CN116713613A - Glass wafer laser micropore processing equipment for three-dimensional integrated packaging - Google Patents

Abstract

The invention provides a glass wafer laser micropore processing device and a processing method for three-dimensional integrated packaging. The device realizes the essential improvement of the three-dimensional integrated packaging glass wafer laser micropore technology through the comprehensive application of the component structure, and the manufactured glass micropore has small aperture, high depth-diameter ratio, good appearance, smooth surface quality and high micropore array manufacturing efficiency.

Description

Glass wafer laser micropore processing equipment for three-dimensional integrated packaging

Technical Field

The invention relates to the technical field of three-dimensional integrated packaging, in particular to a glass wafer laser micropore processing device and a processing method for three-dimensional integrated packaging.

Background

The three-dimensional packaging adapter plate needs to meet high-density glass through holes of specific requirements so as to improve high-frequency signal isolation, improve integration density and finally realize great improvement of performance. Glass Via (TGV) technology therefore places higher demands on achieving smaller via diameters, larger aspect ratios, better topographical features, smoother surface quality and higher hole densities.

Known glass micro-pore techniques include mechanical drilling, sand blasting, electrochemical discharge pore forming, plasma dry etching pore forming, photosensitive glass etching pore forming and the like, and can only make micro-pores of more than 30 mu m, and the processing efficiency is low, and the micro-pore morphology features are also poor. By adopting ultrafast laser single-pulse perforation, multi-pulse tapping, top-down or bottom-up circular cutting or spiral processing, a micro-channel structure is directly prepared by micro-explosion and ablation, micropores with the minimum diameter of about 20 mu m can be processed, but no taper micropores with the diameter of less than 10 mu m can be almost obtained, the technical requirement of obtaining micropores by laser direct ablation is that the laser energy reaches the ablation threshold value of a material, and the surface of a formed glass through hole is still very rough. Therefore, the quality, depth-to-diameter ratio, and other indices of micropores formed in a glass material by laser direct ablation are not ideal.

The glass is modified by adopting a Gaussian beam scanning mode, and then glass micropores are obtained by etching in an HF solution, which is called laser-assisted chemical wet etching. Although micropores with the diameter less than or equal to 10 mu m can be processed by the method, as the etching time of the inlet of the micropores is longer and the etching liquid at the position is easy to exchange, the etching time of the bottom of the micropores is shorter and the etching liquid exchange is difficult, and finally, only conical micropores with larger inlet diameter and smaller bottom diameter can be obtained. On the basis of the method, a conical modification area is formed in the depth direction by adopting a scanning compensation or power compensation mode, so that the appearance of micropores can be improved to a great extent, and micropores with smaller taper are obtained.

The ultra-fast laser precision machining technology based on beam shaping provides a new scheme for the TGV technology upgrade: the Gaussian beam can be modulated into a diffraction-free beam with long focal depth through a beam shaping technology, the axial energy distribution of the diffraction-free beam is controllable, the energy controllable deposition and the accurate control of a modified processing area in glass can be realized by combining a high-speed high-precision coaxial focusing system and a synchronous motion control system, and the efficient processing of high-depth-diameter-ratio micropores with highly controllable apertures and holes can be realized by combining a wet etching process. Compared with other TGV processing technologies, the processing process can not generate any mechanical force effect, the thermal effect is small, the hole type is adjustable, the processing can be performed in the atmosphere, the feasibility of industrial batch preparation of the adapter plate can be completely met, and compared with the traditional technology, the method has obvious technical advancement, and key technologies comprise a laser channel forming technology and a wet chemical etching technology.

Disclosure of Invention

The invention aims at the problems and provides a glass wafer laser micropore processing device and a processing method for three-dimensional integrated packaging, which are used for realizing the improvement of the glass wafer laser micropore technology of the three-dimensional integrated packaging.

The technical scheme of the invention is that the glass wafer laser micropore processing equipment for three-dimensional integrated packaging comprises a frame, a moving assembly, an optical path assembly, an upper blanking assembly and an operating system, wherein the optical path assembly and the upper blanking assembly are respectively connected with the moving assembly, and the electric control and operating system are respectively connected with the optical path assembly and the upper blanking assembly, and the moving assembly, the optical path assembly, the upper blanking assembly and the electric control and operating system are uniformly arranged on the frame;

The electronic control and operation system comprises a main control machine, an ACS motion controller, a ceramic motor driver, a height acquisition card, a laser power supply and a controller, wherein the main control machine is used for overall coordination of the functions of the whole machine, including processing grating coding feedback signals, processing laser displacement signals, planning perforation paths, planning laser automatic focusing, planning focus following and controlling laser synchronous output, and the ACS motion controller is used for driving a servo XY axis assembly, a Z axis assembly and an R axis assembly, executing perforation paths and receiving wafer position feedback signals; the ceramic motor driver drives the ceramic motor to do up-and-down rapid motion for focus following; the height acquisition card is used for acquiring laser displacement signals, and the laser power supply and the controller are used for providing power for the laser, controlling the power and the frequency of the laser and receiving the synchronous signals of the main control computer to realize synchronous output of laser and position;

the movement assembly comprises a marble Dan Zujian, an XY axis assembly, a Z axis assembly and an R axis assembly, wherein the marble assembly is used for fixing the XY axis assembly, the Z axis assembly and the R axis assembly, the XY axis assembly is used for moving a wafer to an upper material position and a lower material position, moving the wafer to a focusing station and a punching station, the Z axis assembly is used for automatically focusing and following a focus of the wafer, and the R axis assembly is provided with a cross sliding table feeding and discharging station and is used for correcting the direction of the wafer through rotation;

The laser device comprises a laser device, a shaping optical path connected with the laser device and a laser head assembly connected with the shaping optical path, wherein the laser device is used for generating high-speed laser pulses and synchronously outputting the high-speed laser pulses with the position of the XY axis assembly, the shaping optical path is used for shaping laser beams, and the laser head assembly is provided with a focusing station and a punching station and is used for laser punching;

the feeding and discharging assembly comprises a wafer carrying mechanism, a clamping mechanism, a correcting mechanism and a lifting mechanism, wherein the clamping mechanism, the correcting mechanism and the lifting mechanism are related to the action of the wafer carrying mechanism, the clamping mechanism is respectively related to the action of the correcting mechanism, the wafer carrying mechanism is used for carrying wafers, the correcting mechanism is provided with a track feeding and discharging station and is used for correcting the positions of the wafers, the lifting mechanism is provided with a bin station, the wafers are automatically fed from the bin station by means of servo operation, and the clamping mechanism is matched with the wafer carrying mechanism for feeding and discharging the wafers.

The invention further adopts the technical scheme that: the marble component comprises a bedplate, upright posts, positioning blocks and a cross beam, wherein two upright posts are vertically arranged on two sides of the opposite edges of the upward plane of the bedplate in parallel, two ends of the cross beam respectively correspond to one upright post and are arranged on the upright posts, and the upright posts, the bedplate, the upright posts and the cross beam are fixedly arranged in an auxiliary manner by adopting the positioning blocks; the Z-axis assembly is arranged on one side of the cross beam, and the XY-axis assembly and the R-axis assembly are horizontally arranged on the platen on the same side of the Z-axis assembly.

The invention further adopts the technical scheme that: the XY axle subassembly includes buffer, limit switch, organ cover, grating chi, linear guide rail pair, bottom plate, linear electric motor, slide table board, end plate and tow chain, the grating chi the linear guide rail pair, linear electric motor the end plate cooperation is installed on the bottom plate, the slide table board passes through the linear guide rail pair cooperation is installed on the bottom plate, the buffer with limit switch cooperation control the stroke of slide table board, the tow chain is used for electrical components wiring and pneumatic components stringing.

The invention further adopts the technical scheme that: the Z-axis assembly comprises a servo motor, a Z-axis bottom plate, a linear guide rail pair, a ball screw pair, a Z-axis sliding table plate, a limit switch, a buffer block, a bearing seat and a motor seat, wherein the linear guide rail pair is arranged on two sides of the Z-axis bottom plate in the vertical direction, the Z-axis sliding table plate capable of sliding up and down on the linear guide rail pair is integrally arranged on the two sides of the linear guide rail pair, the limit switch capable of enabling the Z-axis sliding table plate to be fixed on the Z-axis bottom plate in a variable position is arranged on one side of the Z-axis sliding table plate, the motor seat is arranged at the middle position of the vertical direction of the Z-axis bottom plate, the servo motor is arranged on the motor seat, the lower part of the motor seat is connected with the bearing seat, the buffer block is communicated with the bearing seat in a hollow mode, the ball screw pair is arranged in the buffer block, the buffer block is fixed on the Z-axis bottom plate through screws, and the side of the buffer block is tightly attached to the bearing seat.

The invention further adopts the technical scheme that: the R-axis assembly comprises a bottom plate, a vacuum gauge, a limit switch, a DD motor, a turntable base, a terminal block, a laser power meter, a vacuum turntable and a vacuum chuck, wherein the bottom plate is arranged on a sliding table plate of the XY-axis assembly, the DD motor is arranged on the bottom plate, the turntable base is arranged on the DD motor, the limit switch is arranged on one side of the DD motor and used for controlling the rotating stroke of the DD motor, the vacuum gauge is used for monitoring the vacuum degree of the vacuum chuck, the turntable base is arranged on the side of DD Ma Dashang, the vacuum turntable and the vacuum chuck are arranged above the turntable base, the vacuum turntable and the vacuum chuck are used for fixing wafers in the feeding and discharging process, the laser power meter is arranged on the bottom plate on one side of the vacuum turntable, and the terminal block is fixed on one side of the upper side of the bottom plate.

The invention further adopts the technical scheme that: the shaping light path comprises a laser inlet, a laser outlet, a light gate, a reflecting mirror, a three-dimensional adjusting frame, a two-dimensional adjusting frame, a beam expander, a wave plate, a six-dimensional adjusting frame and a light path sealing plate, wherein the light gate is connected with the rear of the laser inlet and used for shielding when working idly to prevent laser leakage, the reflecting mirror corresponding to the light gate is used for reflecting laser at the light gate, the reflecting mirror is arranged on the three-dimensional adjusting frame, the beam expander and the reflecting mirror are oppositely arranged to expand the diameter of a laser outlet beam, the beam expander is arranged on the two-dimensional adjusting frame, the wave plate receives the light expanded by the beam expander and modulates the light beam into left-handed circular polarized light, the wave plate is arranged on the six-dimensional adjusting frame, and the light path sealing plate is used for sealing all shaping light path components except the laser inlet and the laser outlet.

The invention further adopts the technical scheme that: the laser head assembly comprises a first reflecting mirror assembly, an organ cover, a second reflecting mirror assembly, a barrel lens assembly, a focusing CCD, a two-dimensional adjusting frame, a displacement sensor, a ceramic motor, an objective lens, a low-power camera, a high-power camera, a point light source and a sealing plate, wherein the first reflecting mirror assembly is used for receiving and reflecting laser processed by a shaping light path and is communicated with the second reflecting mirror assembly through the organ cover, the point light source, the barrel lens assembly, the focusing CCD and the second reflecting mirror assembly are matched, the first reflecting mirror assembly, the second reflecting mirror assembly, the barrel lens assembly and the focusing CCD are sealed by the sealing plate, one side outside the sealing plate is connected with the barrel lens assembly and is provided with the two-dimensional adjusting frame, the displacement sensor, the ceramic motor and the objective lens are connected with the focusing station and the punching station, and the other side outside the sealing plate is connected with the barrel lens assembly and is provided with the low-power camera and the high-power camera.

The invention further adopts the technical scheme that: the wafer carrying mechanism comprises a servo motor, a synchronous belt matched with the servo motor, limit switches are arranged at two ends of a linear guide pair, a sliding table cylinder is arranged on the linear guide pair, two groups of sucker frames are arranged on the sliding table cylinder, suckers, a vacuum gauge and an oil buffer are respectively arranged on the two groups of sucker frames, and a drag chain is arranged above the linear guide pair.

The invention further adopts the technical scheme that: the clamping mechanism comprises a bottom plate, a synchronous belt, a limit switch, a linear guide rail pair, a drag chain, an air cylinder, clamping jaws, synchronous pulleys and a servo motor, wherein the servo motor is arranged on the side of the bottom plate, the synchronous pulleys and the synchronous belt are arranged in a matched mode, the linear guide rail pair is arranged above the synchronous belt, the limit switch is arranged above two ends of the linear guide rail pair, the drag chain which moves in a matched mode is arranged below the synchronous belt, the servo motor drives the synchronous pulleys, the synchronous belt, the air cylinder and the clamping jaws move linearly along the linear guide rail pair, and the clamping jaws are connected with the air cylinder.

The invention further adopts the technical scheme that: the correcting mechanism comprises a support, a limit switch, a pair of alignment sliding rails, a linear guide rail pair, a synchronous pulley, a synchronous belt, a wafer SENSOR, a limit stop and a servo motor, wherein the servo motor is installed on the support, the synchronous belt and the synchronous pulley are installed in a matched mode with the servo motor, a pair of linear guide rail pairs are installed above the support, a pair of alignment sliding rails are installed on the linear guide rail pairs relatively, the alignment sliding rails form a track feeding and discharging station, the wafer SENSOR is installed on the track feeding and discharging station and used for detecting the wafer, and the limit stop is installed at one end of the linear guide rail pair and used for preventing the sliding blocks of the guide rail pair from falling off.

The invention further adopts the technical scheme that: the lifting mechanism comprises a limit switch, a servo motor, a lifting module, a drag chain, a support, a wafer SENSOR, a protection plate, a blocking stop block, a blocking SENSOR and a sliding table, wherein the servo motor, the limit switch and the drag chain are arranged on the lifting module, the lifting module is arranged on the support, the sliding table and the lifting module are matched to slide on the lifting module, the sliding table is a storage bin station, the storage bin station is provided with the wafer SENSOR and is used for detecting a wafer, the sliding table is further provided with the 1108 blocking stop block and 1109 blocking SENSOR and is used for fixing blocking and detecting blocking, and the protection plate is arranged outside the sliding table.

The other technical scheme of the invention is a method for processing by adopting the glass wafer laser micropore processing equipment, and the processing method comprises the following steps:

s1, initializing a bin position: the station of the storage bin filled with the materials is driven by a servo lifting mechanism to finish initialization, wherein the first material of the storage bin is flush with the clamping jaw of the clamping mechanism;

s2, taking out the wafer by the clamping mechanism: the clamping jaw of the clamping mechanism takes out the wafer and translates to the track loading and unloading station, and jumps to S23;

S3, putting down the wafer by the clamping mechanism: the clamping jaw of the clamping mechanism is loosened, the wafer is placed at the feeding and discharging station on the track and is continuously translated for a certain distance to reasonably avoid, and at the moment, the left and right directions of the wafer have relatively determined position accuracy;

s4, correcting the wafer by the correcting mechanism: the track feeding and discharging station can follow the correcting mechanism to do clamping and loosening actions, the track distance and the correcting mechanism stroke are adjusted in advance according to the type of the wafer, after the clamping jaw of the clamping mechanism is loosened, the correcting mechanism clamps, and the front and rear positions of the wafer are corrected;

s5, picking up the wafer by the carrying mechanism: the two groups of suckers of the conveying mechanism can do left-right translation and lifting material taking and discharging actions, and the feeding sucker of the conveying mechanism picks up the wafer aiming at the corrected wafer with the determined position;

s6, translation of the carrying mechanism: the carrying mechanism translates, and the feeding sucker reaches the position right above the feeding and discharging stations of the cross sliding table;

s7, putting down the wafer by the carrying mechanism: the carrying mechanism places the wafer on an R-axis sucker of a loading and unloading station on the cross sliding table, and the R-axis sucker is started to suck the wafer;

s8, global photographing: shooting the whole wafer by a global camera;

s9, preliminary direction correction: taking the wafer notch as a judging feature, and finishing the preliminary direction correction of the wafer by rotating the R-axis servo motor;

S10, enabling the wafer to reach a focusing station: the XY axis assembly drives the R axis assembly and the wafer to horizontally move to reach the focusing station;

s11, focusing: the Z axis moves up and down to finish focusing;

s12, correcting the accurate direction: by means of a high-precision CCD, taking a more accurate structure on a wafer as a judging feature, and finishing accurate direction correction of the wafer by rotating an R axis;

s13, CCD positioning: determining the accurate position of the wafer MARK by adopting a two-point or multi-point positioning method;

s14, height measurement scanning: the displacement sensor scans along the punching path, acquires the height data of the measuring points at the frequency of 50KHz, and acquires 16 groups of data for each measuring point to obtain an average value;

s15, generating a focal length compensation file: the punching software generates a focal length compensation file according to the height measurement result obtained by height measurement scanning, wherein the focal length compensation file is a set of points formed by (X, Y, Z) coordinates and is used for adjusting the laser focus position in real time;

s16, punching: the laser completes punching on the wafer on the punching station in a position synchronous output mode;

s17, enabling the wafer to reach a feeding and discharging station of the sliding table: the XY axle assembly drives the R axle assembly and the wafer to horizontally move to reach the loading and unloading station of the cross sliding table;

s18, picking up the punched wafer by a blanking sucker: the blanking sucker of the conveying mechanism is positioned right above the blanking station on the cross sliding table, and the blanking sucker descends to pick up the punched wafer;

S19, translation of the carrying mechanism: the carrying mechanism translates leftwards, so that the feeding sucker is positioned right above the feeding and discharging stations of the cross sliding table;

s20, a new wafer which is not punched is placed on an R shaft of a blanking station on a cross sliding table in a descending manner by a feeding sucker, the punched wafer is placed on the blanking station on a track in a descending manner by the blanking sucker in a synchronous manner, one branch flow is started by driving the wafer to jump to S7 by the blanking station on the cross sliding table, and the other branch flow jumps to S21;

s21, conveying the wafer back by the clamping mechanism: the clamping mechanism sends the punched wafers on the track feeding and discharging stations back to the storage bin;

s22, returning the wafer to a bin station, and ending the main flow;

s23, descending a bin for one lattice: automatically descending a bin station for one grid, repeatedly executing S2-S4 after the previous material taking cycle is completed by executing S5, and automatically ascending the bin station for one grid after the material taking cycle is completed, and waiting for S22;

s24, translating the clamping mechanism: s5, the carrying mechanism takes away the wafer on the track, and the clamping mechanism can translate and take materials;

s25, taking out the wafer by the clamping mechanism: the clamping mechanism takes out the next wafer and prepares to start a second round of circulation;

s26, putting down the wafer by the clamping mechanism, wherein the step is the same as the step S3;

S27, picking up the wafer by the conveying mechanism, wherein the step is the same as the step S5;

s28, translating the carrying mechanism, wherein the step is the same as the step S6, but the distance between the left sucker and the right sucker needs to be translated, so that the step S29 is realized;

s29, a left sucker of the conveying mechanism waits above the feeding and discharging stations on the cross sliding table.

The invention provides the glass wafer laser micropore processing equipment for three-dimensional integrated packaging and the processing method by utilizing the equipment, overcomes the defects of the traditional micropore processing equipment through the comprehensive application of all structural components of the equipment, realizes the essential improvement of the glass wafer laser micropore technology of the three-dimensional integrated packaging, and has the advantages of small pore diameter, high depth-diameter ratio, good appearance, smooth surface quality and high micropore array manufacturing efficiency.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a glass wafer laser micro-hole processing device for three-dimensional integrated packaging according to an embodiment of the invention;

FIG. 2 is a schematic diagram of a motion assembly according to an embodiment of the present invention;

fig. 3 is a schematic view of a marble assembly according to an embodiment of the present invention;

FIG. 4 is a schematic view of an XY axis assembly according to an embodiment of the present invention;

FIG. 5 is a schematic view of a Z-axis assembly according to an embodiment of the present invention;

FIG. 6 is a schematic view of an R-axis assembly according to an embodiment of the present invention;

FIG. 7 is a schematic view of an optical path component according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a shaping optical path structure according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of a laser head assembly according to an embodiment of the present invention;

FIG. 10 is a schematic diagram of a loading and unloading assembly according to an embodiment of the present invention;

FIG. 11 is a schematic view of a wafer handling mechanism according to an embodiment of the present invention;

FIG. 12 is a schematic view of a clamping mechanism according to an embodiment of the present invention;

FIG. 13 is a schematic diagram of a correction mechanism according to an embodiment of the present invention;

FIG. 14 is a schematic view of a lifting mechanism according to an embodiment of the present invention;

FIG. 15 is a schematic diagram of a glass wafer laser micro-hole processing apparatus for three-dimensional integrated packaging according to an embodiment of the present invention;

FIG. 16 is a schematic station diagram of a glass wafer laser micro-hole processing apparatus for three-dimensional integrated packaging according to an embodiment of the present invention;

FIG. 17 is a schematic flow diagram of a processing method of a glass wafer laser micro-hole processing device for three-dimensional integrated package according to an embodiment of the present invention;

wherein the reference numerals designate: 1. the motion component, 2, the light path component, 3, the feeding and discharging component, 4, the electric control and operation system, 5, the laser, 6, the shaping light path, 7, the laser head component, 8, the wafer handling mechanism, 9, the clamping mechanism, 10, the correction mechanism, 11, the marble Dan Zujian, 12, the XY axis component, 13, the Z axis component, 14, the R axis component, 15, the rack, 101, the bedplate, 102, the upright post, 103, the positioning block, 104, the beam, 201, the buffer, 202, the limit switch, 203, the organ cover, 204, the grating ruler, 205, the linear guide rail pair, 206, the bottom plate, 207, the linear motor, 208, the slipway plate, 209, the end plate, 210, the drag chain, 301, the servo motor, 302, the Z axis bottom plate, 303, the linear guide rail pair, 304, the ball screw pair, 305, the Z axis slide bedplate, 306, the limit switch, 307, the buffer block, 308, the bearing seat, 309, the motor seat, 401, the bottom plate, 402, the vacuum gauge, 403, limit switches, 404, DD motor, 405, turret base, 406, terminal block, 407, laser power meter, 408, vacuum turret, 409, vacuum chuck, 601, laser entrance, 602, laser exit, 603, shutter, 604, mirror, 605, three-dimensional adjustment frame, 606, two-dimensional adjustment frame, 607, beam expander, 608, toggle, 609, six-dimensional adjustment frame, 701, mirror assembly, 702, organ cover, 703, mirror assembly, 704, barrel assembly, 705, focusing CCD,706, two-dimensional adjustment frame, 707, displacement sensor, 708, ceramic motor, 709, objective lens, 710, low power camera, 711, high power camera, 712, sealing plate, 713, point light source, 801, servo motor, 802, synchronous belt, 803, linear guide pair, 804, slipway cylinder, 805, chuck, 806, chuck frame, 807, vacuum gauge, 808, drag chain, 809. limit switches, 810, hydraulic buffers, 901, bottom plates, 902, synchronous belts, 903, limit switches, 904, linear guide pairs, 905, drag chains, 906, cylinders, 907, clamping jaws, 908, synchronous pulleys, 909, servo motors, 1001, supports, 1002, limit switches, 1003, alignment slide rails, 1004, linear guide pairs, 1005, synchronous pulleys, 1006, synchronous belts, 1007, wafer SENSOR,1008, limit stops, 1009, servo motors, 1101, limit switches, 1102, servo motors, 1103, lifting modules, 1104, drag chains, 1105, supports, 1106, wafer SENSOR,1107, guard plates, 1108, stopper stops, 1109, stopper SENSOR,1110, and slipways.

Detailed Description

The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. In the present invention, unless otherwise indicated, terms of orientation such as "inner and outer" are used to generally refer to the inner and outer of the outline of the respective object. The term "top and bottom" is used to refer to the top, bottom, front and back, top and bottom of the corresponding object.

The embodiment of the invention aims at glass wafer laser micropore processing equipment for three-dimensional integrated packaging, which is suitable for processing TGV induced guide holes of various glass substrate laser induced etching processes such as BF33, AF32, quartz, eagle-X, sapphire and the like; the thickness of the glass is less than or equal to 0.9mm; glass size: a wafer substrate with a diameter of more than or equal to 450 mm or a 510 mm glass panel; pore wall adjustable taper: 0 ° -7 °; platform positioning accuracy: 1 μm; minimum aperture and precision: 3 [ mu ] m + -1 [ mu ] m; finish of hole wall: 200 nm; maximum depth-to-diameter ratio: 150:1, a step of; micropore roundness: less than or equal to 100 percent nm; post-etch yield: 99.9999%; processing speed: and more than or equal to 10000 holes/second. The apparatus of the present invention provides the following examples:

As shown in fig. 1 to 3, 7 and 10, the glass wafer laser micro-hole processing device for three-dimensional integrated packaging consists of four parts including a mechanism, optics, an electric control and software, wherein the device comprises a frame 15, a moving component 1, an optical path component 2 and a loading and unloading component 3 which are respectively connected with the moving component 1, and an electric control and operating system 4 which is respectively connected with the optical path component 2 and the loading and unloading component 3, and the moving component 1, the optical path component 2, the loading and unloading component 3 and the electric control and operating system 4 are uniformly arranged on the frame 15;

as shown in fig. 15, the electronic control and operation system 4 includes a main control machine, an ACS motion controller, a ceramic motor driver, a height acquisition card, a laser power supply and a controller, where the main control machine is used for overall coordination of the overall functions, including processing grating coding feedback signals, processing laser displacement signals, planning perforation paths, planning laser automatic focusing, planning focus following and controlling laser synchronous output; the ACS motion controller utilizes micron-scale motion control for driving the servo XY axis assembly 12, the Z axis assembly 13, and the R axis assembly 14, for performing a punch path, and for receiving wafer position feedback signals; the ceramic motor driver drives the ceramic motor to do up-and-down rapid motion for focus following; the height acquisition card is used for acquiring laser displacement signals, and the laser power supply and the controller are used for providing power for the laser, controlling the power and the frequency of the laser and receiving the synchronous signals of the main control computer to realize synchronous output of laser and position. The laser is used for receiving the laser controller signal, outputting high-speed laser pulse and realizing synchronous output of laser and position; the shaping light path is used for transmitting laser, shaping the laser and selecting radial energy; the laser head assembly is used for laser axial homogenization, laser drilling, automatic focusing and focus tracking by utilizing a 3D structure light modulation technology; the XY axis assembly and the R axis assembly are used for moving according to a planned path, adsorbing a wafer, correcting wafer fillet and sending grating coding signals; the Z-axis assembly is used for automatic focusing. The invention combines the fluorine-free wet chemical etching process, and the comprehensive application of the structural components and the corresponding technology ensures that the glass wafer laser micropore processing equipment realizes smaller diameter of the through hole, larger depth-to-diameter ratio, better morphological characteristics, smoother surface quality and higher hole density.

The motion assembly 1 comprises a marble assembly 11, an XY axis assembly 12, a Z axis assembly 13 and an R axis assembly 14, wherein the marble assembly 11 is used for fixing the XY axis assembly 12, the Z axis assembly 13 and the R axis assembly 14, the XY axis assembly 12 is used for moving a wafer to an upper material position and a lower material position and moving the wafer to a focusing station and a punching station, the Z axis assembly 13 is used for automatically focusing and following a focus of the wafer, and the R axis assembly 14 is provided with a cross sliding table feeding station and a discharging station for correcting the direction of the wafer through rotation;

the optical path assembly 2 comprises a laser 5, a shaping optical path 6 connected with the laser 5 and a laser head assembly 7 connected with the shaping optical path 6, wherein the laser 5 is used for generating high-speed laser pulses and realizing position synchronous output with the XY axis assembly 12, the shaping optical path 6 is used for shaping laser beams, and the laser head assembly 7 is provided with a focusing station and a punching station and is used for laser punching;

the loading and unloading assembly 3 comprises a wafer carrying mechanism 8, a clamping mechanism 9, a correcting mechanism 10 and a lifting mechanism (not shown), wherein the clamping mechanism 9 is associated with the action of the wafer carrying mechanism 8, the clamping mechanism 9 is respectively associated with the action of the correcting mechanism 10 and the lifting mechanism, the wafer carrying mechanism 8 is used for carrying wafers, the correcting mechanism 10 is provided with a track loading and unloading station for correcting the positions of the wafers, the lifting mechanism is provided with a bin station, the wafers are automatically fed from the bin station by using servo operation, and the clamping mechanism 9 is matched with the wafer carrying mechanism 8 for loading and unloading the wafers.

In some preferred embodiments, referring to fig. 3, the marble assembly 11 includes a bedplate 101, two upright posts 102, two positioning blocks 103 and a beam 104, wherein the two upright posts 102 are vertically arranged on two sides of opposite edges of an upward plane of the bedplate 101 in parallel, two ends of the beam 104 are respectively corresponding to one upright post 102 and are mounted on the upright posts 102, and the upright posts 102 and the bedplate 101, the upright posts 102 and the beam 104 are mounted and fixed in an auxiliary manner by adopting the positioning blocks 103; the Z-axis assembly 13 is mounted on one side of the beam 104, and the XY-axis assembly 12 and the R-axis assembly 14 are disposed on the platen 101 on the same side as the Z-axis assembly 13.

In some preferred embodiments, referring to fig. 4, the XY axis assembly 12 includes a buffer 201, a limit switch 202, an organ cover 203, a grating scale 204, a linear guide pair 205, a base plate 206, a linear motor 207, a sliding table plate 208, an end plate 209, and a drag chain 210, wherein the grating scale 204, the linear guide pair 205, the linear motor 207, the end plate 209 are cooperatively mounted on the base plate 206, the sliding table plate 208 is cooperatively mounted on the base plate 206 through the linear guide pair 205, the buffer 201 and the limit switch 202 cooperatively control the stroke of the sliding table plate 208, and the drag chain 210 is used for electrical element wiring and pneumatic element piping.

In some preferred embodiments, referring to fig. 5, the Z-axis assembly 13 includes a servo motor 301, a Z-axis bottom plate 302, a linear guide rail pair 303, a ball screw pair 304, a Z-axis sliding table plate 305, a limit switch 306, a buffer block 307, a bearing seat 308 and a motor seat 309, the linear guide rail pair 303 is mounted on two sides of the Z-axis bottom plate 302 in a vertical direction, the Z-axis sliding table plate 305 capable of sliding up and down on the linear guide rail pair 303 is integrally mounted on the two sides of the linear guide rail pair 303, the limit switch 306 capable of fixing the Z-axis sliding table plate 305 on the Z-axis bottom plate 302 in a variable position is mounted on one side of the Z-axis sliding table plate 305, the motor seat 309 is mounted on a middle position in a vertical direction of the Z-axis bottom plate 302, the servo motor 301 is mounted on the motor seat 309, the bearing seat 308 is connected below the motor seat 309, the buffer block 307 is connected below the bearing seat 308, the buffer block 307 is hollow and the bearing seat 308 is internally provided with the ball screw pair 304, and the buffer block 307 is fixed on the side of the Z-axis bottom plate 302 by fixing the screw pair 308.

In some preferred embodiments, referring to fig. 6, the R-axis assembly 14 includes a base plate 401, a vacuum gauge 402, a limit switch 403, a DD motor 404, a turntable base 405, a terminal block 406, a laser power meter 407, a vacuum turntable 408, and a vacuum chuck 409, the base plate 401 is mounted on the slide table plate 208 of the XY-axis assembly 12, the DD motor 404 is mounted on the base plate 401, the turntable base 405 is mounted on the DD motor 404, the limit switch 403 is mounted on one side of the DD motor 404 for controlling the rotational stroke of the DD motor 404, the vacuum gauge 402 is used for monitoring the vacuum level of the vacuum chuck, the turntable base 405 is mounted above the DD motor 404, the vacuum turntable 408 and the vacuum chuck 409 are mounted above the turntable base 405, the vacuum turntable 408 and the vacuum chuck 409 are used for fixing a wafer during loading and unloading, the laser power meter 407 is mounted on the base plate on one side of the vacuum turntable 408, and the terminal block 406 is fixed on one side above the base plate 401.

In some preferred embodiments, referring to fig. 8, the shaping optical path 6 includes a laser inlet 601, a laser outlet 602, an optical shutter 603, a mirror 604, a three-dimensional adjusting frame 605, a two-dimensional adjusting frame 606, a beam expander 607, a wave plate 608, a six-dimensional adjusting frame 609, and an optical path sealing plate (not shown), the optical shutter 603 is connected to the laser inlet 601 and is used for shielding laser leakage when working idle, the mirror 604 corresponding to the optical shutter 603 is used for reflecting laser at the optical shutter 603, the mirror 604 is mounted on the three-dimensional adjusting frame 605, the beam expander 607 is disposed opposite to the mirror 604 and is used for expanding the diameter of the laser outlet beam, the beam expander 607 is mounted on the two-dimensional adjusting frame 606, the wave plate 608 receives the light after the beam expander 604 and modulates the beam into left-circular polarized light, the wave plate 608 is mounted on the six-dimensional adjusting frame 609, and the optical path sealing plate is used for sealing all shaping optical path 6 components except the laser inlet 601 and the laser outlet 602.

In some preferred embodiments, referring to fig. 9, the laser head assembly 7 includes a first mirror assembly 701, an organ cover 702, a second mirror assembly 703, a barrel lens assembly 704, a focusing CCD705, a two-dimensional adjusting frame 706, a displacement sensor 707, a ceramic motor 708, an objective lens 709, a low power camera 710, a high power camera 711, a point light source 713, and a sealing plate 712, wherein the first mirror assembly 701 is used for receiving and reflecting the laser processed by the shaping optical path 6, the second mirror assembly 703 is communicated with the first mirror assembly 701 through the organ cover 702, the point light source 713, the barrel lens assembly 704, the focusing CCD705 and the second mirror assembly 703 are cooperatively arranged, the first mirror assembly 701, the second mirror assembly 703, the barrel lens assembly 704, and the focusing CCD705 are all sealed by the sealing plate 712, the two-dimensional adjusting frame 706, the displacement sensor 707, the ceramic motor 708, and the ceramic motor 709 are connected to the barrel lens assembly on one side outside the sealing plate 712, the high power camera 712 is connected to the other side of the barrel lens assembly, and the high power camera 712 is connected to the high power camera 712 is mounted to the other side of the high power camera 712, and the high power camera 712 is connected to the other side of the focal position sensor 710 and the high power camera 712 is connected to the high power camera 712.

In some preferred embodiments, referring to fig. 11, the wafer handling mechanism 8 includes a servo motor 801, a synchronous belt 802 mechanically matched with the servo motor 801, limit switches 809 are installed at two ends of the synchronous belt 802 and two ends of a linear guide pair 803, a sliding table cylinder 804 is installed on the linear guide pair 803, two groups of suction cup frames 806 are installed on the sliding table cylinder, suction cups 805, a vacuum gauge 807 and a hydraulic buffer 810 are respectively installed on the two groups of suction cup frames 806, and a drag chain 808 is installed above the linear guide pair 803.

In some preferred embodiments, referring to fig. 12, the material clamping mechanism 9 includes a bottom plate 901, a synchronous belt 902, a limit switch 903, a linear guide rail pair 904, a drag chain 905, an air cylinder 906, a clamping jaw 907, a synchronous pulley 908 and a servo motor 909, wherein the servo motor 909 is mounted on the side of the bottom plate 901, the synchronous pulley 908 and the synchronous belt 902 are mounted in cooperation with the servo motor 909, the linear guide rail pair 904 is mounted above the synchronous belt 902, the limit switch 903 is mounted above two ends of the linear guide rail pair 904, the drag chain 905 which is matched with the synchronous belt 902 to move is mounted below the synchronous belt 902, the servo motor 909 drives the synchronous pulley 908, the synchronous belt 902, the air cylinder 906, the clamping jaw 907 and the like to move linearly along the linear guide rail pair 904, and the clamping jaw 907 is linked with the air cylinder 906.

In some preferred embodiments, referring to fig. 13, the correction mechanism 10 includes a bracket 1001, a limit switch 1002, a pair of alignment rails 1003, a pair of linear guide rails 1004, a synchronous pulley 1005, a synchronous belt 1006, a wafer SENSOR1007, a limit stop 1008 and a servo motor 1009, the servo motor 1009 is mounted on the bracket 1001, the synchronous belt 1006 and the synchronous pulley 1005 are mounted in cooperation with the servo motor 1009, a pair of linear guide rails 1004 is mounted above the bracket 1001, a pair of alignment rails 1003 is mounted on the pair of linear guide rails 1004, the pair of alignment rails 1003 form a track loading and unloading station, the wafer SENSOR1007 is mounted on the track loading and unloading station, and the limit stop 1008 is mounted on one end of the pair of linear guide rails 1004 for preventing the pair of guide rails from falling off.

In some preferred embodiments, referring to fig. 14, the lifting mechanism includes a limit switch 1101, a servo motor 1102, a lifting module 1103, a drag chain 1104, a support 1105, a wafer SENSOR1106, a protection plate 1107, a jam stop 1108, a jam SENSOR1109, and a sliding table 1110, the lifting module 1103 is provided with the servo motor 1102, the limit switch 1101, the drag chain 1104, the lifting module 1103 is mounted on the support 1105, the sliding table 1110 and the lifting module 1103 are matched to slide on the lifting module 1103, the sliding table 1110 is a bin station, the bin station is provided with the wafer SENSOR1106 for detecting the presence or absence of a wafer, the sliding table is also provided with the jam stop 1108 and the jam SENSOR1109 for fixing a jam and detecting the presence or absence of a jam, and the sliding table is externally provided with the protection plate 1107.

The embodiment of the invention also provides a processing method of the glass wafer laser micropore processing equipment for three-dimensional integrated packaging, referring to fig. 16, in the processing method, the processing equipment is divided into five stations according to the functional areas, and the five stations are respectively: i, a bin station and a blanking place on the wafer; II, a track loading and unloading station and a wafer initial position correcting place; III, a loading and unloading station of the cross sliding table, and a loading and unloading station of the wafer on the XYR platform; IV, focusing the station, wherein the wafer finishes focusing at the station; v punching station, the wafer completes the manufacture of the induction channel at the station.

Referring to fig. 17, the processing method is as follows:

s1, initializing a bin position: the station of the storage bin filled with the materials is driven by a servo lifting mechanism to finish initialization, wherein the first material of the storage bin is flush with the clamping jaw of the clamping mechanism;

s2, taking out the wafer by the clamping mechanism: the clamping jaw of the clamping mechanism takes out the wafer and translates to the track loading and unloading station, and jumps to S23;

s3, putting down the wafer by the clamping mechanism: the clamping jaw of the clamping mechanism is loosened, the wafer is placed at the feeding and discharging station on the track and is continuously translated for a certain distance to reasonably avoid, and at the moment, the left and right directions of the wafer have relatively determined position accuracy;

S4, correcting the wafer by the correcting mechanism: the track feeding and discharging station can follow the correcting mechanism to do clamping and loosening actions, the track distance and the correcting mechanism stroke are adjusted in advance according to the type of the wafer, after the clamping jaw of the clamping mechanism is loosened, the correcting mechanism clamps, and the front and rear positions of the wafer are corrected;

s5, picking up the wafer by the carrying mechanism: the two groups of suckers of the conveying mechanism can do left-right translation and lifting material taking and discharging actions, and the feeding sucker of the conveying mechanism picks up the wafer aiming at the corrected wafer with the determined position;

s6, translation of the carrying mechanism: the carrying mechanism translates, and the feeding sucker reaches the position right above the feeding and discharging stations of the cross sliding table;

s7, putting down the wafer by the carrying mechanism: the carrying mechanism places the wafer on an R-axis sucker of a loading and unloading station on the cross sliding table, and the R-axis sucker is started to suck the wafer;

s8, global photographing: shooting the whole wafer by a global camera;

s9, preliminary direction correction: taking the wafer notch as a judging feature, and finishing the preliminary direction correction of the wafer by rotating the R-axis servo motor;

s10, enabling the wafer to reach a focusing station: the XY axis assembly drives the R axis assembly and the wafer to horizontally move to reach the focusing station;

s11, focusing: the Z axis moves up and down to finish focusing;

s12, correcting the accurate direction: by means of a high-precision CCD, taking a more accurate structure on a wafer as a judging feature, and finishing accurate direction correction of the wafer by rotating an R axis;

S13, CCD positioning: determining the accurate position of the wafer MARK by adopting a two-point or multi-point positioning method;

s14, height measurement scanning: the displacement sensor scans along the punching path, acquires the height data of the measuring points at the frequency of 50KHz, and acquires 16 groups of data for each measuring point to obtain an average value;

s15, generating a focal length compensation file: the punching software generates a focal length compensation file according to the height measurement result obtained by height measurement scanning, wherein the focal length compensation file is a set of points formed by (X, Y, Z) coordinates and is used for adjusting the laser focus position in real time;

s16, punching: the laser completes punching on the wafer on the punching station in a position synchronous output mode;

s17, enabling the wafer to reach a feeding and discharging station of the sliding table: the XY axle assembly drives the R axle assembly and the wafer to horizontally move to reach the loading and unloading station of the cross sliding table;

s18, picking up the punched wafer by a blanking sucker: the blanking sucker of the conveying mechanism is positioned right above the blanking station on the cross sliding table, and the blanking sucker descends to pick up the punched wafer;

s19, translation of the carrying mechanism: the carrying mechanism translates leftwards, so that the feeding sucker is positioned right above the feeding and discharging stations of the cross sliding table;

s20, a new wafer which is not punched is placed on an R shaft of a blanking station on a cross sliding table in a descending manner by a feeding sucker, the punched wafer is placed on the blanking station on a track in a descending manner by the blanking sucker in a synchronous manner, one branch flow is started by driving the wafer to jump to S7 by the blanking station on the cross sliding table, and the other branch flow jumps to S21;

S21, conveying the wafer back by the clamping mechanism: the clamping mechanism sends the punched wafers on the track feeding and discharging stations back to the storage bin;

s22, returning the wafer to a bin station, and ending the main flow;

s23, descending a bin for one lattice: automatically descending a bin station for one grid, repeatedly executing S2-S4 after the previous material taking cycle is completed by executing S5, and automatically ascending the bin station for one grid after the material taking cycle is completed, and waiting for S22;

s24, translating the clamping mechanism: s5, the carrying mechanism takes away the wafer on the track, and the clamping mechanism can translate and take materials;

s25, taking out the wafer by the clamping mechanism: the clamping mechanism takes out the next wafer and prepares to start a second round of circulation;

s26, putting down the wafer by the clamping mechanism, wherein the step is the same as the step S3;

s27, picking up the wafer by the conveying mechanism, wherein the step is the same as the step S5;

s28, translating the carrying mechanism, wherein the step is the same as the step S6, but the distance between the left sucker and the right sucker needs to be translated, so that the step S29 is realized;

s29, the left sucker of the conveying mechanism waits above the feeding and discharging stations on the cross sliding table.

The glass wafer laser micropore processing equipment for three-dimensional integrated packaging and the processing method by utilizing the equipment provided by the embodiments overcome the defects of the traditional micropore processing equipment through the comprehensive application of equipment components, realize the essential improvement of the glass wafer laser micropore technology for three-dimensional integrated packaging, and have the advantages of small pore diameter, high depth-diameter ratio, good appearance, smooth surface quality and high micropore array manufacturing efficiency.

Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Claims (12)

1. The glass wafer laser micropore processing equipment for three-dimensional integrated packaging is characterized by comprising a frame, a moving assembly, an optical path assembly, an upper blanking assembly and a lower blanking assembly, wherein the optical path assembly and the upper blanking assembly are respectively connected with the moving assembly, and an electric control and operation system is respectively connected with the optical path assembly and the upper blanking assembly, and the moving assembly, the optical path assembly, the upper blanking assembly and the electric control and operation system are uniformly arranged on the frame;

the electronic control and operation system comprises a main control machine, an ACS motion controller, a ceramic motor driver, a height acquisition card, a laser power supply and a controller, wherein the main control machine is used for overall coordination of the functions of the whole machine, including processing grating coding feedback signals, processing laser displacement signals, planning perforation paths, planning laser automatic focusing, planning focus following and controlling laser synchronous output, and the ACS motion controller is used for driving a servo XY axis assembly, a Z axis assembly and an R axis assembly, executing perforation paths and receiving wafer position feedback signals; the ceramic motor driver drives the ceramic motor to do up-and-down rapid motion for focus following; the height acquisition card is used for acquiring laser displacement signals, and the laser power supply and the controller are used for providing power for the laser, controlling the power and the frequency of the laser and receiving the synchronous signals of the main control computer to realize synchronous output of laser and position;

The movement assembly comprises a marble Dan Zujian, an XY axis assembly, a Z axis assembly and an R axis assembly, wherein the marble assembly is used for fixing the XY axis assembly, the Z axis assembly and the R axis assembly, the XY axis assembly is used for moving a wafer to an upper material position and a lower material position, moving the wafer to a focusing station and a punching station, the Z axis assembly is used for automatically focusing and following a focus of the wafer, and the R axis assembly is provided with a cross sliding table feeding and discharging station and is used for correcting the direction of the wafer through rotation;

the laser device comprises a laser device, a shaping optical path connected with the laser device and a laser head assembly connected with the shaping optical path, wherein the laser device is used for generating high-speed laser pulses and synchronously outputting the high-speed laser pulses with the position of the XY axis assembly, the shaping optical path is used for shaping laser beams, and the laser head assembly is provided with a focusing station and a punching station and is used for laser punching;

the feeding and discharging assembly comprises a wafer carrying mechanism, a clamping mechanism, a correcting mechanism and a lifting mechanism, wherein the clamping mechanism, the correcting mechanism and the lifting mechanism are related to the action of the wafer carrying mechanism, the clamping mechanism is respectively related to the action of the correcting mechanism, the wafer carrying mechanism is used for carrying wafers, the correcting mechanism is provided with a track feeding and discharging station and is used for correcting the positions of the wafers, the lifting mechanism is provided with a bin station, the wafers are automatically fed from the bin station by means of servo operation, and the clamping mechanism is matched with the wafer carrying mechanism for feeding and discharging the wafers.

2. The glass wafer laser micropore processing device for three-dimensional integrated packaging according to claim 1, wherein the marble component comprises a bedplate, upright posts, positioning blocks and a beam, wherein two upright posts are vertically arranged on two sides of opposite edges of an upward plane of the bedplate in parallel, two ends of the beam correspond to one upright post and are arranged on the upright posts, and the upright posts, the bedplate, the upright posts and the beam are fixedly arranged in an auxiliary manner by adopting the positioning blocks; the Z-axis assembly is arranged on one side of the cross beam, and the XY-axis assembly and the R-axis assembly are horizontally arranged on the platen on the same side of the Z-axis assembly.

3. The apparatus for three-dimensionally integrated packaged glass wafer laser micro-hole processing according to claim 1, wherein the XY axis assembly comprises a buffer, a limit switch, an organ cover, a grating scale, a linear guide rail pair, a bottom plate, a linear motor, a slide plate, an end plate and a drag chain, wherein the grating scale, the linear guide rail pair, the linear motor, the end plate are cooperatively mounted on the bottom plate, the slide plate is cooperatively mounted on the bottom plate through the linear guide rail pair, the buffer and the limit switch cooperatively control the stroke of the slide plate, and the drag chain is used for electric element wiring and pneumatic element pipe arrangement.

4. The glass wafer laser micro-hole processing device for three-dimensional integrated packaging according to claim 1, wherein the Z-axis assembly comprises a servo motor, a Z-axis bottom plate, a linear guide pair, a ball screw pair, a Z-axis sliding table plate, a limit switch, a buffer block, a bearing seat and a motor seat, the linear guide pair is mounted on two sides of the Z-axis bottom plate in a vertical direction, a Z-axis sliding table plate capable of sliding up and down on the linear guide pair is integrally mounted on the two sides of the linear guide pair, the limit switch capable of fixing the Z-axis sliding table plate on the Z-axis bottom plate in a variable position is mounted on one side of the Z-axis sliding table plate, the motor seat is mounted on the middle position of the Z-axis bottom plate in a vertical direction, the servo motor is mounted on the motor seat, the bearing seat is connected below the bearing seat, the buffer block is connected with the bearing seat in a hollow communication manner, the ball screw pair is built in the buffer block is fixed on the Z-axis bottom plate through screws, and the buffer block is tightly attached to the side surface of the Z-axis bottom plate.

5. The glass wafer laser micro-hole processing apparatus for three-dimensional integrated package according to claim 3, wherein the R-axis assembly comprises a bottom plate, a vacuum gauge, a limit switch, a DD motor, a turntable base, a terminal block, a laser power meter, a vacuum turntable and a vacuum chuck, the bottom plate is mounted on the slide plate of the XY-axis assembly, the DD motor is mounted on the bottom plate, the turntable base is mounted on the DD motor, the limit switch is mounted on one side of the DD motor for controlling the rotational stroke of the DD motor, the vacuum gauge is used for monitoring the vacuum degree of the vacuum chuck, the turntable base is mounted on one side of the DD Ma Dashang, the vacuum turntable and the vacuum chuck are mounted above the turntable base, the vacuum turntable and the vacuum chuck are used for fixing a wafer during feeding and discharging processes, the laser power meter is mounted on the bottom plate on one side of the vacuum turntable, and the terminal block is fixed on one side above the bottom plate.

6. The glass wafer laser micro-hole processing device for three-dimensional integrated packaging according to claim 1, wherein the shaping light path comprises a laser inlet, a laser outlet, a light gate, a reflecting mirror, a three-dimensional adjusting frame, a two-dimensional adjusting frame, a beam expander, a wave plate, a six-dimensional adjusting frame and a light path sealing plate, the light gate is connected behind the laser inlet and is used for shielding when working idle to prevent laser leakage, the reflecting mirror corresponding to the light gate is used for reflecting laser at the light gate, the reflecting mirror is mounted on the three-dimensional adjusting frame, the beam expander is arranged opposite to the reflecting mirror and is used for expanding the beam diameter of the laser outlet, the beam expander is mounted on the two-dimensional adjusting frame, the wave plate receives the light expanded by the beam expander and modulates the beam into left-handed circularly polarized light, the wave plate is mounted on the six-dimensional adjusting frame, and the light path sealing plate is used for sealing all shaping light path components except the laser inlet and the laser outlet.

7. The glass wafer laser micro-hole processing device for three-dimensional integrated packaging according to claim 1, wherein the laser head assembly comprises a first reflecting mirror assembly, an organ cover, a second reflecting mirror assembly, a barrel mirror assembly, a focusing CCD, a two-dimensional adjusting frame, a displacement sensor, a ceramic motor, an objective lens, a low-power camera, a high-power camera, a point light source and a sealing plate, wherein the first reflecting mirror assembly is used for receiving and reflecting laser processed by the shaping light path, the second reflecting mirror assembly is communicated with the first reflecting mirror assembly through the organ cover, the point light source, the barrel mirror assembly, the focusing CCD and the second reflecting mirror assembly are matched and arranged, the first reflecting mirror assembly, the second reflecting mirror assembly, the barrel mirror assembly and the focusing CCD are all sealed by the sealing plate, one side outside the sealing plate is connected with the barrel mirror assembly, the two-dimensional adjusting frame, the displacement sensor, the ceramic motor and the objective lens are arranged below the displacement sensor, the focusing CCD is matched with the low-power camera, and the high-power camera is arranged at the other side of the sealing plate, and the high-power camera is connected with the barrel mirror assembly.

8. The glass wafer laser micro-hole processing device for three-dimensional integrated packaging according to claim 1, wherein the wafer carrying mechanism comprises a servo motor and a synchronous belt matched with the servo motor, limit switches are installed at two ends of the synchronous belt and two ends of the linear guide pair, a sliding table cylinder is installed on the linear guide pair, two groups of sucker frames are installed on the sliding table cylinder, and suckers, a vacuum gauge and an oil buffer which are installed on the two groups of sucker frames respectively are installed above the linear guide pair.

9. The glass wafer laser micropore processing device for three-dimensional integrated packaging according to claim 1, wherein the clamping mechanism comprises a bottom plate, a synchronous belt, a limit switch, a linear guide rail pair, a drag chain, an air cylinder, clamping jaws, a synchronous pulley and a servo motor, wherein the servo motor is installed on the side of the bottom plate, the synchronous pulley and the synchronous belt are installed in a matched mode with the servo motor, the linear guide rail pair is installed above the synchronous belt, the limit switch is installed above two ends of the linear guide rail pair, the drag chain matched with the synchronous belt to move is installed below the synchronous belt, the servo motor drives the synchronous pulley, the synchronous belt, the air cylinder and the clamping jaws to do linear motion along the linear guide rail pair, and the clamping jaws are connected with the air cylinder.

10. The glass wafer laser micropore processing device for three-dimensional integrated packaging according to claim 1, wherein the correction mechanism comprises a bracket, a limit switch, an alignment slide rail, a linear guide rail pair, a synchronous pulley, a synchronous belt, a wafer SENSOR, a limit stop and a servo motor, wherein the servo motor is installed on the bracket, the synchronous belt and the synchronous pulley are installed in a matched manner with the servo motor, a pair of linear guide rail pairs are installed above the bracket, a pair of alignment slide rails are installed on the linear guide rail pairs oppositely, the alignment slide rails form a track loading and unloading station, the wafer SENSOR is installed on the track loading and unloading station and used for detecting wafers, and the limit stop is installed at one end of the linear guide rail pair and used for preventing a slide block of the guide rail pair from falling off.

11. The glass wafer laser micro-hole processing device for three-dimensional integrated packaging according to claim 1, wherein the lifting mechanism comprises a limit switch, a servo motor, a lifting module, a drag chain, a support, a wafer SENSOR, a protection plate, a blocking stopper and a sliding table, the lifting module is provided with the servo motor, the limit switch and the drag chain, the lifting module is arranged on the support, the sliding table is matched with the lifting module to slide on the lifting module, the sliding table is a bin station, the bin station is provided with the wafer SENSOR for detecting wafers, the sliding table is also provided with the 1108 blocking stopper and 1109 blocking stopper for fixing blocking and detecting blocking, and the sliding table is externally provided with the protection plate.

12. A method of processing using the glass wafer laser micro-hole processing apparatus of any of claims 1-11, the processing method comprising the steps of:

s1, initializing a bin position: the station of the storage bin filled with the materials is driven by a servo lifting mechanism to finish initialization, wherein the first material of the storage bin is flush with the clamping jaw of the clamping mechanism;

s2, taking out the wafer by the clamping mechanism: the clamping jaw of the clamping mechanism takes out the wafer and translates to the track loading and unloading station, and jumps to S23;

s3, putting down the wafer by the clamping mechanism: the clamping jaw of the clamping mechanism is loosened, the wafer is placed at the feeding and discharging station on the track and is continuously translated for a certain distance to reasonably avoid, and at the moment, the left and right directions of the wafer have relatively determined position accuracy;

s4, correcting the wafer by the correcting mechanism: the track feeding and discharging station can follow the correcting mechanism to do clamping and loosening actions, the track distance and the correcting mechanism stroke are adjusted in advance according to the type of the wafer, after the clamping jaw of the clamping mechanism is loosened, the correcting mechanism clamps, and the front and rear positions of the wafer are corrected;

s5, picking up the wafer by the carrying mechanism: the two groups of suckers of the conveying mechanism can do left-right translation and lifting material taking and discharging actions, and the feeding sucker of the conveying mechanism picks up the wafer aiming at the corrected wafer with the determined position;

S6, translation of the carrying mechanism: the carrying mechanism translates, and the feeding sucker reaches the position right above the feeding and discharging stations of the cross sliding table;

s7, putting down the wafer by the carrying mechanism: the carrying mechanism places the wafer on an R-axis sucker of a loading and unloading station on the cross sliding table, and the R-axis sucker is started to suck the wafer;

s8, global photographing: shooting the whole wafer by a global camera;

s9, preliminary direction correction: taking the wafer notch as a judging feature, and finishing the preliminary direction correction of the wafer by rotating the R-axis servo motor;

s10, enabling the wafer to reach a focusing station: the XY axis assembly drives the R axis assembly and the wafer to horizontally move to reach the focusing station;

s11, focusing: the Z axis moves up and down to finish focusing;

s12, correcting the accurate direction: by means of a high-precision CCD, taking a more accurate structure on a wafer as a judging feature, and finishing accurate direction correction of the wafer by rotating an R axis;

s13, CCD positioning: determining the accurate position of the wafer MARK by adopting a two-point or multi-point positioning method;

s14, height measurement scanning: the displacement sensor scans along the punching path, acquires the height data of the measuring points at the frequency of 50KHz, and acquires 16 groups of data for each measuring point to obtain an average value;

s15, generating a focal length compensation file: the punching software generates a focal length compensation file according to the height measurement result obtained by height measurement scanning, wherein the focal length compensation file is a set of points formed by (X, Y, Z) coordinates and is used for adjusting the laser focus position in real time;

S16, punching: the laser completes punching on the wafer on the punching station in a position synchronous output mode;

s17, enabling the wafer to reach a feeding and discharging station of the sliding table: the XY axle assembly drives the R axle assembly and the wafer to horizontally move to reach the loading and unloading station of the cross sliding table;

s18, picking up the punched wafer by a blanking sucker: the blanking sucker of the conveying mechanism is positioned right above the blanking station on the cross sliding table, and the blanking sucker descends to pick up the punched wafer;

s19, translation of the carrying mechanism: the carrying mechanism translates leftwards, so that the feeding sucker is positioned right above the feeding and discharging stations of the cross sliding table;

s20, a new wafer which is not punched is placed on an R shaft of a blanking station on a cross sliding table in a descending manner by a feeding sucker, the punched wafer is placed on the blanking station on a track in a descending manner by the blanking sucker in a synchronous manner, one branch flow is started by driving the wafer to jump to S7 by the blanking station on the cross sliding table, and the other branch flow jumps to S21;

s21, conveying the wafer back by the clamping mechanism: the clamping mechanism sends the punched wafers on the track feeding and discharging stations back to the storage bin;

s22, returning the wafer to a bin station, and ending the main flow;

s23, descending a bin for one lattice: automatically descending a bin station for one grid, repeatedly executing S2-S4 after the previous material taking cycle is completed by executing S5, and automatically ascending the bin station for one grid after the material taking cycle is completed, and waiting for S22;

S24, translating the clamping mechanism: s5, the carrying mechanism takes away the wafer on the track, and the clamping mechanism can translate and take materials;

s25, taking out the wafer by the clamping mechanism: the clamping mechanism takes out the next wafer and prepares to start a second round of circulation;

s26, putting down the wafer by the clamping mechanism, wherein the step is the same as the step S3;

s27, picking up the wafer by the conveying mechanism, wherein the step is the same as the step S5;

s28, translating the carrying mechanism, wherein the step is the same as the step S6, but the distance between the left sucker and the right sucker needs to be translated, so that the step S29 is realized;

s29, a left sucker of the conveying mechanism waits above the feeding and discharging stations on the cross sliding table.