CN102350559B - Laser reballing system - Google Patents
Laser reballing system Download PDFInfo
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- CN102350559B CN102350559B CN 201110240940 CN201110240940A CN102350559B CN 102350559 B CN102350559 B CN 102350559B CN 201110240940 CN201110240940 CN 201110240940 CN 201110240940 A CN201110240940 A CN 201110240940A CN 102350559 B CN102350559 B CN 102350559B
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- reballing
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Abstract
The invention discloses a laser reballing system. The laser reballing system disclosed by the invention comprises a laser generator, a dielectric mirror, an F-theta mirror and a soldering working cavity which are successively arranged in a light path, wherein a Z-direction servo motion mechanism is arranged on a side wall of the soldering working cavity; an XY servo working platform is arranged below the soldering working cavity; a workpiece is arranged on the XY servo working platform; a CCD (charge coupled device) sensor is arranged above the dielectric mirror; a ball storage room, a disturbance mechanism and a ball transmission pipeline are successively arranged at one side of the soldering working cavity from top to bottom; a ball through hole is formed on a side wall at the end of the soldering working cavity; an elastic blocking plate is arranged at the edge of the ball through hole; an elastic sheet is arranged at the lower end in the ball transmission pipeline; and a ball press boss is arranged on the external wall of the soldering working cavity. The laser reballing system disclosed by the invention can be used for producing BGA (ball grid array) components in batches and can carry out single reballing in the repairing process, thereby saving the cost and improving the production efficiency.
Description
Technical field
The invention belongs to electronics process industry and soldering tech field, particularly relate to a kind of laser reballing system.
Background technology
It is mainly to adopt vapour deposition process, electrodeposition process, stencil methods etc. to plant slicker solder eutectic soldered ball that present BGA plants ball.
In vapour deposition process, when metal mask thickness used is very little, its rigidity requirement just can not get satisfying, and the mask size is to cold and hot sensitivity, also easily produce the misalignment phenomenon in preparation process, therefore it is difficult to realize the ball of planting on large size chip surface, and cost is also very high, and the use of this technique is fewer and feweri at present.
Electrodeposition process is the improvement to vapour deposition process, occupies leading position at the preparation flip chip bonding in bump process.This technology utilization photo chemistry technology generating window deposits by plating at normal temperatures.Its maximum advantage is that all salient points can generate simultaneously, has satisfied extensive, the industrial needs of continous way, is not subjected to the restriction of substrate size, and its producing cost is also low than vapour deposition process.It is wayward that electrodeposition process is planted the composition of ball, and technology cycle is long, cost is still higher, its existing technique is mainly used in approved product, plant the ball requirement for various, need to spend plenty of time adjustment equipment when conversion products, this especially is not suitable in small lot or single-piece production and individual groups piece installing rework process.
The technological process that the mould printing salient point is planted the playing skill art needs special template, lacks flexibility, is unsuitable for reprocessing of small batch production and respective solder, only suitable large-scale production in enormous quantities.
Summary of the invention
The object of the invention is to overcome the shortcoming and defect of prior art, a kind of laser reballing system is provided, in the process of carrying out the chip reparation, can carry out the single ball of planting, thereby save cost, improved production efficiency.
The present invention is achieved through the following technical solutions:
A kind of laser reballing system comprises laser generator that light path successively arranges, dielectric mirror, F-θ mirror, welding job chamber.The sidewall in welding job chamber is provided with Z direction servo motion mechanism, be provided with the servo workbench of XY below the welding job chamber, place work piece on the servo workbench of XY, the top of described dielectric mirror is provided with ccd sensor, a side in the welding job chamber is disposed with ball storage chamber, perturbation mechanism from top to bottom, the pipeline of losing, have a logical ball hole on the sidewall of end, described welding job chamber, edge in logical ball hole is provided with elastic block piece, bottom in the pipeline of losing is provided with a shell fragment, is provided with a pressure ball projection on the outer wall in welding job chamber; Described ccd sensor, laser generator, Z direction servo motion mechanism, the servo workbench of XY are connected with computer respectively.
Described laser generator comprises beam expanding lens, partially reflecting mirror, Q-switch, laser pump cavity, the completely reflecting mirror that connects successively.
The below of described ball storage chamber is the funnel type device, and described perturbation mechanism is arranged on the sidewall of funnel type device, and described perturbation mechanism is made of disturbance sheet and manipulation knob, and described disturbance sheet is arranged in the funnel type device.
The present invention utilizes semiconductor laser or optical fiber laser (beam quality factor M
2＜1.5), and in conjunction with the laser transmitting system of Q-switch and beam expanding lens;
XY workbench by computer numerical control (CNC) accurately is controlled at the displacement of horizontal direction, accurately moves among a small circle fast, guarantees that laser focuses on the solder joint place accurately; The welding job chamber moves up and down and the workbench close fit, makes soldered ball arrive accurately solder joint;
The flexible catch in place, logical ball hole, there is the pressure ball projection below, and the pressure ball projection makes the shell fragment compression once by pushing the ball in each downward storke, the ball of shell fragment promotion through overcompression is passed through, and other balls are blocked.
The present invention is simple in structure, and simple operation is easy to utilize.
Description of drawings
Fig. 1 is the structural representation of laser reballing system of the present invention.
Fig. 2 is the partial structurtes enlarged diagram of Fig. 1 welding job chamber, the pipeline of losing.
The partial structurtes enlarged diagram of ball storage chamber, perturbation mechanism, the pipeline of losing in Fig. 3 Fig. 1.
The internal structure schematic diagram of Fig. 4 Fig. 1 laser generator.
Fig. 5 is that laser reballing system is delivered to ball in the process schematic diagram in welding job chamber.
In upper figure: controller 1; Laser generator 2; Ccd sensor 3; Dielectric mirror 4 (narrow-band-filter); Ball storage chamber 5; The pipeline 6 of losing; Welding job chamber 7; Perturbation mechanism 8; Workpiece 9; The servo workbench 10 of XY; F-θ mirror 11; Elastic block piece 12; Shell fragment 13; Pressure ball projection 14; Welding job chamber Z direction servo motion mechanism 15; Annular light source 16; Disturbance sheet 17; Manual control knob 18; Funnel type device 19; Ball storage chamber 20; Beam expanding lens 21; Partially reflecting mirror 22; Q-switch 23; Laser pump cavity 24; Completely reflecting mirror 25.
The specific embodiment
The below is described in further detail the specific embodiment of the present invention, but embodiments of the present invention are not limited to this.
Embodiment
As shown in Figure 1 and Figure 2.laser reballing system of the present invention, comprise the laser generator 2 of light path setting successively, dielectric mirror 4, F-θ mirror 11, welding job chamber 7, the sidewall in welding job chamber 7 is provided with Z direction servo motion mechanism 15, be provided with the servo workbench 10 of XY below welding job chamber 7, place work piece 9 on the servo workbench 10 of XY, the top of described dielectric mirror 4 is provided with ccd sensor 3, a side of 7 is disposed with ball storage chamber 5 from top to bottom in the welding job chamber, perturbation mechanism 8, the pipeline 6 of losing, have a logical ball hole on the sidewall of 7 ends, described welding job chamber, edge in logical ball hole is provided with elastic block piece 12, bottom in the pipeline 6 of losing is provided with a shell fragment 13, be provided with a pressure ball projection 14 on the outer wall in welding job chamber 7, described ccd sensor 3, laser generator 2, Z direction servo motion mechanism 15, the servo workbench 10 of XY is connected with computer 1 respectively.
As shown in Figure 4.Described laser generator 2 comprises beam expanding lens 21, partially reflecting mirror 22, Q-switch 23, laser pump cavity 24, the completely reflecting mirror 25 that connects successively.
As shown in Figure 3.The below of described ball storage chamber 5 is funnel type device 19, and described perturbation mechanism 8 is arranged on the sidewall of funnel type device 19, and described perturbation mechanism 8 is made of disturbance sheet 17 and manipulation knob, and described disturbance sheet 17 is arranged in funnel type device 19.
Controller 1 (computer) is controlled the Z direction servo motion mechanism 15 in laser generator 2, the servo workbench 10 of XY and welding job chamber.Laser generator 2 adopts 200W semiconductor pump YAG laser instrument, perhaps adopts the 50-100W optical fiber laser.The wavelength that optical fiber laser sends is close with YAG laser, but beam quality is better than semiconductor pumped YAG laser.Insert Q-switch 23 in laser generator 2 resonators, and expanded by beam expanding lens 21 in partially reflecting mirror 22 fronts.The servo workbench 10 of XY moves in the horizontal direction, makes the solder joint for the treatment of of the workpiece that is fixed on workbench aim at welding job chamber 7 according to the instruction of controller 1.Move on the Z direction in welding job chamber 7, dielectric mirror 4 can visible light transmissive and reflector laser, and F-θ mirror 11 focuses on parallel laser beam a bit, and focus is on the horizontal plane of workpiece place.When XY servo-worktable 10 is aimed at welding job chamber 7 with the point until soldered ball of workpiece, welding job chamber 7 moves downward to the operating point (minimum point), simultaneously soldered ball enters welding job chamber 7 by the pipeline 6 of losing under the effect of shell fragment 13 elastic force, along working chamber arrival solder joint place, through dielectric mirror 4 reflections, and focused on solder joint by F-θ mirror 11 by laser generator 2 Emission Lasers this moment, melt soldered ball, adhere on workpiece.The annular light source 16 of working chamber lower end throws light on, visible transmission is crossed dielectric mirror 4, arrival ccd sensor 3 places, ccd sensor 3 with signal feedback to controller 1, controller 1 can judge whether solder joint is aimed at laser spot and finely tuned workbench 10 before welding accordingly, can also survey the welding quality of the rear solder joint of welding.In case what certain ball occurs plants the ball poor quality, detection system can be write down this piece wiring board numbering, again plants ball after manual the processing again.
As shown in Figure 2, a logical ball hole is arranged on the 7 chamber walls of welding job chamber, when welding job chamber 7 is positioned at minimum point, logical ball mouth is over against the pipe outlet of losing, flexible catch 12 in the duct has a shell fragment 13 in the pipeline of losing, the end of shell fragment 13 only contacts with a bead, shell fragment 13 is after pushing away away a bead, and a large amount of little club of top depresses shell fragment 13 is pushed back original position.One pressure ball projection 14 is arranged on working chamber 7 outer walls.
As shown in Fig. 5 (1), when welding job chamber 7 moved downward under the control of Z direction servo motion mechanism 15, pressure ball projection 14 can enter in the groove of the pipeline 6 of losing, and extrusion ball makes shell fragment 13 compressions.Along with the continuation in welding job chamber 7 descends, pressure ball projection 14 is left the pipeline 6 of losing, simultaneously the pipeline 6 of losing is aimed in the logical ball hole on the sidewall in welding job chamber 7, shell fragment 13 after compression is given ball one thrust and is made ball form initial velocity, finally making ball pass elastic block piece 12 enters in welding job chamber 7, other balls fall to beginning to compress shell fragment 13 simultaneously, and this process is as shown in Fig. 5 (2).When next ball arrives the exit position of the pipeline 6 of losing, without overcompression, can't make it pass through elastic block piece 12 due to shell fragment 13, this process such as Fig. 5 (3) have therefore avoided a plurality of balls to enter simultaneously in welding job chamber 7.
A large amount of balls is entering when losing pipeline 6, might block, connect a funnel type device 19 below ball storage chamber 5, add a perturbation mechanism 8 that is consisted of by disturbance sheet 17 and manual control knob 18 at funnel type device 19 sidewalls, referring to Fig. 3, the outer rim of disturbance sheet 17 and funnel type device 19 have minimum spacing, less than the diameter of ball, in the time of can blocking at the ball of funnel type device 19 and pipeline 6 junctions of losing, ball is pushed aside.The pipeline 6 of losing is transparent material, and whether the ball that can observe out in the pipeline 6 of losing is sufficient, if when the ball deficiency appears in the pipeline 6 of losing, manually stirs and handles knob 18.
Be below the contrast table of the key property of the present invention and two kinds of main flow BGA soldering tech of prior art:
Just can realize preferably the present invention as mentioned above.
Above-described embodiment is the better embodiment of the present invention; but embodiments of the present invention are not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present invention and principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, within being included in protection scope of the present invention.
Claims (3)
1. laser reballing system, it is characterized in that, comprise the laser generator of light path setting successively, dielectric mirror, F-θ mirror, the welding job chamber, the sidewall in welding job chamber is provided with Z direction servo motion mechanism, the below in welding job chamber is provided with the servo workbench of XY, place work piece on the servo workbench of XY, the top of described dielectric mirror is provided with ccd sensor, a side in the welding job chamber is disposed with ball storage chamber from top to bottom, perturbation mechanism, the pipeline of losing, have a logical ball hole on the sidewall of end, described welding job chamber, edge in logical ball hole is provided with elastic block piece, bottom in the pipeline of losing is provided with a shell fragment, be provided with a pressure ball projection on the outer wall in welding job chamber, described ccd sensor, laser generator, Z direction servo motion mechanism, the servo workbench of XY is connected with computer respectively.
2. laser reballing system according to claim 1, is characterized in that, described laser generator comprises beam expanding lens, partially reflecting mirror, Q-switch, laser pump cavity, the completely reflecting mirror that connects successively.
3. laser reballing system according to claim 2, it is characterized in that, the below of described ball storage chamber is the funnel type device, and described perturbation mechanism is arranged on the sidewall of funnel type device, described perturbation mechanism is made of disturbance sheet and manipulation knob, and described disturbance sheet is arranged in the funnel type device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110240940 CN102350559B (en) | 2011-08-22 | 2011-08-22 | Laser reballing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110240940 CN102350559B (en) | 2011-08-22 | 2011-08-22 | Laser reballing system |
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| Publication Number | Publication Date |
|---|---|
| CN102350559A CN102350559A (en) | 2012-02-15 |
| CN102350559B true CN102350559B (en) | 2013-06-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110240940 Expired - Fee Related CN102350559B (en) | 2011-08-22 | 2011-08-22 | Laser reballing system |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807202B (en) * | 2018-06-11 | 2019-11-12 | 广东海洋大学 | A kind of method of laser production solder bump |
| CN111872511B (en) * | 2020-06-29 | 2022-03-22 | 江苏亚威艾欧斯激光科技有限公司 | Tin ball implanting device and tin ball welding device |
| RU2770605C2 (en) * | 2020-08-18 | 2022-04-19 | Акционерное общество "Калужский научно-исследовательский радиотехнический институт" | Method for automated installation of balls on bga or csp microchips during reballing |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5855323A (en) * | 1996-11-13 | 1999-01-05 | Sandia Corporation | Method and apparatus for jetting, manufacturing and attaching uniform solder balls |
| CN1233029C (en) * | 2003-04-11 | 2005-12-21 | 华中科技大学 | Soldered ball embedding device |
| CN100343966C (en) * | 2005-05-12 | 2007-10-17 | 上海交通大学 | Welding disk vision identifying and positioning system for flexible laser ball implanting machine |
| CN101515556A (en) * | 2008-02-21 | 2009-08-26 | 矽品精密工业股份有限公司 | Solder ball accommodating structure |
| CN101556925A (en) * | 2009-05-19 | 2009-10-14 | 华南理工大学 | Method for producing leadless brazing alloy salient point by laser |
| CN202388126U (en) * | 2011-08-22 | 2012-08-22 | 华南理工大学 | Laser jet bumping system |
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2011
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| CN102350559A (en) | 2012-02-15 |
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Granted publication date: 20130612 Termination date: 20210822 |