CN208289245U - A kind of CO2 laser hole drilling system - Google Patents
A kind of CO2 laser hole drilling system Download PDFInfo
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- CN208289245U CN208289245U CN201820713583.6U CN201820713583U CN208289245U CN 208289245 U CN208289245 U CN 208289245U CN 201820713583 U CN201820713583 U CN 201820713583U CN 208289245 U CN208289245 U CN 208289245U
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- galvanometer
- laser
- field lens
- workpiece
- lens
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Abstract
The utility model discloses a kind of CO2 laser hole drilling systems, the device includes CO2 laser, beam expanding lens, diaphragm, X galvanometer, Y galvanometer, field lens, workpiece and workbench, the light of the CO2 laser transmitting passes sequentially through beam expanding lens, diaphragm, X galvanometer, Y galvanometer, field lens and workpiece, Y galvanometer is located above field lens, workpiece is located at below field lens, and workbench is located at below workpiece.In the utility model, the laser that the device is emitted by CO2 laser, reduces the angle of divergence by beam expanding lens, adjusts light diameter using aperture device, X, Y galvanometer improves the speed of drilling, pcb board face is focused on by plane field lens, highdensity energy removes material moment in pcb board, forms micropore, wherein, the device can realize that 75-150um PCB micro-aperture is processed, and carry out unit processing by laser galvanometer scanning mode, can be obviously improved drilling efficiency.
Description
Technical field
The utility model belongs to laser drilling processes field, in particular to a kind of CO2 laser hole drilling system.
Background technique
As electronic product develops towards portable, miniaturization direction, circuit board miniaturization is proposed higher and higher
Demand.The key of raising circuit board miniaturization is smaller and smaller between more and more narrow line width and different level route
Miniature via hole.It is special that printed wiring board (PCB) gradually shows lamination based on high-density interconnection technology, multifunction
Sign.And traditional machine drilling limit processing diameter is 100um, this obviously has been unable to meet requirement, can instead
A kind of miniature via hole processing method of novel laser.
The realistic situation of 100um or less micro-aperture, exploitation one can not be processed in PCB manufacture in face of numerical controlled machinery drilling
Kind new pattern laser hole-drilling system, using high-speed, high precision as target, by constructing new pattern laser drilling processing system, to overcome, solve
Certainly existing PCB numerical controlled machinery processing technology disadvantage provides a kind of stability and high efficiency, the processing of high-precision micro-aperture for High density of PCB plate
Laser-processing system adapts to the technical need of the small via hole manufacture of PCB.
Disclosing a kind of laser hole drilling system and method, the device in the prior art includes laser, the first reflecting mirror,
Two-mirror, beam shaping system, vibration mirror scanning focusing system, workpieces processing pcb board and processing platform；The workpieces processing
Pcb board is set on processing platform, and vibration mirror scanning focusing system is located above the workpieces processing pcb board；First reflecting mirror, light
Beam orthopedic systems and the second reflecting mirror are from top to bottom coaxially disposed, and are located at the side of vibration mirror scanning focusing system, the second reflection
Mirror and vibration mirror scanning focusing system are arranged along same level axis；The first reflecting mirror is arranged in along same level axis in laser
Side.It is an advantage of the invention that it is inadequate to pcb board drilled edge chip strength to eliminate gauss laser using beam shaping system
The drilling effect of high-precision, high-quality is realized in the influence of residue glue easy to form.
Utility model content
To solve the above problems, the purpose of this utility model is to provide a kind of raising drilling efficiency, 75- can be achieved
The CO2 laser hole drilling system of 150um PCB micro-aperture processing；
Another of the utility model is designed to provide a kind of CO2 laser hole drilling system, and the apparatus structure is simple, processing
It is at low cost, it is easy to be widely popularized.
To achieve the above object, the technical solution of the utility model is as follows.
The utility model provides a kind of CO2 laser hole drilling system, which includes CO2 laser, beam expanding lens, diaphragm, X vibration
The light of mirror, Y galvanometer, field lens, workpiece and workbench, the CO2 laser transmitting passes sequentially through beam expanding lens, diaphragm, X galvanometer, Y
Galvanometer, field lens and workpiece, the Y galvanometer are located above field lens, and the workpiece is located at below field lens, and the workbench is located at workpiece
Lower section.In the utility model, the laser which is emitted by CO2 laser reduces the angle of divergence by beam expanding lens, utilizes
Aperture device adjusts light diameter, and X, Y galvanometer improve the speed of drilling, focuses on pcb board face by plane field lens, highly dense
The energy of degree removes material moment in pcb board, forms micropore, wherein the device can realize 75-150um PCB micro-aperture
Processing, carries out unit processing by laser galvanometer scanning mode, can be obviously improved drilling efficiency.
Further, the CO2 laser, beam expanding lens, diaphragm and X galvanometer are arranged on same straight line.
Further, the Y galvanometer, field lens, workpiece and workbench are located on same vertical axis.Such structure design
It is irradiated on beam expanding lens, diaphragm and X galvanometer conducive to the light beam for emitting CO2 laser, realizes and reduce the angle of divergence, pass through diaphragm
The diameter for adjusting light, so that light be focused on PCB panel by field lens.
Further, which further includes mounting rack, the CO2 laser, beam expanding lens, diaphragm, X galvanometer, Y galvanometer and field
Mirror is mounted on mounting rack by connecting rod.Light beam convenient for the transmitting of CO2 laser is irradiated on PCB panel, to promote brill
Hole efficiency.
Further, the X galvanometer is connect with mounting rack rotary type.Such design adjusts the angle convenient for good,
To realize more efficient, more stable, higher precision micro-aperture processing.
Further, the Y galvanometer is connect with mounting rack rotary type.Such design adjusts the angle convenient for good,
To realize more efficient, more stable, higher precision micro-aperture processing.
The advantage of the utility model is: compared with the prior art, in the utility model, which is swashed by CO2
The laser of light device transmitting, reduces the angle of divergence by beam expanding lens, adjusts light diameter using aperture device, X, Y galvanometer improve
The speed of drilling focuses on pcb board face by plane field lens, and highdensity energy removes material moment in pcb board, is formed micro-
Hole, wherein the device can realize that 75-150um PCB micro-aperture is processed, and carry out unit by laser galvanometer scanning mode and add
Work can be obviously improved drilling efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model CO2 laser hole drilling system.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
To achieve the above object, the technical solution of the utility model is as follows.
Shown in Figure 1, the utility model provides a kind of CO2 laser hole drilling system, which includes CO2 laser 1, expands
Beam mirror 2, diaphragm 3, X galvanometer 4, Y galvanometer 5, field lens 6, workpiece 7 and workbench, the light that CO2 laser 1 emits pass sequentially through expansion
Beam mirror 2, diaphragm 3, X galvanometer 4, Y galvanometer 5, field lens 6 and workpiece 7, Y galvanometer 5 are located at 6 top of field lens, and workpiece 7 is located under field lens 6
Side, workbench (not shown) are located at 7 lower section of workpiece.In the utility model, which is swashed by what CO2 laser emitted
Light, reduces the angle of divergence by beam expanding lens, adjusts light diameter using aperture device, and X, Y galvanometer improve the speed of drilling, lead to
It crosses plane field lens and focuses on pcb board face, highdensity energy removes material moment in pcb board, forms micropore, wherein the dress
Achievable 75-150um PCB micro-aperture processing is set, unit processing is carried out by laser galvanometer scanning mode, can significantly be mentioned
Rise drilling efficiency.
In the present embodiment, CO2 laser 1, beam expanding lens 2, diaphragm 3 and X galvanometer 4 are arranged on same straight line.
In the present embodiment, Y galvanometer 5, field lens 6, workpiece 7 and workbench are located on same vertical axis.Such structure
Design is conducive to for the light beam that CO2 laser emits being irradiated on beam expanding lens, diaphragm and X galvanometer, realizes and reduces the angle of divergence, passes through
Diaphragm adjusts the diameter of light, so that light be focused on PCB panel by field lens.
In the present embodiment, which further includes mounting rack 8, CO2 laser 1, beam expanding lens 2, diaphragm 3, X galvanometer 4, Y vibration
Mirror 5 and field lens 6 are mounted on mounting rack 8 by connecting rod.Light beam convenient for the transmitting of CO2 laser is irradiated on PCB panel, from
And promote drilling efficiency.
In the present embodiment, X galvanometer 4 is connect with 8 rotary type of mounting rack.Good adjusting angle is convenient in such design
Degree, to realize more efficient, more stable, higher precision micro-aperture processing.
In the present embodiment, Y galvanometer 5 is connect with 8 rotary type of mounting rack.Good adjusting angle is convenient in such design
Degree, to realize more efficient, more stable, higher precision micro-aperture processing.
The advantage of the utility model is: compared with the prior art, in the utility model, which is swashed by CO2
The laser of light device transmitting, reduces the angle of divergence by beam expanding lens, adjusts light diameter using aperture device, X, Y galvanometer improve
The speed of drilling focuses on pcb board face by plane field lens, and highdensity energy removes material moment in pcb board, is formed micro-
Hole, wherein the device can realize that 75-150um PCB micro-aperture is processed, and carry out unit by laser galvanometer scanning mode and add
Work can be obviously improved drilling efficiency.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (6)
1. a kind of CO2 laser hole drilling system, which is characterized in that the device includes CO2 laser, beam expanding lens, diaphragm, X galvanometer, Y
Galvanometer, field lens, workpiece and workbench, the light of the CO2 laser transmitting pass sequentially through beam expanding lens, diaphragm, X galvanometer, Y vibration
Mirror, field lens and workpiece, the Y galvanometer are located above field lens, and the workpiece is located at below field lens, and the workbench is located under workpiece
Side.
2. CO2 laser hole drilling system as described in claim 1, which is characterized in that the CO2 laser, beam expanding lens, diaphragm and
X galvanometer is arranged on same straight line.
3. CO2 laser hole drilling system as described in claim 1, which is characterized in that the Y galvanometer, field lens, workpiece and workbench
On same vertical axis.
4. CO2 laser hole drilling system as described in claim 1, which is characterized in that the device further includes mounting rack, the CO2
Laser, beam expanding lens, diaphragm, X galvanometer, Y galvanometer and field lens are mounted on mounting rack by connecting rod.
5. CO2 laser hole drilling system as claimed in claim 4, which is characterized in that the X galvanometer and mounting rack rotary type connect
It connects.
6. CO2 laser hole drilling system as claimed in claim 4, which is characterized in that the Y galvanometer and mounting rack rotary type connect
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820713583.6U CN208289245U (en) | 2018-05-14 | 2018-05-14 | A kind of CO2 laser hole drilling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820713583.6U CN208289245U (en) | 2018-05-14 | 2018-05-14 | A kind of CO2 laser hole drilling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208289245U true CN208289245U (en) | 2018-12-28 |
Family
ID=64727584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820713583.6U Active CN208289245U (en) | 2018-05-14 | 2018-05-14 | A kind of CO2 laser hole drilling system |
Country Status (1)
| Country | Link |
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| CN (1) | CN208289245U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590290A (en) * | 2019-01-14 | 2019-04-09 | 青岛理工大学 | A kind of hole laser cleaner that can be applicable in multiple aperture, pass |
| CN109967866A (en) * | 2019-04-19 | 2019-07-05 | 苏州德龙激光股份有限公司 | Marking on the fly mode Combined process equipment |
-
2018
- 2018-05-14 CN CN201820713583.6U patent/CN208289245U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590290A (en) * | 2019-01-14 | 2019-04-09 | 青岛理工大学 | A kind of hole laser cleaner that can be applicable in multiple aperture, pass |
| CN109967866A (en) * | 2019-04-19 | 2019-07-05 | 苏州德龙激光股份有限公司 | Marking on the fly mode Combined process equipment |
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