CN103706954A - Low-loss laser cutting saw - Google Patents
Low-loss laser cutting saw Download PDFInfo
- Publication number
- CN103706954A CN103706954A CN201410012279.5A CN201410012279A CN103706954A CN 103706954 A CN103706954 A CN 103706954A CN 201410012279 A CN201410012279 A CN 201410012279A CN 103706954 A CN103706954 A CN 103706954A
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- laser
- cutting
- low
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a low-loss laser cutting saw to solve the technical problems that in the prior art, a silicon ingot cutting method is high in loss rate, the diameters of cut wafers are limited, and production efficiency is low, and belongs to the technical field of semiconductor devices. The low-loss laser cutting saw comprises a laser device set, a coupling device, optical fiber sets, a foil belt, a guide rail, a support and a driving control device, wherein the laser device set transmits multiple laser beams, the laser beams are converged to input ends of the optical fiber sets through the coupling device, the optical fiber sets are flush with one another side by side and fixed to the foil belt, the two ends of the foil belt can be straightened and fixed to the two ends of the support, lasers are transmitted to output ends of the optical fiber sets through the input ends of the optical fiber sets, and laser cutting is achieved under the control of the driving control device. By means of the low-loss laser cutting saw, the loss rate can be remarkably reduced, the cutting diameters are not limited, the low-loss laser cutting saw is particularly suitable for machining solar photovoltaic silicon ingots, and production cost of solar cells is reduced.
Description
Technical field
The present invention relates to a kind of low cutting and damage laser cutting saw, belong to technical field of semiconductor device.
Background technology
Efficiency is high, quality is light owing to having for solar cell, is convenient to the advantages such as large-scale production, becomes one of basic power source of the mankind.World's solar cell sales volume keeps annual 20% speed increment.Because solar cell yield is fast rising trend, therefore to producing the raw-material consumption of solar cell, increase rapidly.In solar cell, silicon solar cell most widely used general.Silicon solar cell is divided into monocrystaline silicon solar cell and multi-crystal silicon film solar battery, but the price of monocrystalline silicon and polysilicon is high, and how in preparation process, it is cost-saving and improve the key of output that the loss that reduces silicon chip becomes solar-photovoltaic technology.
In prior art, silicon ingot cutting method mainly contains three kinds: the first is to adopt inside diameter slicer cutting, and it is cut and damages as 0.3-0.35 millimeter, and crystalline silicon cutting loss is larger; The second is Laser MicroJet cutting, although the method has reduced silicon cutting loss, with basic to being restricted to of diameter wafer, its cutting upper limit is 1000 times of current diameter, that is to say, if cut to damage, be limited in 80 microns, can process diameter wafer and can not surpass 80mm; The third is scroll saw cutting crystal wafer technology, and wafer thickness can reach below 150 microns, and minimum is cut and damaged 122 microns; The production capacity of most typical Switzerland multi-line cutting machine is to process the silicon ingot of 4 groups of 125mm * l25mm * 520mm simultaneously, approximately 3.15 hours used times, can cut into slices 4160, and the current average thickness of slice, thin piece is 325 microns.But its minimum is cut damage and has still been limited the reduction of cutting loss rate.The wafer that the production thickness of take is 100 microns is example, cuts loss rate up to 55%.In addition, also have direct growth from melt to go out silicon ribbon in prior art, to reduce the loss of section, but the speed of growth is relatively slow, affects production efficiency.
Summary of the invention
The object of the invention is to solve in prior art the cutting method of silicon ingot, to cut loss rate high, cutting crystal wafer restricted diameter system, and the technical problem that production efficiency is low, provides a kind of low cutting to damage laser cutting saw.
Low cutting of the present invention damaged laser cutting saw, comprising: laser array, coupling device, optical fiber group, foil, guide rail, support and driving control device; Described laser array transmitting multiple laser bundle; Described coupling device is comprised of a plurality of plus lens, and each plus lens converges to an optic fibre input end by beam of laser bundle; Described optical fiber group is comprised of multifiber, multifiber output side-by-side alignment is fixed in foil, optical fiber by the Laser Transmission of optic fibre input end to fiber-optic output, at least one optical fiber is used for detection optical fiber output apart from the height of cut point, and feeding back to driving control device, at least one optical fiber is as cutting light source; The two ends of described foil can be separately fixed at the two ends of support and can move up and down, and foil is in stretching state; Described is erected on guide rail, and can in guide rail, do straight reciprocating motion; The speed that described drive control device controls support moves reciprocatingly in guide rail and according to the feedback regulation foil of optical fiber the height apart from cut point.
Further, also comprise cleaning device, cleaning device can produce current or inert gas flow, removes cutting residue and chip.
Further, the wavelength of the laser beam of described laser array transmitting is 247-1550nm, is more preferably 355nm.
Further, described optical fiber is silica fibre.
Further, the diameter of described optical fiber is 30-50 micron.
Further, described driving control device comprises stepper motor.
Further, described foil is stainless steel foil, and thickness is 10-50 micron.
Further, described foil is two, and optical fiber group is bonded and fixed between two foils.
Further, describedly for detection optical fiber output, apart from the optical fiber of the height of cut point, mostly be two most.
Beneficial effect of the present invention:
Low cutting of the present invention damaged laser cutting saw and can significantly be reduced and cut loss rate, and to not restriction of cutting diameter, and production efficiency is high, is convenient to large-scale application, is particularly useful for the processing of photovoltaic silicon ingot.Take 2012 as example, global solar polysilicon output is 23.4 ten thousand tons, 15 dollars of price per kilograms, in this case, every minimizing 1% cut damage, just can save fund millions of dollar, dwindle 2300 tons of market has openings.Cast-cutting saw of the present invention is used the laser cutting silicon ingot of ultra-thin joint-cutting, according to the cutting optical fibre diameter using, the loss rate of cutting of preparing the process of Silicon Wafer is significantly reduced, and then reduce the production cost of solar cell from silicon ingot.The damage of cutting of cast-cutting saw is less than 80 μ m, the wafer thickness of finally going on the market of take is calculated as 100 μ m, cutting loss rate is 44%, than prior art, cut and damage 55% obviously reduction, at least can save every year tens million of dollars, dwindle the market has openings of 2800 tons, if use 30 microns of cutting optical fibre outputs, the damage of cutting of cast-cutting saw can be controlled in 50 microns, cuts loss rate and only has 33%; And the diameter of this cast-cutting saw cutting silicon ingot is unrestricted.
Accompanying drawing explanation
Fig. 1 is the low structural representation that damages laser cutting saw of cutting of the present invention;
In figure, 1, laser array, 2, plus lens, 3, optical fiber, 4, foil, 5, guide rail, 6, support, 7, driving control device, 8, cleaning device.
The specific embodiment
In order to make those skilled in the art further understand the present invention, below in conjunction with accompanying drawing, further illustrate the present invention.
As shown in Figure 1, low cutting damaged laser cutting saw, comprising: laser array 1, coupling device 2, optical fiber 3, foil 4, guide rail 5, support 6 and driving control device 7; Laser array 1 can be one or more laser instruments, laser array 1 transmitting multiple laser bundle; Coupling device is comprised of a plurality of plus lens 2, and each plus lens 2 converges to optical fiber 3 inputs by beam of laser bundle; Optical fiber group is comprised of multifiber 3, multifiber 3 output side-by-side alignment are fixed in foil 4, optical fiber 3 by the Laser Transmission of optical fiber 3 inputs to optical fiber 3 outputs, at least one optical fiber 3 is the height apart from cut point for detection optical fiber 3 outputs, and feed back to driving control device 7, this type optical fiber 3 is called detection optical fiber, and at least one optical fiber 3, as cutting light source, is called cutting optical fibre; The two ends that the two ends of foil 4 can be separately fixed at support 6 make foil 4 in stretching state, and foil 4 can move up and down in support 6, regulate foil 4 with respect to the height of cut point; Support 6 is located on guide rail 5, and can in guide rail 5, do straight reciprocating motion; Driving control device 7 control speed that supports 6 move reciprocatingly in guide rail 5 and according to the feedback regulation foil 4 of detection optical fiber the height apart from cut point, and then controlled the cutting of cutting optical fibre.
In present embodiment, the low damage laser cutting saw of cutting also comprises cleaning device 8, in laser cutting process, can produce residue and chip, cleaning device 8 can produce the horizontal inert gas flow that is parallel to joint-cutting and blow away residue and chip, or generation current, clean residue and chip, and purge flow or current can also play cooling effect, take away waste heat, guarantee cutting accuracy.
In present embodiment, if detection optical fiber have one just can detection optical fiber 3 outputs apart from the height of cut point, be generally two, be positioned at the two ends, left and right of optical fiber group, the left and right sides of cutting fibre; For increasing cutting speed, improve cutting effect, in optical fiber group, generally there are many cutting optical fibres, make to cut peak power output multiplication, also can be as required, increase and decrease cutting optical fibre number reaches the object of regulating power.Each root cutting optical fibre connects beam of laser bundle, cutting optical fibre side-by-side alignment is bonded and fixed in foil 4, because foil 4 is in stretching state, just formed and usingd the light saw of cutting optical fibre Laser output as cutting teeth, by straight reciprocating motion above silicon ingot, reach the object of cutting, the laser cutting saw that cutting optical fibre output shoot laser is operating point.
In present embodiment, the laser wavelength range of laser array 1 generally can be at 247-1550nm, because the 355nm laser of 3-5W level is relatively easy to obtain, and polysilicon to the absorptance of 355nm laser to strong two orders of magnitude of the absorption of 1064nm laser, so preferred 355nm laser.For example can adopt all solid state laser of Nd:YAG, using its frequency tripling is that the laser of 355nm output 3W is as laser beam.
In present embodiment, optical fiber 3 adopts into the exposed silica fibre of core diameter 30-50 micron, and optical fiber 3, as transmission medium and the output of laser, cuts polysilicon silicon ingot with near field Laser output.
In the present invention, the thickness of foil 4 is generally 10-50 micron, present embodiment adopts the stainless steel foil of two 10 micron thickness, metal forming bearing tension is in 5-100 newton, if optical fiber 3 diameters are no more than 50 microns, saw body gross thickness and is no more than 80 microns, can control the thickness of cutting damage is 80 microns, if optical fiber 3 diameters are 30 microns, saw body gross thickness is no more than 50 microns, and can control the thickness of cutting damage is 50 microns.
In present embodiment, driving control device 7 comprises stepper motor, can be according to laser output power and actual cutting effect, reciprocating speed to support 6 is adjusted, and the height of surveying according to detection optical fiber, adjust foil 4 apart from the height of cut point, and then drive the cutting optical fibre being fixed in foil 4 to cut required Silicon Wafer.
Claims (10)
1. low cutting damaged laser cutting saw, it is characterized in that, comprising: laser array (1), coupling device, optical fiber group, foil (4), guide rail (5), support (6) and driving control device (7);
Described laser array (1) transmitting multiple laser bundle;
Described coupling device is comprised of a plurality of plus lens (2), and each plus lens (2) converges to an optical fiber (3) input by beam of laser bundle;
Described optical fiber group is comprised of multifiber (3), multifiber (3) output side-by-side alignment is fixed in foil (4), optical fiber (3) by the Laser Transmission of optical fiber (3) input to optical fiber (3) output, at least one optical fiber (3) is the height apart from cut point for detection optical fiber (3) output, and feeding back to driving control device (7), at least one optical fiber (3) is as cutting light source;
The two ends of described foil (4) can be separately fixed at the two ends of support (6) and can move up and down, and foil (4) is in stretching state;
It is upper that described support (6) is located at guide rail (5), and can in guide rail (5), do straight reciprocating motion;
Described driving control device (7) is controlled speed that support (6) moves reciprocatingly in guide rail (5) and the height apart from cut point according to the feedback regulation foil (4) of optical fiber (3).
2. low cutting according to claim 1 damaged laser cutting saw, it is characterized in that, also comprise cleaning device (8), cleaning device (8) can produce current or inert gas flow, removes cutting residue and chip.
3. low cutting according to claim 1 and 2 damaged laser cutting saw, it is characterized in that, the wavelength of the laser beam of described laser array (1) transmitting is 247-1550nm.
4. low cutting according to claim 3 damaged laser cutting saw, it is characterized in that, the wavelength of the laser beam of described laser array (1) transmitting is 355nm.
5. low cutting according to claim 1 and 2 damaged laser cutting saw, it is characterized in that, described optical fiber (3) is silica fibre.
6. low cutting according to claim 1 and 2 damaged laser cutting saw, it is characterized in that, the diameter of described optical fiber (3) is 30-50 micron.
7. low cutting according to claim 1 and 2 damaged laser cutting saw, it is characterized in that, described driving control device (7) comprises stepper motor.
8. low cutting according to claim 1 and 2 damaged laser cutting saw, it is characterized in that, described foil (4) is stainless steel foil, and thickness is 10-50 micron.
9. low cutting according to claim 1 and 2 damaged laser cutting saw, it is characterized in that, described foil (4) is two, and optical fiber group is bonded and fixed between two foils.
10. low cutting according to claim 1 and 2 damaged laser cutting saw, it is characterized in that, describedly for detection optical fiber (3) output, apart from the optical fiber (3) of the height of cut point, mostly is two most.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410012279.5A CN103706954A (en) | 2014-01-10 | 2014-01-10 | Low-loss laser cutting saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410012279.5A CN103706954A (en) | 2014-01-10 | 2014-01-10 | Low-loss laser cutting saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103706954A true CN103706954A (en) | 2014-04-09 |
Family
ID=50400500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410012279.5A Pending CN103706954A (en) | 2014-01-10 | 2014-01-10 | Low-loss laser cutting saw |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103706954A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105234560A (en) * | 2015-09-30 | 2016-01-13 | 厦门市三安光电科技有限公司 | Cutting method for semiconductor chips |
| CN107775199A (en) * | 2017-11-17 | 2018-03-09 | 奥士康科技股份有限公司 | Circuit board cutting machine and circuit board cutting method |
| TWI803019B (en) * | 2021-10-20 | 2023-05-21 | 國立中央大學 | A method of quick slicing of ingot column |
| CN117066977A (en) * | 2023-09-28 | 2023-11-17 | 浙江睿兆芯半导体科技有限公司 | Chip ultrathin grinding and cutting method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070062921A1 (en) * | 2005-09-13 | 2007-03-22 | Lemi Ltd. | Full-body laser scribing method of fragile material |
| CN2936533Y (en) * | 2006-08-15 | 2007-08-22 | 上海大量光电科技有限公司 | Machine tool with laser scan drawing instrument and cutting or carving device |
| JP2009272469A (en) * | 2008-05-08 | 2009-11-19 | Disco Abrasive Syst Ltd | Slicing method of semiconductor ingot |
| JP2011082398A (en) * | 2009-10-08 | 2011-04-21 | Mitsubishi Electric Corp | Laser processing device and method of manufacturing solar cell |
| CN102476403A (en) * | 2010-11-23 | 2012-05-30 | 大连创达技术交易市场有限公司 | Method for precisely cutting single crystal silicon by optical fiber laser |
| JP2013215787A (en) * | 2012-04-10 | 2013-10-24 | Toshiba Corp | Laser processing device, laser processing system, and laser processing method |
-
2014
- 2014-01-10 CN CN201410012279.5A patent/CN103706954A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070062921A1 (en) * | 2005-09-13 | 2007-03-22 | Lemi Ltd. | Full-body laser scribing method of fragile material |
| CN2936533Y (en) * | 2006-08-15 | 2007-08-22 | 上海大量光电科技有限公司 | Machine tool with laser scan drawing instrument and cutting or carving device |
| JP2009272469A (en) * | 2008-05-08 | 2009-11-19 | Disco Abrasive Syst Ltd | Slicing method of semiconductor ingot |
| JP2011082398A (en) * | 2009-10-08 | 2011-04-21 | Mitsubishi Electric Corp | Laser processing device and method of manufacturing solar cell |
| CN102476403A (en) * | 2010-11-23 | 2012-05-30 | 大连创达技术交易市场有限公司 | Method for precisely cutting single crystal silicon by optical fiber laser |
| JP2013215787A (en) * | 2012-04-10 | 2013-10-24 | Toshiba Corp | Laser processing device, laser processing system, and laser processing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105234560A (en) * | 2015-09-30 | 2016-01-13 | 厦门市三安光电科技有限公司 | Cutting method for semiconductor chips |
| CN107775199A (en) * | 2017-11-17 | 2018-03-09 | 奥士康科技股份有限公司 | Circuit board cutting machine and circuit board cutting method |
| TWI803019B (en) * | 2021-10-20 | 2023-05-21 | 國立中央大學 | A method of quick slicing of ingot column |
| CN117066977A (en) * | 2023-09-28 | 2023-11-17 | 浙江睿兆芯半导体科技有限公司 | Chip ultrathin grinding and cutting method |
| CN117066977B (en) * | 2023-09-28 | 2024-02-23 | 浙江睿兆芯半导体科技有限公司 | Chip ultrathin grinding and cutting method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103706954A (en) | Low-loss laser cutting saw | |
| US20220072660A1 (en) | Method for cutting substrate wafer from indium phosphide crystal bar | |
| CN101281936B (en) | Method for cutting pedion fingerlike staggered solar battery sheet | |
| CN201516540U (en) | Novel LED wafer three-beam laser scribing apparatus | |
| CN111347571A (en) | Laser-assisted low-damage cutting machining system and method for optical hard and brittle material | |
| CN103072211B (en) | A kind of wiresaw cutting method | |
| CN203156960U (en) | Novel chip sawing system | |
| CN201997852U (en) | Laser scribing device for crystalline silicon solar cell | |
| CN110732782A (en) | laser equipment for splitting battery piece | |
| CN102248294B (en) | Array type water waveguide laser processing device | |
| CN112846538A (en) | Solar cell low-loss cutting device and method | |
| CN104380436A (en) | Method of cutting an ingot for solar cell fabrication | |
| CN107263750B (en) | Cutting method of solar silicon wafer and three-dimensional solar silicon wafer | |
| CN204148723U (en) | A kind of twin-laser diced system | |
| CN202137662U (en) | Polycrystalline silicon block chamfering device | |
| CN2904397Y (en) | Optical fiber output laser for parallel machine tool | |
| CN213410786U (en) | Processing device for ultrafast laser transparent material | |
| CN112846536A (en) | Laser low-loss cutting device and method for solar cell | |
| CN212286340U (en) | High-speed cutting device for amorphous strip | |
| CN109986196A (en) | Double-station cell piece laser process equipment and its control method | |
| CN101745746A (en) | Laser four-beam slotting device of solar silicon wafer | |
| CN110900016A (en) | Complex micro-nano structure processing method based on laser separation | |
| EP2648872A1 (en) | Device for structuring large format modules | |
| CN211389611U (en) | Cutting backboard for improving cutting efficiency of solar cell silicon wafer | |
| CN214069071U (en) | Compact integrated laser amplification stage |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140409 |