CN202388126U - Laser jet bumping system - Google Patents
Laser jet bumping system Download PDFInfo
- Publication number
- CN202388126U CN202388126U CN 201120305714 CN201120305714U CN202388126U CN 202388126 U CN202388126 U CN 202388126U CN 201120305714 CN201120305714 CN 201120305714 CN 201120305714 U CN201120305714 U CN 201120305714U CN 202388126 U CN202388126 U CN 202388126U
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- ball
- chamber
- laser
- welding job
- welding operation
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Abstract
The utility model discloses a laser jet bumping system which comprises the following components: a laser generator, a dielectric mirror, an F-theta mirror and a welding operation chamber, wherein the components are successively equipped in an optical path. A side wall of the welding operation chamber is provided with a Z-direction servo motion mechanism. An XY servo operation platform is provided below the welding operation chamber. A workpiece is placed on the XY servo operation platform. A CCD sensor is provided above the dielectric mirror. One side of the welding operation chamber is provided with the following components successively from top to bottom: a ball storage chamber, a disturbance mechanism and a ball conveying pipe. The side wall at one end of the welding operation chamber is provided with a ball passing hole. The edge of the ball passing hole is provided with an elastic separation blade. The lower end in the ball conveying pipe is provided with an elastic sheet. The outer wall of the welding operation chamber is provided with a ball pressing projection. The laser jet bumping system can be used for producing BGA original piece in batch and can also used for laser jet bumping of a single ball in the repairing process, thereby reducing cost and improving production efficiency.
Description
Technical field
The utility model belongs to electronics process industry and soldering tech field, particularly relates to a kind of laser ball implanting system.
Background technology
It mainly is to adopt vapour deposition process, electrodeposition process, stencil methods to wait and plant slicker solder eutectic soldered ball that present BGA plants ball.
In vapour deposition process; When used metal mask thickness was very little, its rigidity requirement just can not get satisfying, and the mask size is to cold and hot sensitivity; Also be easy to generate the misalignment phenomenon in the preparation process; Therefore it is difficult to realize the ball of planting on large size chip surface, and cost is also very high, and the use of this technology is fewer and feweri at present.
Electrodeposition process is the improvement to vapour deposition process, occupies leading position at the preparation flip chip bonding in bump process.This technology utilization photo chemistry technology generates window, deposits through plating at normal temperatures.Its biggest advantage is that all salient points can generate simultaneously, has satisfied extensive, the industrial needs of continous way, does not receive the restriction of substrate size, and its producing cost is also low than vapour deposition process.It is wayward that electrodeposition process is planted the composition of ball; And the technology cycle is long; Cost is still higher, and its existing technology is mainly used in approved product, plants the ball requirement for various; Need when conversion products, spend plenty of time adjustment equipment, this especially is not suitable in small lot or single-piece production and individual groups piece installing rework process.
The technological process that the mould printing salient point is planted the playing skill art needs special template, lacks flexibility, is inappropriate for reprocessing of small batch production and respective solder, only suitable large-scale production in enormous quantities.
Summary of the invention
The purpose of the utility model is to overcome the shortcoming and defect of prior art, and a kind of laser ball implanting system is provided, and in carrying out the process that chip repairs, can carry out the single ball of planting, thereby practice thrift cost, has improved production efficiency.
The utility model is realized through following technical scheme:
A kind of laser ball implanting system comprises laser generator, dielectric mirror, F-θ mirror, welding job chamber that light path successively is provided with.The sidewall in welding job chamber is provided with Z direction servo motion mechanism; Below the welding job chamber, be provided with the servo workbench of XY; Place work piece on the servo workbench of XY, the top of said dielectric mirror is provided with ccd sensor, and the side in the welding job chamber is disposed with ball storage chamber, perturbation mechanism from top to bottom, the pipeline of losing; Have a logical ball hole on the sidewall of end, said welding job chamber; Edge in logical ball hole is provided with elastic block piece, and the bottom in the pipeline of losing is provided with a shell fragment, and it is protruding on the outer wall in welding job chamber, to be provided with a pressure ball; Said ccd sensor, laser generator, Z direction servo motion mechanism, the servo workbench of XY are connected with computer respectively.
Said laser generator comprises beam expanding lens, partially reflecting mirror, Q-switch, laser pump cavity, the completely reflecting mirror that connects successively.
The below of said ball storage chamber is the funnel type device, and said perturbation mechanism is arranged on the sidewall of funnel type device, and said perturbation mechanism is made up of disturbance sheet and manipulation knob, and said disturbance sheet is arranged in the funnel type device.
The utility model utilizes semiconductor laser or optical fiber laser (beam quality factor M
2＜1.5), and combine the laser transmitting system of Q-switch and beam expanding lens;
Through the XY workbench of computer numerical control (CNC), accurately be controlled at the displacement of horizontal direction, accurately move among a small circle fast, guarantee that laser focuses on the solder joint place accurately; The welding job chamber moves up and down and the workbench close fit, makes soldered ball arrive solder joint accurately;
Flexible catch is located in logical ball hole, and the below has pressure ball protruding, and the pressure ball convexity makes the shell fragment compression once through pushing the ball in each downward storke, and the ball of shell fragment promotion through overcompression is passed through, and other balls are stopped.
The utility model is simple in structure, and simple operation is easy to utilize.
Description of drawings
Fig. 1 is the structural representation of the utility model laser ball implanting system.
Fig. 2 a is the partial structurtes enlarged diagram of Fig. 1 welding job chamber, the pipeline of losing.
Fig. 2 b be Fig. 1 welding job chamber, the pipeline of losing look up the partial structurtes enlarged diagram.
Fig. 3 a is the partial structurtes enlarged diagram of ball storage chamber among Fig. 1, perturbation mechanism, the pipeline of losing.
Fig. 3 b is the opposite side partial structurtes enlarged diagram of ball storage chamber among Fig. 1, perturbation mechanism, the pipeline of losing.
The internal structure sketch map of Fig. 4 Fig. 1 laser generator.
Fig. 5 (1) is the process sketch map 1 that the laser ball implanting system is delivered to ball in the welding job chamber.
Fig. 5 (2) is the process sketch map 2 that the laser ball implanting system is delivered to ball in the welding job chamber.
Fig. 5 (3) is the process sketch map 3 that the laser ball implanting system is delivered to ball in the welding job chamber.
Among the last figure: controller 1; Laser generator 2; Ccd sensor 3; Dielectric mirror 4 (narrow-band-filter); Ball storage chamber 5; The pipeline 6 of losing; Welding job chamber 7; Perturbation mechanism 8; Workpiece 9; The servo workbench 10 of XY; F-θ mirror 11; Elastic block piece 12; Shell fragment 13; Pressure ball protruding 14; Welding job chamber Z direction servo motion mechanism 15; Annular light source 16; Disturbance sheet 17; Manual control knob 18; Funnel type device 19; Ball storage chamber 20; Beam expanding lens 21; Partially reflecting mirror 22; Q-switch 23; Laser pump cavity 24; Completely reflecting mirror 25.
The specific embodiment
Do further detailed explanation in the face of the specific embodiment of the utility model down, but the embodiment of the utility model is not limited thereto.
Embodiment
Shown in Fig. 1, Fig. 2 a, Fig. 2 b.The utility model laser ball implanting system; The laser generator 2, dielectric mirror 4, F-θ mirror 11, the welding job chamber 7 that comprise light path setting successively; The sidewall in welding job chamber 7 is provided with Z direction servo motion mechanism 15; Below welding job chamber 7, be provided with the servo workbench 10 of XY, place work piece 9 on the servo workbench 10 of XY, the top of said dielectric mirror 4 is provided with ccd sensor 3; Side in welding job chamber 7 is disposed with ball storage chamber 5, perturbation mechanism 8 from top to bottom, the pipeline 6 of losing; Have a logical ball hole on the sidewall of 7 ends, said welding job chamber, be provided with elastic block piece 12 at the edge in logical ball hole, the bottom in the pipeline 6 of losing is provided with a shell fragment 13; It is protruding 14 on the outer wall in welding job chamber 7, to be provided with a pressure ball, and said ccd sensor 3, laser generator 2, Z direction servo motion mechanism 15, the servo workbench 10 of XY are connected with computer 1 respectively.
As shown in Figure 4.Said laser generator 2 comprises beam expanding lens 21, partially reflecting mirror 22, Q-switch 23, laser pump cavity 24, the completely reflecting mirror 25 that connects successively.
Shown in Fig. 3 a, Fig. 3 b.The below of said ball storage chamber 5 is a funnel type device 19, and said perturbation mechanism 8 is arranged on the sidewall of funnel type device 19, and said perturbation mechanism 8 is made up of disturbance sheet 17 and manipulation knob, and said disturbance sheet 17 is arranged in the funnel type device 19.
The Z direction servo motion mechanism 15 in controller 1 (computer) control laser generator 2, the servo workbench 10 of XY and welding job chamber.Laser generator 2 adopts 200W semiconductor pump YAG laser instrument, perhaps adopts the 50-100W optical fiber laser.The wavelength that optical fiber laser sends is close with YAG laser, but beam quality is better than semiconductor pumped YAG laser.Insert Q-switch 23 in laser generator 2 resonators, and expand bundle by beam expanding lens 21 in partially reflecting mirror 22 fronts.The servo workbench 10 of XY moves in the horizontal direction, makes the solder joint of treating of the workpiece that is fixed on the workbench aim at welding job chamber 7 according to the instruction of controller 1.Move on the Z direction in welding job chamber 7, dielectric mirror 4 can visible light transmissive and reflector laser, and F-θ mirror 11 focuses on parallel laser beam a bit, and focus is on the horizontal plane of workpiece place.When the servo workbench 10 of XY was aimed at welding job chamber 7 with the point of treating soldered ball of workpiece, welding job chamber 7 moved downward to the operating point (minimum point), and a soldered ball gets into welding job chamber 7 by the pipeline 6 of losing under the effect of shell fragment 13 elastic force simultaneously; Arrive the solder joint place along working chamber; Through dielectric mirror 4 reflected, and by F-θ mirror 11 focused on solder joint by laser generator 2 emission laser this moment; Melt soldered ball, adhere on the workpiece.The annular light source 16 of working chamber lower end throws light on; Visible transmission is crossed dielectric mirror 4; Arrive ccd sensor 3 places; Ccd sensor 3 is given controller 1 with signal feedback, and controller 1 can judge whether solder joint is aimed at laser spot and finely tuned workbench 10 before welding in view of the above, can also survey the welding quality of welding back solder joint.In case what certain ball occurs plants the ball poor quality, detection system can be write down this piece wiring board numbering, plants ball after the manual process more again.
Shown in Fig. 2 a, Fig. 2 b, a logical ball hole is arranged, on the 7 chamber walls of welding job chamber when welding job chamber 7 is positioned at minimum point; Logical ball mouth is over against the pipe outlet of losing; Flexible catch 12 in the duct has a shell fragment 13 in the pipeline of losing, the end of shell fragment 13 only contacts with a bead; Shell fragment 13 is after pushing away away a bead, and a large amount of little club of top depresses shell fragment 13 is pushed back original position.One pressure ball protruding 14 is arranged on working chamber 7 outer walls.
Shown in Fig. 5 (1), when welding job chamber 7 moved downward under the control of Z direction servo motion mechanism 15, pressure ball protruding 14 can get in the groove of the pipeline 6 of losing, and extrusion ball makes shell fragment 13 compressions.Continuation decline along with welding job chamber 7; Pressure ball protruding 14 leaves the pipeline 6 of losing; The pipeline 6 of losing is aimed in logical ball hole on the sidewall in the chamber of welding job simultaneously 7, and the shell fragment 13 after the compression is given ball one thrust and made ball form initial velocity, finally makes ball pass elastic block piece 12 and gets in the welding job chamber 7; Other balls fall to beginning to compress shell fragment 13 simultaneously, and this process is shown in Fig. 5 (2).When next ball arrived the exit position of the pipeline 6 of losing, because shell fragment 13 without overcompression, can't make it pass through elastic block piece 12, this process such as Fig. 5 (3) had therefore avoided a plurality of balls to get into simultaneously in the welding job chamber 7.
When a large amount of balls is lost pipeline 6 in entering, might block, below ball storage chamber 5, connect a funnel type device 19; Add a perturbation mechanism 8 that constitutes by disturbance sheet 17 and manual control knob 18 at funnel type device 19 sidewalls; Referring to Fig. 3, the outer rim of disturbance sheet 17 and funnel type device 19 have minimum spacing, less than the diameter of ball; In the time of can blocking at the ball of the funnel type device 19 and pipeline 6 junctions of losing, ball is pushed aside.The pipeline 6 of losing is transparent material, and whether the ball that can observe out in the pipeline 6 of losing is sufficient, if the pipeline 6 of losing ball occurs when not enough, then manually stirs and handles knob 18.
Below be the contrast table of the key property of the utility model and two kinds of main flow BGA of prior art soldering tech:
Just can realize the utility model preferably as stated.
The foregoing description is the utility model preferred implementation; But the embodiment of the utility model is not restricted to the described embodiments; Other any do not deviate from change, the modification done under spirit and the principle of the utility model, substitutes, combination, simplify; All should be the substitute mode of equivalence, be included within the protection domain of the utility model.
Claims (3)
1. a laser ball implanting system is characterized in that, comprises laser generator, dielectric mirror, F-θ mirror, the welding job chamber of light path setting successively; The sidewall in welding job chamber is provided with Z direction servo motion mechanism; The below in welding job chamber is provided with the servo workbench of XY, place work piece on the servo workbench of XY, and the top of said dielectric mirror is provided with ccd sensor; Side in the welding job chamber is disposed with ball storage chamber, perturbation mechanism from top to bottom, the pipeline of losing; Have a logical ball hole on the sidewall of end, said welding job chamber, be provided with elastic block piece at the edge in logical ball hole, the bottom in the pipeline of losing is provided with a shell fragment; It is protruding on the outer wall in welding job chamber, to be provided with a pressure ball, and said ccd sensor, laser generator, Z direction servo motion mechanism, the servo workbench of XY are connected with computer respectively.
2. laser ball implanting according to claim 1 system is characterized in that, said laser generator comprises beam expanding lens, partially reflecting mirror, Q-switch, laser pump cavity, the completely reflecting mirror that connects successively.
3. laser ball implanting according to claim 2 system; It is characterized in that the below of said ball storage chamber is the funnel type device, said perturbation mechanism is arranged on the sidewall of funnel type device; Said perturbation mechanism is made up of disturbance sheet and manipulation knob, and said disturbance sheet is arranged in the funnel type device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120305714 CN202388126U (en) | 2011-08-22 | 2011-08-22 | Laser jet bumping system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120305714 CN202388126U (en) | 2011-08-22 | 2011-08-22 | Laser jet bumping system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202388126U true CN202388126U (en) | 2012-08-22 |
Family
ID=46663078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120305714 Withdrawn - After Issue CN202388126U (en) | 2011-08-22 | 2011-08-22 | Laser jet bumping system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202388126U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102350559A (en) * | 2011-08-22 | 2012-02-15 | 华南理工大学 | Laser reballing system |
| CN105336633A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Ball mounting tool for BGA chip |
-
2011
- 2011-08-22 CN CN 201120305714 patent/CN202388126U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102350559A (en) * | 2011-08-22 | 2012-02-15 | 华南理工大学 | Laser reballing system |
| CN105336633A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Ball mounting tool for BGA chip |
| CN105336633B (en) * | 2015-11-14 | 2017-10-31 | 苏州光韵达光电科技有限公司 | A kind of plant ball instrument for bga chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120822 Effective date of abandoning: 20130612 |
|
| RGAV | Abandon patent right to avoid regrant |