CN209986396U

CN209986396U - Double-light-path laser device and battery piece processing equipment

Info

Publication number: CN209986396U
Application number: CN201920710606.2U
Authority: CN
Inventors: 罗搏飞; 冼志军; 周志豪
Original assignee: Changzhou Jiejiachuang Intelligent Equipment Co Ltd
Current assignee: Changzhou Jiejiachuang Intelligent Equipment Co Ltd
Priority date: 2019-05-17
Filing date: 2019-05-17
Publication date: 2020-01-24
Anticipated expiration: 2029-05-17

Abstract

The utility model discloses a double-light-path laser device and battery piece processing equipment, wherein the double-light-path laser device comprises a laser (1), a laser beam emitted by the laser is selectively reflected to an A light path or a B light path through a rotating shaft galvanometer (8), and is emitted to two processing platforms by two light paths in turn; the optical path A and the optical path B have the same structure and comprise a first reflecting mirror (2), a second reflecting mirror (3), a beam expanding and shaping device (4), a scanning galvanometer (5) and a field lens (9); the laser beam is reflected by the first reflecting mirror and the second reflecting mirror, and then is emitted to the processing platform through the beam expanding and shaping device, the scanning galvanometer and the field lens; the laser beam emitted by the special laser irradiates to the two processing platforms in turn through the two light paths, wafers on the two processing platforms are processed in turn, the total cost of the whole set of equipment is reduced, the waiting time of laser processing is reduced, the utilization rate of laser is improved, and the capacity of the laser equipment is increased to 8000-8500 wafers per hour.

Description

Double-light-path laser device and battery piece processing equipment

Technical Field

The utility model relates to a battery piece's of PERC SE technique processing equipment in the solar photovoltaic trade especially relates to a double-optical-path laser device and have this laser device's battery piece processing equipment.

Background

Since the global oil crisis outbreak in the 70 th 20 th century, the solar photovoltaic power generation technology has attracted high attention in western developed countries, and governments of various countries have made policy encouragement and support for the solar photovoltaic power generation technology from the viewpoint of environmental protection and energy sustainable development strategy, and the photovoltaic industry has rapidly developed in the world, and in addition to crystalline silicon solar cells and amorphous silicon solar cells, new solar cells such as various compound semiconductor solar cells and laminated solar cells composed of two types of solar cells have appeared. Solar energy is one of the best alternatives to traditional energy sources due to its cleanliness and renewability. With research and technical development for many years, the price of the solar photovoltaic module has been greatly reduced, and the solar energy conversion efficiency has also been improved, so that the commercial development and application of solar photovoltaic power generation are possible.

At present, the photovoltaic industry is in a new stage of developing from a rough type to a fine type, a new stage of changing from splicing scale, splicing speed and splicing price to splicing quality, splicing technology and splicing benefit, and a new stage of gradually realizing price balance change from subsidy dependence. The talent-talent director and chief executive officer also indicate that in the coming decade, the photovoltaic industry in China should pursue high-quality development, with less resource investment, creating higher value.

Various indications show that with the advance of the development of high quality, the photovoltaic industry has considerable prospects. The photovoltaic industry is ever subjected to wave break, but the scale of the photovoltaic industry is continuously increased, the application range is continuously expanded, and almost any region in the world is used, which shows the light quality of the photovoltaic industry, so that the photovoltaic industry can be continuously developed and grown in each wave break. Market conditions for efficient solar cell laser processing equipment

The flat price online trend of photovoltaic power generation is obvious, the electricity price is continuously reduced, the growth speed of the photovoltaic power generation industry is further accelerated, and photovoltaic power generation enterprises face market opportunities; meanwhile, bidding price winning and price winning of photovoltaic power generation electric charge are continuously reduced due to online bidding, and the competition pressure of the industry is increased. Under the background, photovoltaic power generation enterprises need to further reduce the power generation cost by applying more efficient battery assemblies and other modes; photovoltaic cell manufacturing enterprises purposefully push out high-efficiency solar cell products such as PERC cells and the like, and the productivity of the high-efficiency solar cell is rapidly expanded by newly building and reconstructing an original production line and the like. The specific situation is as follows:

1. the high-efficiency solar cell technology can obviously improve the power generation efficiency of the cell

At present, the high-efficiency solar cell technology mainly comprises PERC, SE, MWT and the like, the three processes can be superposed on the same production line, and the efficiency improvement effect is shown in the following table:

2. the high-efficiency solar cell technology can bring considerable benefits to photovoltaic power stations

Taking the PERC process as an example, under the current market conditions, the photovoltaic power station applying the PERC battery component generates larger profit than applying the traditional photovoltaic battery component, and the electricity consumption cost can be reduced to the level of 0.01-0.02 yuan. The newly published successful bid leaders photovoltaic power generation project in 3 months in 2018, all successful bid enterprises adopt the PERC technology, the price of the on-line electricity is 0.41-0.45 yuan/degree, the median is 0.43 yuan/degree, and the advantages of the PERC technology are reflected.

3. The high-efficiency solar cell technology can bring considerable benefits to battery manufacturers

Taking the PERC process as an example, under the current market environment, the traditional battery production line is transformed into the PERC battery production line, the income is considerable, the equipment investment can be recovered within 1 year, and the demand of photovoltaic cell manufacturers on the PERC battery laser processing equipment is rapidly increased. In addition, the use of advanced processes such as PERC and the like is beneficial to photovoltaic cell production enterprises to improve the product performance, increases the chance of entering a "catcher plan", and is beneficial to improving the brand value of the photovoltaic cell production enterprises.

4. Market scale measurement and calculation of high-efficiency solar cell technology

By 2020, the capacity of the photovoltaic cell can reach 138 gigawatts, and the capacity of the PERC cell is expected to be about 73 gigawatts and occupies about 53 percent. Considering that the laser equipment corresponding to the newly increased PERC capacity comprises PERC, a splitting machine and the like, the total market quantity of the related laser processing equipment is more than 19 million yuan calculated according to the capacity of the PERC battery of 73 gigawatts in 2020. Other efficient solar cell processing technologies are also under development, including MWT, SE, etc., which can be overlaid with PERC, with the projected total market volume of MWT, SE and other laser processing equipment exceeding 18 billion dollars by 2020.

5. Market competition pattern

In the high-efficiency solar cell laser processing equipment industry, only a few enterprises capable of providing competitive high-efficiency solar cell laser processing equipment currently comprise German Rofin, German Innolas Solutions, Wuhandi, Changzhou laser, Suzhou Meyer, Dazhou and Youguagao energy and the like, and the competitive pattern of several manufacturers mainly based on Wuhandi is formed at present.

The equipment is the soul of semiconductor technology, and the photovoltaic industry in China can make extremely rapid development, which is inseparable from the technical progress and the localization of the equipment. In 2018, the production capacity of the PERC battery piece in China is further improved, production line equipment is gradually replaced by domestic equipment, and the production process is more mature.

After the production of PERC technology has matured, cost-effective Selective Emitter (SE) technology will also become the first choice for photovoltaic enterprises, and SE is expected to grow steadily up to 2020, accounting for over 50% of the market share of PERC cells.

With the continuous and rapid development of the photovoltaic industry, the demand of manufacturers for producing large solar cells for improving the productivity is also continuously increased. The capacity of PERC laser equipment in 2016 is 4500 sheets per hour, the capacity is increased to 5500 sheets per hour at the end of 2017, the capacity is increased to 6000 sheets per hour in 2018, the capacity is 6500 sheets per hour in Wuhan dell, and the capacity can be increased to 7500 sheets per hour in later transformation and upgrading. From the trend of the industry, the productivity of the screen printing equipment matched with the PERC laser equipment is continuously improved, and the demand of manufacturers for producing large solar cells for improving the productivity of the laser equipment is more and more increased. At present, the double-track capacity of the screen printing equipment reaches 8000 pieces per hour, and laser online/offline equipment matched with the screen printing equipment is not completely matched, so that the improvement of the capacity of the whole equipment is restricted.

In the process of generating the solar cell, a process is to place the wafer into PERC laser equipment and process the wafer by laser. The existing processing mode is that a laser device corresponds to a processing platform and a runner for feeding and discharging, the runner moves wafers into the processing platform piece by piece for laser processing, and unprocessed wafers are used for replacing processed wafers after processing. In this processing method, the laser device stops working during the wafer replacement process, resulting in low throughput and high acquisition cost of the whole device.

Therefore, how to increase the throughput of laser equipment is an urgent technical problem to be solved in the industry.

SUMMERY OF THE UTILITY MODEL

In order to solve the above defects existing in the prior art, the utility model provides a two light path laser device and have this laser device's battery piece processing equipment.

The technical scheme adopted by the utility model is to design a double-light-path laser device, which comprises a laser, wherein a laser beam emitted by the laser is reflected to an A light path or a B light path through selecting a rotating shaft galvanometer, and the laser beam is emitted to two processing platforms through the two light paths in turn; the optical path A and the optical path B have the same structure and comprise a first reflecting mirror, a second reflecting mirror, a beam expanding and shaping device, a scanning galvanometer and a field lens; the laser beam is reflected by the first reflecting mirror and the second reflecting mirror, and then is emitted to the processing platform through the beam expanding and shaping device, the scanning galvanometer and the field lens; and the industrial personal computer controls the laser, the rotating shaft galvanometer and the scanning galvanometer to work.

The utility model also designs a battery piece processing device, which comprises the double-light-path laser device, wherein an A platform and a B platform are respectively arranged below the double-light-path laser device, an A runner of a processed wafer on the A platform is replaced by an unprocessed wafer, and a B runner of a processed wafer on the B platform is replaced by an unprocessed wafer; and the double-light-path laser device processes the wafers on the platform A and the platform B in turn.

And positioning camera modules are respectively arranged below the platform A and the platform B and send wafer position information to the industrial personal computer.

The laser processing table is made of transparent materials.

The runner A and the runner B adopt the same structure and respectively comprise a feeding side transmission belt, a processing position transmission belt and a discharging side transmission belt which are sequentially connected, and the wafer can be placed on the upper surfaces of the three sections of transmission belts for transmission; the processing station conveying belt is arranged on the jacking device; the processing station conveying belt can ascend to be level with the feeding side conveying belt and the discharging side conveying belt or descend to be submerged into the platform A or the platform B under the driving of the jacking device.

Platform A and platform B adopt the same structure, all include and dodge the groove of dodging of processing position transmission band still distributes a plurality of vacuum on the platform and inhales the hole, the vacuum is inhaled the jogged joint vacuum generating device, sinks when processing position transmission band dodge in the groove, the wafer is shelved on the platform, the hole can be inhaled in the vacuum wafer.

The three conveyor belts of the feeding side conveyor belt, the processing position conveyor belt and the discharging side conveyor belt are all composed of two parallel belts, and the wafer is placed on the belts for conveying; the corresponding avoidance groove also comprises two parallel long grooves for avoiding the belt.

The vacuum generating device, the feeding side conveying belt, the processing position conveying belt and the discharging side conveying belt are controlled by a variable program controller, and the variable program controller and the industrial personal computer carry out signal interaction.

The utility model provides a technical scheme's beneficial effect is:

the laser beam emitted by the special laser irradiates the two processing platforms in turn through the two light paths, wafers on the two processing platforms are processed in turn, the total cost of the whole set of equipment is reduced, the time for replacing the processed wafers with unprocessed wafers is saved, the waiting time for laser processing is reduced, the utilization rate of the laser is improved, and the capacity of the laser equipment is increased to 8000-8500 tablets per hour.

Drawings

The invention is explained in more detail below with reference to exemplary embodiments and the accompanying drawings, in which:

FIG. 1 is a schematic diagram of a dual optical path laser apparatus;

FIG. 2 is a schematic view of a cell processing apparatus;

FIG. 3 is a top view of the flow channel of the preferred embodiment of the present invention;

FIG. 4 is a schematic block diagram of a control circuit according to a preferred embodiment of the present invention;

fig. 5 is a control flow chart of the preferred embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The utility model discloses a double-light path laser device, which refers to the principle schematic diagram shown in figure 1 and comprises a laser 1, wherein the laser beam emitted by the laser is alternatively reflected to an A light path or a B light path through a rotating shaft vibrating mirror 8 and is emitted to two processing platforms by two light paths in turn; the optical path A and the optical path B have the same structure and comprise a first reflecting mirror 2, a second reflecting mirror 3, a beam expanding and shaping device 4, a scanning galvanometer 5 and a field lens 9; the laser beam is reflected by the first reflecting mirror and the second reflecting mirror, then is emitted to the processing platform through the beam expanding and shaping device, the scanning vibrating mirror and the field lens, and the cell (namely the wafer) on the processing platform is processed in turn.

And the industrial personal computer controls the laser, the rotating shaft galvanometer and the scanning galvanometer to work. The laser generates laser beams under the control of the industrial personal computer. The rotating shaft galvanometer rotates under the control of an industrial personal computer, and the laser beam is selected to be emitted to the light path A or the light path B. The scanning galvanometer vibrates under the control of an industrial personal computer to guide laser beams to process. By the structure, two positions can be processed by one laser and two light paths in turn, so that the arrangement of the lasers is saved, and the production cost of the whole machine is saved. In the preferred embodiment of the present patent, the laser device is used in a cell processing apparatus, it should be understood that this is an example, and the dual optical path laser device can also be used in other apparatuses.

The utility model also discloses a battery piece processing equipment, refer to the battery piece processing equipment principle sketch map that fig. 2 shows, it includes above-mentioned double optical path laser device, is equipped with A platform 6 and B platform 7 respectively below double optical path laser device to and replace the A runner of the processed wafer on the A platform with unprocessed wafer, replace the B runner of the processed wafer on the B platform with unprocessed wafer; and the double-light-path laser device processes the wafers on the platform A and the platform B in turn. The time for loading and unloading is needed when the unprocessed wafer is used for replacing the processed wafer, and the time for loading and unloading is basically equivalent to the time for processing one wafer by laser, so that the dual-optical-path laser device can work all the time. Compare among the prior art runner that a laser device corresponds a processing platform and one and goes up unloading, the utility model discloses can save a laser device, reduce equipment cost, reduce the time of laser beam machining latency, promote the utilization ratio of laser, increase laser equipment productivity and 8000-.

And positioning camera modules 10 are respectively arranged below the platform A6 and the platform B7, the positioning camera modules send wafer position information to the industrial personal computer, the industrial personal computer obtains the accurate position of the wafer, and the wafer of the scanning galvanometer can be controlled to perform precision machining. In some embodiments, the size of the wafer is larger than that of the platform A (or the platform B), so the positioning camera module can shoot the wafer even though being arranged below the platform, and the position of the wafer can be fed back to the industrial personal computer. In a preferred embodiment, the laser processing station is made of a transparent material to better reflect the position of the wafer.

Referring to fig. 3, in the preferred embodiment, the flow path a and the flow path B have the same structure, and each flow path a and flow path B includes a feeding side conveyor belt 21, a processing position conveyor belt 22 and a discharging side conveyor belt 23, which are connected in sequence, and the wafer can be placed on the upper surfaces of the three sections of conveyor belts for conveying; the processing station conveyor belt is arranged on the jacking device 24; the processing station conveying belt can be driven by the jacking device to ascend to be level with the feeding side conveying belt and the discharging side conveying belt or descend to be submerged into the A platform 6 or the B platform 7.

Platform A6 and platform B7 adopt the same structure, all include dodging add the groove of dodging of station transmission band, still distribute a plurality of vacuum on the platform and inhale the hole, the vacuum is inhaled the jogged joint vacuum generating device, sinks when processing position transmission band dodge in the groove, the wafer is shelved on the platform, the vacuum is inhaled the hole and can be inhaled the wafer.

The three conveyor belts, namely the feeding side conveyor belt 21, the processing position conveyor belt 22 and the discharging side conveyor belt 23, are all composed of two parallel belts 20, and the wafer is placed on the belts for conveying; the corresponding avoidance slot also includes two parallel elongated slots to avoid the belt 20.

Referring to the schematic block diagram of the control circuit of the preferred embodiment shown in fig. 4, the vacuum generating device, the feeding-side conveyor belt 21, the processing station conveyor belt 22 and the discharging-side conveyor belt 23 are controlled by a variable program controller (PLC in the figure) which performs signal interaction with the industrial personal computer. Through the signal interaction of the two, the whole machine is cooperatively controlled to form a whole.

The utility model discloses a control method is: replacing the processed wafer on the platform A by the unprocessed wafer through the runner A, and replacing the processed wafer on the platform B by the unprocessed wafer through the runner B; and (4) processing the wafers on the platform A and the platform B in turn by using a double-light-path laser device.

Referring to a flow chart of the control of the preferred embodiment shown in fig. 5, the control method of the battery piece processing equipment comprises the following specific steps:

firstly, a lifting device in a runner A drives a processing station transmission belt to ascend, a feeding side transmission belt, a processing station transmission belt and a discharging side transmission belt rotate, unprocessed wafers are used for replacing processed wafers on a platform A, then the three transmission belts stop rotating, the lifting device drives the processing station transmission belt to sink, the unprocessed wafers are placed on the platform A, a vacuum suction hole sucks the wafers, and a positioning camera module below the platform A shoots the positions of the wafers; meanwhile, the rotating shaft galvanometer deflects to switch the laser beam to a B light path, and the scanning galvanometer guides the laser beam to process the wafer on the B platform according to the position of the wafer;

secondly, a lifting device in the flow channel B drives a processing station transmission belt to ascend, a feeding side transmission belt, a processing station transmission belt and a discharging side transmission belt rotate, unprocessed wafers are used for replacing processed wafers on a platform B, then the three transmission belts stop rotating, the lifting device drives the processing station transmission belt to sink, the unprocessed wafers are placed on the platform B, a vacuum suction hole sucks the wafers, and a positioning camera module below the platform B shoots the positions of the wafers; and simultaneously, the rotating shaft galvanometer deflects to switch the laser beam to the optical path A, and the scanning galvanometer guides the laser beam to process the wafer on the platform A according to the position of the wafer.

According to the above process description, two flow channels and two processing platforms are assembled under the dual-optical-path laser device, and the dual-flow channel wafer is not synchronously transferred to the processing platforms. After the processing mode begins, the A flow channel conveys the wafer to the A platform, the processing station conveying belt which is at a low position begins to rise under the work of the lifting device, the processing station conveying belt is enabled to be parallel and level to the feeding side conveying belt and the discharging side conveying belt, the processed wafer is conveyed to the discharging side conveying belt from the processing station conveying belt, the lifting device descends, the unprocessed wafer falls on the A platform, the A platform vacuum generation device works, the wafer is adsorbed and fixed, the camera module is positioned to photograph and position, and then the double-light-path laser device begins to process the wafer on the A platform. When the wafer of the platform A is processed by laser, a processing position transmission belt in a flow passage B rises at the work of a lifting device, an unprocessed wafer is transmitted to the processing position transmission belt from a material loading side transmission belt, the lifting device descends, the wafer falls on the platform B, vacuum is absorbed, a camera shoots and positioning is completed, after the laser processing of the wafer on the platform A is completed, the laser deflects to a light passage B from the light passage A under the adjustment of a rotating shaft vibrating mirror, the laser rotates to the platform B, the laser does not need to stop emitting light too much to wait for the time difference of material loading and unloading, the wafer on the platform B can be processed immediately after the light passage deflection, at the same time, the platform A breaks the vacuum, the lifting device ascends, the processed wafer is transmitted to a material unloading side transmission belt from the processing position transmission belt, and then the wafer is transmitted out from the flow passage A. Meanwhile, new wafers are conveyed from the feeding side conveying belt to the processing position conveying belt, the lifting device descends, unprocessed wafers fall on the platform A, and then fixing and camera positioning are completed; and after the wafer on the platform surface of the platform B is processed, the laser is transferred to the platform A for laser processing. B, breaking vacuum of the platform, lifting the lifting device, conveying the processed wafer from the conveying belt of the processing position to the conveying belt of the blanking side, and then conveying the processed wafer out from the runner B; meanwhile, a new wafer is conveyed from the feeding side conveying belt to the processing position conveying belt, the lifting device descends, and the wafer falls to the platform B to complete fixing and camera positioning.

The utility model discloses in, the time of laser beam machining wafer is about 0.85 second, and the wafer is from conveying to the platform, and the time of fixed and camera location also needs to reach about 0.85 second, therefore two steps circulate in turn in the control flow, and laser beam machining is going on always, has reduced laser beam machining's latency, great increase the utilization ratio of laser, the process time of monolithic wafer has also obtained the great reduction.

The foregoing examples are illustrative only and are not intended to be limiting. Any equivalent modifications or variations without departing from the spirit and scope of the present application should be included in the claims of the present application.

Claims

1. A double-light-path laser device comprises a laser (1) and is characterized in that a laser beam emitted by the laser is selectively reflected to an A light path or a B light path through a rotating shaft vibrating mirror (8) and is emitted to two processing platforms through the two light paths in turn; the optical path A and the optical path B have the same structure and comprise a first reflecting mirror (2), a second reflecting mirror (3), a beam expanding and shaping device (4), a scanning galvanometer (5) and a field lens (9); the laser beam is reflected by the first reflecting mirror and the second reflecting mirror, and then is emitted to the processing platform through the beam expanding and shaping device, the scanning galvanometer and the field lens; and the industrial personal computer controls the laser, the rotating shaft galvanometer and the scanning galvanometer to work.

2. A cell processing apparatus comprising the dual optical path laser device of claim 1, wherein an a stage (6) and a B stage (7) are provided below the dual optical path laser device, respectively, and an a runner for replacing a processed wafer on the a stage with an unprocessed wafer and a B runner for replacing a processed wafer on the B stage with an unprocessed wafer; and the double-light-path laser device processes the wafers on the platform A and the platform B in turn.

3. The battery piece processing equipment according to claim 2, wherein a positioning camera module (10) is arranged below the platform A (6) and the platform B (7) respectively, and the positioning camera module sends wafer position information to the industrial personal computer.

4. The battery piece processing equipment according to claim 3, wherein the A platform (6) and the B platform (7) are made of transparent materials.

5. The battery piece processing device according to claim 2, wherein the flow channel A and the flow channel B are of the same structure and each comprises a feeding side conveying belt (21), a processing conveying belt (22) and a discharging side conveying belt (23) which are connected in sequence, and the wafer can be placed on the upper surfaces of the three sections of conveying belts for conveying; the processing position transmission belt is arranged on the jacking device (24); the processing station conveying belt can ascend to be level with the feeding side conveying belt and the discharging side conveying belt or descend to be submerged into the platform A (6) or the platform B (7) under the driving of the jacking device.

6. The battery piece processing equipment according to claim 5, wherein the A platform (6) and the B platform (7) are of the same structure and respectively comprise an avoidance groove for avoiding the processing station conveying belt, a plurality of vacuum suction holes are distributed on the platforms, the vacuum suction holes are connected with a vacuum generating device, when the processing station conveying belt sinks into the avoidance groove, the wafer is placed on the platforms, and the vacuum suction holes can suck the wafer.

7. The battery plate processing device according to claim 6, wherein the three conveyor belts of the feeding side conveyor belt (21), the processing position conveyor belt (22) and the discharging side conveyor belt (23) are composed of two parallel belts (20), and the wafer is placed on the belts for conveying; the corresponding avoidance groove also comprises two parallel long grooves for avoiding the belt (20).

8. The battery piece processing device according to claim 6, wherein the vacuum generating device, the feeding side conveyor belt (21), the processing position conveyor belt (22) and the discharging side conveyor belt (23) are controlled by a variable program controller, and the variable program controller performs signal interaction with the industrial personal computer.