; Said blue LED chip comprises a bottom surface towards base plate for packaging, an end face relative with said bottom surface and the side that is connected said bottom surface and end face, and said blue LED chip exiting surface is positioned on the said end face.
4. package structure for LED as claimed in claim 1; It is characterized in that; Said blue LED chip comprises a bottom surface towards base plate for packaging, an end face relative with said bottom surface and the side that is connected said bottom surface and end face, and said blue LED chip exiting surface is positioned on the said side.
5. package structure for LED as claimed in claim 1; It is characterized in that; Said blue LED chip comprises a bottom surface towards base plate for packaging, an end face relative with said bottom surface and the side that is connected said bottom surface and end face, and said blue LED chip exiting surface is positioned on said end face and the side.
6. package structure for LED as claimed in claim 1 is characterized in that, said yellow fluorescence bisque comprises silica gel and is entrained in the yellow fluorescent powder in the said silica gel.
7. package structure for LED as claimed in claim 1 is characterized in that, said red fluorescence bisque comprises silica gel and is entrained in the red fluorescence powder in the said silica gel.
8. package structure for LED as claimed in claim 2 is characterized in that, said green phosphor layer comprises silica gel and is entrained in the green emitting phosphor in the said silica gel.
9. package structure for LED as claimed in claim 1 is characterized in that, said base plate for packaging comprises two metallic supports of electric separating, and said light-emitting diode chip for backlight unit and said two metallic supports electrically connect.
10. package structure for LED as claimed in claim 9 is characterized in that, said light-emitting diode chip for backlight unit is attached at said two metallic supports on one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205005978U CN202423386U (en) | 2011-12-05 | 2011-12-05 | Light emitting diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205005978U CN202423386U (en) | 2011-12-05 | 2011-12-05 | Light emitting diode packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202423386U true CN202423386U (en) | 2012-09-05 |
Family
ID=46748117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205005978U Expired - Lifetime CN202423386U (en) | 2011-12-05 | 2011-12-05 | Light emitting diode packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202423386U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633220A (en) * | 2013-03-31 | 2014-03-12 | 深圳市子元技术有限公司 | LED fluorescent powder coating technology |
| CN106876561A (en) * | 2017-03-14 | 2017-06-20 | 河北利福光电技术有限公司 | A kind of long-distance fluorescent powder encapsulating structure and its implementation |
| CN114578613A (en) * | 2020-11-30 | 2022-06-03 | 优美特创新材料股份有限公司 | Backlight module containing fluorescent powder and quantum dots |
-
2011
- 2011-12-05 CN CN2011205005978U patent/CN202423386U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633220A (en) * | 2013-03-31 | 2014-03-12 | 深圳市子元技术有限公司 | LED fluorescent powder coating technology |
| CN103633220B (en) * | 2013-03-31 | 2016-08-03 | 深圳市三创客科技有限公司 | A kind of LED fluorescent powder application techniques |
| CN106876561A (en) * | 2017-03-14 | 2017-06-20 | 河北利福光电技术有限公司 | A kind of long-distance fluorescent powder encapsulating structure and its implementation |
| CN114578613A (en) * | 2020-11-30 | 2022-06-03 | 优美特创新材料股份有限公司 | Backlight module containing fluorescent powder and quantum dots |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN LT PHOTOELECTRICITY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN REFOND OPTOELECTRONICS CO., LTD. Effective date: 20140514 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140514 Address after: 518000, Guangdong, Shenzhen, Baoan District Xixiang street, hang Chau Hengfeng Industrial City, B15 plant, five or six floor Patentee after: Shenzhen Lingtao Photoelectric Technology Co., Ltd. Address before: The two district of Shenzhen City, Guangdong province Nanshan District 518000 white pine road Piovan letter Industrial Park 6 Patentee before: Shenzhen Refond Optoelectronics Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |