CN103633220A - LED fluorescent powder coating technology - Google Patents
LED fluorescent powder coating technology Download PDFInfo
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- CN103633220A CN103633220A CN201310107767.XA CN201310107767A CN103633220A CN 103633220 A CN103633220 A CN 103633220A CN 201310107767 A CN201310107767 A CN 201310107767A CN 103633220 A CN103633220 A CN 103633220A
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- aluminum alloy
- aluminium alloy
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- 239000000843 powder Substances 0.000 title abstract description 9
- 238000005516 engineering process Methods 0.000 title abstract description 7
- 238000000576 coating method Methods 0.000 title abstract description 3
- 239000011248 coating agent Substances 0.000 title abstract 2
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 80
- 238000012545 processing Methods 0.000 claims abstract description 36
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 238000004381 surface treatment Methods 0.000 claims abstract description 8
- 230000003647 oxidation Effects 0.000 claims abstract description 7
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 26
- 239000007822 coupling agent Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 14
- 239000011259 mixed solution Substances 0.000 claims description 12
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 10
- 230000004913 activation Effects 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 230000009466 transformation Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 24
- 239000003292 glue Substances 0.000 description 4
- 238000007743 anodising Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention discloses an LED fluorescent powder coating technology. An aluminium alloy surface is used as a reflection surface of an LED light source. The aluminium alloy is processed by surface treatment, and the surface treatment comprises aluminium alloy anodic oxidation treatment, nanometer fluorescent powder surface finish processing, nanometer fluorescent powder filling processing and hole sealing processing. The aluminium alloy surface is used as the reflection surface and partly converts blue light emitted by an LED to yellow light through conversion effect of the nanometer fluorescent powders. The yellow light and the blue light are mixed and become white light. Technical effects of the technology are that the fluorescent powders are no longer obstacles of LED heat radiation, and meanwhile the fluorescent powders would not work under relatively high temperature. The technology is an optimal technical scheme for an ultra high power LED light source.
Description
Technical field
The invention belongs to LED lighting technical field, be specifically related to a kind of LED fluorescent material application techniques.
Background technology
At present, first LED fluorescent material mix with glue conventionally, then drips glue and be coated on LED surface, take blue-ray LED as example, and after blue light light emits from LED, part blue light light and fluorescent material effect are converted into gold-tinted, gold-tinted and blue light, what emit like this has just become white light.Due to the glue non-conductor of heat often, blue light is absorbed rear section by fluorescent material and is converted to heat energy, so just there will be glue aging, after fluorescent material is heated, luminous efficiency reduces, the problem of the aspects such as colour temperature drift, the temperature of LED also can raise simultaneously, shortens the useful life of LED.
Therefore propose a kind of new LED fluorescent material coating process, can overcome the defect of existing encapsulation technology.
Summary of the invention
Shortcoming for existing LED fluorescent powder packaging, an important component part in the whole LED fluorescent material application techniques scheme that the present invention proposes as inventor, a kind of LED fluorescent material application techniques is provided, is applied to LED illumination, overcome the shortcoming of existing LED fluorescent powder packaging.
The present invention realizes like this, a kind of LED fluorescent material application techniques, aluminum alloy surface is used as the reflecting surface of LED light source, aluminium alloy is through surface treatment, surface treatment comprises aluminium alloy anode oxide processing, nano-phosphor finishing is processed, and the filling processing of nano-phosphor and sealing of hole are processed, and each step is described below:
Aluminium alloy anode oxide is processed and is divided into following steps, the first step, aluminum alloy surface polishing, second step, aluminum alloy surface anodic oxidation, the 3rd step, aluminum alloy surface activation processing, the polishing of described first step aluminum alloy surface is using aluminium alloy as anode, put into the mixed solution of perchloric acid and ethanol, the scope of anode voltage is from 0 volt to 15 volts, and the temperature of the mixed solution of perchloric acid and ethanol maintains below 10 degrees Celsius by refrigerating system, and the time of aluminum alloy surface polishing is in 60 seconds; The anodic oxidation of described second step aluminum alloy surface is using aluminium alloy as anode; put into the mixed solution of phosphoric acid, water and ethanol; anode voltage is 120 volts to 250 volts, and the temperature of the mixed solution of phosphoric acid, water and ethanol maintains below 10 degrees Celsius by refrigerating system; Described the 3rd step aluminum alloy surface activation processing is that aluminium alloy is immersed in coupling agent, and the temperature of coupling agent maintains between 80 degrees Celsius to 120 degrees Celsius.
It is that nano-phosphor and coupling agent are mixed that nano-phosphor finishing is processed, the mass ratio of nano-phosphor and coupling agent is 100 to 5 to 100 to 1, in mixed process, the temperature of coupling agent is between 80 degrees Celsius to 120 degrees Celsius, the time of mixing is 1 hour to 24 hours, processes for 30 seconds to 300 seconds having under hyperacoustic environment.
The filling processing of nano-phosphor is that the nano-phosphor that obtains after nano-phosphor finishing is processed and above-mentioned aluminum alloy surface are processed the aluminium alloy obtaining and mixed, the frequency of carrying out ultrasonic wave processing under the environment of the ultrasonic powers of every cubic metre 30 watts to 200 watts be 60kHz to 80kHz, the processing time is 300 seconds to 1000 seconds.
It is that the aluminium alloy after the filling processing of nano-phosphor is carried out to sealing of hole processing that sealing of hole is processed, the parameter that sealing of hole is processed is, temperature is 80 degrees Celsius to 100 degrees Celsius, and air pressure is that 1 atmosphere is pressed onto 5 atmospheric pressure, the volumetric concentration of steam is 30% to 50%, and the processing time is 30 minutes to 60 minutes.
Better, described aluminum alloy surface is partly converted to gold-tinted as reflecting surface by the transformation of the described nano-phosphor of blue light process of LED transmitting, and gold-tinted and blue light become white light.
Know-why of the present invention: make aluminum alloy surface occur mirror effect by polishing, be conducive to the reflection of light, by anodizing technology aluminium alloy show the hole diameter that produces in 200 nanometers to 350 nanometers, the degree of depth of hole is in 300 nanometers to 3 micron, after aluminum alloy surface activation processing, nano aperture inwall will adhere to coupling agent; The effect that nano-phosphor finishing is processed is to make coupled dose of parcel of nano-phosphor; In nano-phosphor pouring process, nano-phosphor enters in the nano aperture of aluminum alloy surface, and under the help of coupling agent, nano-phosphor is attracted in the nano aperture of aluminum alloy surface; By sealing of hole, process, make the hole sealing of the pellumina of aluminum alloy surface, and then sealing nano-phosphor.Process so later aluminum alloy surface, as reflecting surface, the transformation of the blue light process nano-phosphor of LED transmitting is partly converted to gold-tinted, after aluminum alloy surface reflection, gold-tinted and blue light become white light.
Creativeness of the present invention is:
A, fluorescent material are away from LED light emitting source, and the temperature of fluorescent material work approaches room temperature, and the job stability of fluorescent material improves, and the life-span increases;
B, LED light-emitting area do not have stopping of fluorescent material, and the heat dispersion of LED improves;
C, fluorescent material composition can be different at the different parts of aluminum alloy surface, can realize like this light that same LED light source produces multiple color.
D, aluminum alloy surface is processed and the application of fluorescent material combines, aluminium alloy can provide good heat radiation for fluorescent material, can provide better design for ultra high power LED light source.
Technique effect of the present invention is: fluorescent material is no longer the obstruction of LED heat radiation, and fluorescent material can not worked at higher temperature yet simultaneously, is a kind of preferred technical scheme of ultra high power LED light source.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of the aluminum alloy surface after the aluminum alloy surface anodized of the embodiment of the present invention.
Fig. 2 is the schematic cross-section of the aluminum alloy surface after the aluminum alloy surface activation processing of the embodiment of the present invention.
Fig. 3 is the schematic cross-section of the aluminum alloy surface after the filling processing of the nano-phosphor of the embodiment of the present invention.
Fig. 4 is the schematic cross-section of the aluminum alloy surface after the sealing of hole of the embodiment of the present invention is processed.
Fig. 5 is the schematic diagram of the aluminum alloy surface reflection LED light source of the embodiment of the present invention.
Description of reference numerals: 1, aluminium alloy; 10, aluminum alloy surface; 11, porous anodic aluminium oxide; 21, the coupling agent on porous anodic aluminium oxide surface; 50, nano-phosphor; 51, the coupling agent on nano-phosphor surface; 31, the blue light of LED transmitting; 32, mixed light; 41, LED; 42, LED support.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Below in conjunction with above-mentioned drawings and Examples, the present invention is described in further detail.
The embodiment of the present invention is as shown in Figures 1 to 5: the present invention realizes like this, a kind of LED fluorescent material application techniques, aluminum alloy surface is used as the reflecting surface of LED light source, aluminium alloy is through surface treatment, surface treatment comprises aluminium alloy anode oxide processing, nano-phosphor finishing is processed, and the filling processing of nano-phosphor and sealing of hole are processed, and each step is described below.
Aluminium alloy anode oxide is processed and is divided into following steps, the first step, aluminum alloy surface polishing, second step, aluminum alloy surface anodic oxidation, the 3rd step, aluminum alloy surface activation processing, the polishing of first step aluminum alloy surface is using aluminium alloy as anode, put into the mixed solution of perchloric acid and ethanol, the scope of anode voltage is from 0 volt to 15 volts, and the temperature of the mixed solution of perchloric acid and ethanol maintains 4 degrees Celsius by refrigerating system, and the time of aluminum alloy surface polishing is 30 seconds; The anodic oxidation of second step aluminum alloy surface is using aluminium alloy as anode, put into the mixed solution of phosphoric acid, water and ethanol, anode voltage is 200 volts, the mass concentration of phosphoric acid is 1%, and the mass concentration of ethanol is 50%, and the temperature of the mixed solution of phosphoric acid, water and ethanol maintains 4 degrees Celsius by refrigerating system, anodizing time is 30 minutes, as shown in Figure 1, the hole diameter of the porous anodic aluminium oxide 11 of the aluminum alloy surface 10 obtaining is about 350 nanometers, and the degree of depth is 2 microns; The 3rd step aluminum alloy surface activation processing is that aluminium alloy is immersed in coupling agent, the temperature of coupling agent maintains 90 degrees Celsius, coupling agent is monoalkoxytitanates, and as shown in Figure 2, the coupling agent 21 on porous anodic aluminium oxide surface is attached to porous anodic aluminium oxide 11 surfaces.
It is that nano-phosphor and coupling agent are mixed that nano-phosphor finishing is processed, the mass ratio of nano-phosphor and coupling agent is 100 to 2, in mixed process, the temperature of coupling agent is 90 degrees Celsius, the time of mixing is 3 hours, processed for 100 seconds having under hyperacoustic environment, coupling agent is monoalkoxytitanates.
The filling processing of nano-phosphor is that the nano-phosphor that obtains after above-mentioned nano-phosphor finishing is processed and aluminum alloy surface are processed the aluminium alloy obtaining and mixed, the frequency of carrying out ultrasonic wave processing under the environment of the ultrasonic powers of 100 watts every cubic metre is 70kHz, processing time is 500 seconds, as shown in Figure 3, the surface of nano-phosphor 50 is by coupling agent 51 parcels on nano-phosphor surface, by the coupled action of coupling agent, nano-phosphor 50 is adsorbed in the inside, cavity of porous anodic aluminium oxide 11.
It is that the aluminium alloy after the filling processing of above-mentioned nano-phosphor is carried out to sealing of hole processing that sealing of hole is processed, the parameter that sealing of hole is processed is, ambient temperature is 90 degrees Celsius, air pressure is 3 atmospheric pressure, the volumetric concentration of steam is 40%, and the processing time is 40 minutes, as shown in Figure 4, porous anodic aluminium oxide 11 is under water and effect, and the oxidized aluminium of hole of porous anodic aluminium oxide 11 seals.
As shown in Figure 4, LED41 is fixed on LED support 42, the light-emitting area of LED41 is towards aluminium alloy 1, and the surface of aluminium alloy 1 is partly converted to gold-tinted as reflecting surface by the transformation of the blue light of LED41 transmitting 31 process nano-phosphors, and the mixed light 32 of gold-tinted and blue light is white light.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, for example, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (2)
1. a LED fluorescent material application techniques, aluminum alloy surface is used as the reflecting surface of LED light source, it is characterized in that: described aluminium alloy is through surface treatment, surface treatment comprises aluminium alloy anode oxide processing, nano-phosphor finishing is processed, the filling processing of nano-phosphor and sealing of hole are processed, and each step is described below:
Described aluminium alloy anode oxide is processed and is divided into following steps, the first step, aluminum alloy surface polishing, second step, aluminum alloy surface anodic oxidation, the 3rd step, aluminum alloy surface activation processing, the polishing of described first step aluminum alloy surface is using aluminium alloy as anode, put into the mixed solution of perchloric acid and ethanol, the scope of anode voltage is from 0 volt to 15 volts, and the temperature of the mixed solution of perchloric acid and ethanol maintains below 10 degrees Celsius by refrigerating system, and the time of aluminum alloy surface polishing is in 60 seconds; The anodic oxidation of described second step aluminum alloy surface is using aluminium alloy as anode; put into the mixed solution of phosphoric acid, water and ethanol; anode voltage is 120 volts to 250 volts, and the temperature of the mixed solution of phosphoric acid, water and ethanol maintains below 10 degrees Celsius by refrigerating system; Described the 3rd step aluminum alloy surface activation processing is that aluminium alloy is immersed in coupling agent, and the temperature of coupling agent maintains between 80 degrees Celsius to 120 degrees Celsius;
It is that nano-phosphor and coupling agent are mixed that described nano-phosphor finishing is processed, the mass ratio of nano-phosphor and coupling agent is 100 to 5 to 100 to 1, in mixed process, the temperature of coupling agent is between 80 degrees Celsius to 120 degrees Celsius, the time of mixing is 1 hour to 24 hours, processes for 30 seconds to 300 seconds having under hyperacoustic environment;
The filling processing of described nano-phosphor is that the nano-phosphor that obtains after nano-phosphor finishing is processed and above-mentioned aluminum alloy surface are processed the aluminium alloy obtaining and mixed, the frequency of carrying out ultrasonic wave processing under the environment of the ultrasonic powers of every cubic metre 30 watts to 200 watts be 60kHz to 80kHz, the processing time is 300 seconds to 1000 seconds;
It is that the aluminium alloy after the filling processing of nano-phosphor is carried out to sealing of hole processing that described sealing of hole is processed, the parameter that sealing of hole is processed is, temperature is 80 degrees Celsius to 100 degrees Celsius, and air pressure is that 1 atmosphere is pressed onto 5 atmospheric pressure, the volumetric concentration of steam is 30% to 50%, and the processing time is 30 minutes to 60 minutes.
2. LED fluorescent material application techniques according to claim 1, is characterized in that: described aluminum alloy surface is partly converted to gold-tinted as reflecting surface by the transformation of the described nano-phosphor of blue light process of LED transmitting, and gold-tinted and blue light become white light.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310107767.XA CN103633220B (en) | 2013-03-31 | 2013-03-31 | A kind of LED fluorescent powder application techniques |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310107767.XA CN103633220B (en) | 2013-03-31 | 2013-03-31 | A kind of LED fluorescent powder application techniques |
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| CN103633220A true CN103633220A (en) | 2014-03-12 |
| CN103633220B CN103633220B (en) | 2016-08-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106435687A (en) * | 2016-09-22 | 2017-02-22 | 宇龙计算机通信科技(深圳)有限公司 | Electronic device shell, processing method thereof and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040135163A1 (en) * | 2003-01-13 | 2004-07-15 | Hsing Chen | Pink light emitting diode |
| CN101320773A (en) * | 2008-07-11 | 2008-12-10 | 深圳市聚飞光电有限公司 | Packaging method for improving LED external quantum efficiency and LED packaging structure |
| CN202423386U (en) * | 2011-12-05 | 2012-09-05 | 深圳市瑞丰光电子股份有限公司 | Light emitting diode packaging structure |
| JP5103849B2 (en) * | 2006-09-28 | 2012-12-19 | カシオ計算機株式会社 | Liquid crystal display |
-
2013
- 2013-03-31 CN CN201310107767.XA patent/CN103633220B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040135163A1 (en) * | 2003-01-13 | 2004-07-15 | Hsing Chen | Pink light emitting diode |
| JP5103849B2 (en) * | 2006-09-28 | 2012-12-19 | カシオ計算機株式会社 | Liquid crystal display |
| CN101320773A (en) * | 2008-07-11 | 2008-12-10 | 深圳市聚飞光电有限公司 | Packaging method for improving LED external quantum efficiency and LED packaging structure |
| CN202423386U (en) * | 2011-12-05 | 2012-09-05 | 深圳市瑞丰光电子股份有限公司 | Light emitting diode packaging structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106435687A (en) * | 2016-09-22 | 2017-02-22 | 宇龙计算机通信科技(深圳)有限公司 | Electronic device shell, processing method thereof and electronic device |
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| CN103633220B (en) | 2016-08-03 |
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Address after: 16, Guangdong, Longhua, Shenzhen New District, people street, people Avenue, former A1607 building, room 518000 Applicant after: Shenzhen Sanchuangke Technology Co., Ltd. Address before: The streets of Baoan District Shenzhen city Guangdong province 518131 Mei Long Road and Bulong road at the junction of the Meilong town garden 9 Building 2 unit 16A (Office) Applicant before: Shenzhen Ziyuan Technology Co., Ltd. |
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