CN111843253A - Precision optical positioning structure for laser cutting wafer - Google Patents
Precision optical positioning structure for laser cutting wafer Download PDFInfo
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- CN111843253A CN111843253A CN202010901588.3A CN202010901588A CN111843253A CN 111843253 A CN111843253 A CN 111843253A CN 202010901588 A CN202010901588 A CN 202010901588A CN 111843253 A CN111843253 A CN 111843253A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 43
- 238000003698 laser cutting Methods 0.000 title claims abstract description 37
- 238000005520 cutting process Methods 0.000 claims abstract description 67
- 230000000007 visual effect Effects 0.000 claims description 42
- 230000007246 mechanism Effects 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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Abstract
The invention provides a precision optical positioning structure for cutting a wafer by laser, which comprises a precision XY-axis two-dimensional workbench and a laser cutting device, wherein the precision XY-axis two-dimensional workbench is arranged on a rack and used for fixing the wafer, the laser cutting device is arranged on the rack and positioned above the precision XY-axis two-dimensional workbench, the laser cutting device comprises a cutting laser generator, laser emitted by the cutting laser generator enters a focusing mirror of the laser cutting device, a fixed light circuit board is fixedly arranged on the rack and positioned above the precision XY-axis two-dimensional workbench, a Z-axis moving frame moving along a Z axis is arranged on the fixed light circuit board, the cutting laser generator is arranged on the fixed light circuit board, and a first beam combiner, a third beam combiner and the focusing mirror are arranged on the Z-axis moving frame; the laser emitted by the cutting laser generator is subjected to optical treatment and then vertically enters a third beam combiner, is reflected by the third beam combiner and then horizontally enters a first beam combiner, and is reflected by the first beam combiner and then vertically enters a focusing mirror of the laser cutting device.
Description
Technical Field
The invention belongs to the wafer scribing industry in the chip industry, and particularly relates to a precise optical positioning structure for laser cutting of a wafer.
Background
With the development of science and technology, the electronic industry has been rapidly advanced, the demand of various integrated and control circuits has been rapidly increased, and the demand of chip packaging has also been rapidly increased. The chip packaging means that a precise semiconductor integrated circuit chip is mounted on a frame, then the chip is connected with frame pins by leads, finally the semiconductor integrated circuit chip is sealed by epoxy resin, and the outside carries out signal transmission with the internal chip through the pins. The packaging mainly comprises the step of fixedly packaging a precise semiconductor integrated circuit chip, so that the semiconductor integrated circuit chip is not influenced by external humidity and dust while playing a role, and meanwhile, good mechanical vibration or impact resistance protection is provided, and the applicability of the semiconductor integrated circuit chip is improved. Meanwhile, the chip is packaged on the metal frame, so that the heat dissipation area is increased, and the operation reliability of the chip is improved. This requires the wafer to be cut with high precision during processing using a cutting device.
The laser processing equipment is used as a carrier for the application of the laser processing technology, relates to large-scale precision equipment with stronger technical performance in various subjects such as light, machine, electricity, softness and the like, and is also key equipment for upgrading the manufacturing industry. With the further promotion of global industrialization process, the miniaturization and intellectualization of various products, new processing application and new production requirements are continuously generated, the precision requirement on equipment is also continuously increased, the defects of the traditional mechanical processing equipment are more and more obvious, the laser processing equipment can rapidly develop silicon wafers as semiconductor materials which are most widely applied, and the semiconductor materials of the silicon substrate occupy the leading position.
There are many methods for cutting silicon product circles, different silicon product circles have different characteristics, and the requirements for laser equipment are the same, so that the laser processing technology needs to be customized according to the product size, and an optimal solution is found out. Laser processing is a technology that laser photons are used as energy carriers, and a series of physical and chemical changes are caused to a processed material through the interaction between a laser beam and the material, so that the material is cut, drilled, etched and other processing modes are realized. After the laser is focused by expanding beam, a focusing point of several micrometers is formed on the surface of the material, any cutting can be flexibly finished by matching with the movement of the platform,
some problems still appear in the use process of the existing laser cutting device, and due to the fact that wafers have various specifications and the like, the positioning accuracy is not high. This requires high precision positioning to ensure cutting accuracy and cutter feed accuracy. Moreover, the conventional mechanism for adjusting the focal length needs to move up or down the laser generator, the laser range finder, the visual positioning device and the like as a whole. Starting or stopping the motor generates some force, and the components have certain deviation in the positions of the components in the moving process for a long time, so that focusing is not accurate.
Disclosure of Invention
The invention provides a precise optical positioning structure for a laser cutting wafer.
The object of the invention is achieved in the following way: the precise optical positioning structure for the laser cutting of the wafer comprises a precise XY-axis two-dimensional workbench and a laser cutting device, wherein the precise XY-axis two-dimensional workbench is arranged on a rack and used for fixing the wafer, the laser cutting device is arranged on the rack and positioned above the precise XY-axis two-dimensional workbench, the laser cutting device comprises a cutting laser generator, laser emitted by the cutting laser generator enters a focusing mirror of the laser cutting device, a fixed light circuit board is fixedly arranged on the rack and positioned above the precise XY-axis two-dimensional workbench, a Z-axis moving frame moving along a Z axis is arranged on the fixed light circuit board, the cutting laser generator is arranged on the fixed light circuit board, and a first beam combiner, a third beam combiner and the focusing mirror are arranged on the Z-axis moving frame; the laser emitted by the cutting laser generator is subjected to optical treatment and then vertically enters a third beam combiner, is reflected by the third beam combiner and then horizontally enters a first beam combiner, and is reflected by the first beam combiner and then vertically enters a focusing mirror of the laser cutting device.
And a visual positioning device fixed on the Z-axis moving frame is arranged above the first beam combiner, and the central axis of the optical path of the visual positioning device vertically enters the first beam combiner and then coaxially and vertically enters the focusing lens together with the central axis of the cutting laser.
The high-precision laser range finder is fixed on the Z-axis moving frame, ranging laser emitted by the high-precision laser range finder horizontally enters a second beam combining mirror fixed on the Z-axis moving frame, is reflected by the second beam combining mirror to enter a first beam combining mirror, and coaxially enters the focusing mirror together with cutting laser vertically entering the focusing mirror after passing through the first beam combining mirror; at the moment, the central axis of the optical path of the visual positioning device passes through the second beam combiner and the first beam combiner and then enters the focusing mirror together with the ranging laser and the cutting laser.
And a visual positioning device fixed on the fixed light path plate is arranged above the first beam combiner, and the central axis of the light path of the visual positioning device vertically enters the first beam combiner and then coaxially and vertically enters the focusing mirror together with the central axis of the cutting laser.
The high-precision laser range finder is fixed on the fixed optical circuit board, and a fourth beam combining mirror and a second beam combining mirror are arranged on the Z-axis moving frame; the second beam combining mirror is positioned above the first beam combining mirror, and the heights of the fourth beam combining mirror and the second beam combining mirror are consistent; the distance measuring laser emitted by the high-precision laser distance measuring instrument vertically enters a fourth beam combining mirror, horizontally enters a second beam combining mirror after being reflected by the fourth beam combining mirror, enters a first beam combining mirror after being reflected by the second beam combining mirror, and enters a focusing mirror coaxially with the cutting laser vertically entering the focusing mirror after passing through the first beam combining mirror.
A visual positioning device fixed on the fixed light path board is arranged above the first beam combiner, and after a central axis of a light path of the visual positioning device vertically enters the first beam combiner, the central axis of the light path and a cutting laser coaxially and vertically enter the focusing mirror; at the moment, the central axis of the optical path of the visual positioning device passes through the second beam combiner and the first beam combiner and then enters the focusing mirror together with the ranging laser and the cutting laser.
A first miniature two-dimensional moving device is arranged between the visual positioning device and the fixed light path board, and the first miniature two-dimensional moving device moves the visual positioning device and is used for adjusting the central axis of the light path of the visual positioning device.
And a second miniature two-dimensional moving device is arranged between the bottom of the high-precision laser range finder and the fixed light path board, and the second miniature two-dimensional moving device moves the high-precision laser range finder to adjust the central axis of the laser of the high-precision laser range finder.
And the Z-axis moving frame is movably arranged on the fixed light path board through a screw rod mechanism.
The invention has the beneficial effects that: the cutting laser generator which is heavier and has more precise elements is moved out of the Z-axis moving frame and placed on the fixed light path board, an inclined third beam combiner is added, laser emitted by the cutting laser generator vertically enters the third beam combiner after optical treatment, horizontally enters the first beam combiner after being reflected by the third beam combiner, and vertically enters a focusing mirror of the laser cutting device after being reflected by the first beam combiner. The focusing effect can be achieved by only moving the focusing lens which must be moved and the first beam combining lens and the third beam combining lens which help to cut the laser of the laser generator to reach the focusing lens. The cutting laser generator is not damaged; when the Z-axis moving frame moves, the light path is simple, the dislocation is not easy to occur, and the position of the dislocation can be easily found even if the dislocation exists, so that the adjustment is convenient.
Drawings
Fig. 1 is a simplified schematic diagram of the present invention.
Fig. 2 is a schematic side view of fig. 1.
Fig. 3 is another embodiment of fig. 1.
Wherein, 1 is a cutting laser generator, 2 is a first beam combining mirror, 3 is a focusing mirror, 4 is a visual positioning device, 5 is a high-precision laser range finder, 6 is a second beam combining mirror, 7 is a first miniature two-dimensional moving device, 8 is a second miniature two-dimensional moving device, 9 is a third beam combining mirror, 10 is a fourth beam combining mirror, 11 is a fixed light path board, 12 is a Z-axis moving frame, 13 is a screw mechanism, 14 is a moving frame mounting groove, and 15 is a guide rail.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments, and it should be understood that the preferred embodiments described herein are only for illustrating and explaining the present invention and are not to be construed as limiting the present invention. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, as meaning either fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium; either mechanically or electrically. Unless explicitly defined otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Relational terms such as first, second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
As shown in fig. 1-3, a precision optical positioning structure for laser cutting a wafer includes a precision XY-axis two-dimensional table disposed on a frame for fixing the wafer, a chuck (not shown) for fixing the wafer disposed on the table, and a laser cutting device disposed on the frame above the precision XY-axis two-dimensional table, wherein the laser cutting device includes a cutting laser generator 1, laser emitted from the cutting laser generator 1 enters a focusing lens 3 of the laser cutting device, a fixed light path plate 11 is fixedly disposed on the frame above the precision XY-axis two-dimensional table, a Z-axis moving frame 12 moving along a Z-axis is disposed on the fixed light path plate 11, the cutting laser generator 1 is disposed on the fixed light path plate 11, and a first beam combiner 2, a third beam combiner 9 and the focusing lens 3 are disposed on the Z-axis moving frame 12; the laser emitted by the cutting laser generator 1 is subjected to optical treatment and then vertically enters the third beam combiner 9, is reflected by the third beam combiner 9 and then horizontally enters the first beam combiner 2, and is reflected by the first beam combiner 2 and then vertically enters the focusing mirror 3 of the laser cutting device. In the conventional optical positioning structure, the cutting laser generator 1 is fixed to the Z-axis moving frame 12 in a conventional manner. The Z-axis moving frame 12 is movably arranged on the rack, and the Z-axis moving frame 12 is driven by the moving frame driving mechanism to move up and down along the rack so as to drive the focusing lens 3 on the Z-axis moving frame to be far away from or close to the wafer on the precise XY-axis two-dimensional workbench to play a focusing role. The cutting laser generator 1 includes a series of precision optical elements such as a laser, a power adjusting device, a polarization state direction adjusting mechanism, a device for expanding a beam and adjusting a divergence angle, an optical phase modulator, and the like. After sequentially passing through the power adjustment, the polarization direction adjustment, the beam expansion, the divergence angle adjustment and the optical phase modulator, the laser horizontally enters the focusing lens through the first beam combiner 2 which is arranged by inclining 45 degrees. These are the existing structures and the specific principles are not described in detail. The cutting laser generator 1 is a precision component, and many optical components are complicated, and if there is a deviation in the relative position, the laser light emitted will be affected. During the up-and-down movement of the Z-axis moving frame 12, the cutting laser generator thereon is affected by the force generated by the start or stop of the motor, and the position deviation is caused for a long time. The more components are moved on the Z-axis moving frame 12, the more components are likely to be displaced, thereby affecting the focusing effect. In this patent, move out Z axle that heavier and the more cutting laser generator of precision component and remove frame 12 and place fixed light path board 11 on, increase the third beam combiner 9 of slope, the laser of cutting laser generator 1 transmission is vertical gets into third beam combiner 9 after optical treatment, the level gets into first beam combiner 2 after third beam combiner 9 reflects, gets into laser cutting device's focusing mirror 3 perpendicularly after first beam combiner 2 reflects. Thus, only the focusing mirror 3 which has to be moved and the first beam combiner 2 and the third beam combiner 9 which help to cut the laser light of the laser generator 1 to reach the focusing mirror 3 are moved to achieve the focusing effect. The cutting laser generator 1 is not damaged; when the Z-axis moving frame 12 moves, the optical path is relatively simple and is not easy to be dislocated, and even if the optical path is dislocated, the dislocated position can be easily found, so that the adjustment is convenient.
Furthermore, a visual positioning device 4 fixed on the Z-axis moving frame 12 is arranged above the first beam combiner 2, and a central axis of a light path of the visual positioning device 4 vertically enters the first beam combiner 2 and then coaxially and vertically enters the focusing mirror 3 together with a central axis of the cutting laser. So that the point of the cutting laser is at the central point of the visual positioning device 4, which facilitates accurate positioning.
A high-precision laser range finder 5 is fixed on the Z-axis moving frame 12, ranging laser emitted by the high-precision laser range finder 5 horizontally enters a second beam combining mirror 6 fixed on the Z-axis moving frame 12, is reflected by the second beam combining mirror 6 to enter a first beam combining mirror 2, and enters a focusing mirror after passing through the first beam combining mirror 2 along with cutting laser vertically entering a focusing mirror 3; at this time, the central axis of the optical path of the visual positioning device 4 passes through the second beam combiner 6 and the first beam combiner 2, and then enters the focusing mirror together with the distance measuring laser and the cutting laser. Because the optical path of the visual positioning device 4, the ranging laser and the cutting laser are coaxial and enter the focusing mirror, the wafer surface position measured by the high-precision laser range finder is on the central axis of the cutting laser on the uneven wafer surface, and the Z-axis moving frame 12 is easy to adjust so that the cutting laser focus is positioned at the cutting position on the uneven wafer surface.
In another technical scheme, a visual positioning device 4 fixed on the fixed light path plate 11 is arranged above the first beam combining mirror 2, and after a central axis of a light path of the visual positioning device 4 vertically enters the first beam combining mirror 2, the central axis of the light path and a central axis of the cutting laser coaxially and vertically enter the focusing mirror 3. The visual positioning device 4 is also arranged on the fixed light path board 11, thereby further reducing the number and weight of the moving components required on the Z-axis moving frame 12 and improving the accuracy.
Or the high-precision laser range finder 5 is fixed on the fixed optical path board 11, and the fourth beam combiner 10 and the second beam combiner 6 are arranged on the Z-axis moving frame 12; the second beam combining mirror 6 is positioned above the first beam combining mirror 2, and the heights of the fourth beam combining mirror 10 and the second beam combining mirror 6 are consistent; the ranging laser emitted by the high-precision laser range finder 5 vertically enters the fourth beam combiner 10, horizontally enters the second beam combiner 6 after being reflected by the fourth beam combiner 10, enters the first beam combiner 2 after being reflected by the second beam combiner 6, and enters the focusing lens 3 coaxially with the cutting laser vertically entering the focusing lens 3 after passing through the first beam combiner 2. The high-precision laser range finder 5 is arranged on the fixed light path plate 11, so that the number and weight of moving components required on the Z-axis moving frame 12 are reduced. The distance measuring laser emitted by the high-precision laser distance measuring instrument 5 and the cutting laser vertically entering the focusing mirror 3 coaxially enter the focusing mirror. The precision of laser cutting is further ensured.
Preferably, a visual positioning device 4 fixed on the fixed light path plate 11 is arranged above the first beam combiner 2, and after a central axis of a light path of the visual positioning device 4 vertically enters the first beam combiner 2, the central axis of the light path and a central axis of the cutting laser coaxially and vertically enter the focusing mirror 3; at this time, the central axis of the optical path of the visual positioning device 4 passes through the second beam combiner 6 and the first beam combiner 2, and then enters the focusing mirror together with the distance measuring laser and the cutting laser.
A first miniature two-dimensional moving device 7 is arranged between the visual positioning device 4 and the fixed light path plate 11, and the first miniature two-dimensional moving device 7 moves the visual positioning device 4 to adjust the central axis of the light path of the visual positioning device. The micro two-dimensional moving device 7 may be a commercially available two-dimensional moving frame for a lens or a two-dimensional moving frame for a microscope. During the use, make the range finding laser and the cutting laser that get into focusing mirror 3 coaxial, range finding laser and cutting laser coincide at the surperficial laser bright point of wafer, adjust first miniature two-dimensional mobile device 7 for the surperficial laser bright point of wafer is in the central point of vision positioner and puts.
And a second miniature two-dimensional moving device 8 is arranged between the bottom of the high-precision laser range finder 5 and the fixed light path plate 11, and the second miniature two-dimensional moving device 8 moves the high-precision laser range finder 5 to adjust the central axis of the laser of the high-precision laser range finder 5. The second miniature two-dimensional moving device 8 moves the high-precision laser range finder 5 to adjust the central axis of the laser of the high-precision laser range finder. The second miniature two-dimensional moving device 8 may be an angle adjuster, besides a two-dimensional moving frame of a lens or a two-dimensional moving frame of a microscope, for adjusting the angle of the central axis of the laser emitted by the high-precision laser range finder 5 and controlling the central axis of the laser of the high-precision laser range finder 5.
During the use, at first open cutting laser, cutting laser produces cutting laser bright spot on the wafer surface, opens high accuracy laser range finder 5, and the range finding laser also produces the range finding laser bright spot on the wafer surface, adjusts the miniature two-dimensional mobile device 5 of second and makes range finding laser bright spot and cutting laser bright spot coincidence, then adjusts first miniature two-dimensional mobile device 7 for the laser bright spot of wafer surface coincidence is in the central point of vision positioner.
A longitudinal fine-tuning device can be arranged between the focusing lens 3 and the Z-axis moving frame 12, and needs to be arranged at a position avoiding the optical path. The arrangement can be directly fixed by the two or fixed by the connecting frame, and other parts of the application can also be arranged in the way. The longitudinal fine adjustment device is a longitudinal moving linear piezoelectric motor and a linear piezoelectric ceramic motor, and adjusts the focus of the focusing mirror.
Or in another embodiment, namely an embodiment without the fixed light path plate 11 or the visual positioning device 4 is not arranged on the fixed light path plate 11 or the high-precision laser range finder 5 is not arranged on the fixed light path plate 11, the first miniature two-dimensional moving device 11 is arranged between the visual positioning device 4 and the Z-axis moving frame 12. And a second miniature two-dimensional moving device 8 is arranged between the bottom of the high-precision laser range finder 5 and a Z-axis moving frame 12 of the machine frame.
Wherein, the mobile visual positioning device 4 is used for adjusting the central axis of the optical path of the visual positioning device to coincide with other axes; the movable high-precision laser range finder 5 adjusts the central axis of the laser of the high-precision laser range finder to coincide with other axes; when the concave-convex degree of the surface of the wafer is tiny, the cutting laser focus can be adjusted only by moving the focusing lens, so that the cutting laser focus can be adjusted more accurately.
The Z-axis moving frame 12 is movably disposed on the fixed light path plate 11 through a screw mechanism 13. A lead screw motor can be fixedly arranged on the fixed light path plate 11, an output shaft of the lead screw motor is connected with a vertical lead screw, and a bearing at the other end of the lead screw and a bearing seat are rotatably arranged on the fixed light path plate 11. The nut of the screw rod is connected with the Z-axis moving frame 12 and drives the Z-axis moving frame 12 to move up and down. A guide rail 15 can be arranged on the fixed light path plate 11, a slide block is arranged on the guide rail 15, and the slide block is connected with the Z-axis moving frame 12; the guide rail 15 and the slider play a role of guidance. The fixed light path plate 11 may be provided with a moving frame mounting groove 14, and the Z-axis moving frame 12 moves in the space of the moving frame mounting groove 14. In the specific implementation: and rotating a lead screw motor according to requirements to enable the Z-axis moving frame 12 to drive the focusing mirror 3 to move to a proper position for focusing.
It should be noted that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper" and "lower," "vertical," "horizontal," "top," "bottom," "inner" and "outer" used in the description refer to the orientation or positional relationship as shown in the drawings, merely for the purpose of slogan to describe the patent, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation. And therefore should not be construed as limiting the scope of the invention.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. Where combinations of features are mutually inconsistent or impractical, such combinations should not be considered as being absent and not within the scope of the claimed invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.
Claims (9)
1. The precise optical positioning structure for the laser cutting wafer comprises a precise XY-axis two-dimensional workbench arranged on a rack and used for fixing the wafer, and a laser cutting device arranged above the precise XY-axis two-dimensional workbench on the rack, wherein the laser cutting device comprises a cutting laser generator, and laser emitted by the cutting laser generator enters a focusing mirror of the laser cutting device, and the precise optical positioning structure is characterized in that: a fixed light path board is fixedly arranged on the rack above the precise XY-axis two-dimensional workbench, a Z-axis moving frame moving along the Z axis is arranged on the fixed light path board, the cutting laser generator is arranged on the fixed light path board, and a first beam combiner, a third beam combiner and a focusing lens are arranged on the Z-axis moving frame; the laser emitted by the cutting laser generator is subjected to optical treatment and then vertically enters a third beam combiner, is reflected by the third beam combiner and then horizontally enters a first beam combiner, and is reflected by the first beam combiner and then vertically enters a focusing mirror of the laser cutting device.
2. The precision optical positioning structure for laser cutting wafer as claimed in claim 1, wherein: and a visual positioning device fixed on the Z-axis moving frame is arranged above the first beam combiner, and the central axis of the optical path of the visual positioning device vertically enters the first beam combiner and then coaxially and vertically enters the focusing lens together with the central axis of the cutting laser.
3. The precision optical positioning structure for laser cutting wafer as claimed in claim 2, wherein: the high-precision laser range finder is fixed on the Z-axis moving frame, ranging laser emitted by the high-precision laser range finder horizontally enters a second beam combining mirror fixed on the Z-axis moving frame, is reflected by the second beam combining mirror to enter a first beam combining mirror, and coaxially enters the focusing mirror together with cutting laser vertically entering the focusing mirror after passing through the first beam combining mirror; at the moment, the central axis of the optical path of the visual positioning device passes through the second beam combiner and the first beam combiner and then enters the focusing mirror together with the ranging laser and the cutting laser.
4. The precision optical positioning structure for laser cutting wafer as claimed in claim 1, wherein: and a visual positioning device fixed on the fixed light path plate is arranged above the first beam combiner, and the central axis of the light path of the visual positioning device vertically enters the first beam combiner and then coaxially and vertically enters the focusing mirror together with the central axis of the cutting laser.
5. The precision optical positioning structure for laser cutting wafer as claimed in claim 1, wherein: a high-precision laser range finder is fixed on the fixed light path board, and a fourth beam combining mirror and a second beam combining mirror are arranged on the Z-axis moving frame; the second beam combining mirror is positioned above the first beam combining mirror, and the heights of the fourth beam combining mirror and the second beam combining mirror are consistent; the distance measuring laser emitted by the high-precision laser distance measuring instrument vertically enters a fourth beam combining mirror, horizontally enters a second beam combining mirror after being reflected by the fourth beam combining mirror, enters a first beam combining mirror after being reflected by the second beam combining mirror, and enters a focusing mirror coaxially with the cutting laser vertically entering the focusing mirror after passing through the first beam combining mirror.
6. The precision optical positioning structure for laser cutting wafer as claimed in claim 5, wherein: a visual positioning device fixed on the fixed light path board is arranged above the first beam combiner, and the central axis of the light path of the visual positioning device vertically enters the first beam combiner and then coaxially and vertically enters the focusing mirror together with the central axis of the cutting laser; at the moment, the central axis of the optical path of the visual positioning device passes through the second beam combiner and the first beam combiner and then enters the focusing mirror together with the ranging laser and the cutting laser.
7. The precision optical positioning structure for laser cutting wafer as claimed in claim 4 or 6, wherein: a first miniature two-dimensional moving device is arranged between the visual positioning device and the fixed light path board, and the first miniature two-dimensional moving device moves the visual positioning device and is used for adjusting the central axis of the light path of the visual positioning device.
8. The precision optical positioning structure for laser cutting wafer as claimed in claim 5 or 6, wherein: the miniature two-dimensional moving device of second sets up between the bottom of high accuracy laser range finder and the fixed light circuit board, the miniature two-dimensional moving device of second removes the central axis that high accuracy laser range finder used for adjusting high accuracy laser range finder laser.
9. The precision optical positioning structure for laser cutting wafer as claimed in claim 1, wherein: and the Z-axis moving frame is movably arranged on the fixed light path board through a screw rod mechanism.
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| CN202010901588.3A CN111843253A (en) | 2020-08-31 | 2020-08-31 | Precision optical positioning structure for laser cutting wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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