CN202379405U - Automatic directional arrangement device for chips - Google Patents
Automatic directional arrangement device for chips Download PDFInfo
- Publication number
- CN202379405U CN202379405U CN2011205626441U CN201120562644U CN202379405U CN 202379405 U CN202379405 U CN 202379405U CN 2011205626441 U CN2011205626441 U CN 2011205626441U CN 201120562644 U CN201120562644 U CN 201120562644U CN 202379405 U CN202379405 U CN 202379405U
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- chip
- automatic directional
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Abstract
The utility model discloses an automatic directional arrangement device for chip. The automatic directional arrangement device comprises a vibrating disc and a conveying track, wherein a chip placement region and a vibrating track are arranged in the vibrating disc; one end of the vibrating track is communicated with the chip placement region, and the other end of the vibrating track is communicated with the conveying track; the vibrating track is provided with a separation section track which is integrated with the vibrating track; and the thickness of the separation section track is less than the thickness of the vibrating track. According to the automatic directional arrangement device, GPP (Glass Passivation Pellet) chips are automatically arranged on P face or N face according to requirements, so that the quality of the chips is guaranteed, and the breakage and failure of the chips caused by manual operation reason are avoided.
Description
Technical field
The utility model relates to a kind of chip automatic directional collating unit, is used for GPP chip processing procedure process and arranges both forward and reverse directions to cutting the sheet chip that looses.
Background technology
In the prior art, the GPP chip all adopts the sheet packaged form that looses, and is about to the small size chip that finished chip is laser-cut into designing requirement jointly, takes off from blue film through chip pick-up equipment, forms single little chip.After drawing into single-chip, need single-chip be tested one by one because of technology or experiment for indivedual batches, at this moment need the artificial tweezers that use that the chip unification is arranged in the zone of regulation by the negative or positive electrode direction.
But the arrangement operation of carrying out with staff owing to be the operation that relies on operator's skill level, because of the operator is different, can makes and arrange the needed time and ordered state is different, so it is low and can not obtain the problem of stable alignment form to exist capacity rating.Because of using tweezers pincer attack strength uncontrollable, be easy to cause strength to cross ambassador's chip rupture and lost efficacy in this process.
In order to address the above problem, Chinese patent number " 02154332.1 " discloses a kind of chip component collating unit, and open day is 2003.06.04, has the plate that is provided with the chip component arrangement plane; The housing that is configured on this plate and the fill area of chip component is set, supply with the component feeding portion of chip component to said plate; The chip component that the said plate of subtend is supplied with is given the swinging gear that horizontally rotates that horizontally rotates swing, makes the chip component collating unit can obtain the automation of the arrangement operation of chip component.
But because the PN junction of GPP chip has the corrosion concave surface; And above-mentioned patented technology chip component when arranging is to do to horizontally rotate swing; Make the GPP chip can not unify to be arranged in the zone of regulation by the negative or positive electrode direction; Thereby this patented technology and be not suitable for and arrange the GPP chip, can only adopt the mode of manual arrangement to carry out in the prior art equally.
Summary of the invention
The purpose of the utility model is to overcome the problems referred to above that GPP arrangements of chips both forward and reverse directions exists in the prior art; A kind of chip automatic directional collating unit is provided; The utility model is arranged the GPP chip as requested automatically by P face or N face; Guarantee chip quality, the chip broken invalid of avoiding the manual operation reason to cause.
For realizing above-mentioned purpose, the technical scheme that the utility model adopts is following:
A kind of chip automatic directional collating unit; It is characterized in that: involving vibrations dish and delivery track; Be provided with chip rest area and vibrating the track in the said vibrating disk, said vibrating the track one end is communicated with the chip rest area, and the other end is communicated with delivery track; Said vibrating the track is provided with the branch selections track in aggregates with vibrating the track, and the thickness of said minute selections track is less than the thickness of vibrating the track.
The thickness of said vibrating the track is 0.3-0.5mm.
The thickness of said minute selections track is 0.15-0.2mm.
Said delivery track is connected with vibrator.
Said vibrating the track shape in the shape of a spiral is distributed in the vibrating disk.
The selections track was positioned at the vibrating the track middle part in said minute.
Adopt the advantage of the utility model to be:
One, the utility model involving vibrations dish and delivery track are provided with chip rest area and vibrating the track in the said vibrating disk, said vibrating the track one end is communicated with the chip rest area; The other end is communicated with delivery track; Said vibrating the track is provided with branch selections track, and the thickness of said minute selections track adopts this structure that the GPP chip is arranged by P face or N face as requested automatically less than the thickness of vibrating the track; Guarantee chip quality; The chip broken invalid of avoiding the manual operation reason to cause, and the branch selections track that is provided with can be that the die grading of contact surface returns the chip rest area with the N face chip on the vibrating the track, makes separating effect more reliable.
Two, in the utility model; The thickness of said vibrating the track is 0.3-0.5mm; Further; The thickness of said minute selections track is 0.15-0.2mm, adopts this structure to guarantee that further with the N face chip on the vibrating the track be the reliability that the die grading of contact surface returns the chip rest area, improves the accuracy of arranging.
Three, in the utility model, said delivery track is connected with vibrator, makes through the consistent conveying on request of arrangements of chips after the vibration arrangement, and can adjust the chip of not arranging on request.
Four, this reality and novel in, said vibrating the track is shape in the shape of a spiral, the accuracy rate that makes the GPP chip automatically arrange by P face or N face as requested is higher.
Five, this reality and novel in, said minute selections track is positioned at the vibrating the track middle part, arranges through vibrating the track earlier, through dividing the sorting of selections track, improves accuracy again.
Description of drawings
Structural representation when Fig. 1 uses for the utility model
Be labeled as among the figure: 1, vibrating disk, 2, delivery track, 3, the chip rest area, 4, vibrating the track, 5, divide the selections track, 6, vibrator, 7, chip.
The specific embodiment
A kind of chip automatic directional collating unit; Involving vibrations dish 1 and delivery track 2; Be provided with chip rest area 3 and vibrating the track 4 in the said vibrating disk 1, said vibrating the track 4 one ends are communicated with chip rest area 3, and the other end is communicated with delivery track 2; Said vibrating the track 4 is provided with the branch selections track 5 in aggregates with vibrating the track 4, and the thickness of said minute selections track 5 is less than the thickness of vibrating the track 4.
The preferred implementation of the utility model is that the thickness of said vibrating the track 4 is 0.3-0.5mm, for example can select 0.3mm, 0.4mm or 0.5mm, but is not limited to aforementioned thicknesses.
The another preferred implementation of the utility model is that the thickness of said minute selections track 5 is 0.15-0.2mm, for example can select 0.15mm, 0.17mm or 0.2mm, but is not limited to aforementioned thicknesses.
The another preferred implementation of the utility model does, said delivery track 2 is connected with vibrator 6, and the mode that drives delivery track 2 has a lot, but is not limited thereto mode, also can adopt other induced way.
The another preferred implementation of the utility model is that said vibrating the track 4 shape in the shape of a spiral is distributed in the vibrating disk 1.The set-up mode of vibrating the track 4 has a lot, is not limited thereto mode.
The principle of work of the utility model is following:
The sheet chip that will loose is put into vibrating disk 1, and vibrating disk 1 following vibrator makes the vibrating the track 4 of chip 7 entering chip vibrating disks, chip 7 part N faces and P face at this moment; PN has the corrosion concave surface because of the GPP chip; When the branch selections track 5 at vibrating the track 4 middle parts of passing through vibrating disk 1; Owing to divide selections track 5 different with the thickness of vibrating the track 4; Make N face chip because of the chip rest area 3 in the not enough vibrating disk 1 that drops back of minute selections track 5 contact Area of bearing, get into vibrating the track 4 again at random; This work area guarantees to have only P face chip to pass through; P face chip supplies test to use through flowing out vibrating disk 1 with vibrating disk 1 bonded assembly delivery track 2; Delivery track 2 is also through vibrator 6 automatic moving chips.
Delivery track in the utility model can adopt rectilinear orbit.Through the appeal structure, reach the chip screening effect, and can regulate amplitude and reach the protection chip, chip was not lost efficacy because of damaged.
Claims (6)
1. chip automatic directional collating unit; It is characterized in that: involving vibrations dish (1) and delivery track (2); Be provided with chip rest area (3) and vibrating the track (4) in the said vibrating disk (1); Said vibrating the track (4) one ends are communicated with chip rest area (3); The other end is communicated with delivery track (2), and said vibrating the track (4) is provided with and vibrating the track (4) branch selections track (5) in aggregates, said minute the selections track (5) thickness less than the thickness of vibrating the track (4).
2. chip automatic directional collating unit according to claim 1 is characterized in that: the thickness of said vibrating the track (4) is 0.3-0.5mm.
3. chip automatic directional collating unit according to claim 1 and 2 is characterized in that: said minute the selections track (5) thickness be 0.15-0.2mm.
4. chip automatic directional collating unit according to claim 3 is characterized in that: said delivery track (2) is connected with vibrator (6).
5. according to claim 1,2 or 4 described chip automatic directional collating units, it is characterized in that: said vibrating the track (4) shape in the shape of a spiral is distributed in the vibrating disk (1).
6. according to claim 1,2 or 4 described chip automatic directional collating units, it is characterized in that: said minute the selections track (5) be positioned at vibrating the track (4) middle part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205626441U CN202379405U (en) | 2011-12-29 | 2011-12-29 | Automatic directional arrangement device for chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205626441U CN202379405U (en) | 2011-12-29 | 2011-12-29 | Automatic directional arrangement device for chips |
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CN202379405U true CN202379405U (en) | 2012-08-15 |
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CN2011205626441U Expired - Lifetime CN202379405U (en) | 2011-12-29 | 2011-12-29 | Automatic directional arrangement device for chips |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105564940A (en) * | 2015-12-18 | 2016-05-11 | 梅州市凯煜自动化设备有限公司 | Automatic slice inserting machine for wire wrapping frame of micro-motor |
CN105564941A (en) * | 2015-12-18 | 2016-05-11 | 梅州市凯煜自动化设备有限公司 | Adjusting device for sheet material conveying |
CN111375558A (en) * | 2018-12-29 | 2020-07-07 | 乐山希尔电子股份有限公司 | Withstand voltage testing device |
CN111375569A (en) * | 2018-12-29 | 2020-07-07 | 乐山希尔电子股份有限公司 | Test all-in-one machine |
-
2011
- 2011-12-29 CN CN2011205626441U patent/CN202379405U/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105564940A (en) * | 2015-12-18 | 2016-05-11 | 梅州市凯煜自动化设备有限公司 | Automatic slice inserting machine for wire wrapping frame of micro-motor |
CN105564941A (en) * | 2015-12-18 | 2016-05-11 | 梅州市凯煜自动化设备有限公司 | Adjusting device for sheet material conveying |
CN111375558A (en) * | 2018-12-29 | 2020-07-07 | 乐山希尔电子股份有限公司 | Withstand voltage testing device |
CN111375569A (en) * | 2018-12-29 | 2020-07-07 | 乐山希尔电子股份有限公司 | Test all-in-one machine |
CN111375569B (en) * | 2018-12-29 | 2023-08-01 | 乐山希尔电子股份有限公司 | Test all-in-one machine |
CN111375558B (en) * | 2018-12-29 | 2024-01-09 | 乐山希尔电子股份有限公司 | Withstand voltage testing arrangement |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20120815 |
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CX01 | Expiry of patent term |