CN202423283U - Energy-saving environment-friendly LED (light-emitting diode) module - Google Patents
Energy-saving environment-friendly LED (light-emitting diode) module Download PDFInfo
- Publication number
- CN202423283U CN202423283U CN201120454299XU CN201120454299U CN202423283U CN 202423283 U CN202423283 U CN 202423283U CN 201120454299X U CN201120454299X U CN 201120454299XU CN 201120454299 U CN201120454299 U CN 201120454299U CN 202423283 U CN202423283 U CN 202423283U
- Authority
- CN
- China
- Prior art keywords
- led
- module
- energy
- base plate
- led chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses an energy-saving environment-friendly LED (light-emitting diode) module which comprises a base plate and a plurality of LED chips, wherein the plurality of LED chips are arranged on the base plate. The energy-saving environment-friendly LED module is characterized in that a layer of fluorescent powder coating with the uniform thickness is arranged on the surface of each LED chip, and the plurality of LED chips are arranged on the base plate at intervals; and the base plate is made of an aluminum material or a ceramic material, and the plurality of LED chips are electrically connected with one another in parallel or in series. As the fluorescent powder mixture coatings on the surfaces of the LED chips are uniform in thickness, the phenomenon that light emitted from the periphery of the LED chips is shielded by the coating on the base plate can be avoided, the LED radiating problem is solved, and the LED luminous efficiency is improved so as to prolong the service life of the LED module, and simultaneously the characteristics of energy conservation and environment protection can be embodied; and compared with the LED module produced by a common method, the energy-saving environment-friendly LED module disclosed by the utility model has the advantages that the efficiency is improved by 30%, the junction temperature is reduced, and the reliability is improved.
Description
Technical field
The utility model relates to a kind of LED module, specifically is a kind of energy saving and environment friendly LED module.
Background technology
Be similar to general-purpose diode, LED is made up of PN junction, has unilateral conduction equally, and is luminous when forward conduction.White light LEDs is the core devices of semiconductor lighting; Well-known white light is the complex light that is mixed by multiple monochromatic light; As sunlight can share out bonus, orange, yellow, green, blue, indigo, purple seven kinds of monochromatic light; So we will obtain white light and want multiple photochromic the mixing, the present preparation method of white light LEDs has several kinds; A kind of is that blue LED adds yellow YAG fluorescent material, and a kind of is that ultraviolet LED adds RGB fluorescent material, and a kind of RGB of being three-primary color LED is mixed into White LED.Minimum at the technical costs that blue led obtains white light with the phosphor mixture coating at present, luminous efficiency also is the highest in several kinds of acquisition white light methods, relatively is applicable to illumination, and blue led adds the extensive use at present of yellow YAG fluorescent material.The LED module be exactly integrated plurality of LEDs on same substrate, conveniently use and reduce cost, also increased luminous efficiency and stability simultaneously, it is good that the LED module has heat radiation, makes LED continue long service life, long-term work is more stable.
Because the difference that blue led mixes in crystals growth process of heap of stone; The difference that causes the blue led emission wavelength, glow color, light efficiency, colour temperature all can cause deviation owing to the differentia influence of phosphor mixture coating around the emission wavelength of blue led and the led chip behind the blue led coating fluorescent material.It is photochromic that single LED can carry out sorting with instrument; But for the LED module; Integrated plurality of LEDs and one; The color of the plurality of LEDs on whole mould is fast can be affected owing to the wavelength and the LED yellow fluorescent powder mixture coating on every side of blue led, and many glow colors can demonstrate color error ratio on the whole LED module.
Traditional LED module is the fluorescent material mixed coating that fluorescent material and silica gel constitute to be coated in device have on the substrate of led chip; Make phosphor mixture with the surface of substrate and all led chip coverings; The coating layer thickness of the coating layer thickness of the upper surface of said led chip and led chip periphery is inconsistent, so many glow colors can demonstrate color error ratio on the whole LED module; In addition, the fluorescent material mixed coating of substrate surface blocks the light of led chip periphery, so the utilance of light is extremely low, does not meet energy conservation and environment protection.
Summary of the invention
The purpose of the utility model is to provide that a kind of thermal diffusivity is good, the energy saving and environment friendly LED module of long service life.
For solving the problems of the technologies described above, the technical scheme that the utility model adopted is:
A kind of energy saving and environment friendly LED module includes substrate and a plurality of led chip, and a plurality of led chips are located on the substrate, it is characterized in that: the surface of said each led chip is provided with the uniform fluorescent coating of a layer thickness.
Said a plurality of led chip is spaced apart on substrate.
Said substrate is to be processed by aluminum or ceramic material, adopts the electric connection mode of parallel connection or series connection between a plurality of led chips.
The beneficial effect of the utility model: because the phosphor mixture coating layer thickness uniformity on led chip surface; The phenomenon that the light of having avoided the coating on the substrate that the led chip periphery is sent blocks; Both solved the LED heat dissipation problem; Increase the LED luminous efficiency again, thereby prolonged the useful life of led module, also embodied the characteristics of energy-conserving and environment-protective simultaneously; The LED module improved efficiency 30% that the utility model is made than commonsense method descends LED module junction temperature, increases the unfailing performance of module.
Description of drawings
Below in conjunction with accompanying drawing the utility model is done further to specify.
Fig. 1 is the structural representation of led module.
Among the figure: 1, substrate; 2, led chip; 3, phosphor mixture coating.
Embodiment
As shown in Figure 1, a kind of energy saving and environment friendly LED module includes substrate and a plurality of led chip 2, and a plurality of led chips 2 are located on the substrate 1, and the surface of said each led chip 2 is provided with the uniform fluorescent coating 3 of a layer thickness.
The production process of the utility model: the led chip more than four 2 is disperseed crisscross being installed on the plate base 1, adopt the electric connection mode of parallel connection or series connection between a plurality of led chips 2, the Butut of its circuit can freely design; Substrate 1 can be aluminium base or pottery, the also substrate of available other materials, and material chosen will be beneficial to heat radiation; After utilizing centrifugal blender that fluorescent material is mixed and remove the bubble in the mixture with silica gel; The fluorescent material mixed coating that fluorescent material and silica gel are constituted is coated in device to be had on the substrate 1 of led chip 2; Make phosphor mixture with the surface of substrate and all led chip coverings; The substrate that will scribble phosphor mixture 3 then is placed in 60 ℃ of baking boxs and is cured 2 hours, changes 150 ℃ of baking boxs then over to aging two hours, cooling back LED module curing molding; After solidifying completion; The peripheral phosphor mixture coating of each led chip on the LED module is utilized laser cutting; Make the phosphor mixture coating layer thickness that periphery covered of led chip consistent, dispose the phosphor mixture layer that is positioned at substrate surface then with the phosphor mixture coating layer thickness of the upper surface of led chip.
Operation principle: led chip is luminous to be six bright dippings; Led chip PN stratum is a photon with electronic switch; Photon excites the acquisition sodium yellow with fluorescent powder grain in emission process; The sodium yellow that fluorescent material excites mixes with the part blue light and obtains white light, and photon reflects in phosphor mixture, reflects.The part photon can absorb by mixed thing; In order to make the photon loss minimum,, make photon obtain emission maximum efficient with fluorescent material excision around the led chip; LED module after the coating encapsulation is covered by the full wafer phosphor mixture; The phosphor mixture of chip periphery is resected to optimum thickness, the LED module is lighted under spectrometer, according to the color that is provided with phosphor mixture around the led chip 3 through the row laser cutting; Make the phosphor mixture 3 that is wrapped on the led chip 2 consistency of thickness, make the luminous unanimity of all led chips on the whole LED module at led chip 2 each faces.
The above is the preferred implementation of the utility model, can not limit the interest field of the utility model certainly with this.Should be pointed out that for those skilled in the art, the technical scheme of the utility model is made amendment or is equal to replacement, do not break away from the protection range of the utility model.
Claims (3)
1. an energy saving and environment friendly LED module includes substrate and a plurality of led chip, and a plurality of led chips are located on the substrate, it is characterized in that: the surface of said each led chip is provided with the uniform fluorescent coating of a layer thickness.
2. energy saving and environment friendly LED module according to claim 1 is characterized in that: said a plurality of led chips are spaced apart on substrate.
3. energy saving and environment friendly LED module according to claim 1 is characterized in that: said substrate is to be processed by aluminum or ceramic material, adopts the electric connection mode of parallel connection or series connection between a plurality of led chips.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120454299XU CN202423283U (en) | 2011-11-16 | 2011-11-16 | Energy-saving environment-friendly LED (light-emitting diode) module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120454299XU CN202423283U (en) | 2011-11-16 | 2011-11-16 | Energy-saving environment-friendly LED (light-emitting diode) module |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202423283U true CN202423283U (en) | 2012-09-05 |
Family
ID=46748015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201120454299XU Expired - Fee Related CN202423283U (en) | 2011-11-16 | 2011-11-16 | Energy-saving environment-friendly LED (light-emitting diode) module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202423283U (en) |
-
2011
- 2011-11-16 CN CN201120454299XU patent/CN202423283U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102723424B (en) | Method for preparing fluorescent wafer for LED (light-emitting diode) | |
CN101699638A (en) | Phosphor powder film making method and obtained phosphor powder film encapsulating method | |
CN101915369A (en) | LED white light source module | |
CN102945914B (en) | A kind of fluorescent glass coating for optical wavelength conversion and white light emitting device | |
CN201549499U (en) | Encapsulating structure of ceramic-based high-power red, green and blue LED | |
CN108987549A (en) | A kind of white chip preparation method | |
CN101030610B (en) | Large-power light-emitting diodes and its fluorescent-powder coating method | |
CN102721007A (en) | Remote phosphor structure applicable to LED lighting and production method thereof | |
CN101887941A (en) | Preparation method of LED phosphor layer | |
CN102403421B (en) | Method for coating LED module fluorescent powder mixture | |
CN202791789U (en) | Light-emitting diode (LED) fluorescent lampshade | |
CN209471995U (en) | High photosynthetic efficiency White-light LED chip | |
CN108987556A (en) | A kind of white chip | |
CN202423283U (en) | Energy-saving environment-friendly LED (light-emitting diode) module | |
CN103489857B (en) | A kind of White LED light-emitting device | |
CN203787464U (en) | White light LED device based on quantum points | |
CN102095092A (en) | Wafer level packaging structure and method for LED (light emitting diode | |
CN103915551A (en) | Novel white-light LED packaging structure and manufacturing method | |
CN202394970U (en) | Light-emitting diode (LED) chip and light source module using same | |
CN201893339U (en) | Integrated type LED light source | |
CN202307890U (en) | Novel integrated high-power LED (light-emitting diode) packaging structure | |
CN202996897U (en) | LED luminescent device and LED light fixture having the same | |
CN202405318U (en) | Integrated large-power LED packaging structure | |
CN110767792A (en) | COB light source and preparation method thereof | |
CN106098909B (en) | A kind of preparation method of LED illumination composite construction fluorescent glass piece |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20121116 |