CN103633220B - A kind of LED fluorescent powder application techniques - Google Patents
A kind of LED fluorescent powder application techniques Download PDFInfo
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- CN103633220B CN103633220B CN201310107767.XA CN201310107767A CN103633220B CN 103633220 B CN103633220 B CN 103633220B CN 201310107767 A CN201310107767 A CN 201310107767A CN 103633220 B CN103633220 B CN 103633220B
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- phosphor
- aluminum alloy
- aluminium alloy
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000843 powder Substances 0.000 title claims abstract description 14
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 80
- 230000008569 process Effects 0.000 claims abstract description 33
- 239000011148 porous material Substances 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 230000026683 transduction Effects 0.000 claims abstract description 5
- 238000010361 transduction Methods 0.000 claims abstract description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 26
- 239000007822 coupling agent Substances 0.000 claims description 24
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 14
- 239000011259 mixed solution Substances 0.000 claims description 12
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 10
- 230000004913 activation Effects 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 238000002604 ultrasonography Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 13
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 24
- 239000003292 glue Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000007743 anodising Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention discloses a kind of LED fluorescent powder application techniques, aluminum alloy surface uses as the reflecting surface of LED light source, aluminium alloy processes through surface, surface processes and includes that aluminium alloy anode oxide processes, nano-phosphor surface moditied processing, nano-phosphor fill process and sealing pores, the blue light of LED emission is partially converted to gold-tinted, gold-tinted and blue light through the transduction of nano-phosphor as reflecting surface by aluminum alloy surface becomes white light.The solution have the advantages that: fluorescent material is no longer the obstruction of LED heat radiation, and fluorescent material also will not work at a higher temperature simultaneously, be a kind of preferably technical scheme of ultra high power LED light source.
Description
Technical field
The invention belongs to technical field of LED illumination, be specifically related to a kind of LED fluorescent powder application techniques.
Background technology
At present, first LED fluorescent powder mixes with glue, then drips glue and is coated on LED surface, as a example by blue-ray LED, blue light light from LED emission out after, some blue light light and fluorescent material effect are converted into gold-tinted, gold-tinted and blue light, so emit has just become white light.Due to the non-conductor of glue heat often, blue light is absorbed rear section by fluorescent material and is converted to heat energy, thus there will be glue aging, after fluorescent material is heated, luminous efficiency reduces, the problem of the aspects such as colour temperature drift, the temperature of LED also can raise simultaneously, shortens the service life of LED.
It is proposed that a kind of new LED fluorescent powder coating process, it is possible to overcome the defect of existing encapsulation technology.
Summary of the invention
The shortcoming encapsulated for existing LED fluorescent powder, an important component part in the whole LED fluorescent powder application techniques scheme that the present invention proposes as inventor, a kind of LED fluorescent powder application techniques is provided, is applied to LED illumination, the shortcoming overcoming the encapsulation of existing LED fluorescent powder.
The present invention is realized in, a kind of LED fluorescent powder application techniques, aluminum alloy surface uses as the reflecting surface of LED light source, aluminium alloy processes through surface, surface processes and includes that aluminium alloy anode oxide processes, nano-phosphor surface moditied processing, nano-phosphor fill process and sealing pores, each step is described as follows:
Aluminium alloy anode oxide processes and is divided into following steps, the first step, aluminum alloy surface polishing, second step, aluminum alloy surface anodic oxidation, 3rd step, aluminum alloy surface activation processing, described first step aluminum alloy surface polishing is as anode using aluminium alloy, put into the mixed solution of perchloric acid and ethanol, the scope of anode voltage is that the temperature of the mixed solution of perchloric acid and ethanol maintains less than 10 degrees Celsius by refrigeration system, and the time of aluminum alloy surface polishing is within 60 seconds from 0 volt to 15 volt；Described second step aluminum alloy surface anodic oxidation is as anode using aluminium alloy, puts into the mixed solution of phosphoric acid, water and ethanol, and anode voltage is 120 volts to 250 volts, and the temperature of the mixed solution of phosphoric acid, water and ethanol maintains less than 10 degrees Celsius by refrigeration system;Described 3rd step aluminum alloy surface activation processing is to immerse in coupling agent by aluminium alloy, and the temperature of coupling agent maintains between 80 degrees Celsius to 120 degrees Celsius.
Nano-phosphor surface moditied processing is nano-phosphor and coupling agent to be mixed, the mass ratio of nano-phosphor and coupling agent is 100 to 5 to 100 to 1, in mixed process, the temperature of coupling agent is between 80 degrees Celsius to 120 degrees Celsius, mixing time be 1 hour by 24 hours, carry out processing 30 seconds to 300 seconds in the environment of having ultrasound wave.
It is the nano-phosphor obtained after the moditied processing of nano-phosphor surface and above-mentioned aluminum alloy surface to be processed the aluminium alloy obtained mix that nano-phosphor fill processes, the frequency carrying out ultrasonic Treatment in the environment of the ultrasonic power of every cubic metre 30 watts to 200 watts is 60kHz to 80kHz, and the process time is 300 seconds to 1000 seconds.
Sealing pores is that the aluminium alloy after nano-phosphor fill being processed carries out sealing pores, the parameter of sealing pores is, temperature is 80 degrees Celsius to 100 degrees Celsius, and air pressure is that 1 air is pressed onto 5 atmospheric pressure, the volumetric concentration of steam is 30% to 50%, and the process time is 30 minutes to 60 minutes.
Preferably, the blue light of LED emission is partially converted to gold-tinted, gold-tinted and blue light through the transduction of described nano-phosphor as reflecting surface by described aluminum alloy surface becomes white light.
The know-why of the present invention: make aluminum alloy surface that mirror effect occur by polishing, be conducive to the reflection of light, by anodizing technology aluminium alloy show produce hole diameter in 200 nanometers to 350 nanometers, the degree of depth of hole is in 300 nanometers to 3 micron, after aluminum alloy surface activation processing, nano aperture inwall will adhere to coupling agent；The effect of nano-phosphor surface moditied processing is so that coupled dose of nano-phosphor parcel；In nano-phosphor pouring process, nano-phosphor enters in the nano aperture of aluminum alloy surface, and with the help of coupling agent, nano-phosphor is attracted in the nano aperture of aluminum alloy surface；Pass through sealing pores so that the hole of the pellumina of aluminum alloy surface is closed, and then close nano-phosphor.So processing later aluminum alloy surface, as reflecting surface, through the transduction of nano-phosphor, the blue light of LED emission is partially converted to gold-tinted, after aluminum alloy surface reflects, gold-tinted and blue light become white light.
The creativeness of the present invention is:
A, fluorescent material are away from LED luminous source, the temperature near room temperature of fluorescent material work, and the job stability of fluorescent material improves, and the life-span increases；
B, LED light-emitting area does not has the stop of fluorescent material, and the heat dispersion of LED improves；
C, phosphor constituents can be different at the different parts of aluminum alloy surface, so can realize same LED light source and produce the light of multiple color.
D, aluminum alloy surface being processed and the application of fluorescent material combines, aluminium alloy can be that fluorescent material provides good heat radiation, can be that ultra high power LED light source provides more preferable design.
The solution have the advantages that: fluorescent material is no longer the obstruction of LED heat radiation, and fluorescent material also will not work at a higher temperature simultaneously, be a kind of preferably technical scheme of ultra high power LED light source.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of the aluminum alloy surface after the aluminum alloy surface anodized of the embodiment of the present invention.
Fig. 2 is the schematic cross-section of the aluminum alloy surface after the aluminum alloy surface activation processing of the embodiment of the present invention.
Fig. 3 is the schematic cross-section of the aluminum alloy surface after the nano-phosphor fill process of the embodiment of the present invention.
Fig. 4 is the schematic cross-section of the aluminum alloy surface after the sealing pores of the embodiment of the present invention.
Fig. 5 is the schematic diagram of the aluminum alloy surface reflex LED light source of the embodiment of the present invention.
Description of reference numerals: 1, aluminium alloy；10, aluminum alloy surface；11, porous anodic aluminium oxide；21, the coupling agent on porous anodic aluminium oxide surface；50, nano-phosphor；51, the coupling agent on nano-phosphor surface；31, the blue light of LED emission；32, mixed light；41、LED；42, LED support.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Below in conjunction with above-mentioned drawings and Examples, the present invention is described in further detail.
The embodiment of the present invention is as shown in Figures 1 to 5: the present invention is realized in, a kind of LED fluorescent powder application techniques, aluminum alloy surface uses as the reflecting surface of LED light source, aluminium alloy processes through surface, surface processes and includes that aluminium alloy anode oxide processes, nano-phosphor surface moditied processing, nano-phosphor fill process and sealing pores, each step is described as follows.
Aluminium alloy anode oxide processes and is divided into following steps, the first step, aluminum alloy surface polishing, second step, aluminum alloy surface anodic oxidation, 3rd step, aluminum alloy surface activation processing, first step aluminum alloy surface polishing is as anode using aluminium alloy, put into the mixed solution of perchloric acid and ethanol, the scope of anode voltage is that the temperature of the mixed solution of perchloric acid and ethanol maintains 4 degrees Celsius by refrigeration system from 0 volt to 15 volt, and the time of aluminum alloy surface polishing is 30 seconds；Second step aluminum alloy surface anodic oxidation is as anode using aluminium alloy, put into the mixed solution of phosphoric acid, water and ethanol, anode voltage is 200 volts, the mass concentration of phosphoric acid is 1%, and the mass concentration of ethanol is 50%, and the temperature of the mixed solution of phosphoric acid, water and ethanol maintains 4 degrees Celsius by refrigeration system, anodizing time is 30 minutes, as it is shown in figure 1, the hole diameter of the porous anodic aluminium oxide 11 of the aluminum alloy surface 10 obtained is about 350 nanometers, the degree of depth is 2 microns；3rd step aluminum alloy surface activation processing is to immerse in coupling agent by aluminium alloy, the temperature of coupling agent maintains 90 degrees Celsius, coupling agent is monoalkoxytitanates, as in figure 2 it is shown, the coupling agent 21 on porous anodic aluminium oxide surface is attached to porous anodic aluminium oxide 11 surface.
Nano-phosphor surface moditied processing is nano-phosphor and coupling agent to be mixed, the mass ratio of nano-phosphor and coupling agent is 100 to 2, in mixed process, the temperature of coupling agent is 90 degrees Celsius, the time of mixing is 3 hours, carrying out processing 100 seconds in the environment of having ultrasound wave, coupling agent is monoalkoxytitanates.
It is the nano-phosphor obtained after the moditied processing of above-mentioned nano-phosphor surface and aluminum alloy surface to be processed the aluminium alloy obtained mix that nano-phosphor fill processes, the frequency carrying out ultrasonic Treatment in the environment of the ultrasonic power of 100 watts every cubic metre is 70kHz, the process time is 500 seconds, as shown in Figure 3, the surface of nano-phosphor 50 is wrapped up by the coupling agent 51 on nano-phosphor surface, by the coupled action of coupling agent, the cavity that nano-phosphor 50 is adsorbed in porous anodic aluminium oxide 11 is internal.
Sealing pores is that the aluminium alloy after above-mentioned nano-phosphor fill being processed carries out sealing pores, the parameter of sealing pores is, ambient temperature is 90 degrees Celsius, air pressure is 3 atmospheric pressure, the volumetric concentration of steam is 40%, and the process time is 40 minutes, as shown in Figure 4, porous anodic aluminium oxide 11 is under water and effect, and the oxidized aluminum of hole of porous anodic aluminium oxide 11 is closed.
As shown in Figure 4, LED41 is fixed on LED support 42, the light-emitting area of LED41 is towards aluminium alloy 1, and the mixed light 32 that the blue light 31 that LED41 is launched as reflecting surface by the surface of aluminium alloy 1 is partially converted to gold-tinted, gold-tinted and blue light through the transduction of nano-phosphor is white light.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, such as, all any amendment, equivalent and improvement etc. made within the spirit and principles in the present invention, should be included within the scope of the present invention.
Claims (2)
1. a LED fluorescent powder coating process, aluminum alloy surface uses as the reflecting surface of LED light source, it is characterized in that: described aluminium alloy processes through surface, surface processes and includes: aluminium alloy anode oxide process, nano-phosphor surface moditied processing, nano-phosphor fill process and sealing pores, and each step is described as follows:
Described aluminium alloy anode oxide processes and is divided into following steps, the first step, aluminum alloy surface polishing, second step, aluminum alloy surface anodic oxidation, 3rd step, aluminum alloy surface activation processing, described first step aluminum alloy surface polishing is as anode using aluminium alloy, put into the mixed solution of perchloric acid and ethanol, the scope of anode voltage is that the temperature of the mixed solution of perchloric acid and ethanol maintains less than 10 degrees Celsius by refrigeration system, and the time of aluminum alloy surface polishing is within 60 seconds from 0 volt to 15 volt；Described second step aluminum alloy surface anodic oxidation is as anode using aluminium alloy, puts into the mixed solution of phosphoric acid, water and ethanol, and anode voltage is 120 volts to 250 volts, and the temperature of the mixed solution of phosphoric acid, water and ethanol maintains less than 10 degrees Celsius by refrigeration system;Described 3rd step aluminum alloy surface activation processing is to immerse in coupling agent by aluminium alloy, and the temperature of coupling agent maintains between 80 degrees Celsius to 120 degrees Celsius；Described nano-phosphor surface moditied processing is nano-phosphor and coupling agent to be mixed, the mass ratio of nano-phosphor and coupling agent is 100 to 5 to 100 to 1, in mixed process, the temperature of coupling agent is between 80 degrees Celsius to 120 degrees Celsius, mixing time be 1 hour by 24 hours, carry out processing 30 seconds to 300 seconds in the environment of having ultrasound wave；It is the nano-phosphor obtained after the moditied processing of nano-phosphor surface and above-mentioned aluminum alloy surface to be processed the aluminium alloy obtained mix that described nano-phosphor fill processes, the frequency carrying out ultrasonic Treatment in the environment of the ultrasonic power of every cubic metre 30 watts to 200 watts is 60kHz to 80kHz, and the process time is 300 seconds to 1000 seconds；Described sealing pores is that the aluminium alloy after nano-phosphor fill being processed carries out sealing pores, the parameter of sealing pores is, the ambient temperature of sealing pores is 80 degrees Celsius to 100 degrees Celsius, the ambient pressure of sealing pores is that 1 air is pressed onto 5 atmospheric pressure, the volumetric concentration of steam is 30% to 50%, and the process time is 30 minutes to 60 minutes.
LED fluorescent powder coating process the most according to claim 1, is characterized in that: the blue light of LED emission is partially converted to gold-tinted, gold-tinted and blue light through the transduction of described nano-phosphor as reflecting surface by described aluminum alloy surface becomes white light.
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| CN201310107767.XA CN103633220B (en) | 2013-03-31 | 2013-03-31 | A kind of LED fluorescent powder application techniques |
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| CN106435687A (en) * | 2016-09-22 | 2017-02-22 | 宇龙计算机通信科技(深圳)有限公司 | Electronic device shell, processing method thereof and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101320773A (en) * | 2008-07-11 | 2008-12-10 | 深圳市聚飞光电有限公司 | Packaging method for improving LED external quantum efficiency and LED packaging structure |
| CN202423386U (en) * | 2011-12-05 | 2012-09-05 | 深圳市瑞丰光电子股份有限公司 | Light emitting diode packaging structure |
| JP5103849B2 (en) * | 2006-09-28 | 2012-12-19 | カシオ計算機株式会社 | Liquid crystal display |
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| TW200412682A (en) * | 2003-01-13 | 2004-07-16 | Solidlite Corp | Pink LED |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5103849B2 (en) * | 2006-09-28 | 2012-12-19 | カシオ計算機株式会社 | Liquid crystal display |
| CN101320773A (en) * | 2008-07-11 | 2008-12-10 | 深圳市聚飞光电有限公司 | Packaging method for improving LED external quantum efficiency and LED packaging structure |
| CN202423386U (en) * | 2011-12-05 | 2012-09-05 | 深圳市瑞丰光电子股份有限公司 | Light emitting diode packaging structure |
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