CN109986196A - Double-station cell piece laser process equipment and its control method - Google Patents
Double-station cell piece laser process equipment and its control method Download PDFInfo
- Publication number
- CN109986196A CN109986196A CN201910350821.0A CN201910350821A CN109986196A CN 109986196 A CN109986196 A CN 109986196A CN 201910350821 A CN201910350821 A CN 201910350821A CN 109986196 A CN109986196 A CN 109986196A
- Authority
- CN
- China
- Prior art keywords
- station
- wafer
- transmission belt
- laser
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 66
- 230000008569 process Effects 0.000 title claims abstract description 45
- 238000012545 processing Methods 0.000 claims abstract description 35
- 239000000725 suspension Substances 0.000 claims abstract description 3
- 230000005540 biological transmission Effects 0.000 claims description 63
- 238000003754 machining Methods 0.000 claims description 29
- 239000000126 substance Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 84
- 238000004519 manufacturing process Methods 0.000 abstract description 25
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 23
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 23
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 23
- 210000004027 cell Anatomy 0.000 description 19
- 238000005516 engineering process Methods 0.000 description 13
- 238000011161 development Methods 0.000 description 7
- 238000010248 power generation Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 230000002860 competitive effect Effects 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000013083 solar photovoltaic technology Methods 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of double-station cell piece laser process equipment and its control methods, and it further includes handling equipment that wherein double-station cell piece laser process equipment, which includes the laser beam emitting device of laser processing platform (1) and suspension above it,；The laser processing platform is divided into A station (1) and B station (2), and handling equipment replaces wafer machined on A station and B station with unprocessed wafer, and the laser beam emitting device processes the wafer being located on A station and B station in turn；Using the present invention, laser processing area is allow to accommodate two wafers simultaneously, laser processing when, reduce laser processing wait time, the utilization rate of improving laser, increase laser equipment production capacity to 8000-8500 piece per hour.
Description
Technical field
The present invention relates to the process equipments of the cell piece of PERC/SE technology in photovoltaic industry, more particularly to one kind
With double-station, continuous cell piece laser process equipment and its control method are laser machined.
Background technique
Since oil crisis is broken out in whole world the 1970s, solar photovoltaic technology draws in western developed country
Great attention is played, national governments are from the angle of environmental protection and energy sustainable development strategy, numerous and confused policies drum
It encourages and supports solar photovoltaic technology, photovoltaic industry to rapidly develop in the whole world, remove solar cells made of crystalline silicon, amorphous silicon
Outside solar battery, various compound semiconductor solar batteries, and the layer being made of two kinds of solar batteries are had also appeared
The novel solar batteries such as product type solar battery.Solar energy becomes substitution tradition because it is with spatter property and reproducibility
One of preferred plan of the energy.With research and technological development for many years, solar photovoltaic assembly price has declined to a great extent, and
Solar conversion efficiency be also improved make it possible solar energy power generating commercial development and application.
Currently, photovoltaic industry by spelling scale, spells speed, spelling price from extensive style to the new stage of fining development
To the new stage for spelling quality, spelling technology, spelling benefit transformation, relied on from subsidy to the new stage for gradually realizing that par changes.It is closed
Luminous energy president and CEO Gao Jifan are also indicated that, 10 years following, and the photovoltaic industry in China should pursue high quality development,
With less resource input, higher value is created.
There is some evidence that with the propulsion that " high quality " develops, photovoltaic industry prospect is considerable.Although photovoltaic industry after
Setback, but its scale, in sustainable growth, application range is all using in continuous enlargement, the substantially any area in the whole world, this says
Bright speciality possessed by Mingguang City's volt itself, makes it that can continue to develop and grow in setback each time.High-efficiency solar
Battery laser process equipment market situation:
Photovoltaic power generation cheap internet access trend is obvious, and electricity price constantly declines, and will further speed up photovoltaic power generation industry growth rate, light
Volt electricity power enterprise faces the market opportunity；It surfs the Net at a competitive price at the same time and photovoltaic power generation electricity charge tender price is brought to continue to decline, industry
Competitive pressure increases.Photovoltaic power generation enterprise need to further be dropped by modes such as the more efficient battery components of application in this context
Low cost of electricity-generating；Photovoltaic cell manufacturing enterprise then pointedly releases the efficient solar battery products such as PERC battery, passes through
It creates and reconstructs the modes such as original producing line and expand high performance solar batteries production capacity rapidly.Concrete condition is as follows:
1, high performance solar batteries technology can be obviously improved cell power generation efficiency
High performance solar batteries technical matters mainly includes PERC, SE, MWT etc. at present, and above-mentioned three kinds of technique can be same
It is overlapped in producing line, efficiency enhancement effect is as shown in the table:
2, high performance solar batteries technology can bring notable benefits for photovoltaic plant
By taking PERC technique as an example, under the conditions of existing market, photovoltaic plant application PERC battery component will be relatively with tradition
Photovoltaic cell component generates larger income, can degree of making electricity cost decrease by the level of 0.01-0.02 member.In March, 2018
The middle target leader photovoltaic power generation project of newest announcement, acceptance of the bid enterprise all use PERC technology, and rate for incorporation into the power network is
0.41-0.45 member/degree, median are 0.43 yuan/degree, embody the advantage of PERC technology.
3, high performance solar batteries technology can bring notable benefits for battery manufacturer
By taking PERC technique as an example, under existing market environment, transforming conventional batteries producing line as PERC battery producing line income can
It sees, i.e. recoverable equipment investment, demand of the photovoltaic cell manufacturer to PERC battery laser process equipment are thus quick in 1 year
Increase.Furthermore be conducive to photovoltaic cell manufacturing enterprise using advanced technologies such as PERC and promote properties of product, increase selected " neck
The chance of runner's plan " is conducive to the brand value for promoting photovoltaic cell manufacturing enterprise.
4, high performance solar batteries technical market scale calculation
To 2020, photovoltaic cell production capacity is up to 138 gigawatts, and PERC battery production capacity is expected to be 73 gigawatts or so, and accounting is about
53%.Consider that the newly-increased corresponding laser equipment of PERC production capacity includes the equipment such as PERC, breaking machine, according to PERC battery to 2020
73 gigawatt of production capacity calculate, the associated laser process equipment total market size will be more than 1,900,000,000 yuan.Other high performance solar batteries processing
Technique is also in cultivation and development, and including MWT, SE etc., MWT, SE technique can be superimposed with PERC technique, it is contemplated that 2020,
MWT, SE and other laser process equipment total market sizes will be more than 1,800,000,000 yuan.
5, market competition structure
In high performance solar batteries laser process equipment industry, it is capable of providing competitive high performance solar batteries at present and swashs
Light process equipment only has several enterprises, including German Luo Fen, Germany InnoLas Solutions, Wuhan Supreme Being you, Changzhou
Laser laser, Suzhou step be, big nation, friend Chao Nengyuan etc., formd the competing of the Ji Jia manufacturer with Wuhan Supreme Being based on you at present
Strive pattern.
Equipment is the soul of semiconductor technology, and why China's photovoltaic industry can obtain extremely fast development, with equipment
Technological progress is inseparable with production domesticization.2018, PERC cell piece production capacity in China was further promoted, apparatus for production line
It is gradually substituted by home equipment, production technology is more mature.
After PERC technology produces maturing, high selective emission electrode (SE) technology of cost performance will also become light
Lie prostrate the first choice of enterprise, it is contemplated that stabilized growth to 2020, is occupied 50% or more PERC Battery Market share by SE.
With the continuous fast development of photovoltaic industry, need that the manufacturer of major solar battery sheet production promotes production capacity
It asks and is also continuously improved.The production capacity of PERC laser equipment in 2016 be 4500 per hour, the end of the year 2017 were promoted to 5500 per small
When, it was promoted by 2018 to 6000 per hour, at the beginning of 2019, you provide production capacity 6500 per hour to Wuhan Supreme Being, and the later period changes
7500 off-line device types hourly can be promoted to by making upgrading.From the point of view of the trend of industry, matched with PERC laser equipment
The production capacity of screen printing apparatus be also continuously improved, the manufacturer of major solar battery sheet production is for laser equipment production capacity
The demand of promotion is also increasing.Currently, the production capacity of screen printing apparatus double track has reached 8000 per hour, and and silk screen
The matched laser on-line/off-line equipment of printing equipment is not matched completely also, and the promotion of integral device production capacity is restrict.
In the generating process of solar battery sheet, a procedure is put into wafer in PERC laser equipment, uses laser
Wafer is processed.Existing processing method is to move into wafer in PERC laser equipment to process piecewise, after to be processed
The wafer of machined mistake is replaced with untreated wafer.Such processing method, laser equipment will stop in wafer replacement process
It only works, causes whole equipment capacity not high.
Therefore, how the production capacity of improving laser equipment is industry technical problem urgently to be resolved.
Summary of the invention
In order to solve drawbacks described above existing in the prior art, the present invention proposes that one kind is efficient, with double-station,
Laser machine continuous cell piece laser process equipment and the control method of the equipment.
The technical solution adopted by the present invention is that designing a kind of double-station cell piece laser process equipment, including laser processing platform
It further include handling equipment with the laser beam emitting device of suspension above it；The laser processing platform is divided into A station and B station,
Handling equipment replaces wafer machined on A station and B station with unprocessed wafer, and the laser beam emitting device adds in turn
Station is in the wafer on A station and B station.
The handling equipment includes A runner and B runner；The A runner is put machined wafer away by A station, simultaneously
Unprocessed wafer is conveyed to A station；Machined wafer is put away from B station and is not added to the conveying of B station by the B runner
The wafer of work.
The laser beam emitting device includes: from top to bottom stacked laser emitter, scanning galvanometer module, field lens, and
Positioning camera module；There are two the positioning camera module is total, it is separately mounted to below A station and B station.
The laser processing platform uses transparent material.
The field lens uses large format field lens.
The A runner and B runner use identical structure, all include the feeding side transmission belt being successively connected, machining position transmission
Band and blanking side transmission belt, the wafer can be placed in above three sections of transmission belts and be transmitted；Machining position transmission belt is mounted on lifting
On device；Machining position transmission belt can rise to and feeding side transmission belt and the holding of blanking side transmission belt under the driving of lifting device
Concordantly or decline is submerged in laser processing platform.
The A station and B station of the laser processing platform use identical structure, all include the evacuation of evacuation machining position transmission belt
Slot is also distributed multiple vacuum sucking holes on station, and when machining position transmission belt is sunk in the escape groove, the wafer is laid in
On station, the wafer can be sucked in the vacuum sucking holes.
The invention also discloses a kind of control methods of double-station cell piece laser process equipment: preparation has A station and B
The laser processing platform of station, handling equipment replaces wafer machined on A station and B station with unprocessed wafer, described
Laser beam emitting device processes the wafer being located on A station and B station in turn.
The handling equipment includes A runner and B runner, and the A runner is put machined wafer away by A station, simultaneously
Unprocessed wafer is conveyed to A station；Machined wafer is put away from B station and is not added to the conveying of B station by the B runner
The wafer of work.
The control method of the double-station cell piece laser process equipment comprising the following specific steps
Feeding side transmission belt, machining position transmission belt and the rotation of blanking side transmission belt in the first step, A runner, with unprocessed crystalline substance
Machined wafer on circle replacement A station, then three transmission belts all stop operating, and lifting device drives machining position transmission belt
Unprocessed wafer is shelved on A station by sinking, and wafer, the positioning camera module photograph below A station is sucked in vacuum sucking holes
Wafer position;Laser beam emitting device processes the wafer on B station according to wafer position simultaneously；
Feeding side transmission belt, machining position transmission belt and the rotation of blanking side transmission belt in second step, B runner, with unprocessed crystalline substance
Machined wafer on circle replacement B station, then three transmission belts all stop operating, and lifting device drives machining position transmission belt
Unprocessed wafer is shelved on B station by sinking, and wafer, the positioning camera module photograph below B station is sucked in vacuum sucking holes
Wafer position；Laser beam emitting device processes the wafer on A station according to wafer position simultaneously.
The beneficial effect of the technical scheme provided by the present invention is that:
This patent is not changing the existing laser of original equipment, reflecting mirror, on the basis of the basic devices such as scanning galvanometer,
The field lens (f-theta field lens) that large format is replaced in light path design originally, the scanning range of single wafer before from
180mmx180mm or so is extended to 400mmx400mm or so, and laser processing area is allow to accommodate two wafers simultaneously, is swashing
When light is processed, the time that laser processing waits is reduced, the utilization rate of improving laser increases laser equipment production capacity to 8000-8500
Piece is per hour.
Detailed description of the invention
Below with reference to embodiment and attached drawing, the present invention is described in detail, in which:
Fig. 1 is present pre-ferred embodiments schematic diagram；
Fig. 2 is present pre-ferred embodiments runner top view；
Fig. 3 is present pre-ferred embodiments control flow chart.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is described in further detail.It should be appreciated that specific embodiment described herein is used only for explaining the present invention, not
For limiting the present invention.
The invention discloses a kind of double-station cell piece laser process equipments, referring to Fig. 1 comprising laser machine platform and hang
Laser beam emitting device above it is set, further includes handling equipment；The laser processing platform is divided into A station 1 and B station 2, on
Blanking device replaces wafer machined on A station and B station with unprocessed wafer, and the laser beam emitting device is processed in turn
Wafer on A station and B station.Hold that laser processing area (icon 10 is signified in Fig. 1) can simultaneously using the present invention
Two wafers of receiving reduce the time that laser processing waits in laser processing, and the utilization rate of improving laser increases laser equipment
Production capacity to 8000-8500 piece per hour.
As shown in fig. 1, the optical system in this patent is consistent with structure used in current market common apparatus, substantially
Structure is the laser using 532nm by scanning galvanometer and field lens, and laser facula convergence on laser processing table top is poly- after outgoing
Coke realizes the processing of laser technology.Optical system in this patent before scanning galvanometer and scanning galvanometer is constant, optical system
Scan the small field mirror of breadth in system and be changed to the bigger field mirror of scanning breadth so that the working range of laser scanning from
180mmx180mm or so becomes 400mmx400mm or so before, expands laser processing area (10) from the range of wafer
Two panels crystal silicon wafer can be extremely accommodated simultaneously.
In the preferred embodiment, the handling equipment includes A runner and B runner；The A runner is by machined wafer
It is put away from A station and conveys unprocessed wafer to A station；The B runner by machined wafer put away from B station and to
B station conveys unprocessed wafer.
In the preferred embodiment, the laser beam emitting device includes: from top to bottom stacked laser emitter 3, scanning vibration
Mirror module 4, field lens 5 and positioning camera module 6.Referring to Fig. 1, the positioning camera module is separately mounted to A there are two being total to
Below station and B station.
In some embodiments, the size of wafer will be greater than the size of A station (and B station), so positioning camera module
Although being mounted on the lower section of station, wafer can be also shot, to the position of control system feedback wafer.In the preferred embodiment, it is
Preferably the position of reflection wafer, the laser processing platform use transparent material.
In the preferred embodiment, the field lens uses large format field lens.
Referring to Fig. 2 shows preferred embodiment runner top view, the A runner and B runner use identical structure, all include
Feeding side transmission belt 21, machining position transmission belt 22 and the blanking side transmission belt 23 being successively connected, the wafer can be placed in three sections of biographies
It is transmitted above defeated band；Machining position transmission belt is mounted on lifting device；Machining position transmission belt is under the driving of lifting device
Or decline concordant with feeding side transmission belt and the holding of blanking side transmission belt can be risen to submerge in laser processing platform.
The A station 1 and B station 2 of the laser processing platform use identical structure, all include keeping away for evacuation machining position transmission belt
It allows slot, is also distributed multiple vacuum sucking holes on station, when machining position transmission belt is sunk in the escape groove, the wafer lies on the table
On station, the wafer can be sucked in the vacuum sucking holes.
It may be noted that in the preferred embodiment, feeding side transmission belt 21, machining position transmission belt 22 and blanking side transmission belt 23,
This three sections of transmission belts are made of two parallel belts 20, and wafer is placed on belt 20 and is transmitted.It is kept away described in corresponding
Allow slot that parallel two are also made, to avoid the belt 20.
The invention also discloses a kind of control methods of double-station cell piece laser process equipment: preparation has A station and B
The laser processing platform of station, handling equipment replaces wafer machined on A station and B station with unprocessed wafer, described
Laser beam emitting device processes the wafer being located on A station and B station in turn.
In the preferred embodiment, the handling equipment includes A runner and B runner, and the A runner is by machined wafer
It is put away from A station and conveys unprocessed wafer to A station；The B runner by machined wafer put away from B station and to
B station conveys unprocessed wafer.
The flow chart of the preferred embodiment control shown referring to Fig. 3, the control of the double-station cell piece laser process equipment
Method processed comprising the following specific steps
Feeding side transmission belt, machining position transmission belt and the rotation of blanking side transmission belt in the first step, A runner, with unprocessed crystalline substance
Machined wafer on circle replacement A station, then three transmission belts all stop operating, and lifting device drives machining position transmission belt
Unprocessed wafer is shelved on A station by sinking, and wafer, the positioning camera module photograph below A station is sucked in vacuum sucking holes
Wafer position;Laser beam emitting device processes the wafer on B station according to wafer position simultaneously；
Feeding side transmission belt, machining position transmission belt and the rotation of blanking side transmission belt in second step, B runner, with unprocessed crystalline substance
Machined wafer on circle replacement B station, then three transmission belts all stop operating, and lifting device drives machining position transmission belt
Unprocessed wafer is shelved on B station by sinking, and wafer, the positioning camera module photograph below B station is sucked in vacuum sucking holes
Wafer position；Laser beam emitting device processes the wafer on A station according to wafer position simultaneously.
By above procedure description it is found that the present invention is using double-station dual channel cell piece laser process equipment, control
Two step alternate cycles in process, it is not synchronous driving that dual channel, which transmits crystal silicon wafer to laser processing table top,.Dual channel
Alternately wafer is sent on the double-station of laser processing table top.When transmitting wafer, another runner then stops one runner
Come etc. to be laser machined.Laser is under the adjustment of scanning galvanometer, the alternate wafer processed on double-station.This laser processing is set
Standby, the time for laser machining wafer is about 0.85 second, and wafer will also reach from table top, the time of fixed and camera positioning is sent to
0.85 second or so, therefore, laser processing was carrying out always, reduces the waiting time of laser processing, greatly increases laser
Utilization rate, the process time of single-wafer also obtained reducing significantly.
Above embodiments are by way of example only, non-to provide constraints.It is any without departing from the application spirit and scope, and to it
The equivalent modifications or change of progress, shall be included in the scope of claims of this application.
Claims (10)
1. a kind of double-station cell piece laser process equipment, the Laser emission dress including laser processing platform and suspension above it
It sets, which is characterized in that further include handling equipment；The laser processing platform is divided into A station (1) and B station (2), loading and unloading dress
It sets and replaces wafer machined on A station and B station with unprocessed wafer, the laser beam emitting device is processed in turn is located at A
Wafer on station and B station.
2. double-station cell piece laser process equipment as described in claim 1, which is characterized in that the handling equipment includes
A runner and B runner；Machined wafer is put away from A station and conveys unprocessed wafer to A station by the A runner；Institute
B runner is stated to put machined wafer away from B station and convey unprocessed wafer to B station.
3. double-station cell piece laser process equipment as described in claim 1, which is characterized in that the laser beam emitting device packet
It includes: from top to bottom stacked laser emitter (3), scanning galvanometer module (4), field lens (5) and positioning camera module (6)；Institute
State positioning camera module altogether there are two, be separately mounted to below A station and B station.
4. double-station cell piece laser process equipment as claimed in claim 3, which is characterized in that the laser processing platform uses
Transparent material.
5. double-station cell piece laser process equipment as claimed in claim 3, which is characterized in that the field lens uses large format
Field lens.
6. double-station cell piece laser process equipment as claimed in claim 2, which is characterized in that the A runner and B runner are adopted
It all include feeding side transmission belt (21), machining position transmission belt (22) and the blanking side transmission belt being successively connected with identical structure
(23), the wafer can be placed in above three sections of transmission belts and be transmitted；Machining position transmission belt is mounted on lifting device；Machining position
Transmission belt can rise to or decline concordant with feeding side transmission belt and the holding of blanking side transmission belt under the driving of lifting device not to be had
Enter to laser machine in platform.
7. double-station cell piece laser process equipment as claimed in claim 6, which is characterized in that the A of the laser processing platform
Station (1) and B station (2) use identical structure, all include the escape groove of evacuation machining position transmission belt, are also distributed on station multiple
Vacuum sucking holes, when machining position transmission belt is sunk in the escape groove, the wafer is laid on station, the vacuum sucking holes
The wafer can be sucked.
8. a kind of control method of double-station cell piece laser process equipment, which is characterized in that preparation has A station and B station
Laser processing platform, handling equipment wafer machined on unprocessed wafer replacement A station and B station is described
Laser beam emitting device processes the wafer being located on A station and B station in turn.
9. the control method of double-station cell piece laser process equipment as claimed in claim 8, which is characterized in that above and below described
Material device includes A runner and B runner, and machined wafer is put away from A station and conveyed to A station undressed by the A runner
Wafer；Machined wafer is put away from B station and conveys unprocessed wafer to B station by the B runner.
10. the control method of double-station cell piece laser process equipment as claimed in claim 9, which is characterized in that including with
Lower specific steps:
Feeding side transmission belt, machining position transmission belt and the rotation of blanking side transmission belt in the first step, A runner, with unprocessed crystalline substance
Machined wafer on circle replacement A station, then three transmission belts all stop operating, and lifting device drives machining position transmission belt
Unprocessed wafer is shelved on A station by sinking, and wafer, the positioning camera module photograph below A station is sucked in vacuum sucking holes
Wafer position;Laser beam emitting device processes the wafer on B station according to wafer position simultaneously；
Feeding side transmission belt, machining position transmission belt and the rotation of blanking side transmission belt in second step, B runner, with unprocessed crystalline substance
Machined wafer on circle replacement B station, then three transmission belts all stop operating, and lifting device drives machining position transmission belt
Unprocessed wafer is shelved on B station by sinking, and wafer, the positioning camera module photograph below B station is sucked in vacuum sucking holes
Wafer position;Laser beam emitting device processes the wafer on A station according to wafer position simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910350821.0A CN109986196A (en) | 2019-04-28 | 2019-04-28 | Double-station cell piece laser process equipment and its control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910350821.0A CN109986196A (en) | 2019-04-28 | 2019-04-28 | Double-station cell piece laser process equipment and its control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109986196A true CN109986196A (en) | 2019-07-09 |
Family
ID=67135451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910350821.0A Pending CN109986196A (en) | 2019-04-28 | 2019-04-28 | Double-station cell piece laser process equipment and its control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109986196A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112935543A (en) * | 2021-02-03 | 2021-06-11 | 歌尔股份有限公司 | Double-material-channel elastic sheet welding equipment |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040129685A1 (en) * | 2002-12-26 | 2004-07-08 | Hitachi Via Mechanics, Ltd. | Multibeam laser drilling apparatus |
| JP2008012537A (en) * | 2006-06-30 | 2008-01-24 | Shibuya Kogyo Co Ltd | Cutting apparatus |
| KR20120046957A (en) * | 2010-11-03 | 2012-05-11 | (주)큐엠씨 | Laser processing device and laser processing method using the same |
| CN103071925A (en) * | 2012-12-28 | 2013-05-01 | 苏州德龙激光股份有限公司 | Device and method for etching conducting layer made from graphene on touch screen |
| CN103801823A (en) * | 2014-02-14 | 2014-05-21 | 中国电子科技集团公司第四十五研究所 | Wafer alignment positioning device and method |
| CN106624352A (en) * | 2016-11-30 | 2017-05-10 | 大族激光科技产业集团股份有限公司 | Marking equipment for marking metal surface with black by laser and marking method of marking equipment |
| CN106695486A (en) * | 2016-12-22 | 2017-05-24 | 沈祥明 | Metal plate trimmer |
| CN206305651U (en) * | 2016-12-30 | 2017-07-07 | 浙江奥龙电源有限公司 | A kind of battery wall-through welder of single-station |
| CN206643499U (en) * | 2017-04-20 | 2017-11-17 | 武汉铱科赛科技有限公司 | A kind of controllable laser-processing system of focal position of laser dynamic |
| CN107900529A (en) * | 2017-12-29 | 2018-04-13 | 科大天工智能装备技术（天津）有限公司 | It is a kind of new easy to fixed liquid crystal display laser repairing machine |
| CN108161543A (en) * | 2017-12-25 | 2018-06-15 | 苏州宁林光电科技有限公司 | A kind of automatic loading and unloading device for plate processing |
| CN108406096A (en) * | 2018-03-22 | 2018-08-17 | 大族激光科技产业集团股份有限公司 | laser calibration method, processing method and device |
| CN207787984U (en) * | 2017-12-29 | 2018-08-31 | 科大天工智能装备技术（天津）有限公司 | One kind being convenient for fixed liquid crystal display laser repairing machine |
| CN207824189U (en) * | 2017-12-27 | 2018-09-07 | 大族激光科技产业集团股份有限公司 | A kind of multistation laser welding work station |
| CN108941900A (en) * | 2018-09-30 | 2018-12-07 | 武汉帝尔激光科技股份有限公司 | Laser splitting device and double-station laser process equipment and method |
| CN209919090U (en) * | 2019-04-28 | 2020-01-10 | 常州捷佳创智能装备有限公司 | Double-station cell laser processing equipment |
-
2019
- 2019-04-28 CN CN201910350821.0A patent/CN109986196A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040129685A1 (en) * | 2002-12-26 | 2004-07-08 | Hitachi Via Mechanics, Ltd. | Multibeam laser drilling apparatus |
| JP2008012537A (en) * | 2006-06-30 | 2008-01-24 | Shibuya Kogyo Co Ltd | Cutting apparatus |
| KR20120046957A (en) * | 2010-11-03 | 2012-05-11 | (주)큐엠씨 | Laser processing device and laser processing method using the same |
| CN103071925A (en) * | 2012-12-28 | 2013-05-01 | 苏州德龙激光股份有限公司 | Device and method for etching conducting layer made from graphene on touch screen |
| CN103801823A (en) * | 2014-02-14 | 2014-05-21 | 中国电子科技集团公司第四十五研究所 | Wafer alignment positioning device and method |
| CN106624352A (en) * | 2016-11-30 | 2017-05-10 | 大族激光科技产业集团股份有限公司 | Marking equipment for marking metal surface with black by laser and marking method of marking equipment |
| CN106695486A (en) * | 2016-12-22 | 2017-05-24 | 沈祥明 | Metal plate trimmer |
| CN206305651U (en) * | 2016-12-30 | 2017-07-07 | 浙江奥龙电源有限公司 | A kind of battery wall-through welder of single-station |
| CN206643499U (en) * | 2017-04-20 | 2017-11-17 | 武汉铱科赛科技有限公司 | A kind of controllable laser-processing system of focal position of laser dynamic |
| CN108161543A (en) * | 2017-12-25 | 2018-06-15 | 苏州宁林光电科技有限公司 | A kind of automatic loading and unloading device for plate processing |
| CN207824189U (en) * | 2017-12-27 | 2018-09-07 | 大族激光科技产业集团股份有限公司 | A kind of multistation laser welding work station |
| CN107900529A (en) * | 2017-12-29 | 2018-04-13 | 科大天工智能装备技术（天津）有限公司 | It is a kind of new easy to fixed liquid crystal display laser repairing machine |
| CN207787984U (en) * | 2017-12-29 | 2018-08-31 | 科大天工智能装备技术（天津）有限公司 | One kind being convenient for fixed liquid crystal display laser repairing machine |
| CN108406096A (en) * | 2018-03-22 | 2018-08-17 | 大族激光科技产业集团股份有限公司 | laser calibration method, processing method and device |
| CN108941900A (en) * | 2018-09-30 | 2018-12-07 | 武汉帝尔激光科技股份有限公司 | Laser splitting device and double-station laser process equipment and method |
| CN209919090U (en) * | 2019-04-28 | 2020-01-10 | 常州捷佳创智能装备有限公司 | Double-station cell laser processing equipment |
Non-Patent Citations (3)
| Title |
|---|
| 杜秋等: "单激光器剥线平台设计和工艺参数研究", 应用激光, vol. 1, no. 05, pages 578 - 582 * |
| 杨永强等: "激光扫描焊接的研究现状与应用前景", 机电工程技术, no. 09, 30 September 2010 (2010-09-30), pages 103 - 113 * |
| 陈毕双等: "激光打标知识与技能训练", vol. 1, 31 August 2018, 华中科技大学出版社, pages: 22 - 23 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112935543A (en) * | 2021-02-03 | 2021-06-11 | 歌尔股份有限公司 | Double-material-channel elastic sheet welding equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114551636B (en) | Efficient heterojunction solar cell and preparation method thereof | |
| CN104409405A (en) | Cell conveying mechanism for preparing HIT (Heterojunction with Intrinsic Thinlayer) solar battery with flat plate-type PECVD (Plasma Enhanced Chemical Vapor Deposition) and method thereof | |
| KR20110059724A (en) | Laser material removal methods and apparatus | |
| CN102201493A (en) | High-speed precision crystal silicon laser etching apparatus and method | |
| CN101937948B (en) | Mask plate for preparing receiver of light-gathering film battery | |
| CN112952009A (en) | Perovskite battery component and preparation method and application thereof | |
| CN101567303B (en) | Laser film engraving equipment and scribing method | |
| CN109986196A (en) | Double-station cell piece laser process equipment and its control method | |
| CN105449037A (en) | Preparation method of flexible thin-film solar cell module | |
| CN108724488A (en) | Automatic high speed sliver apparatus | |
| CN210615496U (en) | Triaxial scanning galvanometer laser device and battery piece processing equipment | |
| CN209834917U (en) | Liftable belt formula buffer memory mechanism | |
| CN209919090U (en) | Double-station cell laser processing equipment | |
| CN110052702A (en) | Double light path laser device, cell processing device and its control method | |
| CN110643978A (en) | Amorphous silicon coating equipment for manufacturing HIT battery | |
| CN103706954A (en) | Low-loss laser cutting saw | |
| CN110202256A (en) | Three axis scanning galvanometer laser aids, cell processing device and its control method | |
| CN112103373B (en) | Edge processing system and method for solar cell | |
| CN102623551A (en) | Manufacturing process for reducing corrosion thickness of solar silicon wafer | |
| Bennett et al. | World record module efficiency for large and thin mc-Si MWT cells | |
| CN211759265U (en) | Laser cutting equipment applied to brittle material | |
| CN111129216B (en) | Equipment for preparing double-sided passivation film of PERC battery and using method thereof | |
| CN211256085U (en) | Amorphous silicon coating equipment for manufacturing HIT battery | |
| CN205057300U (en) | Laser engraving machine | |
| CN103474515A (en) | Manufacturing method of P-type double-sided solar cell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |